A laser low-temperature heating device with controllable power consumption and an optical module

Abstract

The utility model relates to the field of optical communication technology, and specifically to a laser low-temperature heating device and an optical module with controllable power consumption, comprising a first electrode and a second electrode configured at the first end of an FPC soft board, and a heating layer configured at the second end of the FPC soft board and electrically connected to the first electrode and the second electrode, the heating layer being in contact with the tube seat surface of a coaxial laser; the first end of the FPC soft board is connected to a power supply on a mainboard, and the power supply is connected to a PWM signal output end of an MCU on the mainboard. The utility model can maintain the laser operating in an appropriate temperature range at low temperatures by contacting the heating layer of the FPC soft board with the tube seat surface of the coaxial laser, thereby ensuring the efficiency, stability and reliability of heating. By controlling the power supply with an adjustable duty cycle PWM, the laser can be flexibly and controllably heated at low temperatures within the allowable power consumption range, thereby achieving controllable heating power consumption, and the PWM pulse control has a fast response speed, thereby achieving flexible control of the heating power consumption.

Description

Technical Field

[0001] The utility model relates to the technical field of optical communication, and in particular to a laser low-temperature heating device with controllable power consumption and an optical module. Background Art

[0002] With the development of fronthaul technology in the optical communication field, operators have put forward requirements for SFP+ and SFP28CWDM series optical modules with wider operating temperature ranges, such as industrial grade and extended grade. The performance of lasers is closely related to temperature, which poses higher challenges to the low-temperature performance and wavelength stability of optical modules. It is required to flexibly control the heating laser within the allowable power consumption range, compensate for low-temperature wavelength deviation, power change, performance impact, etc., and achieve stable link transmission within the operating temperature range.

[0003] In the prior art, there are several heating methods: (1) using a dedicated TEC Controller to control TEC to heat the laser; (2) using a DC-DC power supply to heat the laser through a heating resistor; (3) using an FPC heating film to indirectly heat the area to be heated. Among them, in heating method (1), the TEC usually needs to be packaged in a TO together with the laser chip, and then the pins TEC+ and TEC- are led out from the TO tube holder. At low temperatures, the DAC output controls the TEC Controller to control the magnitude and direction of the current flowing through the TEC to achieve low-temperature heating. However, the heating method of the TEC Controller to control the TEC has at least the following two defects: one is that the structure is complex and occupies the TO space, resulting in great difficulty in packaging; the other is that an additional TEC Controller needs to be added, which increases energy consumption and increases the difficulty and cost of mainboard layout. In heating method (2), the heating resistor is usually welded on the back of the laser flexible circuit board. At low temperature, by turning on the DC-DC output power supply, low-temperature heating with fixed power consumption can be achieved. However, the method of heating through the heating resistor with DC-DC power supply has at least the following two defects: the first is that the heating area is small and the FPC in the middle leads to low heating efficiency; the second is that the DC-DC set voltage output power consumption is fixed and the heating control is not flexible. In heating method (3), the FPC heating film is configured with a heating wire on the back of the soft board and leads to an electrode, and is stacked as a single layer. It is attached to the area to be heated and heated through a layer of soft board. This leads to a larger thermal resistance and low heating efficiency. At the same time, it will also make the laser welding pin stump longer, introduce additional reflections and discontinuities, and affect the RF transmission performance.

[0004] Based on this, there is an urgent need for a laser low-temperature heating device that can flexibly control heating power consumption at low temperatures and stabilize the wavelength and performance of the laser. Utility Model Content

[0005] The purpose of the utility model is to provide a laser low-temperature heating device and an optical module with controllable power consumption. The laser is heated by heating the FPC soft board heating layer, and the power supply is controlled by adjustable duty cycle PWM, thereby achieving controllable heating power consumption to solve the problems of high energy consumption, inflexible heating control and low heating efficiency in existing heating methods.

[0006] The embodiment of the utility model is realized by the following technical scheme: a laser low-temperature heating device with controllable power consumption, comprising a first electrode and a second electrode arranged at a first end of an FPC soft board, and a heating layer arranged at a second end of the FPC soft board and electrically connected to the first electrode and the second electrode, wherein the heating layer contacts the tube seat surface of the coaxial laser;

[0007] The first end of the FPC soft board is connected to the power supply on the mainboard, and the power supply is connected to the PWM signal output end of the MCU on the mainboard.

[0008] According to a preferred embodiment, it also includes a temperature sensor configured on the mainboard, and the temperature sensor is electrically connected to the MCU.

[0009] According to a preferred embodiment, the power supply is a DC-DC power supply.

[0010] According to a preferred embodiment, the heating layer is integrally formed with the FPC soft board through a lamination process.

[0011] According to a preferred embodiment, the thickness of the heating layer is about half of the FPC soft board.

[0012] According to a preferred embodiment, via holes matching the coaxial laser pins are provided on the heating layer and the FPC soft board.

[0013] According to a preferred embodiment, a serpentine impedance line is etched on the side of the heating layer that contacts the coaxial laser tube base surface.

[0014] According to a preferred embodiment, the serpentine impedance line is connected to the first electrode and the second electrode via internal wiring of the FPC soft board.

[0015] The utility model also provides an optical module, comprising the laser low-temperature heating device with controllable power consumption as described above.

[0016] According to a preferred embodiment, the MCU is connected to a gold finger, the input side of the gold finger is connected to an optical module transmitter, the optical module transmitter includes a transmission clock data recovery unit, a laser driving circuit, a transmitting end FPC soft board and the coaxial laser connected in sequence, and the input end of the transmission clock data recovery unit is connected to the gold finger;

[0017] The output side of the gold finger is connected to an optical module receiver, which includes an optical receiver, a receiving end soft board, a limiting amplifier and a receiving clock data recovery unit connected in sequence, and the receiving clock data recovery unit is connected to the gold finger.

[0018] The technical solution of a laser low-temperature heating device and an optical module with controllable power consumption provided by the embodiment of the utility model has at least the following advantages and beneficial effects: (1) The laser low-temperature heating device contacts the FPC soft board heating layer with the coaxial laser tube seat surface to maintain the laser working in an appropriate temperature range at low temperature, thereby ensuring the efficiency, stability and reliability of heating; (2) The laser is heated by heating the FPC soft board heating layer, and then the power supply is controlled by adjustable duty cycle PWM, so that the laser can be flexibly and controllably heated at low temperature within the allowable power consumption range, thereby realizing controllable heating power consumption; (3) The switch output of the heating power supply is controlled by PWM pulses with adjustable duty cycle, with fast response speed, so that flexible control of heating power consumption can be realized; (4) No additional dedicated chip is required, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the assembly of a laser low-temperature heating device with controllable power consumption provided in Example 1 of the utility model;

[0020] Figure 2 A schematic diagram of the structure of a laser low-temperature heating device with controllable power consumption provided in Example 1 of the utility model;

[0021] Figure 3 A schematic diagram of the second end of the FPC soft board with controllable power consumption provided in Example 1 of the utility model;

[0022] Figure 4 A structural block diagram of an optical module provided in Embodiment 2 of the present utility model;

[0023] Icon: 1-FPC soft board, 2-first electrode, 3-second electrode, 4-heating layer, 5-coaxial laser, 6-tube holder, 7-main board, 8-via. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0025] Example 1

[0026] See also Figure 1 to Figure 2 As shown, the utility model provides a laser low temperature heating device with controllable power consumption, wherein the assembly of the laser low temperature heating device with controllable power consumption is as follows Figure 1 shown.

[0027] In this embodiment, the controllable power consumption laser low-temperature heating device adopts the FPC soft board 1 heating method to heat the FPC soft board 1 in direct contact with the area to be heated; specifically, the controllable power consumption laser low-temperature heating device includes a first electrode 2 and a second electrode 3 arranged at the first end of the FPC soft board 1, and a heating layer 4 arranged at the second end of the FPC soft board 1 and electrically connected to the first electrode 2 and the second electrode 3, the heating layer 4 is in contact with the surface of the tube socket 6 of the coaxial laser 5, and the heating layer 4 can also be a heating resistor; it should be noted that, in addition to contacting the surface of the tube socket 6 of the coaxial laser 5, the area to be heated can also be any position, and there is no specific limitation here.

[0028] In this embodiment, the heating layer 4 of the FPC soft board 1 is in contact with the surface of the coaxial laser 5 socket 6 to maintain the laser working in an appropriate temperature range at low temperature, thereby ensuring the efficiency, stability and reliability of heating; different from TEC heating, this heating method does not require additional dedicated chips and has low cost.

[0029] Regarding the provision of heating power, in this embodiment, see Figure 2 As shown, the first end of the FPC soft board 1 is connected to the power supply on the main board 7. Preferably, the power supply is a DC-DC power supply; the DC-DC power supply is connected to the PWM signal output end of the MCU on the main board 7, and the first electrode 2 and the second electrode 3 are respectively connected to the power output end and the ground end of the power supply through the first end of the FPC soft board 1. The MCU outputs a pulse square wave with an adjustable duty cycle in an analog PWM manner to control the enable and repeat switching of the DC-DC power supply, and intermittently pulses the power supply to the heating layer 4, thereby realizing intermittent heating of the coaxial laser 5. In addition, the heating power consumption can also be controlled by adjusting the output voltage of the DC-DC power supply, which will not be described in detail here.

[0030] This embodiment controls the power supply through adjustable duty cycle PWM, which can flexibly and controllably perform low-temperature heating of the laser within the allowable power consumption range, thereby achieving controllable heating power consumption; and by controlling the switch output of the heating power supply through adjustable duty cycle PWM pulses, the response speed is fast, and flexible control of the heating power consumption can be achieved.

[0031] More specifically, the present embodiment also includes a temperature sensor configured on the main board 7, and the temperature sensor is electrically connected to the MCU; when in a low temperature environment, the temperature sensor detects that the temperature drops to a set heating start threshold, thereby triggering the MCU to output a pulse square wave with an adjustable duty cycle through an analog PWM method to intermittently heat the coaxial laser 5; when the temperature sensor detects that the temperature rises back to the heating stop threshold, it triggers the MCU to shut down the DC-DC power supply.

[0032] In addition, it should be noted that in different low-temperature sections, the duty cycle of the PWM pulse square wave can be adjusted to control the length of time for continuous power supply and heating within the switching cycle, thereby achieving thermal efficiency output with different heating power consumption; for example, in shallow low temperatures, a small duty cycle pulse output can be used to lightly heat the laser with low power consumption; when the temperature is deeply low, a large duty cycle pulse output can be used to heat the laser with high power consumption intensity.

[0033] Regarding the structure of the heating layer 4, in a possible implementation, the heating layer 4 is integrally formed with the FPC soft board 1 through a lamination process, and the thickness of the heating layer 4 is about half of the FPC soft board 1. When it is in close contact with the front of the coaxial laser 5 socket 6, it can also serve as a reinforcement for the soft board, and at the same time, it also has a protective optimization effect on the soldering tin leakage short circuit of the coaxial laser 5 pins;

[0034] In addition, in order to adapt to the direct contact with the tube base 6, see Figure 3 As shown, via holes 8 matching the pins of the coaxial laser 5 are provided on the heating layer 4 and the FPC soft board 1. At the same time, the serpentine impedance line etched on the contact surface of the heating layer 4 also avoids the pins of the coaxial laser 5 and maintains a safe distance; further, the serpentine impedance line is connected to the first electrode 2 and the second electrode 3 through the internal routing of the FPC soft board 1 to simplify the circuit configuration.

[0035] Example 2

[0036] This embodiment provides an optical module, including the laser low-temperature heating device with controllable power consumption as described in Embodiment 1.

[0037] Specifically, see Figure 4 As shown, the MCU is connected to the gold finger, the input side of the gold finger is connected to the optical module transmitter, the optical module transmitter includes a transmission clock data recovery unit, a laser driving circuit, a transmitting end FPC soft board 1 and the coaxial laser 5 connected in sequence, and the input end of the transmission clock data recovery unit is connected to the gold finger; wherein, the transmission clock data recovery unit is used to recover and shape the signal from the gold finger to improve the transmission performance of the optical module, and the transmission performance of the optical module can be improved by using CDR technology.

[0038] The output side of the gold finger is connected to an optical module receiver, which includes an optical receiver, a receiving end soft board, a limiting amplifier and a receiving clock data recovery unit connected in sequence, and the receiving clock data recovery unit is connected to the gold finger; wherein the limiting amplifier is used to enhance the strength of the optical signal, and the receiving clock data recovery unit is used to recover and shape the signal of the optical receiver.

[0039] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A laser low temperature heating device with controllable power consumption, characterized in that: The invention comprises a first electrode (2) and a second electrode (3) arranged at the first end of an FPC soft board (1), and a heating layer (4) arranged at the second end of the FPC soft board (1) and electrically connected to the first electrode (2) and the second electrode (3), wherein the heating layer (4) is in surface contact with a tube seat (6) of a coaxial laser (5); The first end of the FPC soft board (1) is connected to a power supply on the main board (7), and the power supply is connected to a PWM signal output end of the MCU on the main board (7).

2. The laser low-temperature heating device with controllable power consumption as claimed in claim 1, characterized in that: It also includes a temperature sensor configured on the main board (7), and the temperature sensor is electrically connected to the MCU.

3. The laser low-temperature heating device with controllable power consumption as claimed in claim 1, characterized in that: The power supply is a DC-DC power supply.

4. The laser low-temperature heating device with controllable power consumption as claimed in claim 1, characterized in that: The heating layer (4) is integrally formed with the FPC soft board (1) through a lamination process.

5. The laser low-temperature heating device with controllable power consumption as claimed in claim 1, characterized in that: The thickness of the heating layer (4) is approximately one-half of the thickness of the FPC soft board (1).

6. The laser low-temperature heating device with controllable power consumption as claimed in claim 1, characterized in that: The heating layer (4) and the FPC soft board (1) are provided with via holes (8) matching the pins of the coaxial laser (5).

7. The laser low-temperature heating device with controllable power consumption according to any one of claims 1 to 6, characterized in that: The heating layer (4) is etched with a serpentine impedance line on the side in contact with the surface of the coaxial laser (5) tube base (6).

8. The laser low-temperature heating device with controllable power consumption as claimed in claim 7, characterized in that: The serpentine impedance line is connected to the first electrode (2) and the second electrode (3) via internal wiring of the FPC soft board (1).

9. An optical module, characterized in that: A laser low-temperature heating device with controllable power consumption comprising the device described in any one of claims 1 to 8.

10. The optical module according to claim 9, characterized in that: The MCU is connected to a gold finger, the input side of the gold finger is connected to an optical module transmitter, the optical module transmitter comprises a transmission clock data recovery unit, a laser driving circuit, a transmitting end FPC soft board (1) and the coaxial laser (5) connected in sequence, and the input end of the transmission clock data recovery unit is connected to the gold finger; The output side of the gold finger is connected to an optical module receiver, which includes an optical receiver, a receiving end soft board, a limiting amplifier and a receiving clock data recovery unit connected in sequence, and the receiving clock data recovery unit is connected to the gold finger.

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