Multifunctional composite ceramic circuit board

Abstract

The utility model discloses a multifunctional composite ceramic circuit board, comprising a metal substrate, an upper ceramic layer, a lower ceramic layer and a conductive circuit layer; the side edge of the metal substrate extends outward with a grounding foot; the upper ceramic layer is laminated and bonded to the upper surface of the metal substrate, the upper surface of the upper ceramic layer is concavely provided with a cavity for positioning electronic devices, the bottom surface of the cavity is provided with a conducting hole, and a grounding component is arranged in the conducting hole. By placing the metal substrate between the upper ceramic layer and the lower ceramic layer and bonding and fixing them to form a composite structure, the metal substrate can greatly enhance the toughness of the product and avoid the product from being easily broken and damaged. At the same time, the grounding component is arranged in conjunction with the grounding component, which can be connected between the grounding pad of the electronic device and the metal substrate, so that the grounding circuit is independently separated from the conductive circuit layer, avoiding mutual interference between the circuits, effectively improving the performance of the product, and achieving the purpose of multi-function.

Description

Technical Field

[0001] The utility model relates to the field of ceramic circuit boards, in particular to a multifunctional composite ceramic circuit board. Background Art

[0002] With the gradual deepening of electronic technology in various application fields, the high integration of circuit boards has become an inevitable trend. Highly integrated packaging modules require a good heat dissipation bearing system, and the disadvantages of traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity) have become a bottleneck restricting the development of electronic technology. The LED industry, which has developed rapidly in recent years, has also put forward higher requirements for the TC indicators of its bearing circuit boards. In the field of high-power LED lighting, materials with good heat dissipation performance such as metals and ceramics are often used to prepare circuit substrates. The thermal conductivity of high thermal conductivity aluminum-based circuit boards is generally 1-4W / MK, while the thermal conductivity of ceramic-based circuit boards can reach about 220W / MK depending on their preparation methods and material formulations.

[0003] The main structure of the existing ceramic-based circuit board includes a ceramic substrate and a conductive circuit layer; the conductive circuit layer is arranged on the surface of the ceramic substrate. When in use, the electronic device is placed on the surface of the ceramic substrate and is welded to the conductive circuit layer.

[0004] However, in the prior art, the ceramic substrate is a single-layer structure. Due to the high brittleness of the ceramic material, the ceramic circuit board is easily broken and damaged. In addition, the conductor circuit layer combines the grounding circuit, power supply circuit, signal circuit and other circuits together, and the circuits are easily interfered with each other, resulting in a decrease in the performance of the product. Therefore, it is necessary to improve the current ceramic circuit board. Utility Model Content

[0005] In view of this, the present invention aims to address the deficiencies in the prior art, and its main purpose is to provide a multifunctional composite ceramic circuit board, which can effectively solve the problem that the existing ceramic circuit boards are easily broken and damaged and have reduced performance.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A multifunctional composite ceramic circuit board comprises a metal substrate, an upper ceramic layer, a lower ceramic layer and a conductive circuit layer; a grounding pin is extended outward from the side edge of the metal substrate; the upper ceramic layer is laminated and bonded to the upper surface of the metal substrate, a cavity for positioning electronic devices is formed on the upper surface of the upper ceramic layer, a via hole is provided on the bottom surface of the cavity, the via hole penetrates to the upper surface of the metal substrate, a grounding component is arranged in the via hole, one end of the grounding component is exposed in the cavity, and the other end of the grounding component is contacted and conducted with the upper surface of the metal substrate; the lower ceramic layer is laminated and bonded to the lower surface of the metal substrate; the conductive circuit layer is molded and fixed on the upper surface of the upper ceramic layer and is located beside the cavity.

[0008] As a preferred embodiment, a first through hole is formed through the upper and lower surfaces of the metal substrate, a first countersunk hole is recessed on the upper surface of the lower ceramic layer, and a first pin is extended downward from the lower surface of the upper ceramic layer. The first pin passes through the first through hole and is inserted into the first countersunk hole for positioning, so that the upper ceramic layer and the lower ceramic layer are firmly combined with the metal substrate.

[0009] As a preferred embodiment, a second through hole is formed through the upper and lower surfaces of the metal substrate, a second countersunk hole is recessed on the lower surface of the upper ceramic layer, a second pin extends upward from the upper surface of the lower ceramic layer, and the second pin passes through the second through hole and is inserted into the second countersunk hole for positioning, thereby further firmly combining the upper ceramic layer and the lower ceramic layer with the metal substrate.

[0010] As a preferred solution, grounding pins are radially symmetrically extended outward from both side edges of the metal substrate, and each grounding pin is provided with a fixing hole so as to be fixedly installed with an external chassis and realize grounding conduction at the same time.

[0011] As a preferred solution, the inner diameter of the lower section of the via hole is smaller than the inner diameter of the upper section. The grounding component includes a metal guide column, a metal ejector and a metal spring. The metal guide column can be movably arranged in the upper section of the via hole, and the metal ejector can be movably arranged in the via hole. The upper end of the metal ejector is matched with the upper section of the via hole, and the outer diameter of the upper end of the metal ejector is larger than the inner diameter of the lower section of the via hole. The lower end of the metal ejector is matched with the lower section of the via hole and passes through the lower section of the via hole to contact and conduct with the upper surface of the metal substrate. The metal spring is arranged in the upper section of the via hole and prompts the metal guide column to move upward and prompts the metal ejector to move downward, so that the metal guide column is elastically pressed against the grounding pad of the electronic device to maintain contact, the contact is stable and reliable, and no welding is required. At the same time, the metal ejector is also elastically pressed against the upper surface of the metal substrate to maintain contact, and the contact is stable and reliable, and no welding is required.

[0012] As a preferred solution, the upper ceramic layer is fixed to the upper surface of the metal substrate by laminating and bonding through the first thermally conductive adhesive layer, which has a stable structure, is easy to assemble, and has a good thermal conductive effect.

[0013] As a preferred solution, the lower ceramic layer is fixed to the lower surface of the metal substrate by laminating and bonding through the second thermally conductive adhesive layer, which has a stable structure, convenient assembly and good thermal conductivity.

[0014] Compared with the prior art, the utility model has obvious advantages and beneficial effects. Specifically, it can be seen from the above technical solution that:

[0015] By placing the metal substrate between the upper ceramic layer and the lower ceramic layer and bonding them to form a composite structure, the use of the metal substrate can greatly enhance the toughness of the product and prevent the product from being easily broken or damaged. At the same time, a grounding component is provided. The grounding component can be connected between the grounding pad of the electronic device and the metal substrate to make the grounding circuit and the conductive circuit layer independent and separate, avoiding mutual interference between circuits, effectively improving the performance of the product, and achieving the purpose of multi-function.

[0016] In order to more clearly illustrate the structural features and functions of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a cross-sectional schematic diagram of a preferred embodiment of the utility model;

[0018] Figure 2 yes Figure 1 Enlarged schematic diagram of position A in the middle.

[0019] Description of the accompanying drawings:

[0020] 10. Metal substrate 11. Ground pin

[0021] 101, fixing hole 102, first through hole

[0022] 103, second through hole 20, upper ceramic layer

[0023] 21. Cavity 22. Via hole

[0024] 23. Concave position 24. First pin

[0025] 25. Second countersunk hole 30. Lower ceramic layer

[0026] 31. First countersunk hole 32. Second pin

[0027] 40. Conductive circuit layer 50. Grounding component

[0028] 51. Metal guide pin 52. Metal ejector pin

[0029] 53. Metal spring 60. First thermal conductive adhesive layer

[0030] 70. Second thermal conductive adhesive layer. DETAILED DESCRIPTION

[0031] Please refer to Figure 1 to Figure 2 As shown, it shows the specific structure of a preferred embodiment of the utility model, including a metal substrate 10, an upper ceramic layer 20, a lower ceramic layer 30 and a conductive circuit layer 40.

[0032] The side edge of the metal substrate 10 extends outward with a grounding pin 11, and the grounding pin 11 is used to connect to an external grounding circuit. In this embodiment, the metal substrate 10 is an aluminum substrate or a copper-aluminum composite substrate, but is not limited thereto, and the thickness of the metal substrate 10 is 0.5 mm. The two side edges of the metal substrate 10 extend outward with grounding pins 11 radially and symmetrically, and each grounding pin 11 is provided with a fixing hole 101 so as to be fixedly installed with an external chassis and achieve grounding conduction at the same time. In addition, the upper and lower surfaces of the metal substrate 10 are penetrated with a first through hole 102, and the upper and lower surfaces of the metal substrate 10 are penetrated with a second through hole 103.

[0033] The upper ceramic layer 20 is laminated and bonded to the upper surface of the metal substrate 10. The upper surface of the upper ceramic layer 20 is concavely provided with a cavity 21 for positioning electronic devices. There are multiple cavities 21. The bottom surface of each cavity 21 is provided with a conducting hole 22. The conducting hole 22 penetrates to the upper surface of the metal substrate 10. A grounding component 50 is arranged in the conducting hole 22. One end of the grounding component 50 is exposed in the cavity 21, and the other end of the grounding component 50 is in contact with the upper surface of the metal substrate 10 for conduction. In this embodiment, the thickness of the upper ceramic layer 20 is 2-3 times the thickness of the metal substrate 10. The upper ceramic layer 20 is laminated and bonded to the upper surface of the metal substrate 10 through the first thermal conductive adhesive layer 60, and has a stable structure, convenient assembly, and good thermal conductivity. Furthermore, the inner diameter of the lower section of the via hole 22 is smaller than the inner diameter of the upper section. The grounding component 50 includes a metal guide column 51, a metal ejector pin 52 and a metal spring 53. The metal guide column 51 can be movably arranged at the upper section of the via hole 22, and the metal ejector pin 52 can be movably arranged in the via hole 22. The upper end of the metal ejector pin 52 is adapted to the upper section of the via hole 22. The outer diameter of the upper end of the metal ejector pin 52 is larger than the inner diameter of the lower section of the via hole 22. The lower end of the metal ejector pin 52 is adapted to the upper section of the via hole 22. The lower section of the metal substrate 10 is adapted to and passes through the lower section of the through hole 22 to contact and conduct with the upper surface of the metal substrate 10. The metal spring 53 is arranged at the upper section of the through hole 22 and promotes the metal guide pillar 51 to move upward and the metal ejector pin 52 to move downward, so that the metal guide pillar 51 is elastically pressed against the ground pad of the electronic device to maintain contact, the contact is stable and reliable, and no welding is required. At the same time, the metal ejector pin 52 is elastically pressed against the upper surface of the metal substrate 10 to maintain contact, the contact is stable and reliable, and no welding is required. And, the metal guide pillar 51, the metal ejector pin 52 and the metal spring 53 are all made of steel. And, the upper surface of the upper ceramic layer 20 is concavely provided with a concave position 23.

[0034] The lower ceramic layer 30 is laminated and bonded to the lower surface of the metal substrate 10. In this embodiment, the thickness of the lower ceramic layer 30 is 1-2 times the thickness of the metal substrate 10, and the lower ceramic layer 30 is laminated and bonded to the lower surface of the metal substrate 10 through the second thermal conductive adhesive layer 70, so the structure is stable, the assembly is convenient, and the thermal conductivity is good.

[0035] The conductive circuit layer 40 is formed and fixed on the upper surface of the upper ceramic layer 20 and is located beside the cavity 21. In this embodiment, the conductive circuit layer 40 is located in the concave position 23 so that the conductive circuit layer 40 and the upper ceramic layer 20 are firmly combined.

[0036] The upper surface of the lower ceramic layer 30 is provided with a first countersunk hole 31, and the lower surface of the upper ceramic layer 20 is provided with a first pin 24 extending downward, and the first pin 24 is inserted into the first countersunk hole 31 through the first through hole 102 for positioning, so that the upper ceramic layer 20 and the lower ceramic layer 30 are firmly combined with the metal substrate 10. The lower surface of the upper ceramic layer 20 is provided with a second countersunk hole 25, and the upper surface of the lower ceramic layer 30 is provided with a second pin 32 extending upward, and the second pin 32 is inserted into the second countersunk hole 25 through the second through hole 103 for positioning, so that the upper ceramic layer 20 and the lower ceramic layer 30 are further firmly combined with the metal substrate 10.

[0037] The method of using this embodiment is described in detail as follows:

[0038] When in use, the electronic device is embedded in the cavity 21 and fixed. After being fixed, the ground pad of the electronic device is in contact with the upper end of the metal guide column 51, and then the other welding feet of the electronic device are welded and connected with the conductive circuit layer 40. After the electronic device is installed in this product, screws are used to pass through the fixing holes 101 to fix the product to the chassis and ground it, and the conductive circuit layer 40 is connected to the external cable.

[0039] The design focus of the utility model is: by placing a metal substrate between the upper ceramic layer and the lower ceramic layer and bonding them to form a composite structure, the use of the metal substrate can greatly enhance the toughness of the product and prevent the product from being easily broken or damaged. At the same time, a grounding component is provided, and the grounding component can be connected between the grounding pad of the electronic device and the metal substrate, so that the grounding circuit is independently separated from the conductive circuit layer, avoiding mutual interference between the circuits, effectively improving the performance of the product, and achieving the purpose of multi-function.

[0040] The above description is only a preferred embodiment of the present invention and does not limit the technical scope of the present invention. Therefore, any slight modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A multifunctional composite ceramic circuit board, characterized in that: The invention comprises a metal substrate, an upper ceramic layer, a lower ceramic layer and a conductive circuit layer; a grounding pin is extended outward from the side edge of the metal substrate; the upper ceramic layer is laminated and bonded to the upper surface of the metal substrate, a cavity is recessed on the upper surface of the upper ceramic layer for positioning electronic components, a via hole is provided on the bottom of the cavity, the via hole penetrates to the upper surface of the metal substrate, a grounding component is arranged in the via hole, one end of the grounding component is exposed in the cavity, and the other end of the grounding component is contacted and conducted with the upper surface of the metal substrate; the lower ceramic layer is laminated and bonded to the lower surface of the metal substrate; the conductive circuit layer is molded and fixed on the upper surface of the upper ceramic layer and is located beside the cavity.

2. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: The upper and lower surfaces of the metal substrate are penetrated with a first through hole, the upper surface of the lower ceramic layer is recessed with a first countersunk hole, and the lower surface of the upper ceramic layer extends downward with a first pin, which passes through the first through hole and is inserted into the first countersunk hole for positioning.

3. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: The upper and lower surfaces of the metal substrate are penetrated with second through holes, the lower surface of the upper ceramic layer is recessed with a second countersunk hole, the upper surface of the lower ceramic layer extends upward with a second pin, and the second pin passes through the second through hole and is inserted into the second countersunk hole for positioning.

4. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: Grounding pins are radially and symmetrically extended outward from both side edges of the metal substrate, and each grounding pin is provided with a fixing hole.

5. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: The inner diameter of the lower section of the via hole is smaller than the inner diameter of the upper section. The grounding component includes a metal guide column, a metal ejector and a metal spring. The metal guide column can be movably arranged at the upper section of the via hole, and the metal ejector can be movably arranged in the via hole. The upper end of the metal ejector is matched with the upper section of the via hole, and the outer diameter of the upper end of the metal ejector is larger than the inner diameter of the lower section of the via hole. The lower end of the metal ejector is matched with the lower section of the via hole and passes through the lower section of the via hole to contact and conduct with the upper surface of the metal substrate. The metal spring is arranged at the upper section of the via hole and prompts the metal guide column to move upward and prompts the metal ejector to move downward.

6. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: The upper ceramic layer is fixed on the upper surface of the metal substrate by laminating and bonding through a first heat-conducting adhesive layer.

7. The multifunctional composite ceramic circuit board according to claim 1, characterized in that: The lower ceramic layer is fixed on the lower surface of the metal substrate by laminating and bonding through a second heat-conducting adhesive layer.

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