Silicon wafer carrier supporting device and silicon wafer reaction equipment
By designing a silicon wafer carrier support device including fixed flange and support components, the problem of deformation and heat loss of furnace tubes due to bearing the weight of the silicon wafer is solved, and a more stable and efficient silicon wafer reaction process is achieved.
Patent Information
- Application Number
- CN202421238250.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-31
- Publication Date
- 2025-04-04
- Estimated Expiration
- 2034-05-31
AI Technical Summary
During the silicon wafer reaction process of existing furnace tube equipment, the quartz furnace tube is deformed by the weight of the silicon wafer and the reaction boat, and needs to be replaced frequently; the method of using support rods has problems such as lax sealing, air leakage and heat loss.
A silicon wafer carrier support device is designed, including a first fixed flange, a second fixed flange and a support assembly. The support assembly consists of a first support seat, a second support seat and a support rod. The support rod loads the weight of the silicon wafer and the silicon wafer carrier to avoid transmission to the furnace tube, and a cooling liquid channel is provided in the support base to reduce temperature and reduce softening deformation.
It effectively protects the furnace tube of the silicon wafer reaction equipment, reduces heat loss, and reduces the risk of softening and deformation of the support seat, ensures the stable support of the silicon wafer carrier, and avoids the safety hazards of the reaction boat dumping.
Smart Images
Figure CN222721903U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of solar photovoltaic cell production, in particular to a silicon wafer carrier supporting device and a silicon wafer reaction device using the silicon wafer carrier supporting device. Background Art
[0002] The photovoltaic industry is generally considered to be an industry with great development prospects. Solar photovoltaic cells (hereinafter referred to as photovoltaic cells) are batteries that convert solar energy into electrical energy and are one of the core components of photovoltaic power generation. In the manufacturing process of photovoltaic cells, furnace tube equipment is one of the core equipment. Furnace tube equipment includes diffusion furnaces, oxidation furnaces, annealing furnaces, PECVD equipment and LPCVD equipment, etc., which are widely used as reaction chambers for diffusion, oxidation, annealing and deposition processes of photovoltaic cells. The heat treatment processes such as diffusion, oxidation, annealing and deposition coating of silicon wafers are basically carried out in the reaction chambers of the above-mentioned equipment. The reaction chamber mainly provides a sealed environment. The carrier filled with silicon wafers is placed inside the reaction chamber for heating and introducing process gases for reaction.
[0003] For the furnace tube equipment in the current industry, there are two ways to install the reaction boat used to load silicon wafers in the reaction chamber: one is to place the reaction boat directly in the quartz furnace tube of the reaction chamber (quartz tubes are currently common on the market). This method will cause the quartz furnace tube of the reaction chamber to directly bear the weight of all silicon wafers and the reaction boat. During use, the quartz furnace tube will gradually deform, which will have a great impact on the service life of the quartz furnace tube. The quartz furnace tube needs to be replaced frequently. Due to the high price of quartz furnace tubes, a series of losses caused by frequent replacement have become the pain points and difficulties of the industry. The other is to use two support rods to support the reaction boat and extend it into the reaction chamber. During the process, the two support rods are used to support the reaction boat in the reaction chamber so that the quartz furnace tube is not stressed to extend the service life of the quartz furnace tube. However, there are two support rods in the reaction chamber during the reaction process, which puts high demands on the sealing environment required in the process, and there are often poor sealing and air leakage. At the same time, after the process reaction is completed, the two support rods and the reaction boat exit the reaction chamber at the same time, which will take away more heat. When entering again, the two support rods will also absorb a lot of heat, which will cause large energy loss and have a great impact on the process.
[0004] Therefore, some new furnace tube equipment has appeared on the market, which includes a reactor body, a reaction chamber with two open ends arranged inside the reactor body, two fixed flanges arranged at the two ends of the reaction chamber, two support rods arranged in parallel and spaced apart in the reaction chamber, one end of the two support rods correspondingly mounted on the two support seats of one of the fixed flanges, and the other end of the two support rods correspondingly mounted on the two support seats of the other fixed flange. When the above furnace tube equipment is used in the reaction process of silicon wafers, the reaction boat loaded with silicon wafers is transported into the reaction chamber and placed on the upper surface of the two support rods. At this time, the weight of the silicon wafers and the reaction boat is transferred to the two fixed flanges through the two support rods and loaded by the two fixed flanges, which can avoid the deformation and damage of the quartz furnace tube of the reactor body due to the weight of the silicon wafers and the reaction boat, and solve the technical problem of large heat loss in the reaction chamber caused by the frequent entry and exit of the existing two support rods, and well meet the production needs of enterprises.
[0005] However, when the company used the above-mentioned furnace tube equipment to carry out process reactions, the support seat of the fixed flange softened and deformed, resulting in one end of the support rod being higher and the other end being lower. As a result, there was a safety hazard that the reaction boat was easily tipped over due to the uneven support rod. Utility Model Content
[0006] The utility model aims to solve one of the problems of the prior art to at least a certain extent. To this end, the utility model proposes a silicon wafer carrier support device with a simple structure, which helps to reduce the probability of softening and deformation of the support seat and can better support the silicon wafer carrier; the utility model also proposes a silicon wafer reaction device using the above silicon wafer carrier support device, which can better support the silicon wafer for process reaction.
[0007] According to some embodiments of the utility model, the silicon wafer carrier support device includes a first fixed flange, a second fixed flange and at least one group of support components, and the first fixed flange and the second fixed flange are arranged at intervals; the support component includes a first support seat, a second support seat and a support rod, the first support seat is arranged on the first fixed flange, the second support seat is arranged on the second fixed flange, one end of the support rod is abutted or connected to the first support seat, and the other end of the support rod is abutted or connected to the second support seat; wherein a first cooling liquid channel is arranged inside the first support seat and / or a second cooling liquid channel is arranged inside the second support seat.
[0008] The silicon wafer carrier support device according to some embodiments of the utility model has the following beneficial effects:
[0009] The silicon wafer carrier support device in the present embodiment adopts a structure mainly composed of a first fixed flange, a second fixed flange and a support assembly, so that when the silicon wafer carrier support device in the present embodiment is used in a silicon wafer reaction device, the silicon wafer carrier support device can load the weight of all silicon wafers and silicon wafer carriers through the support rods of the support assembly without transmitting the weight to the furnace tube of the silicon wafer reaction device, which can protect the silicon wafer reaction device and does not require the support rods to frequently enter and exit the silicon wafer reaction device, thereby reducing the heat loss of the silicon wafer reaction device. In addition, by arranging a first cooling liquid channel inside the first support seat and / or arranging a second cooling liquid channel inside the second support seat, The cooling liquid channel can, when in use, be able to introduce cooling liquid into the first cooling liquid channel and / or the second cooling liquid channel, thereby enabling the first support seat and / or the second support seat to maintain a relatively low temperature in a high temperature environment, so that the first support seat and / or the second support seat will not easily soften and deform due to the high temperature. Therefore, the first support seat and / or the second support seat can maintain sufficient rigidity to support the supporting support rod, so that the support rod is not prone to having one end high and the other end low. Therefore, the silicon wafer carrier support device of this embodiment can more stably support the silicon wafer carrier for process reaction, meeting the needs of users.
[0010] In some embodiments of the present application, the first cooling liquid channel is disposed inside the first support seat, the first fixed flange is disposed inside a first liquid inlet channel connected to the first cooling liquid channel, one end of the first liquid inlet channel has a first liquid inlet, and the other end of the first liquid inlet channel has a first liquid outlet.
[0011] In some embodiments of the present application, the second cooling liquid channel is disposed inside the second support seat, the second liquid inlet channel connected to the second cooling liquid channel is disposed inside the second fixing flange, one end of the second liquid inlet channel has a second liquid inlet, and the other end of the second liquid inlet channel has a second liquid outlet.
[0012] In some embodiments of the present application, the number of the support components is two groups, and the two groups of support components are arranged parallel to each other and at intervals.
[0013] In some embodiments of the present application, the first support seat is provided with a first embedding groove adapted to the shape of one end of the support rod, and the second support seat is provided with a second embedding groove adapted to the shape of the other end of the support rod, one end of the support rod is embedded in the first embedding groove, and the other end of the support rod is embedded in the second embedding groove.
[0014] In some embodiments of the present application, the first support seat has a first auxiliary support seat, and the first mounting groove is opened on the first auxiliary support seat; wherein, the first auxiliary support seat can be detachably installed on the first support seat, or the first auxiliary support seat and the first support seat are an integrated structure.
[0015] In some embodiments of the present application, the second support seat has a second auxiliary support seat, and the second mounting groove is opened on the second auxiliary support seat; wherein, the second auxiliary support seat can be removably installed on the second support seat, or the second auxiliary support seat and the second support seat are an integrated structure.
[0016] In some embodiments of the present application, the first support seat is detachably mounted on the first fixing flange, and the second support seat is detachably mounted on the second fixing flange.
[0017] According to some embodiments of the utility model, the silicon wafer reaction equipment includes a reaction furnace main body, which is equipped with the above-mentioned silicon wafer carrier support device; wherein a reaction chamber with two open ends is arranged inside the reaction furnace main body, the first fixed flange is arranged at one open end of the reaction chamber, and the second fixed flange is arranged at the other open end of the reaction chamber.
[0018] The silicon wafer reaction equipment according to some embodiments of the utility model has the following beneficial effects:
[0019] The silicon wafer reaction equipment of this embodiment adopts the above-mentioned silicon wafer carrier support device, which can better support the silicon wafer in the reaction chamber for process reaction. It does not need the reactor body to support the loaded silicon wafer and silicon wafer carrier, which helps to protect the reactor body, and the support rod does not need to frequently enter and exit the reaction chamber, which helps to reduce the heat loss of the reaction chamber. In addition, a first cooling liquid channel is arranged inside the first support seat and / or a second cooling liquid channel is arranged inside the second support seat. When in use, cooling liquid can be introduced into the first cooling liquid channel and / or the second cooling liquid channel, so that the first support seat and / or the second support seat can maintain a relatively low temperature in a high temperature environment. Therefore, the first support seat and / or the second support seat will not easily soften and deform due to high temperature. Therefore, the first support seat and / or the second support seat can maintain sufficient rigidity to support the support rod to load the silicon wafer and the silicon wafer carrier, greatly reducing the probability of the silicon wafer and the silicon wafer carrier tipping over during the process reaction.
[0020] In some embodiments of the present application, a first furnace door capable of opening or closing an opening at one end of the reaction chamber is provided at one end of the reaction furnace body, and a second furnace door capable of opening or closing an opening at the other end of the reaction chamber is provided at the other end of the reaction furnace body. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a schematic diagram of the structure of a silicon wafer carrier support device of some embodiments of the utility model;
[0022] Figure 2 yes Figure 1 A schematic structural diagram of the silicon wafer carrier support device from another angle is shown;
[0023] Figure 3 yes Figure 1 A schematic diagram of a partial structural decomposition of a silicon wafer carrier support device is shown;
[0024] Figure 4 yes Figure 3 The enlarged schematic diagram of point A in the middle;
[0025] Figure 5 yes Figure 3 The enlarged schematic diagram of point B in the middle;
[0026] Figure 6 It is a schematic diagram of the structure of the silicon wafer reaction equipment in certain embodiments of the utility model when the first furnace door and the second furnace door are removed. DETAILED DESCRIPTION
[0027] Embodiments of the present embodiment are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present embodiment, and should not be construed as limiting the present embodiment.
[0028] The drawings used in this embodiment are schematic and principle and are only used to facilitate the description of this embodiment and simplify the description. Therefore, they should not be understood as limiting this embodiment.
[0029] In the description of this embodiment, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0030] In the description of this embodiment, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this embodiment based on the specific content of the technical solution.
[0031] Figures 1 to 5It is a schematic diagram of some embodiments of the silicon wafer carrier support device of the present invention.
[0032] Reference Figures 1 to 5 , and mainly refer to Figures 3 to 5 According to some embodiments of the present invention, the silicon wafer carrier support device includes a first fixed flange 110, a second fixed flange 120 and at least one group of support components 200. Specifically, the first fixed flange 110 and the second fixed flange 120 are arranged at intervals along a certain axis, and the support component 200 includes a first support seat 210, a second support seat 220 and a support rod 230. The first support seat 210 is arranged on the first fixed flange 110, and the second support seat 220 is arranged on the second fixed flange 120. One end of the support rod 230 is fixedly connected to the first support seat 210 or one end of the support rod 230 abuts against the first support seat 210, and the other end of the support rod 230 is fixedly connected to the second support seat 220 or the other end of the support rod 230 abuts against the second support seat 220. In this embodiment, a first cooling liquid channel 211 is provided inside the first support seat 210, and / or a second cooling liquid channel 221 is provided inside the second support seat 220.
[0033] The silicon wafer carrier support device in this embodiment adopts a structure mainly composed of a first fixed flange 110, a second fixed flange 120 and a support assembly 200, so that when the silicon wafer carrier support device in this embodiment is used in a silicon wafer reaction equipment, the silicon wafer carrier support device can load the weight of all silicon wafers and silicon wafer carriers 400 through the support rod 230 of the support assembly 200, and will not be transmitted to the furnace tube of the silicon wafer reaction equipment. It can protect the silicon wafer reaction equipment and does not require the support rod 230 to frequently enter and exit the silicon wafer reaction equipment, thereby reducing the heat loss of the silicon wafer reaction equipment. In addition, by providing a first cooling liquid channel 211 inside the first support seat 210, and / or providing a second cooling liquid channel 212 inside the second support seat 220, When the channel 221 is in use, cooling liquid can be passed into the first cooling liquid channel 211 and / or the second cooling liquid channel 221, so that the first support seat 210 and / or the second support seat 220 can maintain a relatively low temperature in a high temperature environment, so that the first support seat 210 and / or the second support seat 220 will not easily soften and deform due to the high temperature. Therefore, the first support seat 210 and / or the second support seat 220 can maintain sufficient rigidity to support the support rod 230, so that the support rod 230 is not prone to one end being high and the other end being low. Therefore, the silicon wafer carrier support device of this embodiment can more stably support the silicon wafer carrier 400 for process reaction to meet the needs of users.
[0034] In order to make the silicon wafer carrier support device better support the silicon wafer carrier 400, in some embodiments of the present invention, the number of the support components 200 is two groups, and the two groups of support components 200 are arranged parallel to each other and at intervals, such as Figure 1 and Figure 2 As shown, the two support rods 230 of the two groups of support assemblies 200 form a support plane. At this time, the silicon wafer carrier 400 is placed on the two support rods 230. The two support rods 230 can better support the silicon wafer carrier 400 and effectively prevent the silicon wafer carrier 400 from accidentally falling from the support rods 230.
[0035] Reference Figure 1 , Figure 3 , Figure 4 and Figure 5 In order to better convey cooling liquid to the first support seat 210, in some embodiments of the present utility model, a first cooling liquid channel 211 is provided inside the first support seat 210, and a first liquid inlet channel connected to the first cooling liquid channel 211 is provided inside the first fixing flange 110, one end of the first liquid inlet channel has a first liquid inlet port 111, and the other end of the first liquid inlet channel has a first liquid outlet port 112. Specifically, the first cooling liquid channels 211 of the first support seats 210 of the two groups of support assemblies 200 are both connected to the first liquid inlet channel. In this embodiment, the first cooling liquid channels 211 of the two first support seats 210 are connected to the first liquid inlet channel. It is connected in series with the first liquid inlet channel to form a complete flow channel, so the user can transport cooling liquid into the first liquid inlet channel through the first liquid inlet port 111, and the cooling liquid can flow through the first cooling liquid channels 211 of the two first support seats 210, and finally flow out from the first liquid outlet port 112. By adopting the above structure, the cooling liquid can circulate through the two first support seats 210, and then the two first support seats 210 can be cooled and cooled, and the two first support seats 210 are prevented from softening and deforming due to high temperature, so that the two first support seats 210 have sufficient rigidity or strength to support the support rod 230. In this embodiment, the above cooling liquid can be water or a coolant commonly used in daily production, which can be determined according to actual needs.
[0036] It should be noted that, in the above-mentioned embodiment, the first cooling liquid channels 211 of the two first support seats 210 are connected in series with the first liquid inlet channels to form a complete flow channel. In some embodiments of the utility model, two independent first liquid inlet channels are arranged inside the first fixed flange 110, and the first liquid inlet port 111 and the first liquid outlet port 112 are arranged at both ends of each first liquid inlet channel. Therefore, the first cooling liquid channel 211 of one of the first support seats 210 is connected with one of the first liquid inlet channels to form an independent flow channel, and the first cooling liquid channel 211 of the other first support seat 210 is connected with the other first liquid inlet channel to form another independent flow channel. At this time, according to actual needs, cooling liquid can be transported to one or both of the flow channels, and then one of the first support seats 210 or both of the first support seats 210 can be cooled to meet different practical needs of users.
[0037] Reference Figure 2 , Figure 3 , Figure 4 and Figure 5 In order to better convey cooling liquid to the second support seat 220, in some embodiments of the utility model, a second cooling liquid channel 221 is provided inside the second support seat 220, a second liquid inlet channel connected to the second cooling liquid channel 221 is provided inside the second fixing flange 120, one end of the second liquid inlet channel has a second liquid inlet port 121, and the other end of the second liquid inlet channel has a second liquid outlet port 122. Specifically, the second cooling liquid channels 221 of the second support seats 220 of the two groups of support assemblies 200 are all connected to the second liquid inlet channel. In this embodiment, the second cooling liquid channels 221 of the two second support seats 220 and the second liquid inlet channel are connected in series to form a complete flow channel. When it is necessary to convey cooling liquid to the two second support seats 220, the cooling liquid can flow into the second liquid inlet channel from the second liquid inlet port 121, and then flow through the second cooling liquid channels 221 of the two second support seats 220, and the cooling liquid finally flows out from the second liquid outlet port 122, thereby realizing circulating cooling of the two second support seats 220. By adopting the above structure, the two second support seats 220 can be cooled to prevent the two second support seats 220 from softening and deforming due to high temperature, thereby making the two second support seats 220 have sufficient rigidity or strength to support the support rod 230.
[0038] It should be noted that, in the above embodiment, the second cooling liquid channels 221 of the two second support seats 220 are connected in series with the second liquid inlet channels to form a complete flow channel. In some embodiments of the utility model, two independent second liquid inlet channels are arranged inside the second fixed flange 120, and second liquid inlet ports 121 and second liquid outlet ports 122 are arranged at both ends of each second liquid inlet channel. Therefore, the second cooling liquid channel 221 of one of the second support seats 220 is connected with one of the second liquid inlet channels to form an independent flow channel, and the second cooling liquid channel 221 of another second support seat 220 is connected with the other second liquid inlet channel to form another independent flow channel. At this time, according to actual needs, cooling liquid can be transported to one or both of the flow channels, and then one of the second support seats 220 or both of the second support seats 220 can be cooled to meet different practical needs of users.
[0039] In order to better assemble the support rod 230 with the first support seat 210 and the second support seat 220, in some embodiments of the present invention, the first support seat 210 is provided with a first embedding groove 212 that matches the shape of one end of the support rod 230, and the second support seat 220 is provided with a second embedding groove 222 that matches the shape of the other end of the support rod 230. One end of the support rod 230 is embedded in the first embedding groove 212, and the other end of the support rod 230 is embedded in the second embedding groove 222. By adopting the above structure, it is convenient to position and install the support rod 230 and the first support seat 210 and the second support seat 220, and the operation is simple and convenient.
[0040] In order to facilitate the production and processing of the first support seat 210 and the second support seat 220, in some embodiments of the present utility model, the first support seat 210 has a first auxiliary support seat 240, and the first embedding groove 212 is opened in the first auxiliary support seat 240; wherein the first auxiliary support seat 240 can be detachably installed on the first support seat 210. The second support seat 220 has a second auxiliary support seat 250, and the second embedding groove 222 is opened in the second auxiliary support seat 250, wherein the second auxiliary support seat 250 can be detachably installed on the second support seat 220. By adopting the above structure, the first auxiliary support seat 240 and the second auxiliary support seat 250 can be produced separately, and then the first auxiliary support seat 240 and the second auxiliary support seat 250 can be installed on the first support seat 210 and the second support seat 220 in a one-to-one correspondence, which facilitates the production and processing of the first support seat 210 and the second support seat 220.
[0041] It should be noted that, in certain embodiments of the present invention, the first auxiliary support seat 240 and the first support seat 210 are an integrated structure, and the second auxiliary support seat 250 and the second support seat 220 are an integrated structure, which can be determined according to actual needs.
[0042] In order to facilitate the replacement of the first support seat 210 and the second support seat 220, in some embodiments of the present utility model, the first support seat 210 is detachably mounted on the first fixing flange 110, and the second support seat 220 is detachably mounted on the second fixing flange 120. Specifically, the first support seat 210 is bolted to the first fixing flange 110, and the second support seat 220 is bolted to the second fixing flange 120. By adopting the above structure, when the first support seat 210 and / or the second support seat 220 is damaged, it is convenient for the user to replace the first support seat 210 and / or the second support seat 220 with a new one.
[0043] Reference Figures 1 to 6 According to certain embodiments of the present invention, a silicon wafer reaction device includes a reactor body 300, which is provided with the above-mentioned silicon wafer carrier support device, wherein a reaction chamber 301 with two open ends is arranged inside the reactor body 300, a first fixed flange 110 is arranged at one open end of the reaction chamber 301, and a second fixed flange 120 is arranged at the other open end of the reaction chamber 301.
[0044] Since the silicon wafer reaction equipment of this embodiment adopts the above-mentioned silicon wafer carrier support device, it has the advantages of the above-mentioned silicon wafer carrier support device, which will not be repeated here.
[0045] Furthermore, a first furnace door capable of opening or closing one end of the reaction chamber 301 is disposed at one end of the reaction furnace body 300, and a second furnace door capable of opening or closing the other end of the reaction chamber 301 is disposed at the other end of the reaction furnace body 300. By adopting the above structure, the silicon wafer carrier 400 loaded with silicon wafers can enter and exit the reaction chamber 301 easily.
[0046] Although examples of the present embodiment have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present embodiment, and the scope of the present embodiment is defined by the claims and their equivalents.
Claims
1. A silicon wafer carrier support device, characterized in that: include: a first fixing flange and a second fixing flange, wherein the first fixing flange and the second fixing flange are arranged at an interval; At least one set of support components, the support components comprising a first support seat, a second support seat and a support rod, the first support seat is arranged on the first fixing flange, the second support seat is arranged on the second fixing flange, one end of the support rod is abutted or connected to the first support seat, and the other end of the support rod is abutted or connected to the second support seat; Wherein, a first cooling liquid channel is arranged inside the first support seat and / or a second cooling liquid channel is arranged inside the second support seat.
2. The silicon wafer carrier support device according to claim 1, characterized in that: The first support seat is provided with the first cooling liquid channel inside, the first fixing flange is provided with the first liquid inlet channel connected with the first cooling liquid channel inside, one end of the first liquid inlet channel has a first liquid inlet, and the other end of the first liquid inlet channel has a first liquid outlet.
3. The silicon wafer carrier support device according to claim 1, characterized in that: The second support seat is provided with the second cooling liquid channel inside, the second fixing flange is provided with a second liquid inlet channel connected with the second cooling liquid channel inside, one end of the second liquid inlet channel has a second liquid inlet, and the other end of the second liquid inlet channel has a second liquid outlet.
4. The silicon wafer carrier support device according to claim 1, characterized in that: The number of the support components is two groups, and the two groups of support components are arranged parallel to each other and at intervals.
5. The silicon wafer carrier support device according to claim 1, characterized in that: The first support seat is provided with a first embedding groove which is adapted to the shape of one end of the support rod, and the second support seat is provided with a second embedding groove which is adapted to the shape of the other end of the support rod. One end of the support rod is embedded in the first embedding groove, and the other end of the support rod is embedded in the second embedding groove.
6. The silicon wafer carrier support device according to claim 5, characterized in that: The first support seat has a first auxiliary support seat, and the first embedding groove is opened in the first auxiliary support seat; The first auxiliary support seat can be detachably mounted on the first support seat, or the first auxiliary support seat and the first support seat are an integrated structure.
7. The silicon wafer carrier support device according to claim 5, characterized in that: The second support seat has a second auxiliary support seat, and the second mounting groove is provided in the second auxiliary support seat; The second auxiliary support seat can be detachably mounted on the second support seat, or the second auxiliary support seat and the second support seat are an integrated structure.
8. The silicon wafer carrier support device according to claim 1, characterized in that: The first support seat is detachably mounted on the first fixing flange, and the second support seat is detachably mounted on the second fixing flange.
9. Silicon wafer reaction equipment, characterized in that: It comprises a reaction furnace body, wherein the reaction furnace body is provided with a silicon wafer carrier support device as claimed in any one of claims 1 to 8; A reaction chamber with two open ends is arranged inside the reactor body, the first fixed flange is arranged at one open end of the reaction chamber, and the second fixed flange is arranged at the other open end of the reaction chamber.
10. The silicon wafer reaction equipment according to claim 9, characterized in that: A first furnace door capable of opening or closing the opening at one end of the reaction chamber is disposed at one end of the reaction furnace body, and a second furnace door capable of opening or closing the opening at the other end of the reaction chamber is disposed at the other end of the reaction furnace body.