A guide rod type through hole reflow soldering carrier

Abstract

The utility model relates to the technical field of reflow soldering, and discloses a guide rod type through-hole reflow soldering carrier, including a carrier base and a carrier cover; the carrier base includes a bottom plate and a bearing frame, the bearing frame includes two guide mechanisms and two support mechanisms spliced ​​together, each guide mechanism includes a guide support plate and a guide rod arranged on the guide support plate; the carrier cover includes two sliding plates facing each other front and back, the two sliding plates can be slidably covered on the top of the bottom plate, and each sliding plate is provided with a plurality of guide rod connectors on the left and right sides, each guide rod connector passes through the guide rod and can slide axially along the guide rod. The utility model carrier adopts a guide rod design, which can effectively solve the problems of the carrier opening and closing not being smooth, jamming, etc. caused by the cover plates on both sides of the carrier falling down due to gravity in the existing through-hole reflow soldering technology. In addition, the overall structural design of the carrier is reasonable, which ensures its reliability in long-term use.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering, and in particular to a guide rod type through-hole reflow soldering carrier. Background Art

[0002] Through-hole reflow soldering is sometimes also called classified component reflow soldering, which is gradually becoming popular. The through-hole reflow soldering process uses reflow soldering technology to solder plug-in components and special-shaped components with pins. For some products with more SMT components and fewer through-hole components (plug-in components), this process can replace wave soldering and become a process link in PCB mixed assembly technology. The biggest advantage of through-hole reflow soldering is that it can use through-hole plug-ins to obtain better mechanical connection strength while taking advantage of the surface mount manufacturing process.

[0003] Therefore, when the through-hole reflow soldering equipment in the related technology is soldering the PCB through the furnace, due to the large temperature difference between the upper and lower temperature zones, the upper and lower temperature zones are seriously heat-transferring, resulting in poor temperature control. Related technologies such as carriers are needed to solve the problem of serious heat-transferring between the upper and lower temperature zones of the through-hole reflow soldering equipment, which causes damage to non-welding surface components. After the existing through-hole reflow soldering equipment has been running in a high-temperature environment for a long time, it is easy for the carrier to become stuck in opening and closing due to the influence of the high-temperature deformation of the flux, or even unable to open the carrier. After the carrier is forcibly opened, problems such as deformation of the carrier cover occur. Utility Model Content

[0004] The purpose of the utility model is to provide a guide rod type through-hole reflow soldering carrier to address the deficiencies in the prior art. When the equipment is operated at high temperature for a long time, it can still maintain smooth opening and closing to avoid jamming and prevent the problem of the carrier cover tilting downward after being pulled open.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] A guide rod type through-hole reflow soldering carrier is provided, which is used for receiving products to be soldered. The guide rod type through-hole reflow soldering carrier comprises: a carrier base and a carrier cover; the carrier base comprises a bottom plate and a bearing frame, the bottom plate has ventilation holes arranged through it, the bearing frame is arranged around the edge of the bottom plate and connected to the bottom plate, the bearing frame comprises two guide mechanisms and two support mechanisms which are spliced ​​together, the two guide mechanisms are respectively arranged on the left and right sides of the bottom plate, the two support mechanisms are respectively arranged on the front and back sides of the bottom plate, each guide mechanism comprises a guide support plate and a guide rod arranged on the guide support plate, the guide support plate comprises a receiving portion for receiving products to be soldered and an extension portion connected to the receiving portion, the guide rod is extended along the receiving portion and the extension portion; the carrier cover comprises two sliding plates facing each other front and back, the two sliding plates can be slidably covered on the top of the bottom plate, a plurality of guide rod connectors are respectively arranged on the left and right sides of each sliding plate, each guide rod connector is respectively installed on the guide rod and can slide axially along the guide rod.

[0007] Preferably, two guide rod connectors are respectively provided on the left and right sides of each sliding plate, one of the two guide rod connectors is arranged at the front part of the sliding plate, and the other guide rod connector is arranged at the rear part of the sliding plate.

[0008] Preferably, the length of the guide rod is greater than the width of the base plate.

[0009] Preferably, the length of the guide rod is greater than the sum of the widths of the two sliding plates.

[0010] Preferably, the guide rod connector is connected to the two sliding plates via pins.

[0011] Preferably, the carrier cover plate and carrier base are made of but not limited to high temperature resistant materials such as synthetic stone, which can effectively play the role of heat insulation and wind protection; the guide rod can be made of but not limited to hardened and wear-resistant materials such as stainless steel and mold steel.

[0012] Compared with the prior art, the guide rod type through-hole reflow soldering carrier of the utility model has the following beneficial effects:

[0013] The guide rod type through-hole reflow soldering carrier of the utility model operates smoothly under long-term high temperature of the equipment, avoiding jamming when the carrier is opened and closed; in addition, because the guide support plate and the guide rod both extend along the front and rear directions of the base plate and both extend beyond the base plate by a set distance (the guide rod is lengthened), the carrier cover can effectively avoid tilting after being opened. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. Personnel in ordinary fields can also obtain other drawings based on the following drawings without making any creative efforts.

[0015] Figure 1 It is a structural schematic diagram of the guide rod type through-hole reflow soldering carrier of the utility model in a state where the carrier cover is closed;

[0016] Figure 2 It is a structural schematic diagram of the guide rod type through-hole reflow soldering carrier of the utility model in a state where the carrier cover is opened;

[0017] Figure 3 It is an exploded view of the guide rod type through-hole reflow soldering carrier of the utility model. DETAILED DESCRIPTION

[0018] In order to more fully understand the technical content of the present invention, the technical solution of the present invention is further introduced and illustrated in conjunction with specific embodiments below, but is not limited thereto.

[0019] like Figure 1 and3 As shown, the utility model is a guide rod type through-hole reflow soldering carrier, which includes a carrier base 1 and a carrier cover plate 2 .

[0020] The carrier base 1 includes a bottom plate 11 and a carrying frame 12. The bottom plate 11 has a ventilation hole 111 that is arranged through it. The carrying frame 12 is arranged around the edge of the bottom plate 11 and is connected to the bottom plate 11. The carrying frame 12 includes two guide mechanisms 121 and two support mechanisms 122 that are spliced ​​together. The two guide mechanisms 121 are respectively arranged on the left and right sides of the bottom plate 11, and the two support mechanisms 122 are respectively arranged on the front and back sides of the bottom plate 11. Each guide mechanism 121 includes a guide support plate 1211 and a guide rod 1212 arranged on the guide support plate 1211. The guide support plate 1211 includes a receiving portion 1211a for receiving a product to be welded and an extension portion 1211b connected to the receiving portion 1211a. The guide rod 1212 is extended along the receiving portion 1211a and the extension portion 1211b. The length of the guide rod 1212 is greater than the width of the bottom plate 11, and the length of the guide rod 1212 is greater than the sum of the widths of the two sliding plates. The guide rod 1212 is made of stainless steel or mold steel, which has the advantages of corrosion resistance, wear resistance, high temperature resistance and high strength.

[0021] The carrier cover 2 includes two sliding plates 21 facing each other front and back. The two sliding plates 21 can be slidably covered on the top of the bottom plate 11. A plurality of guide rod connectors 22 are respectively provided on the left and right sides of each sliding plate 21. The guide rod connectors 22 are fixedly mounted on the carrier cover 2 by pins. Each guide rod connector 22 passes through the guide rod 1212 and can slide freely axially along the guide rod 1212. In this embodiment, two guide rod connectors 22 are respectively provided on the left and right sides of each sliding plate 21. One of the two guide rod connectors 22 is arranged at the front part of the sliding plate 21, and the other guide rod connector 22 is arranged at the rear part of the sliding plate 21. Since the guide rod connectors 22 are in a parallel state relative to the guide rod 1212, the guide rod 1212 plays a supporting role, which can enable the carrier cover 2 to open and close smoothly without jamming, and prevent the carrier cover 2 from tilting due to the influence of gravity.

[0022] The working principle of the guide rod type through-hole reflow soldering carrier in this embodiment is as follows: when the through-hole reflow soldering equipment is soldering the product, external force is applied to the two sliding plates 21 at the same time, causing the two sliding plates 21 to move away from each other along the guide rod 1212, thereby opening the ventilation hole 111; when the through-hole reflow soldering equipment is not soldering, external force is applied to the two sliding plates 21 at the same time, causing the two sliding plates 21 to move toward each other along the track, thereby closing the ventilation hole 111.

[0023] The utility model guide rod type through hole reflow soldering carrier has the following beneficial effects:

[0024] (1) Since the guide rods 1212 extend in the front-to-rear direction of the bottom plate 11 and extend beyond the bottom plate 11 by a set distance, the guide rod connector 22 disposed at the rear portion of the sliding plate 21 can still be supported by the guide rods 1212 when the carrier cover 2 is opened, thereby effectively preventing the carrier cover 2 from tilting.

[0025] (2) The guide rod type through-hole reflow soldering carrier can be used for a long time in a high temperature and flux environment. In this environment, the guide rod 1212 can still be guaranteed not to be deformed, and the flux can be prevented from adhering to the guide rod 1212 and causing the carrier to jam when opening and closing.

[0026] (3) Through-hole reflow soldering equipment is different from ordinary reflow soldering. Through-hole reflow soldering equipment adopts the method of cooling the upper layer and heating the lower layer. In order to prevent the temperature of the upper and lower layers from being in series, the guide rod type through-hole reflow soldering carrier of the utility model has the function of heat insulation and wind protection. The carrier cover plate 2 and the carrier base 1 in the utility model are made of synthetic stone material. The synthetic stone is composed of natural stone powder and resin. The thermal conductivity of the synthetic stone is very low, so the thermal insulation performance of the carrier is better.

[0027] Finally, it should be noted that the above examples are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in this field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the essence and scope of the technical solution of the utility model.

Claims

1. A guide rod type through hole reflow soldering carrier, used for receiving products to be soldered, characterized in that: include: A carrier base, comprising a bottom plate and a bearing frame, wherein the bottom plate has ventilation holes arranged therethrough, the bearing frame is arranged around the edge of the bottom plate and connected to the bottom plate, the bearing frame comprises two guide mechanisms and two support mechanisms, the two guide mechanisms are respectively arranged on the left and right sides of the bottom plate, the two support mechanisms are respectively arranged on the front and rear sides of the bottom plate, each of the guide mechanisms comprises a guide support plate and a guide rod arranged on the guide support plate, the guide support plate comprises a receiving portion for receiving the product to be welded and an extension portion connected to the receiving portion, and the guide rod is formed by extending along the receiving portion and the extension portion; The carrier cover includes two sliding plates facing each other front and back. The two sliding plates can be slidably covered on the top of the base plate. A plurality of guide rod connectors are respectively provided on the left and right sides of each sliding plate. Each guide rod connector is respectively installed on the guide rod and can slide axially along the guide rod.

2. The guide rod type through hole reflow soldering carrier according to claim 1, characterized in that: Two guide rod connectors are respectively arranged on the left and right sides of each sliding plate, one of the two guide rod connectors is arranged at the front part of the sliding plate, and the other guide rod connector is arranged at the rear part of the sliding plate.

3. The guide rod type through hole reflow soldering carrier according to claim 1, characterized in that: The length of the guide rod is greater than the width of the bottom plate.

4. The guide rod type through hole reflow soldering carrier according to claim 1, characterized in that: The length of the guide rod is greater than the sum of the widths of the two sliding plates.

5. The guide rod type through hole reflow soldering carrier according to claim 1, characterized in that: The guide rod connecting piece is connected to the two sliding plates through pins.

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