A heat dissipation system and power equipment

Abstract

The present application discloses a heat dissipation system and a power device. The heat dissipation system includes a shell and a heat dissipation device. The shell is provided with a first cavity and a second cavity. The first cavity is a relatively sealed environment for installing a working device. The second cavity is located above the first cavity in the direction of gravity and is connected to the outside. The evaporation end of the heat dissipation device is arranged in the first cavity, and the condensation end of the heat dissipation device is arranged in the second cavity. The heat of the first cavity is transferred to the second cavity through the gas-liquid phase conversion of the phase change medium between the evaporation end and the condensation end. The power device includes the above-mentioned heat dissipation system. The beneficial effects of the present application: efficient heat transfer is achieved by efficiently circulating the gas-liquid two-phase flow between the evaporation end and the condensation end under the action of gravity. The heat dissipation efficiency is higher than that of traditional fin radiators and embedded heat pipe radiators, and can meet the cooling requirements of various heating devices on higher power models.

Description

Technical Field

[0001] The present application relates to the technical field of electrical equipment, and in particular to a heat dissipation system and a power device. Background Art

[0002] As the overall power of power equipment increases, the heat dissipation problem becomes more serious. Not only do power modules such as IGBT and BOOST need heat dissipation, but the electronic devices on the internal PCBA also need to take some measures to dissipate heat. The main way to dissipate heat for power equipment in the prior art is to set up the electronic devices or power modules separately and perform corresponding heat dissipation, which will increase the volume of the power equipment. Or, on the basis of the original fin heat sink, an air-to-air heat exchanger or an air heat exchanger with a heat pipe as the medium is added, which will cause the power of the heat exchanger and the radiator to increase further with the increase of the power of the power equipment, and the corresponding size and weight of the heat exchanger will increase significantly. Based on this, it is now urgent to improve the heat dissipation system of existing power equipment. Utility Model Content

[0003] One of the objectives of the present application is to provide a heat dissipation system that can solve at least one defect in the above-mentioned background technology.

[0004] Another object of the present application is to provide a power device that can solve at least one of the defects in the above-mentioned background technology.

[0005] In order to achieve at least one of the above-mentioned purposes, the technical solution adopted in the present application is: a heat dissipation system, including a shell and a heat dissipation device, wherein a first cavity and a second cavity are arranged in the shell, the first cavity is a relatively sealed environment for installing a working device, and the second cavity is located above the first cavity in the direction of gravity and connected to the outside world; the evaporation end of the heat dissipation device is arranged in the first cavity, and the condensation end of the heat dissipation device is arranged in the second cavity, and the heat of the first cavity is transferred to the second cavity through the gas-liquid phase conversion of the phase change working medium between the evaporation end and the condensation end.

[0006] Preferably, the heat dissipation device includes an evaporative heat sink and a condenser; the evaporative heat sink is installed in the first cavity to form the evaporation end, and the condenser is installed in the second cavity to form the condensation end; the evaporative heat sink and the condenser are connected by a pipeline, and the phase change working medium is suitable for flowing along the pipeline.

[0007] Preferably, the interior of the evaporative heat dissipation plate is provided with a surface increasing structure for increasing the boiling heat exchange area.

[0008] Preferably, the working device is installed on the evaporative heat sink; the heat dissipation device also includes a heat exchanger that is not in contact with the working device, the heat exchanger is installed in the first cavity and connected to the condenser, and the heat exchanger is suitable for heat exchange through gas-liquid phase conversion of the phase change working medium.

[0009] Preferably, the heat exchanger is fixedly mounted on the upper portion of the evaporative heat sink, and the heat exchanger is suitable for being connected to the condenser through the evaporative heat sink.

[0010] Preferably, the heat exchanger is spaced apart from the evaporative heat sink, the heat exchanger is located above the evaporative heat sink, and the heat exchanger is connected to the condenser through a separate pipeline.

[0011] Preferably, the working device is installed on at least one side of the evaporative heat dissipation plate, and heat dissipation fins are provided in a non-installation area on at least one side of the evaporative heat dissipation plate.

[0012] Preferably, a fan is installed in the first cavity, and the fan corresponds to the heat exchanger and / or the evaporative heat sink, so as to increase the heat exchange amount between the heat exchanger and / or the evaporative heat sink and the environment.

[0013] Preferably, at least one fan corresponding to the condenser is installed in the second cavity, and a plurality of the fans are arranged at intervals along the extension direction of the condenser.

[0014] A power device comprises the above-mentioned heat dissipation system.

[0015] Compared with the prior art, the beneficial effects of this application are:

[0016] The gas-liquid two-phase flow is efficiently circulated between the evaporation end and the condensation end under the action of gravity to achieve efficient heat transfer. The heat dissipation efficiency is higher than that of traditional fin radiators and embedded heat pipe radiators, and can meet the cooling needs of various heating components on higher power models. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the first embodiment of the utility model in the front view direction.

[0018] Figure 2 For this utility model Figure 1 A schematic diagram of the structure of the embodiment shown in the side view.

[0019] Figure 3 It is a schematic diagram of the structure of the second embodiment of the utility model in a side view.

[0020] Figure 4 It is a schematic structural diagram of the third embodiment of the utility model in the front view direction.

[0021] Figure 5 It is a schematic structural diagram of the fourth embodiment of the utility model in the front view direction.

[0022] In the figure: shell 1, first cavity 11, second cavity 12, heat dissipation device 2, evaporative heat dissipation plate 21, heat exchanger 22, condenser 23, first pipeline 241, second pipeline 242, heat dissipation fins 25, first fan 3, first electromagnetic element 4, power device 5, second electromagnetic element 6, second fan 71, third fan 72. DETAILED DESCRIPTION

[0023] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0024] In the description of the present application, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of narrating the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of the present application.

[0025] It should be noted that the terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0026] The terms "including" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to these processes, methods, products or apparatuses.

[0027] One aspect of the present application provides a heat dissipation system, such as Figure 1 and Figure 2As shown, one of the preferred embodiments includes a housing 1 and a heat sink 2. A first cavity 11 and a second cavity 12 are provided in the housing 1. The first cavity 11 is a sealed environment for installing a working device, so that the working device can generate heat in the first cavity 11 during operation; the second cavity 12 is located above the first cavity 11 in the direction of gravity and is connected to the outside. The evaporation end of the heat sink 2 is provided in the first cavity 11, and the condensation end of the heat sink 2 is provided in the second cavity 12. A phase change medium circulates between the evaporation end and the condensation end of the heat sink 2.

[0028] In the first cavity 11, the evaporation end can absorb heat from the environment, so that the phase-change working fluid in liquid phase can be vaporized by the absorbed heat, and then flow to the condensation end located in the second cavity 12 by rising; the condensation end transfers the heat carried by the gas phase phase-change working fluid to the external environment through heat exchange with the outside world, so that the gas phase phase-change working fluid is condensed and liquefied, and then quickly flows back to the evaporation end of the first cavity 11 under the action of gravity. Through the efficient circulation conversion of the gas-liquid phase of the phase-change working fluid between the evaporation end and the condensation end, the heat of the first cavity 11 can be continuously and efficiently transferred to the second cavity 12 to achieve heat dissipation; and the heat dissipation efficiency of the present application is higher than that of traditional fin radiators and embedded heat pipe radiators, and can meet the cooling requirements of various heating devices on higher power models.

[0029] It should be known that by arranging the second cavity 12 and the first cavity 11 up and down in the direction of gravity g, on the one hand, it can facilitate the smooth rising of heat and gas phase phase change medium, and on the other hand, it can accelerate the rapid reflux of liquid phase phase change medium, thereby efficiently realizing heat exchange between the first cavity 11 and the second cavity 12.

[0030] In this embodiment, there are many specific structures of the heat dissipation device that can achieve the above functions. For the sake of easy understanding, a specific structure will be used for detailed description below. Figure 1 and Figure 2 As shown, the heat dissipation device 2 includes an evaporative heat dissipation plate 21 and a condenser 23. The evaporative heat dissipation plate 21 is a hollow structure and is filled with a phase-change medium. The evaporative heat dissipation plate 21 can be installed in the first cavity 11 to form an evaporation end. The condenser 23 is installed in the second cavity 12 and forms a condensation end through heat exchange with the outside. The evaporative heat dissipation plate 21 and the condenser 23 are connected by a pipeline, so that the phase-change medium can be vaporized in the evaporative heat dissipation plate 21 and can rise along the pipeline to the condenser 23, and then condense and liquefy after completing the heat exchange in the condenser 23 and flow back to the evaporative heat dissipation plate 21 along the pipeline.

[0031] It is understandable that the specific structure and working principle of the evaporative heat sink 21 and the condenser 23 are well-known technologies for those skilled in the art; the common evaporative heat sink 21 can be an aluminum temperature equalizing plate or a copper temperature equalizing plate, etc.; the common condenser 23 can be one or two of a plate-fin heat exchanger, a tube-fin heat exchanger, a surface porous tube heat exchanger, and a threaded tube heat exchanger; the material of the condenser 23 can be an aluminum alloy or a copper alloy, etc. When the evaporative heat sink 21 and the condenser 23 are both made of aluminum alloy, the phase change working fluid can preferably be Freon, fluorinated liquid, and acetone, etc.; when the evaporative heat sink 21 and the condenser 23 are both made of copper alloy, the phase change working fluid can preferably be distilled water and ammonia. And in order to ensure the stable operation of the phase change working fluid, the evaporative heat sink 21 and the condenser 23 should maintain good air tightness.

[0032] In this embodiment, a surface increasing structure for increasing the boiling heat exchange area is provided inside the evaporative heat sink 21 , so that the heat absorption of the evaporative heat sink 21 can be effectively increased through the surface increasing structure to improve the heat dissipation efficiency of the heat sink 2 .

[0033] It is understandable that by providing an increased surface structure in the inner cavity of the evaporative heat sink 21, on the one hand, the rising process of the gas phase phase change medium can be hindered, so that the gas phase phase change medium gradually diffuses into the condenser 23 under the obstruction, thereby effectively improving the heat transfer efficiency of the phase change medium. On the other hand, by providing an increased surface structure, the contact area between the phase change medium and the inner wall of the evaporative heat sink 21 can be effectively increased, thereby further improving the heat transfer efficiency of the phase change medium.

[0034] It should be known that there are many specific structures of the surface enhancement structure that can achieve the above functions. For the sake of easy understanding, three specific examples will be used for detailed description below.

[0035] Example 1: Columnar structures arranged in an array can be set in the inner cavity of the evaporative heat sink 21 to form a desired surface-increasing structure. When the gas phase phase change medium passes through the surface-increasing structure, the columnar structure can separate the inner cavity of the evaporative heat sink 21 into a mesh shape to ensure that the gas phase phase change medium can diffuse; at the same time, the columnar structure increases the contact area with the gas phase phase change medium through the side wall.

[0036] Example 2: Metal powder can be sintered in the inner cavity of the evaporative heat sink 21 so that the inner surface of the evaporative heat sink 21 presents an irregular convex structure to form the desired surface enhancement structure. Thus, when the gas phase phase change medium passes through the surface enhancement structure, the convex structure can hinder the phase change medium to form diffusion; at the same time, the convex structure increases the contact area with the gas phase phase change medium through the surface.

[0037] Example 3: Inner fins may be welded in the inner cavity of the evaporative heat sink 21 to form the desired surface-enhancing structure; the arrangement of the inner fins is similar to that of Example 1, and the working principles of the two are also similar, so they will not be elaborated here in detail.

[0038] In this embodiment, Figure 1 and Figure 2 As shown, the first cavity 11 is mainly used to install working devices, which will generate heat during operation. In order to ensure that the heat in the first cavity 11 can be quickly transferred to the outside, working devices with large heat generation or all working devices can be installed on the evaporative heat sink 21. Therefore, most of the heat generated in the first cavity 11 can be transferred to the outside through the evaporative heat sink 21 using the phase change medium. However, in order to ensure the working safety of the working devices in the first cavity 11, the heat dissipation device 2 also includes a heat exchanger 22 that is not in contact with the working devices. The heat exchanger 22 is installed in the first cavity 11 and is connected to the condenser 23. The heat exchanger 22 can exchange the ambient heat of the first cavity 11 through the gas-liquid phase conversion of the phase change medium.

[0039] It can be understood that the evaporative heat sink 21 is mainly used to directly convert and dissipate the heat generated by the working device during operation, while the heat exchanger 22 is mainly used to convert and dissipate the heat that overflows from the working device into the first cavity 11, so as to avoid continuous accumulation of heat in the first cavity 11 and cause the working device to be in a high temperature and unable to work.

[0040] It should be known that the specific structure and working principle of the heat exchanger 22 are well-known technologies for those skilled in the art; the common heat exchanger 22 may be one or two of a plate-fin heat exchanger, a tube-fin heat exchanger, a surface porous tube heat exchanger, and a threaded tube heat exchanger; the material of the heat exchanger 22 may be an aluminum alloy or a copper alloy, etc. In order to ensure the stable operation of the phase-change working medium, the heat exchanger 22 should maintain good airtightness.

[0041] In this embodiment, there are many specific installation methods for the heat exchanger 22 in the first cavity 11. For the convenience of understanding, two specific examples are provided below for detailed description.

[0042] Example 1: Figure 1 As shown, the heat exchanger 22 is fixedly installed on the evaporative heat dissipation plate 21 , and the heat exchanger 22 can be connected to the condenser 23 through the evaporative heat dissipation plate 21 .

[0043] Specifically, Figure 1 and Figure 2As shown, the upper part of the evaporative heat sink 21 can be connected to the condenser 23 through the first pipeline 241; the vaporized phase-change working medium in the heat exchanger 22 can flow to the evaporative heat sink 21, and then the vaporized phase-change working medium in the evaporative heat sink 21 can rise to the condenser 23 along the first pipeline 241. The lower part of the evaporative heat sink 21 is connected to the condenser 23 through the second pipeline 242, so that the liquefied phase-change working medium in the condenser 23 can flow to the evaporative heat sink 21 along the second pipeline 242, and flow to the heat exchanger 22 after the liquid level reaches a set height.

[0044] It should be known that the heat exchanger 22 is mainly used for converting and dissipating the ambient heat in the first cavity 11. Therefore, according to the rise of heat, it is preferred that the heat exchanger 22 be fixedly installed on the upper part of the evaporative heat sink 21 to facilitate the rapid absorption and conversion of ambient heat by the heat exchanger 22. The filling amount of the phase-change working fluid should ensure that the liquid working fluid level can cover the working device installed on the evaporative heat sink 21 and the contact surface between the heat exchanger 22 and the evaporative heat sink 21, and ensure that the liquid working fluid level is lower than the contact position between the external condenser 23 and the evaporative heat sink 21, that is, the connection point of the first pipeline 241.

[0045] By integrating the heat exchanger 22 into the evaporative heat sink 21, the phase change spaces of the two are connected and embedded in the first cavity 11, the heat dissipation capacity can be maximized, and by sharing the same external condenser 23, the structure of the heat dissipation system is made more compact.

[0046] Example 2: If Figure 4 and Figure 5 As shown, the heat exchanger 22 is fixedly installed in the first cavity 11 and spaced apart from the evaporative heat dissipation plate 21 , and the heat exchanger 22 is connected to the condenser 23 through a separate pipeline.

[0047] Specifically, Figure 4 As shown, the upper parts of the heat exchanger 22 and the evaporative heat sink 21 are both connected to the condenser 23 through the first pipe 241. The first pipe 241 can be connected to the heat exchanger 22 and the evaporative heat sink 21 through two branches, or the heat exchanger 22 and the evaporative heat sink 21 can be connected to the condenser 23 through two independent first pipes 241. Similarly, the lower parts of the heat exchanger 22 and the evaporative heat sink 21 are both connected to the condenser 23 through the second pipe 242.

[0048] It should be known that the heat exchanger 22 is mainly used for converting and dissipating the ambient heat in the first cavity 11 . Therefore, according to the rise of heat, the heat exchanger 22 can be preferably installed above the evaporative heat dissipation plate 21 to facilitate the rapid absorption and conversion of ambient heat by the heat exchanger 22 .

[0049] In this embodiment, Figure 3As shown, a working device is installed on at least one side of the evaporative heat sink 21, and a heat dissipation fin 25 is arranged in a non-installation area on at least one side of the evaporative heat sink 21, so that the heat that the evaporative heat sink 21 cannot convert in time can be quickly transferred to the environment of the first cavity 11, so that it can be quickly absorbed and converted by the heat exchanger 22.

[0050] In this embodiment, Figure 5 As shown, a fan is installed in the first cavity 11, and the fan corresponds to the heat exchanger 22 and / or the evaporative heat sink 21, so as to increase the heat exchange amount between the heat exchanger 22 and / or the evaporative heat sink 21 and the environment.

[0051] It should be known that the fan can accelerate the heat flow speed in the first cavity 11 and can concentrate the heat, thereby accelerating the heat absorption of the heat exchanger 22 or the evaporative heat sink 21. Therefore, multiple fans can be provided. For ease of understanding, a detailed description is given by taking the example that the heat exchanger 22 and the evaporative heat sink 21 are both provided with fans.

[0052] Specifically, Figure 5 As shown, the fan includes a second fan 71 and a third fan 72, and the second fan 71 and the third fan 72 are respectively arranged at the upper part and the lower part of the evaporative heat dissipation plate 21, and the second fan 71 can correspond to the working device at the upper part of the evaporative heat dissipation plate 21, and the working device located above the evaporative heat dissipation plate 21, and the third fan 72 corresponds to the working device at the lower part of the evaporative heat dissipation plate 21, and the working device located below the evaporative heat dissipation plate 21. The second fan 72 and the third fan 73 can increase the air flow near the working device to ensure that the heat overflowed from the working device can be quickly transmitted to the environment, and then absorbed by the heat exchanger 22.

[0053] In this embodiment, Figures 1 to 5 As shown, at least one first fan 3 corresponding to the condenser 23 is installed in the second cavity 12, and a plurality of first fans 3 are arranged at intervals along the extension direction of the condenser 23. The first fan 3 can accelerate the air flow near the condenser 23, and further accelerate the condensation process of the phase change medium in the condenser 23 to improve the heat dissipation efficiency of the heat dissipation device 2.

[0054] It should be known that the extension length of the condenser 23 is generally long, so the number of the first fans 3 is preferably multiple, for example Figure 1 As shown, there are three first fans 3, and the three first fans 3 are arranged at equal intervals along the extension direction of the condenser 23. The air outlet direction of the first fans 3 can be vertically upward or obliquely upward, and only needs to pass through the condenser 23.

[0055] Another aspect of the present application provides a power device, such as Figures 1 to 5As shown, one preferred embodiment includes a working device and the above-mentioned heat dissipation system. The working device is installed in the first cavity 11 and dissipates heat through the heat dissipation device 2.

[0056] It should be known that there are many types of power equipment, which may be inverters, converters or energy storage cabinets, etc. As long as there is a need for heat dissipation in a sealed environment, the above-mentioned heat dissipation system can be used for heat dissipation. The working devices of the power equipment generally include electromagnetic components and power devices 5. There are many ways to install the working devices. For the sake of easy understanding, the following can be described in detail through four specific embodiments.

[0057] Embodiment 1:

[0058] like Figure 1 and Figure 2 As shown, the electromagnetic element includes a first electromagnetic element 4 and a second electromagnetic element 6. The power device 5 and the first electromagnetic element 4 can be fastened and installed on the inner side of the evaporative heat sink 21, and the contact thermal resistance between the power device 5 and the first electromagnetic element 4 and the evaporative heat sink 21 can be reduced by an interface material, and common interface materials include silica gel, etc. The second electromagnetic element 6 is installed on the lower outer side of the evaporative heat sink 21. At this time, the heat exchanger 22 can be fixedly installed on the upper part of the evaporative heat sink 21 and communicate with each other. Compared with the traditional method, the heat exchanger 22 can be innovatively integrated into the evaporative heat sink 21 to realize the phase change space connection between the two, and embedded in the interior of the shell 1, so as to maximize the heat dissipation capacity, and by sharing the same external condenser 23, the structure of the entire power device is more compact.

[0059] It should be known that since the heat generated by the electromagnetic element is larger than that of the power device 5, the first electromagnetic element 4 can be arranged above the power device 5, so that the first electromagnetic element 4 can exchange heat through the evaporative heat sink 21 while also exchanging heat through the heat exchanger 22 to improve the heat exchange efficiency of the first electromagnetic element 4.

[0060] It should also be known that the volume of the condenser 23 outside the power device is much smaller than the current mainstream fin heat sink, and the electromagnetic components can be selected to be built into the interior of the power device, so that the power device can achieve a smaller volume and weight at the same power, and conversely, a higher power configuration can be achieved at the same volume and weight.

[0061] Embodiment 2:

[0062] like Figure 3As shown, compared with the first embodiment, the difference between the second embodiment is that the outer side of the evaporative heat sink 21 is provided with a heat dissipation fin 25, and the heat dissipation fin 25 is located above the second electromagnetic element 6. The heat dissipation fin 25 can accelerate the evaporative heat sink 21 and the second electromagnetic element 6 to release heat to the environment of the first cavity 11.

[0063] Embodiment three:

[0064] like Figure 4 As shown, compared with the first and second embodiments, the third embodiment is different in that the heat exchanger 22 is installed above the evaporative heat sink 21 and spaced apart from the evaporative heat sink 21, and the heat exchanger 22 is connected to the condenser 23 through a separate pipeline. In this way, the conversion process of the phase-changing working medium of the heat exchanger 22 does not need to pass through the evaporative heat sink 21, which can improve the heat exchange efficiency of the heat exchanger 22.

[0065] Embodiment 4:

[0066] like Figure 5 As shown, compared with the first to third embodiments, the difference of the fourth embodiment is that the first electromagnetic element 4 and the second electromagnetic element 6 are respectively arranged above and below the evaporative heat dissipation plate 21, and the heat exchanger 22 and the second fan 71 can be directly opposite to the first electromagnetic element 4, so as to accelerate the heat exchange efficiency of the first electromagnetic element 4. The third fan 72 is directly opposite to the lower part of the evaporative heat dissipation plate 21 and the second electromagnetic element 6, so as to quickly transfer the heat overflowed from the evaporative heat dissipation plate 21 and the second electromagnetic element 6 to the heat exchanger 22.

[0067] The above describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited by the above embodiments, and the above embodiments and the specification only describe the principles of the present application. The present application may have various changes and improvements without departing from the spirit and scope of the present application, and these changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the attached claims and their equivalents.

Claims

1. A heat dissipation system, characterized in that: include: Shell; a first cavity and a second cavity are arranged in the shell, the first cavity is a relatively sealed environment for installing the working device, and the second cavity is located above the first cavity in the direction of gravity and communicates with the outside; as well as A heat dissipation device, wherein the evaporation end of the heat dissipation device is arranged in the first cavity, and the condensation end of the heat dissipation device is arranged in the second cavity, and the heat of the first cavity is transferred to the second cavity through the gas-liquid phase conversion of the phase change working medium between the evaporation end and the condensation end.

2. The heat dissipation system according to claim 1, characterized in that: The heat dissipation device comprises: an evaporative heat sink; the evaporative heat sink is installed in the first cavity to form the evaporation end; and Condenser; the condenser is installed in the second cavity to form the condensation end; The evaporative heat sink and the condenser are connected via a pipeline, and the phase-change working medium is suitable for flowing along the pipeline.

3. The heat dissipation system according to claim 2, characterized in that: The interior of the evaporative heat dissipation plate is provided with a surface increasing structure for increasing the boiling heat exchange area.

4. The heat dissipation system according to claim 2, characterized in that: The working device is installed on the evaporative heat dissipation plate; The heat dissipation device also includes a heat exchanger that is not in contact with the working device. The heat exchanger is installed in the first cavity and is connected to the condenser. The heat exchanger is suitable for heat exchange through gas-liquid phase conversion of the phase change working medium.

5. The heat dissipation system according to claim 4, characterized in that: The heat exchanger is fixedly installed on the upper part of the evaporative heat dissipation plate, and the heat exchanger is suitable for communicating with the condenser through the evaporative heat dissipation plate.

6. The heat dissipation system according to claim 4, characterized in that: The heat exchanger is spaced apart from the evaporative heat dissipation plate, the heat exchanger is located above the evaporative heat dissipation plate, and the heat exchanger is connected to the condenser through the separate pipeline.

7. The heat dissipation system according to claim 4, characterized in that: The working device is installed on at least one side of the evaporative heat dissipation plate, and heat dissipation fins are arranged in a non-installation area on at least one side of the evaporative heat dissipation plate.

8. The heat dissipation system according to any one of claims 4 to 7, characterized in that: A fan is installed in the first cavity, and the fan corresponds to the heat exchanger and / or the evaporative heat dissipation plate.

9. The heat dissipation system according to claim 2, characterized in that: At least one fan corresponding to the condenser is installed in the second cavity, and a plurality of the fans are arranged at intervals along the extension direction of the condenser.

10. A power device, characterized in that: A heat dissipation system comprising any one of claims 1 to 9.

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