Water cooling module

Abstract

The utility model provides a water-cooled heat dissipation module, comprising: a heat-conducting base plate component, an upper cover component and a water pump component; the upper cover component is covered on the heat-conducting base plate component; the heat-conducting base plate component comprises a heat-conducting plate body, and the side of the heat-conducting plate body close to the upper cover component is concave to form a heat exchange cavity; the water pump component is arranged on the upper cover component; the upper cover component comprises an upper cover body and at least one cold water nozzle and at least one hot water nozzle respectively arranged on the upper cover body; the water inlet end of the water pump component is connected to the cold water nozzle; the water outlet end of the water pump component is connected to the heat exchange cavity; the heat exchange cavity is connected to the hot water nozzle. The water-cooled heat dissipation module of the utility model has a compact structure, small size, easy installation, and good heat dissipation effect while being equipped with a water pump component.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation, in particular to a water-cooled heat dissipation module. Background Art

[0002] With the rapid development of science and technology, the wattage of chips is increasing year by year, and the importance of heat dissipation of electronic products is becoming more and more important. If the heat dissipation effect of electronic products is poor, it will not only affect the working efficiency of electronic products, but also affect the life of electronic products. In more serious cases, it may cause explosion. Therefore, how to effectively dissipate heat is an important research and development.

[0003] At present, computers have gradually become an indispensable necessity in people's lives. The processing speed and performance of electronic devices such as graphics chips (GPU) and processors (CPU) in computers are gradually improving. When they are in operation, they will generate a lot of heat energy, which may cause the electronic devices to overheat and cause performance degradation, or even cause damage to the electronic devices due to the continuous increase in temperature.

[0004] In order to improve the heat dissipation effect of electronic devices, an air cooling system is usually used in the prior art to dissipate heat from the electronic devices, but air cooling has certain limitations in heat dissipation.

[0005] In the prior art, another heat dissipation module structure is composed of a heat pipe and a heat dissipation fin. In this structure, when dissipating heat for electronic devices with higher power (for example, chips with higher power wattage), it is necessary to increase the heating pipe and heat dissipation fin of the heat dissipation module, so that the volume of the heat dissipation module also increases. However, the heat dissipation module is installed inside the computer, and its installation is limited by the limited space of the computer itself, which limits the heat dissipation efficiency of the heat dissipation module.

[0006] In order to overcome the limitations of the air cooling system, a water cooling system has been proposed in the prior art to dissipate heat. The existing water cooling system is mainly composed of a water cooling head, a water cooling row and a pump. The water cooling heat dissipation module currently on the market has a cold head and a water cooling row installed inside the heat dissipation module and requires an external pump. When the existing heat dissipation module is equipped with a water cooling system, it is very inconvenient to assemble and occupies a large space, which is limited by the limited installation space of the computer.

[0007] Therefore, how to install a water-cooled heat dissipation device with small size, easy installation and high heat dissipation efficiency in a limited installation space has become a problem that researchers in this field have been committed to solving. Utility Model Content

[0008] In view of the deficiencies in the prior art, the utility model provides a water-cooled heat dissipation module, which has a built-in water pump component and is compact in structure, small in size, easy to install, and has good heat dissipation effect.

[0009] The purpose of this utility model is achieved through the following technical solutions:

[0010] A water-cooling heat dissipation module comprises: a heat-conducting base plate component, an upper cover component and a water pump component; the upper cover component is disposed on the heat-conducting base plate component;

[0011] The heat-conducting bottom plate assembly includes a heat-conducting plate body, and a side of the heat-conducting plate body close to the upper cover assembly is concave to form a heat exchange cavity; the water pump assembly is arranged on the upper cover assembly;

[0012] The upper cover assembly comprises an upper cover body and at least one cold water faucet and at least one hot water faucet respectively arranged on the upper cover body;

[0013] The water inlet end of the water pump assembly is communicated with the cold water faucet; the water outlet end of the water pump assembly is communicated with the heat exchange cavity; and the heat exchange cavity is communicated with the hot water faucet.

[0014] The water-cooling heat dissipation module of the utility model arranges the water pump component on the upper cover component, which is very convenient to assemble, has a compact structure and occupies little space. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0016] Figure 1 It is a schematic diagram of the overall structure of the heat dissipation device of the utility model;

[0017] Figure 2 for Figure 1 The structural schematic diagram of the heat-conducting base plate assembly shown;

[0018] Figure 3 for Figure 2 An exploded schematic diagram of a thermally conductive base plate assembly is shown;

[0019] Figure 4 for Figure 1 The structural schematic diagram of the upper cover assembly shown (I);

[0020] Figure 5 for Figure 1 The structural schematic diagram of the upper cover assembly shown (II);

[0021] Figure 6 for Figure 1 The schematic diagram of the structure of the water pump assembly shown;

[0022] Figure 7 for Figure 6 The schematic diagram of the structure of the water pump body shown;

[0023] Figure 8 for Figure 6The schematic diagram of the structure of the pump body shown;

[0024] Fig. 9 for Figure 6 The schematic diagram of the structure of the water pump cover shown in (I);

[0025] Fig.10 for Figure 6 The schematic diagram of the structure of the water pump cover shown in FIG.

[0026] Fig.11 for Figure 6 A schematic diagram of a portion of the structure of the pump body shown;

[0027] Fig.12 for Figure 1 Schematic diagram of the application of the heat dissipation device shown. DETAILED DESCRIPTION

[0028] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings below. People familiar with this technology can easily understand other advantages and effects of the utility model from the content disclosed in this specification. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions that can be implemented in the utility model, so they have no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that can be produced by the utility model and the purpose that can be achieved, should still fall within the scope of the technical content disclosed in the utility model. At the same time, the terms such as "upper", "lower", "left", "right" and "middle" quoted in this specification are only for the convenience of narration, and are not used to limit the scope of the implementation of the utility model, and the change or adjustment of their relative relationship. Without substantially changing the technical content, it should also be regarded as the scope of the implementation of the utility model.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] like Figure 1 As shown, the utility model discloses a water cooling module 1, comprising: a heat-conducting base plate assembly 10, an upper cover assembly 20 and a water pump assembly 30. The upper cover assembly 20 is disposed on the heat-conducting base plate assembly 10. Figure 2 and Figure 3As shown, the heat-conducting base plate assembly 10 includes a heat-conducting plate body 110, and a side of the heat-conducting plate body 110 close to the upper cover assembly 20 is concave to form a heat exchange cavity 111; the water pump assembly 30 is disposed on the upper cover assembly 20. Figure 4 As shown, the upper cover assembly 20 includes an upper cover body 210 and at least one cold water faucet 220 and at least one hot water faucet 230 respectively disposed on the upper cover body 210. The water inlet of the water pump assembly 30 is communicated with the cold water faucet 220; the water outlet of the water pump assembly 30 is communicated with the heat exchange chamber 111; and the heat exchange chamber 111 is also communicated with the hot water faucet 230. Cold water from an external liquid supply device (e.g., an external water drain) enters the water pump assembly 30 from the cold water faucet 220, and the cold water is pressurized by the water pump assembly 30 and flows into the heat exchange chamber 111 at a high speed through the water outlet. The cold water absorbs heat in the heat exchange chamber 111 and becomes hot water, and the hot water in the heat exchange chamber 111 flows out through the hot water faucet 230 (e.g., flows back to the external water drain). Compared with the water-cooling heat dissipation module in the prior art that is externally connected to a water pump assembly, the water-cooling heat dissipation module 1 of the present invention sets the water pump assembly 30 on the upper cover assembly 20, which is very convenient to assemble, and has a compact structure and occupies a small space. When the water-cooling heat dissipation module 1 of the present invention is used, the heat-conducting bottom plate assembly 10 is attached to the circuit board 2 to be cooled. Preferably, the heat exchange cavity 111 corresponds to the heating device of the circuit board 2 to be cooled.

[0031] like Figure 4 As shown in FIG. 2 , in this embodiment, the upper cover body 210 is provided with a receiving groove 211. The water pump assembly 30 is installed in the receiving groove 211. Figure 6 As shown, the water pump assembly includes: a water pump body 310, a water pump cover 320 and a PCB board 330. The water pump cover 320 is covered on the water pump body 310. The PCB board 330 is arranged on the side of the water pump cover 320 away from the heat-conducting base plate assembly 10. The water pump body 310 and the water pump cover 320 are fixedly connected by locking screws. The water pump body 310 and the water pump cover 320 are connected by locking screws, which is convenient for installation and disassembly.

[0032] The utility model provides a receiving groove 211 on the upper cover body 210 and installs the water pump assembly in the receiving groove 211 , so that the structure of the water cooling module 1 is more compact and the volume is small.

[0033] like Figures 7 to 11As shown, in this embodiment, the water pump body 310 includes: a pump body 311, a pump shaft 312, an impeller 313 and a magnetic body 314. The pump body 311 is provided with a cavity 315; the magnetic body 314 is sleeved on the pump shaft 312, and the magnetic body 314 is disposed on the impeller 313 and is drivingly connected to the impeller 313; the impeller 313 is disposed in the cavity 315 and is rotationally connected to the pump body 311; one end of the pump shaft 312 is rotationally connected to the pump body 311, and the other end extends to the water pump cover 320 and is rotationally connected to the water pump cover 320.

[0034] The pump body 311 also has a water outlet 3111 (i.e., the water outlet of the water pump assembly), and the cavity 315 is connected to the water outlet 3111. The pump body 311 also has a water inlet 3112 (i.e., the water inlet of the water pump assembly), and the cavity 315 is connected to the water inlet 3112.

[0035] like Figure 7 and Fig.11 As shown, in this embodiment, the water pump body 311 further includes a shaft sealing device 316 , and the shaft sealing device 316 is sleeved on the pump shaft 312 .

[0036] like Figure 6 As shown, in this embodiment, the PCB board 330 is fixedly connected to the water pump cover 320. Specifically, the PCB board 330 is provided with a group of first connection holes 331, and the water pump cover 320 is provided with a group of second connection holes 321, and the first connection holes 331 correspond to the second connection holes 321 one by one; the PCB board 330 and the water pump cover 320 are fixedly connected by locking screws through the first connection holes 331 and the second connection holes 321. Specifically, the number of the first connection holes 331 is two, and the two first connection holes 331 are arranged at two diagonal corners of the PCB board 330.

[0037] like Figure 7 and Fig. 9 As shown, in this embodiment, the water pump cover 320 is fixedly connected to the pump body 311. Specifically, the water pump cover 320 is further provided with a set of third connection holes 322, and the pump body 311 is further provided with a fourth connection hole 3113. The third connection holes 322 correspond to the fourth connection holes 3113 one by one. The water pump cover 320 and the pump body 311 are fixedly connected by locking screws through the third connection holes 322 and the fourth connection holes 3113.

[0038] like Figure 4 and Figure 6As shown, in the present embodiment, the water pump upper cover 320 is fixedly connected to the upper cover body 210 to achieve a fixed connection between the water pump body 310 and the upper cover body 210. Specifically, a group of fifth connection holes 323 are provided at the edge of the water pump upper cover 320, and the upper cover body 210 is also provided with a group of sixth connection holes 212, and the sixth connection holes 212 are distributed around the accommodating groove 211. The fifth connection holes 323 correspond one to one with the sixth connection holes 212. The water pump upper cover 320 is fixedly connected to the upper cover body 210 by means of locking screws through the fifth connection holes 323 and the sixth connection holes 212. In the present embodiment, at least one induction coil 324 is provided on the side of the water pump upper cover 320 close to the PCB board 330. The induction coil 324 is electrically connected to the PCB board 330. As shown Figure 6 and Fig.10 As shown, specifically, one side of the water pump cover 320 close to the PCB board 330 is concave to form at least one first groove 325, and the induction coil 324 is arranged in the first groove 325. After the induction coil 324 is connected to the power supply via the PCB board 330, a rotating magnetic field is generated, thereby driving the magnetic body 314, the pump shaft 312, and the impeller 313 to rotate, so that the water pump assembly works. As a preferred embodiment, the number of induction coils 324 is multiple, and correspondingly, the number of first grooves 325 is multiple, and the induction coils 324 correspond to the first grooves 325 one by one; and the multiple induction coils 324 are equidistant and distributed in a ring shape with the center line of the pump shaft 312 as the center. As shown in FIG. Figure 2 and Figure 3 As shown, in this embodiment, the heat exchange chamber 111 is provided with at least one heat exchange fin 112. The heat exchange fin 112 quickly absorbs the heat of the heat conducting plate body 110 and quickly heats the cold water in the heat exchange chamber 111. The cold water flows out from the water outlet 3111 after being heated in the heat exchange chamber 111, thereby further improving the heat exchange efficiency.

[0039] like Figure 2 Figure 3 As shown, in this embodiment, the heat-conducting bottom plate assembly 10 further includes a heat-exchange cover 120. The heat-exchange cover 120 is disposed on the heat-exchange cavity 111. The heat-exchange cover 120 is provided with a first cold water inlet 121; the first cold water inlet 121 is communicated with the heat-exchange cavity 111, and the first cold water inlet 121 is also communicated with the water outlet 3111 of the water pump assembly 30 through a cold water channel. The heat-exchange cover 120 is also provided with a first hot water outlet 122, and the first hot water outlet 122 is communicated with the heat-exchange cavity 111. One side of the heat-conducting plate body 110 close to the upper cover assembly 20 is concave to form a first hot water channel 113, and one end of the first hot water channel 113 is communicated with the first hot water outlet 122. The heat-exchange cover 120 is disposed on the heat-exchange cavity 111 to protect the heat-exchange fins 112 in the heat-exchange cavity 111.

[0040] like Figure 5As shown, in this embodiment, the upper cover body 210 is further provided with at least one second cold water inlet 240 and at least one second hot water outlet 250; the second cold water inlet 240 is connected to the cold water faucet 220, and the second hot water outlet 250 is connected to the hot water faucet 230. Figure 3 As shown, the side of the heat conducting plate 110 close to the upper cover assembly 20 is also concave to form a third hot water channel 114. Figure 5 As shown, the upper cover body 210 is concave on one side close to the heat conducting plate body 110 to form a second hot water channel 213 and a fourth hot water channel 214. The first hot water channel 113, the second hot water channel 213, the third hot water channel 114, and the fourth hot water channel 214 are connected in sequence to form a hot water flow channel; one end of the fourth hot water channel 214 is connected to the second hot water outlet 250. The hot water flow channel surrounds the heat exchange cavity 111. The water-cooled heat dissipation module 1 of the utility model forms multiple sections of hot water channels by forming concave portions in the heat conducting plate body 110 and the upper cover body 210, and the multiple sections of hot water channels are connected in sequence to form a complete hot water flow channel, so that no additional space is required, making the structure of the water-cooled heat dissipation module 1 more compact and smaller in size.

[0041] like Figure 4 and Figure 5 As shown, in this embodiment, the side of the upper cover body 210 close to the heat conducting plate body 110 is also concave to form a first cold water channel 215 and a second cold water channel 216. The side of the receiving groove 211 close to the heat conducting plate body 110 is provided with a second groove 2111 and a third groove 2112. The first cold water channel 215 is connected to the second groove 2111, and the second cold water channel 216 is connected to the third groove 2112; one end of the first cold water channel 215 is connected to the water inlet end 3112 of the water pump assembly 30 through the second groove 2111, and the other end is connected to the second cold water inlet 240. One end of the second cold water channel 216 is connected to the water outlet end 3111 of the water pump assembly 30 through the third groove 2112, and the other end is connected to the first cold water inlet 121. By forming multiple sections of cold water channels in the concave of the heat conducting plate body 110 and the upper cover body 210, no additional space is required, so that the structure of the water-cooled heat dissipation module 1 is more compact and smaller in size. Moreover, cold water flows into the first cold water channel 215 through the second cold water inlet 240, and the cold water flows from the first cold water channel 215 into the water inlet end 3112 of the water pump assembly 30 through the second groove 2111. After being pressurized by the water pump assembly 30, the cold water flows out from the water outlet end 3111 of the water pump assembly 30 to the third groove 2112 and then flows into the second cold water channel 216 from the third groove 2112, thereby realizing the in-and-out action of the cold water in the water pump assembly 30, thereby realizing the isolation of the water path and the circuit (PCB board 30 and induction coil 324).

[0042] Please also read Figures 1 to 12, the working process of the water cooling module 1 of the utility model:

[0043] The cold water faucet 220 is connected to an external water supply device (e.g., an external water drain), and the cold water outputted by the water supply device flows from the cold water faucet 220 into the second cold water inlet 240, and the cold water flows into the first cold water channel 215 through the second cold water inlet 240. After flowing through the first cold water channel 215, the cold water enters the water pump assembly 30 through the second groove 2111 and the water inlet end 3112 of the water pump assembly 30 in sequence for pressurization; the pressurized cold water flows from the water outlet end 3111 of the water pump assembly 30 in sequence into the second cold water channel 216 of the third groove 2112, and after pressurization, The cold water flows through the second cold water channel 216 and then enters the heat exchange chamber 111 through the first cold water inlet 121; the cold water in the heat exchange chamber 111 is heated by the heat conductive plate body 110 and the heat exchange fins 112 to become hot water, and the hot water in the heat exchange chamber 111 flows out to the hot water flow channel through the first hot water outlet 122; the hot water flows through the hot water flow channel and then flows out from the second hot water outlet 230, and finally flows out from the hot water nozzle 250 to the outside of the water-cooled heat dissipation module 1 (for example, an external water drain), thereby taking away the heat absorbed by the water-cooled heat dissipation module 1 to achieve heat dissipation and cooling.

[0044] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A water cooling module, characterized in that: include: A heat-conducting base plate component, an upper cover component and a water pump component; the upper cover component is disposed on the heat-conducting base plate component; The heat-conducting bottom plate assembly includes a heat-conducting plate body, and a side of the heat-conducting plate body close to the upper cover assembly is concave to form a heat exchange cavity; the water pump assembly is arranged on the upper cover assembly; The upper cover assembly comprises an upper cover body and at least one cold water faucet and at least one hot water faucet respectively arranged on the upper cover body; The water inlet end of the water pump assembly is communicated with the cold water faucet; the water outlet end of the water pump assembly is communicated with the heat exchange cavity; and the heat exchange cavity is communicated with the hot water faucet.

2. The water cooling heat dissipation module according to claim 1, characterized in that: The upper cover body is provided with a receiving groove; the water pump assembly is installed in the receiving groove.

3. The water cooling heat dissipation module according to claim 2, characterized in that: The water pump assembly includes: a water pump body, a water pump cover and a PCB board; The water pump upper cover is disposed on the water pump body; the PCB board is disposed on a side of the water pump upper cover away from the heat-conducting bottom plate assembly.

4. The water cooling heat dissipation module according to claim 3, characterized in that: The water pump body includes: a pump body, a pump shaft and an impeller; The pump body is provided with a cavity, the pump shaft is arranged in the cavity and is rotatably connected with the pump body; the impeller is arranged in the cavity, and the impeller is drivingly connected with the pump shaft; The main body is also provided with a water outlet, and the cavity is communicated with the water outlet.

5. The water cooling heat dissipation module according to claim 4, characterized in that: The water pump body also includes a shaft sealing device, and the shaft sealing device is sleeved on the pump shaft.

6. The water cooling heat dissipation module according to claim 3, characterized in that: At least one induction coil is arranged on one side of the water pump upper cover close to the PCB board, and the induction coil is electrically connected to the PCB board.

7. The water cooling module according to claim 6, characterized in that: A side of the water pump upper cover close to the PCB board is concave to form at least one first groove, and the induction coil is arranged in the first groove.

8. The water cooling module according to claim 1, characterized in that: The heat exchange chamber is provided with at least one heat exchange fin.

9. The water cooling module according to claim 1, characterized in that: The heat-conducting bottom plate assembly further comprises a heat-exchange cover; the heat-exchange cover is disposed on the heat-exchange cavity; the heat-exchange cover is provided with a first cold water inlet; the first cold water inlet is communicated with the heat-exchange cavity, and the first cold water inlet is also communicated with the water outlet of the water pump assembly through a cold water channel; The heat exchange cover is also provided with a first hot water outlet, which is communicated with the heat exchange cavity; A side of the heat-conducting bottom plate close to the upper cover assembly is concave to form a first hot water channel, and one end of the first hot water channel is connected to the first hot water outlet.

10. The water cooling heat dissipation module according to claim 9, characterized in that: The upper cover is also provided with at least one second cold water inlet and at least one second hot water outlet; the second cold water inlet is connected to the cold water nozzle, and the second hot water outlet is connected to the hot water nozzle; The side of the heat conducting plate body close to the upper cover assembly is also concave to form a third hot water channel; The side of the upper cover close to the heat conducting plate body is concave to form a second hot water channel and a fourth hot water channel; The first hot water channel, the second hot water channel, the third hot water channel, and the fourth hot water channel are sequentially connected to form a hot water flow channel; one end of the fourth hot water channel is connected to the second hot water outlet.

11. The water cooling heat dissipation module according to claim 10, characterized in that: The hot water channel surrounds the heat exchange cavity.

12. The water cooling module according to claim 10, characterized in that: The side of the upper cover close to the heat-conducting plate body is also concave to form a first cold water channel and a second cold water channel; the side of the accommodating groove close to the heat-conducting plate body is provided with a second groove and a third groove; the first cold water channel is connected to the second groove, and the second cold water channel is connected to the third groove; one end of the first cold water channel is connected to the water inlet end of the water pump assembly through the second groove, and the other end is connected to the second cold water inlet; one end of the second cold water channel is connected to the water outlet end of the water pump assembly through the third groove, and the other end is connected to the first cold water inlet.

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