Radiator assembly

Abstract

The utility model discloses a heat sink assembly, which relates to the technical field of heat dissipation equipment, wherein the heat sink assembly includes: a heat dissipation profile that contacts and connects with a chip on a PCB board and performs heat exchange; a housing is formed with a cavity and an air outlet and an air inlet that are connected to the cavity are provided, the heat dissipation profile and the PCB board are both contained in the cavity, and the heat dissipation profile is located between the PCB board and the inner wall of the cavity; and a fan is connected to the housing, the inner wall of the cavity is formed with a mounting groove, the fan is arranged in the mounting groove, and the fan is located on the side of the heat dissipation profile facing the inner wall of the cavity, the heat dissipation profile includes a heat conducting part, and the fan is also arranged opposite to the heat conducting part, wherein the fan rotates so that the external airflow enters the cavity from the air inlet and forms a heat dissipation airflow that blows toward the heat dissipation profile, the heat dissipation airflow performs heat exchange with the heat dissipation profile, and is discharged from the air outlet. The heat sink assembly provided by the technical solution of the utility model can improve the heat dissipation efficiency and meet the heat dissipation requirements.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation equipment, in particular to a radiator assembly. Background Art

[0002] With the development of electronic and electrical equipment, in order to meet user demand for products, the power circuit conversion capacity of electrical products has been continuously increased, and the power consumption has increased accordingly, so the heat generated has increased sharply. The traditional radiator has a single heat dissipation method and poor heat dissipation effect, and cannot meet the heat dissipation requirements. Utility Model Content

[0003] The main purpose of the utility model is to provide a radiator assembly, aiming to solve the current traditional radiator

[0004] To achieve the above-mentioned purpose, the radiator assembly proposed by the utility model comprises:

[0005] A heat dissipation profile, the heat dissipation profile is in contact with and connected to the chip on the PCB board to perform heat exchange;

[0006] A housing, wherein the housing is formed with a cavity and is provided with an air outlet and an air inlet communicated with the cavity, the heat dissipation profile and the PCB board are both accommodated in the cavity, and the heat dissipation profile is located between the PCB board and the inner wall of the cavity; and

[0007] A fan, wherein the fan is connected to the shell, an installation groove is formed on the inner wall of the cavity, the fan is arranged in the installation groove, and the fan is located on the side of the heat dissipation profile facing the inner wall of the cavity, the heat dissipation profile includes a heat conducting portion, and the fan is also arranged opposite to the heat conducting portion, wherein the fan rotates so that external airflow enters the cavity from the air inlet and forms a heat dissipation airflow blowing toward the heat dissipation profile, the heat dissipation airflow exchanges heat with the heat dissipation profile, and is discharged from the air outlet.

[0008] In one embodiment, the heat sink assembly further includes a heat conducting layer, and the heat dissipation profile contacts the chip through the heat conducting layer to perform heat exchange.

[0009] In one embodiment, the heat dissipation profile includes a substrate and a heat dissipation plate, the substrate is connected to the heat conductive layer, a plurality of heat dissipation plates are provided, and the plurality of heat dissipation plates are arranged in parallel and at intervals on a side of the substrate away from the PCB board, a heat dissipation channel is formed between adjacent heat dissipation plates, and the heat dissipation airflow flows along the heat dissipation channel.

[0010] In one embodiment, the heat dissipation plate includes a heat dissipation portion and an avoidance portion, and in a direction perpendicular to the substrate, an extension length of the heat dissipation portion is greater than an extension length of the avoidance portion.

[0011] In one embodiment, a boss is provided on a side of the substrate facing away from the heat dissipation plate, and the boss is used to contact the heat dissipation components on the PCB.

[0012] In one embodiment, the heat conductive layer is heat conductive silicone.

[0013] In one embodiment, the shell includes an air outlet and an air inlet, the air outlet is provided with a plurality of heat dissipation fins, a guide channel is formed between two adjacent heat dissipation fins, the air outlet is arranged in the guide channel, the air inlet is arranged corresponding to the mounting groove, the air inlet is arranged in the air inlet, and the air inlet is provided with a plurality of the air inlets.

[0014] In one embodiment, the air inlet portion includes a decorative portion, and a plurality of the air inlets are arranged in parallel along the circumference of the decorative portion.

[0015] In one embodiment, the shell includes a main board, a side panel and a fixed plate, the side panel is connected to the edge of the main board, and the side panel and the main board form the cavity, the main board and the side panel are both provided with the air outlet, the air inlet is provided on the main board, the fixed plate is connected to the side panel, and the fixed plate has a mounting hole.

[0016] In one embodiment, the housing is provided with a mounting column, a plurality of the mounting columns are provided, and the mounting columns are used to mount the fan, the heat dissipation profile and the PCB board, and the mounting columns are arranged in the cavity.

[0017] The technical solution of the utility model achieves the purpose of heat dissipation by using a heat dissipation profile to contact and exchange heat with the PCB board that needs heat dissipation. Specifically, a fan is installed on the shell, and the fan rotates and blows toward the heat dissipation profile to form a heat dissipation airflow, and takes away the heat in the heat dissipation profile and the cavity. In this way, the PCB board is cooled by the action of both the heat dissipation profile and the fan, and the heat dissipation efficiency is improved. In addition, the shell is provided with an air inlet and an air outlet, and the outside air enters the cavity through the air inlet, and is discharged from the air outlet after carrying the heat, so that the heat in the cavity can be quickly discharged, further improving the heat dissipation efficiency, and thus meeting the heat dissipation requirements. In addition, the radiator assembly has a simple structure and is easy to install. The radiator assembly can be assembled first, and the entire radiator assembly can be directly installed on the product equipment after the assembly is completed, which simplifies the installation process and improves production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0019] Figure 1 An exploded structural diagram of a heat sink assembly embodiment provided by the utility model at an angle;

[0020] Figure 2 This is a schematic diagram of an exploded structure of a heat sink assembly embodiment provided by the utility model from another angle;

[0021] Figure 3 This is a schematic structural diagram of a shell of a radiator assembly embodiment provided by the utility model.

[0022] Description of Figure Numbers:

[0023] 100, housing; 110, air outlet; 111, air outlet; 112, heat dissipation fin; 113, air guide channel; 120, air inlet; 121, air inlet; 122, decorative part; 130, mounting groove; 140, main board; 150, side panel; 160, fixing plate; 161, mounting hole; 170, mounting column;

[0024] 200, heat dissipation profile; 210, substrate; 211, heat conduction portion; 220, heat dissipation plate; 221, heat dissipation portion; 222, avoidance portion; 230, heat dissipation channel; 240, boss;

[0025] 300, fan;

[0026] 400, thermal conductive layer;

[0027] 500, PCB board; 510, chip.

[0028] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0030] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.

[0032] In the prior art, in order to meet user demand for products, the power circuit conversion capacity of electrical products continues to increase, and power consumption increases accordingly, so the heat generated increases sharply. The traditional radiator has a single heat dissipation method and poor heat dissipation effect, and cannot meet the heat dissipation requirements.

[0033] The utility model provides a radiator assembly.

[0034] See also Figures 1 to 3 As shown, in one embodiment of the utility model, the heat sink assembly includes: a heat dissipation profile 200, a housing 100 and a fan 300, the heat dissipation profile 200 is in contact with and connected to a chip 510 on a PCB board 500 for heat exchange; the housing 100 is formed with a cavity and has an air outlet 111 and an air inlet 121 connected to the cavity, the heat dissipation profile 200 and the PCB board 500 are both accommodated in the cavity, and the heat dissipation profile 200 is located between the PCB board 500 and the inner wall of the cavity; the fan 300 and the housing are connected to each other. 100 is connected, an installation groove 130 is formed on the inner wall of the cavity, a fan 300 is arranged in the installation groove 130, and the fan 300 is located on the side of the heat dissipation profile 200 facing the inner wall of the cavity, the heat dissipation profile 200 includes a heat conducting portion 211, and the fan 300 is also arranged opposite to the heat conducting portion 211, wherein the fan 300 rotates so that the external airflow enters the cavity from the air inlet 121 and forms a heat dissipation airflow blowing toward the heat dissipation profile 200, the heat dissipation airflow exchanges heat with the heat dissipation profile 200, and is discharged from the air outlet 111.

[0035] In the specific implementation process, the heat dissipation profile 200 contacts the chip 510 on the PCB board 500 to dissipate heat for the chip 510. It should be noted that the PCB board 500 is mounted on the product, and the heat dissipation profile 200 is made of aluminum to improve the efficiency of heat conduction, thereby improving the heat dissipation efficiency of the chip 510. The shell 100 is surrounded by a cavity, one side of the cavity has an opening and faces the product, the shell 100 is mounted on the product, and the shell 100 and the product are the cavity walls of the cavity. The side of the PCB board 500 with components mounted faces the housing, and the PCB board 500 is also mounted on the shell 100 by screws and is located in the cavity, thereby facilitating the heat dissipation profile 200 to contact the chip 510 on the PCB board 500 for heat dissipation.

[0036] The fan 300 has an air inlet surface and an air outlet surface. It is understandable that the fan 300 rotates so that the airflow enters the fan 300 from the air inlet surface and is discharged through the air outlet surface. In this embodiment, the air inlet surface faces the housing 100 and is arranged opposite to the air inlet 121. The air outlet surface blows air toward the heat dissipation profile 200. In this way, the fan 300 rotates so that the outside air enters the cavity from the air inlet 121. Most of the airflow flows through the heat dissipation profile 200 and is discharged through the air outlet 111, thereby forming a heat dissipation airflow. The air outlet 111 opened on the housing 100 can accelerate the heat dissipation airflow in the cavity to be discharged from the cavity, further improving the heat dissipation effect. The chip 510 dissipates heat by contacting the heat dissipation profile 200 for heat transfer, and the heat received by the heat dissipation profile 200 is quickly taken away by the heat dissipation airflow generated by the fan 300, thereby achieving heat dissipation, and the heat dissipation effect is greatly improved.

[0037] The inner wall of the cavity is recessed toward the outer wall of the housing 100, and the outer wall of the housing 100 is protruded, thereby forming a mounting groove 130 in the cavity, the contour of the mounting groove 130 is adapted to the fan 300, and the fan 300 is fixed in the mounting groove 130. It should be noted that a mounting column 170 for mounting the fan 300 is protruded from the inner wall of the cavity of the mounting groove 130 near the edge of the mounting groove 130, and one side of the air inlet surface of the fan 300 is located in the mounting groove 130, and the air outlet surface faces the heat dissipation profile 200.

[0038] The technical solution of the utility model achieves the purpose of heat dissipation by using a heat dissipation profile 200 to contact and exchange heat with a PCB board 500 that needs heat dissipation. Specifically, a fan 300 is installed in the housing 100, and the fan 300 rotates and blows toward the heat dissipation profile 200 to form a heat dissipation airflow, and takes away the heat in the heat dissipation profile 200 and the cavity. In this way, under the action of both the heat dissipation profile 200 and the fan 300, the PCB board 500 is cooled together to improve the heat dissipation efficiency. In addition, the housing 100 is provided with an air inlet 121 and an air outlet 111, and the outside air enters the cavity through the air inlet 121, and is discharged from the air outlet 111 after carrying heat, so that the heat in the cavity can be quickly discharged, further improving the heat dissipation efficiency, and then meeting the heat dissipation requirements. In addition, the radiator assembly has a simple structure and is easy to install. The radiator assembly can be assembled first, and the entire radiator assembly can be directly installed on the product equipment after the assembly is completed, simplifying the installation process and improving production efficiency.

[0039] In one embodiment, the heat sink assembly further includes a heat conducting layer 400, which is connected to the heat conducting portion 211, and is also connected to the chip 510, so that the heat dissipation profile 200 contacts and exchanges heat with the chip 510 through the heat conducting layer 400. The heat conducting layer 400 can improve the heat exchange and heat conduction efficiency, and the heat generated by the chip 510 is quickly transferred to the heat sink assembly through the heat conducting layer 400. In the specific implementation process, the heat conducting layer 400 is a heat conducting silica gel, which is in close contact with the chip 510 and the heat sink assembly to transfer heat, thereby improving the heat dissipation efficiency.

[0040] In one embodiment, the heat dissipation profile 200 includes a substrate 210 and a heat dissipation plate 220, the heat conducting portion 211 is disposed on the substrate 210, a plurality of heat dissipation plates 220 are provided, and the plurality of heat dissipation plates 220 are parallelly and spaced apart on a side of the substrate 210 away from the PCB board 500, a heat dissipation channel 230 is formed between adjacent heat dissipation plates 220, and the heat dissipation airflow flows along the heat dissipation channel 230.

[0041] In the specific implementation process, the heat conducting part 211 is arranged on one surface of the substrate 210 and connected to the heat conducting layer 400, and is used to receive the heat transferred by the heat conducting layer 400. The other side is connected to the heat dissipation plate 220, and the heat is further transferred to the heat dissipation plate 220. The heat dissipation plate 220 exchanges heat with the surrounding air to dissipate heat. There are multiple heat dissipation plates 220, and the heat dissipation efficiency is high relative to the substrate 210. Furthermore, the heat dissipation plates 220 and the substrate 210 are perpendicular to each other, and a heat dissipation channel 230 is formed between adjacent heat dissipation plates 220. The fan 300 blows air toward the heat dissipation plate 220, and the airflow takes away the heat through the heat dissipation channel 230, thereby improving the heat dissipation efficiency.

[0042] Furthermore, the heat sink 220 includes a heat sink 221 and an avoidance portion 222. In a direction perpendicular to the substrate 210, the extension length of the heat sink 221 is greater than the extension length of the avoidance portion 222. In this way, the heat sink 220 forms a step-like structure, the heat sink 221 is close to the air outlet 111, and the avoidance portion 222 is opposite to the fan 300, that is, the air outlet surface of the fan 300 blows air toward the avoidance portion 222, and the air flow flows along the heat dissipation channel 230, flows to the heat sink 221, and is further discharged from the air outlet 111. The avoidance portion 222 has a short extension length. On the one hand, it can avoid the fan 300, which is easy to install. On the other hand, there is a certain distance between the avoidance portion 222 and the fan 300, so that the air flow can be diffused, expanding the air flow area, and the air flow blown by the fan 300 can be diffused around the avoidance portion 222, thereby improving the heat dissipation effect.

[0043] In one embodiment, a boss 240 is provided on the side of the substrate 210 facing away from the heat sink 220, and the boss 240 is used to contact the heat dissipation components on the PCB 500. It should be noted that the heat dissipation components on the PCB 500 are components that need to be dissipated, such as another chip, etc. The boss 240 protrudes from the surface of the substrate 210, and the boss 240 is used to contact the components that need to be dissipated to achieve the purpose of heat dissipation.

[0044] In one embodiment, the shell 100 includes an air outlet portion 110 and an air inlet portion 120, the air outlet portion 110 is provided with a plurality of heat dissipation fins 112, a guide channel 113 is formed between two adjacent heat dissipation fins 112, the air outlet 111 is provided in the guide channel 113, the air inlet portion 120 is provided corresponding to the mounting groove 130, the air inlet 121 is provided in the air inlet portion 120, and the air inlet portion 120 is provided with a plurality of air inlets 121.

[0045] In the specific implementation process, the air outlet 110 corresponds to the heat dissipation portion 221 of the heat dissipation plate 220, and the air inlet 120 corresponds to the fan 300. Specifically, the heat dissipation fins 112 of the air outlet 110 protrude from the surface of the housing 100, and the space enclosed by the two heat dissipation fins 112 and the surface of the housing 100 forms a guide channel 113. Further, the air outlet 111 is arranged in the guide channel 113, and the heat dissipation airflow in the cavity enters the guide channel 113 after being discharged from the air outlet 111. On the one hand, the guide channel 113 can speed up the circulation speed of the airflow, thereby improving the heat dissipation efficiency. On the other hand, the heat dissipation fins 112 can increase the contact area with the heat dissipation airflow, thereby improving the heat dissipation efficiency. The air inlet surface of the fan 300 is opposite to the air inlet 121, and the fan 300 blows air toward the heat dissipation profile 200, so that the air pressure on the air outlet side is reduced, so that the external air enters the cavity from the air inlet 121, and flows from the air inlet surface to the air outlet surface through the fan 300, and further blows toward the heat dissipation profile 200, forming a heat dissipation airflow. The air inlet surface of the fan 300 is opposite to the air inlet 121, so that the airflow is directly blown from the fan 300 to the heat dissipation profile 200, making full use of the external air and improving the heat dissipation effect.

[0046] Furthermore, the air inlet 120 includes a decorative portion 122, and a plurality of air inlets 121 are arranged in parallel along the circumference of the decorative portion 122. It is understandable that the rotation center of the fan blades of the fan 300 will not generate wind force, and the decorative portion 122 is opposite to the rotation center of the fan 300 and will not affect the air intake. The decorative portion 122 can be pasted with a logo or other decorative parts, and the air inlets 121 are arranged in parallel around the circumference of the decorative portion 122 and opposite to the fan blade part of the fan 300 to facilitate air intake.

[0047] In one embodiment, the shell 100 includes a main board 140, a side board 150 and a fixed board 160, the side board 150 is connected to the edge of the main board 140, and the side board 150 and the main board 140 form a cavity, the main board 140 and the side board 150 are both provided with an air outlet 111, the air inlet 121 is provided on the main board 140, the fixed board 160 is connected to the side board 150, and the fixed board 160 opens a mounting hole 161.

[0048] In the specific implementation process, the main board 140 and the side panel 150 form a cavity, the opening side of the cavity is opposite to the main board 140, the side panel 150 surrounds the edges of the main board 140, and the fixing plate 160 is connected to the edge of the side panel 150. Specifically, in order to improve the strength of the housing 100, the main board 140, the side panel 150 and the fixing plate 160 are integrally formed and made of aluminum material and cast. The main board 140 and the side panel 150 are both provided with air outlets 111 to increase the channels for the heat dissipation airflow and improve the heat dissipation effect. In addition, multiple air outlets 111 are provided at multiple locations on the main board 140 and the side panel 150 to further improve the heat dissipation effect. The screws pass through the mounting holes 161 on the fixing plate 160 to achieve the installation of the entire radiator assembly.

[0049] In the specific implementation process, the PCB board 500 and the fan 300 are installed in the cavity from the opening side and connected to the main board 140. Further, the housing 100 is provided with a mounting column 170, and a plurality of mounting columns 170 are provided, and are used to install the fan 300, the heat dissipation profile 200 and the PCB board 500. The mounting column 170 is arranged in the cavity. In this embodiment, the mounting group is provided with a plurality of mounting columns 170, and threaded holes are provided on the plurality of mounting columns 170. The fan 300 is fixed to the mounting column 170 of the main board 140 and is locked by screws. The heat dissipation profile 200 is located in the space between the fan 300 and the PCB board 500. The PCB board 500 and the heat dissipation profile 200 are fixed to the mounting column 170 on the main board 140 and are locked by screws. It can be understood that the height and diameter of the mounting column 170 are all adjusted according to the required installation position and structure. The fan 300, the heat dissipation profile 200 and the PCB board 500 are provided with connection holes at the corresponding positions, and the screws pass through the connection holes and are locked on the connection column.

[0050] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A radiator assembly, characterized in that: include: A heat dissipation profile, which is in contact with and connected to the chip on the PCB board to perform heat exchange; A housing, wherein the housing is formed with a cavity and is provided with an air outlet and an air inlet communicated with the cavity, the heat dissipation profile and the PCB board are both accommodated in the cavity, and the heat dissipation profile is located between the PCB board and the inner wall of the cavity; and A fan, wherein the fan is connected to the shell, an installation groove is formed on the inner wall of the cavity, the fan is arranged in the installation groove, and the fan is located on the side of the heat dissipation profile facing the inner wall of the cavity, the heat dissipation profile includes a heat conducting portion, and the fan is also arranged opposite to the heat conducting portion, wherein the fan rotates so that external airflow enters the cavity from the air inlet and forms a heat dissipation airflow blowing toward the heat dissipation profile, the heat dissipation airflow exchanges heat with the heat dissipation profile, and is discharged from the air outlet.

2. The heat sink assembly according to claim 1, wherein: The heat sink assembly further comprises a heat conducting layer, which is connected to the heat conducting part and is also connected to the chip, so that the heat dissipation profile contacts the chip through the heat conducting layer and performs heat exchange.

3. The heat sink assembly according to claim 2, wherein: The heat dissipation profile includes a substrate and a heat dissipation plate, the heat conduction portion is arranged on the substrate, a plurality of heat dissipation plates are provided, and the plurality of heat dissipation plates are arranged in parallel and at intervals on a side of the substrate away from the PCB board, a heat dissipation channel is formed between adjacent heat dissipation plates, and the heat dissipation airflow flows along the heat dissipation channel.

4. The heat sink assembly according to claim 3, wherein: The heat dissipation plate comprises a heat dissipation portion and an escape portion. In a direction perpendicular to the substrate, an extension length of the heat dissipation portion is greater than an extension length of the escape portion.

5. The heat sink assembly according to claim 3, wherein: A boss is provided on one side of the substrate away from the heat sink, and the boss is used to contact the heat dissipation components on the PCB.

6. The heat sink assembly according to claim 2, wherein: The heat-conducting layer is heat-conducting silica gel.

7. The heat sink assembly according to claim 1, wherein: The shell includes an air outlet and an air inlet, the air outlet is provided with a plurality of heat dissipation fins, a guide channel is formed between two adjacent heat dissipation fins, the air outlet is arranged in the guide channel, the air inlet is arranged corresponding to the mounting groove, the air inlet is arranged in the air inlet, and the air inlet is provided with a plurality of the air inlets.

8. The heat sink assembly according to claim 7, wherein: The air inlet portion includes a decorative portion, and a plurality of the air inlets are arranged in parallel along the circumference of the decorative portion.

9. The heat sink assembly according to claim 1, wherein: The shell includes a main board, a side panel and a fixed plate, the side panel is connected to the edge of the main board, and the side panel and the main board form the cavity, the main board and the side panel are both provided with the air outlet, the air inlet is provided on the main board, the fixed plate is connected to the side panel, and the fixed plate has a mounting hole.

10. The heat sink assembly according to claim 9, wherein: The shell is provided with a mounting column, and a plurality of mounting columns are provided and used for mounting the fan, the heat dissipation profile and the PCB board. The mounting columns are arranged in the cavity.

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