Soldering pen structure for welding small size components

Abstract

The utility model discloses a soldering pen structure for welding small-sized components, comprising: a soldering pen body and a pressing piece, the soldering pen body comprising a welding head and a welding handle, one end of the welding head being arranged on one end of the welding handle, the pressing piece comprising a bracket and a pressing head, one end of the bracket being arranged on the welding head or the welding handle, the pressing head being arranged on the other end of the bracket, and when a flash chip is welded, the pressing head is used to press down and position the flash chip. The soldering pen structure for welding small-sized components of the utility model is provided with a soldering pen body and a pressing piece, so that when a flash chip is welded, the flash chip is pressed down and positioned by the pressing head, so as to avoid accidentally pushing the flash chip during welding, causing the flash chip to be offset, so as to improve the welding success rate, and further improve the welding yield rate.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering pens, in particular to a soldering pen structure used for soldering small-sized components. Background Art

[0002] Due to their small size, small-sized components are prone to position shift due to accidental pushing and bumping during the welding process, which brings certain difficulties to welding, such as welding flash chips. Flash chips, as a kind of storage chip, are widely used in various mobile devices, such as smart phones or tablets. In the production process of corresponding mobile devices, it is usually necessary to solder the Flash chip to the corresponding circuit board. Some transfer devices are small in size, and the corresponding flash chips are also small. For example, when welding such small-package components, due to the small size of small-package components, when using a soldering pen for welding, it is easy to accidentally push and bump the flash chip, causing the flash chip to shift, which in turn leads to a low welding yield and a low welding success rate.

[0003] In view of the above, a soldering pen structure for soldering small-sized components is proposed, so as to improve the success rate of soldering. Utility Model Content

[0004] The utility model aims to overcome the shortcomings of the prior art and provide a soldering pen structure for soldering small-sized components which can improve the soldering success rate.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A soldering pen structure for soldering small-sized components comprises: a soldering pen body and a pressing piece, wherein the soldering pen body comprises a soldering head and a soldering handle, one end of the soldering head is arranged on one end of the soldering handle, the pressing piece comprises a bracket and a pressing head, one end of the bracket is arranged on the soldering head or the soldering handle, and the pressing head is arranged on the other end of the bracket. When a flash chip is soldered, the pressing head is used to press down and position the flash chip.

[0007] In one embodiment, the bracket includes a mounting fixing ring and a mounting rod, the mounting fixing ring is sleeved on the welding head or the welding handle, one end of the mounting rod is arranged on the mounting fixing ring, and the other end of the mounting rod extends away from the mounting fixing ring, and the pressing head is arranged on the end of the mounting rod away from the mounting fixing ring.

[0008] In one of the embodiments, the mounting fixing ring is detachably mounted on the welding head.

[0009] In one embodiment, the mounting rod includes a connecting portion and a bending portion, one end of the connecting portion is arranged on the mounting fixing ring, one end of the bending portion is connected to the other end of the connecting portion, the bending portion is bent relative to the connecting portion and forms a preset angle, and the pressing head is arranged on one end of the bending portion away from the connecting portion.

[0010] In one of the embodiments, a clamping hole is provided on the installation fixing ring, and a clamping block is provided on the welding head. When the installation fixing ring is sleeved on the welding head, the clamping block is located in the clamping hole.

[0011] In one embodiment, the welding head includes a welding head front end and a welding head rear end, the welding head front end is arranged on the welding head rear end, the welding head rear end is arranged on the welding handle, and a guide slope is arranged on the welding head rear end.

[0012] In one of the embodiments, a buffer layer is provided on the surface of the pressing head.

[0013] In one embodiment, the buffer layer is a high temperature resistant rubber layer.

[0014] In one embodiment, the pressing head is in a square structure.

[0015] In one of the embodiments, a heat insulating protective cover is provided on the welding handle.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The soldering pen structure for soldering small-sized components of the utility model is provided with a soldering pen body and a pressing piece. Thus, when a flash chip is soldered, the flash chip is pressed down and positioned by the pressing head to avoid accidentally pushing the flash chip during the soldering process, causing the flash chip to be displaced. Thus, the soldering success rate can be improved, thereby improving the soldering yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 This is a schematic structural diagram of a soldering pen structure for soldering small-sized components in one embodiment of the utility model;

[0020] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of the soldering pen structure at point A used to solder small-size components. DETAILED DESCRIPTION

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.

[0022] See also Figure 1 and Figure 2 As shown, a soldering pen structure 10 for soldering small-sized components includes: a soldering pen body 100 and a pressing piece 200, the soldering pen body 100 includes a soldering head 110 and a soldering handle 120, one end of the soldering head 110 is arranged on one end of the soldering handle 120, the pressing piece 200 includes a bracket 210 and a pressing head 220, one end of the bracket 210 is arranged on the soldering head 110 or the soldering handle 120, and the pressing head 220 is arranged at the other end of the bracket 210. When the flash chip 20 is soldered, the pressing head 220 is used to press down and position the flash chip 20.

[0023] It should be noted that the bracket 210 on the pressing member 200 can be installed on the welding head 110 or on the welding handle 120. When welding a flash chip 20 with a small package size, the flash chip 20 is easily displaced due to accidental pushing and bumping during the welding process, thereby affecting the subsequent welding operation. Therefore, in the utility model, by setting the pressing member 200 on the welding pen body 100, the flash chip 20 is pressed down and positioned by the pressing head 220 during welding to avoid the flash chip 20 from shifting its position. In this way, the connection between the pad on the circuit board and the flash chip 20 can be ensured, thereby improving the welding success rate and thus improving the welding yield rate.

[0024] In one embodiment, the bracket 210 includes a mounting fixing ring 211 and a mounting rod 212. The mounting fixing ring 211 is sleeved on the welding head 110 or the welding handle 120. One end of the mounting rod 212 is disposed on the mounting fixing ring 211. The other end of the mounting rod 212 extends toward one end of the mounting fixing ring 211 away from the mounting fixing ring. The pressing head 220 is disposed on one end of the mounting rod 212 away from the mounting fixing ring 211. The mounting rod 212 is used to extend the position of the pressing head 220 so that the pressing head 220 can press down and position the flash chip 20, thereby preventing the flash chip 20 from being displaced during the welding process.

[0025] Furthermore, the mounting and fixing ring 211 is detachably mounted on the welding head 110. By making the mounting and fixing ring 211 detachable, when the pressing member 200 is damaged, the mounting and fixing ring 211 can be removed to replace the pressing member 200. In addition, since the welding position of the welding member 110 is close to the flash chip during welding, the pressing head 220 is provided to shorten the distance of the bracket 210, thereby reducing the space occupied by the pressing member 200, that is, reducing the material usage of the bracket 210.

[0026] Furthermore, the mounting rod 212 includes a connecting portion 212a and a bending portion 212b, one end of the connecting portion 212a is disposed on the mounting fixing ring 211, one end of the bending portion 212b is connected to the other end of the connecting portion 212a, the bending portion 212b is bent relative to the connecting portion 212a and forms a preset angle, and the pressing head 220 is disposed on one end of the bending portion 212b away from the connecting portion 212a. The preset angle formed between the bending portion 212b and the connecting portion 212a needs to ensure that during welding, the tip of the welding head 110 can touch the solder paste while the pressing head 220 can press down to hold the flash chip to ensure the success rate of welding; for example, the preset angle is greater than or equal to 90°.

[0027] Furthermore, a clamping hole is provided on the installation fixing ring 211, and a clamping block is provided on the welding head 110. When the installation fixing ring 211 is sleeved on the welding head 110, the clamping block is located in the clamping hole. The installation fixing ring 211 is fixed by the clamping block and the clamping hole. For example, the clamping block on the welding head 110 is a retractable structure, and a limiting groove is formed inside the welding head 110. One end of the clamping block is connected to a spring, and the other end of the spring is arranged in the limiting groove. By squeezing the clamping block, the spring drives the clamping block to retract. In this way, the clamping hole on the installation fixing block 211 can be sleeved into the clamping block, thereby forming a locking fixation.

[0028] In one embodiment, the welding head 110 includes a welding head front end 111 and a welding head rear end 112, wherein the welding head front end 111 is disposed on the welding head rear end 112, and the welding head rear end 112 is disposed on the welding handle 120, and a guide slope is disposed on the welding head rear end 112. The guide slope can facilitate the installation and fixing ring 211 to be sleeved on the welding head 110.

[0029] In one embodiment, a buffer layer is provided on the surface of the pressing head 220. In order to avoid scratching the flash chip 20 when pressing the flash chip 20, a buffer layer is provided on the surface of the pressing head 220 to provide a buffering effect. Preferably, the buffer layer is a high temperature resistant rubber layer, for example, a high temperature resistant polyurethane rubber material.

[0030] Preferably, the pressing head 220 has a square structure.

[0031] In one embodiment, a heat insulating protective sleeve is provided on the welding handle 120. The heat insulating protective sleeve is provided on the welding handle 120 to play a heat insulating role, so that the operator can hold the welding handle 120 for welding. For example, the heat insulating protective sleeve can be made of existing high temperature resistant rubber material.

[0032] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A soldering pen structure for soldering small-sized components, characterized in that: include: A soldering pen body, the soldering pen body comprising a soldering head and a soldering handle, one end of the soldering head being disposed on one end of the soldering handle; and A pressing member, the pressing member includes a bracket and a pressing head, one end of the bracket is arranged on the welding head or the welding handle, and the pressing head is arranged on the other end of the bracket. When the flash chip is welded, the pressing head is used to press down and position the flash chip.

2. The soldering pen structure for soldering small-sized components according to claim 1, characterized in that: The bracket includes a mounting fixing ring and a mounting rod, the mounting fixing ring is sleeved on the welding head or the welding handle, one end of the mounting rod is arranged on the mounting fixing ring, the other end of the mounting rod extends away from the mounting fixing ring, and the pressing head is arranged on the end of the mounting rod away from the mounting fixing ring.

3. The soldering pen structure for soldering small-sized components according to claim 2, characterized in that: The mounting fixing ring is detachably sleeved on the welding head.

4. The soldering pen structure for soldering small-sized components according to claim 2, characterized in that: The mounting rod includes a connecting portion and a bending portion, one end of the connecting portion is arranged on the mounting fixing ring, one end of the bending portion is connected to the other end of the connecting portion, the bending portion is bent relative to the connecting portion and forms a preset angle, and the pressing head is arranged on one end of the bending portion away from the connecting portion.

5. The soldering pen structure for soldering small-sized components according to claim 2, characterized in that: The mounting and fixing ring is provided with a clamping hole, and the welding head is provided with a clamping block. When the mounting and fixing ring is sleeved on the welding head, the clamping block is located in the clamping hole.

6. The soldering pen structure for soldering small-sized components according to claim 2, characterized in that: The welding head comprises a welding head front end and a welding head rear end, the welding head front end is arranged on the welding head rear end, the welding head rear end is arranged on the welding handle, and a guiding inclined surface is arranged on the welding head rear end.

7. The soldering pen structure for soldering small-sized components according to claim 1, characterized in that: A buffer layer is arranged on the surface of the pressing head.

8. The soldering pen structure for soldering small-sized components according to claim 7, characterized in that: The buffer layer is a high temperature resistant rubber layer.

9. The soldering pen structure for soldering small-sized components according to claim 1, characterized in that: The pressing head is in a square structure.

10. The soldering pen structure for soldering small-sized components according to claim 1, characterized in that: The welding handle is provided with a heat insulation protective cover.

Images