A wire clip, a bonding head and a wire bonding device

Abstract

The present application belongs to the technical field of wire bonding equipment, and relates to a wire clamp used to clamp the metal lead output by the wire bonding equipment, wherein the metal lead is grounded, and the wire clamp includes a support, a clamping assembly, and two wire-passing sliders; the clamping assembly is mounted on the support, and the clamping assembly includes a first clamping arm and a second clamping arm, and the first clamping arm and the second clamping arm are mounted on the support, and the first clamping arm and the second clamping arm cooperate to clamp the metal lead; the wire-passing slider is mounted on the clamping assembly, and the wire-passing slider includes a first wire-passing slider and a second wire-passing slider, and the first wire-passing slider is mounted on the first clamping arm, and the second wire-passing slider is mounted on the second clamping arm, and the side of the wire-passing slider in contact with the metal lead is made of conductive material. The present application also relates to a bundling head and a wire bonding equipment. The technical solution provided by the present application can eliminate static electricity on the wire clamp, reduce wire release resistance, and improve the production efficiency of the wire bonding equipment.

Description

Technical Field

[0001] The present application relates to the technical field of wire bonding equipment, and more specifically, to a wire clamp, a bundling head and a wire bonding equipment. Background Art

[0002] Wire bonding equipment is a conventional production equipment that welds metal wires to a die (or chip holder). When the wire bonding equipment is working, a wire clamp is usually used to clamp the metal wires so that the wire bonding equipment can accurately weld the metal wires to the target position.

[0003] Since the wire clamp needs to effectively resist the frequent pressing and scratching of the metal lead, the traditional wire clamp uses sapphire material with higher hardness to make the wire slider to avoid problems such as crushing the wire due to damage to the surface of the wire slider and failure to clamp the wire tightly.

[0004] However, since the traditional sapphire wire slider is an insulator, when the wire bonding equipment is working, the wire slider moves at high speed with the wire clamp, and frequently contacts and separates with the metal wire and the air, causing static electricity to be generated on the surface of the wire slider. Due to the phenomenon of electrostatic induction, impurities in the air and the metal wire will be attracted and attached to the sapphire wire slider, thereby affecting the wire bonding quality and production efficiency of the wire bonding equipment. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present application is that the wire-passing slider of a traditional wire clamp is prone to generate static electricity, causing impurities and metal wires to be adsorbed on the wire-passing slider, affecting the wire bonding quality and production efficiency of the wire bonding equipment.

[0006] In order to solve the above technical problems, the embodiment of the present application provides a wire clamp, which adopts the following technical solution:

[0007] A wire clamp, used for clamping a metal wire outputted from a wire bonding device, wherein the metal wire is grounded, and the wire clamp comprises a support, a clamping assembly and a wire-passing slider;

[0008] The clamping assembly is mounted on the support, and the clamping assembly includes a first clamping arm and a second clamping arm, the first clamping arm and the second clamping arm are mounted on the support, and the first clamping arm and the second clamping arm cooperate to clamp the metal lead;

[0009] The wire-passing slider is mounted on the clamping assembly, and the wire-passing slider includes a first wire-passing slider and a second wire-passing slider, the first wire-passing slider is mounted on the first clamping arm, the second wire-passing slider is mounted on the second clamping arm, and the side of the wire-passing slider in contact with the metal lead is made of conductive material;

[0010] When the clamping assembly clamps the metal lead, the static electricity on the wire-passing slider is conducted to the ground through the metal lead.

[0011] Furthermore, the wire-passing slider includes a connecting portion and a conductive portion, the connecting portion is connected to the clamping assembly, and the connecting portion is made of an insulating material; the conductive portion is mounted on the connecting portion, and the conductive portion is made of a conductive material.

[0012] Furthermore, the wire clamp also includes a wire, and the clamping assembly is grounded through the wire.

[0013] Furthermore, the line-passing slider is made of a conductive material, and the clamping assembly is made of an insulating material.

[0014] Furthermore, a first limit block is provided on the first clamping arm, and the first wire-passing slider is installed on the first clamping arm and is arranged close to the first limit block;

[0015] The second clamping arm is provided with a second limit block, and the second line-crossing sliding block is mounted on the second clamping arm and is arranged close to the second limit block.

[0016] Furthermore, the first limiting block and the second limiting block are both made of insulating material.

[0017] The present application also provides a bungee, which adopts the following technical solution:

[0018] A bungee comprises a body, a transducer and the above-mentioned wire clamp;

[0019] The transducer is mounted on the body; the wire clamp is mounted on the body and is located above the transducer.

[0020] Furthermore, the bun head also includes a rotating shaft, and the body is rotatably mounted on the rotating shaft.

[0021] The present application also provides a wire bonding device, which adopts the following technical solution:

[0022] A wire bonding device, characterized by comprising the bonding head as described above.

[0023] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0024] The wire clamp provided in the present application has a wire-passing slider which contacts the metal lead on one side thereof and is made of a conductive material. When the clamping assembly clamps the metal lead, the wire-passing slider contacts the metal lead, and the static electricity generated by high-speed friction is directed to the ground through the metal lead, thereby eliminating the static electricity effect on the wire-passing slider, preventing impurities in the air and the metal lead from being attracted and attached to the wire clamp, thereby reducing the wire release resistance and improving the wire bonding quality and production efficiency of the wire bonding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the scheme of the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 is a schematic structural diagram of a wire clamp according to an embodiment of the present application;

[0027] Figure 2 is a top view of the wire clamp of an embodiment of the present application;

[0028] Figure 3 It is a structural schematic diagram of a line-crossing slider according to an embodiment of the present application;

[0029] Figure 4 This is a schematic diagram of the electrical properties of the wire clamp of the embodiment of the present application when removing static electricity;

[0030] Figure 5 is an electrical schematic diagram of a wire clamp in another embodiment of the present application when removing static electricity;

[0031] Figure 6 It is a schematic structural diagram of a wire bonding device according to an embodiment of the present application.

[0032] Reference numerals:

[0033] 1. Support; 2. Clamping assembly; 21. First clamping arm; 211. First limit block; 22. Second clamping arm; 221. Second limit block; 3. Wire-passing slider; 31. First wire-passing slider; 311. Connecting portion; 312. Conductive portion; 32. Second wire-passing slider; 100. Bunting head; 101. Main body; 102. Transducer; 103. Wire clamp; 104. Rotating axis; 200. Wire-releasing mechanism; 300. Metal lead; 400. Loading mechanism; 500. Fire rod; 600. Crystal grain. DETAILED DESCRIPTION

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0035] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0036] Static electricity is formed by the redistribution of charges caused by friction, and also by the redistribution of charges caused by the mutual attraction of charges. Therefore, when the wire bonding equipment is working, the wire slider moves at high speed with the clamping component, causing the wire slider to frequently contact and separate from the metal lead and the air. Part of the charge in the metal lead and the air is transferred to the surface of the wire slider. Since the existing wire slider is usually made of insulating material, the charge can no longer move freely on the insulator, so it cannot return to the metal lead. Therefore, as the wire bonding equipment continues to work, the static electricity on the surface of the traditional sapphire wire slider will gradually increase.

[0037] Therefore, after the traditional sapphire wire-passing slider is charged with static electricity, when the metal lead is close to the wire-passing slider, under the influence of electrostatic induction (the phenomenon that the charge in the conductor is redistributed in the conductor under the action of an external electric field. When a charged object and an uncharged conductor are close to each other, the charge inside the conductor will be redistributed due to the interaction between the charges, and the charges with the opposite polarity to the charged body will appear on the surface of the conductor closest to the charged body, and the same charges will be repelled to the other end of the conductor far away from the charged body), the metal lead will be adsorbed to the surface of the wire-passing slider. At the same time, dust and tiny particles with opposite polarity to the surface of the wire-passing slider will also be adsorbed to the surface of the wire-passing slider, thereby increasing the wire-release resistance of the wire clamp, or even making it impossible to release the wire.

[0038] Based on the above-mentioned electrostatic adsorption situation, the present application provides a wire clamp 103 for clamping the metal lead 300 of the wire bonding device. The wire clamp 103 can eliminate its own static electricity during the process of clamping the metal lead 300, thereby avoiding the above-mentioned electrostatic adsorption situation.

[0039] See also Figure 1 , Figure 2 As shown, the wire clamp 103 provided in the embodiment of the present application includes: a support 1, a clamping assembly 2 and a wire-passing slider 3.

[0040] In some embodiments, the clamping assembly 2 is mounted on the support 1, and the clamping assembly 2 includes a first clamping arm 21 and a second clamping arm 22, the first clamping arm 21 and the second clamping arm 22 are mounted on the support 1, and the first clamping arm 21 and the second clamping arm 22 cooperate to clamp the metal lead 300. In this embodiment, the support 1 also includes a driving assembly (not shown in the figure), which is mounted on the support 1 and connected to the clamping assembly 2, and the driving assembly is used to control the opening or closing of the clamping assembly 2 to achieve the clamping or release of the metal lead 300 output by the wire bonding device.

[0041] In this embodiment, the driving component is connected to the first clamping arm 21 and the second clamping arm 22 respectively, and the driving component is used to drive the first clamping arm 21 and the second clamping arm 22 to move closer or farther away to achieve the clamping or release of the metal lead 300 output by the wire bonding device.

[0042] Please continue reading Figure 1 , Figure 2 As shown, in some embodiments, the wire-passing slider 3 is installed on the clamping assembly 2, the wire-passing slider 3 is arranged on the opposite side of the first clamping arm 21 and the second clamping arm 22, and the side of the wire-passing slider 3 that contacts the metal lead 300 is made of conductive material.

[0043] In this embodiment, the wire-passing slider 3 includes a first wire-passing slider 31 and a second wire-passing slider 32 . The first wire-passing slider 31 is mounted on the first clamping arm 21 , and the second wire-passing slider 32 is mounted on the second clamping arm 22 .

[0044] When the clamping assembly 2 clamps the metal lead 300 , the static electricity on the wire-passing slider 3 is conducted to the ground through the metal lead 300 .

[0045] The wire-passing slider 3 and one side of the metal lead 300 of the wire clamp 103 provided in the embodiment of the present application are made of conductive material. When the clamping assembly 2 clamps the metal lead 300, the wire-passing slider 3 is in contact with the metal lead 300, and the static electricity generated by high-speed friction is guided to the ground through the metal lead 300, thereby eliminating the electrostatic effect on the wire-passing slider 3, avoiding the generation of electrostatic adsorption that causes impurities in the air and the metal lead 300 to be attracted and attached to the wire clamp 103, thereby reducing the wire release resistance.

[0046] See also Figure 3As shown, in some embodiments, the line-passing slider 3 includes a connecting portion 311 and a conductive portion 312, the connecting portion 311 is connected to the clamping assembly 2, and the connecting portion 311 is made of insulating material; the conductive portion 312 is installed on the connecting portion 311, and the conductive portion 312 is made of conductive material.

[0047] In this embodiment, since the clamping assembly 2 drives the wire-passing slider 3 to move at a high speed, the conductive portion 312 rubs against the air at a high speed and frequently contacts the metal lead 300, resulting in charge migration, causing the conductive portion 312 to carry static electricity. Figure 4 As shown; since the metal lead 300 is grounded, when the conductive portion 312 contacts the metal lead 300, the charge of the conductive portion 312 is guided to the ground through the metal lead 300, eliminating the static electricity of the conductive portion 312.

[0048] In this embodiment, the insulating material is selected from ceramic material, SiO2, ZrO2, sapphire or chemically strengthened glass; the conductive material is selected from metal or metal alloy.

[0049] Since the main function of the wire bonding equipment is to weld the metal lead 300 to the crystal grain 600, the wire bonding equipment needs to have two important functions, namely, ignition ball burning and welding detection. The ignition ball burning and welding detection in the wire bonding equipment used in this application both need to form a loop through the metal lead 300. Therefore, if the wire clamp 103 in contact with the metal lead 300 is a conductor as a whole, the metal lead 300 will be directly grounded through the wire clamp 103, and a loop cannot be formed, thereby causing the welding detection function to fail.

[0050] The connecting portion 311 of the wire-passing slider 3 of the embodiment of the present application is made of insulating material, so that there is no electricity between the conductive portion 312 and the clamping assembly 2, thereby avoiding the direct grounding of the metal lead 300 and ensuring that the metal lead 300 can form a loop, so that the wire bonding equipment can realize the function of welding detection.

[0051] In some embodiments, the wire clamp 103 also includes a wire (not shown in the figure), and the clamping assembly 2 is grounded through the wire. In this embodiment, the first clamping arm 21 and the second clamping arm 22 are respectively grounded through the wire. When the driving assembly drives the first clamping arm 21 and the second clamping arm 22 to frequently approach or move away, the static electricity generated by the friction between the first clamping arm 21 or the second clamping arm 22 and the air is guided to the ground through the wire, avoiding attraction to the metal lead 300 and causing the metal lead 300 to deviate, and also avoiding dust and tiny particles in the air from being adsorbed on the first clamping arm 21 or the second clamping arm 22.

[0052] In other embodiments, the wire-passing slider 3 is made entirely of conductive material. At this time, in order to ensure that the metal lead 300 can generate a loop, the clamping component 2 is made of insulating material, wherein the insulating material is a surface-treated titanium alloy or aluminum alloy.

[0053] In this embodiment, due to the high-speed movement of the wire-passing slider 3, the conductive part 312 rubs against the air at high speed, and the charge migrates, so that the conductive part 312 is charged with static electricity. Figure 5 As shown; since the metal lead 300 is grounded, when the conductive portion 312 contacts the metal lead 300, the charge of the conductive portion 312 is guided to the ground through the metal lead 300, eliminating the static electricity of the conductive portion 312.

[0054] See also Figure 1 , Figure 2 As shown, in this embodiment, the number of the wire-passing sliders 3 is two, and the wire clamp 103 includes a first wire-passing slider 31 and a second wire-passing slider 32; the first wire-passing slider 31 is installed on the first clamping arm 21, and the second wire-passing slider 32 is installed on the second clamping arm 22.

[0055] Due to the electrostatic induction effect, the charges inside the metal lead 300 are redistributed, so that the opposite sides of the metal lead 300 are charged with opposite polarities. Since the first wire-passing slider 31 and the second wire-passing slider 32 move at high speed and frequently contact and separate from the metal lead 300, the charges on the metal lead 300 will be transferred to the first wire-passing slider 31 or the second wire-passing slider 32, so that the surfaces of the first wire-passing slider 31 and the second wire-passing slider 32 are charged. Figure 4 or Figure 5 As shown, when the clamping assembly 2 clamps the metal lead 300, the first wire-passing slider 31 and the second wire-passing slider 32 respectively contact the opposite sides of the metal lead 300, so that the charge on the wire-passing slider 3 can be guided to the ground through the metal lead 300, eliminating the static electricity generated on the first wire-passing slider 31 and the second wire-passing slider 32, and preventing impurities in the air from being attracted and attached to the metal lead 300.

[0056] Please continue reading Figure 1 , Figure 2 As shown, in some embodiments, the first clamping arm 21 is provided with a first limit block 211, and the first line-crossing slider 31 is installed on the first clamping arm 21 and is arranged close to the first limit block 211; the second clamping arm 22 is provided with a second limit block 221, and the second line-crossing slider 32 is installed on the second clamping arm 22 and is arranged close to the second limit block 221.

[0057] The embodiment of the present application sets a first limit block 211 on the first clamping arm 21 and a second limit block 221 on the second clamping arm 22 to limit the positions of the first line-passing slider 31 and the second line-passing slider 32, thereby improving the installation stability of the first line-passing slider 31 and the second line-passing slider 32.

[0058] In this embodiment, the first limit block 211 and the second limit block 221 are both made of insulating material, wherein the insulating material is a titanium alloy or an aluminum alloy that has been surface treated. The first limit block 211 and the second limit block 221 of the embodiment of the present application are made of insulating material to prevent the first wire-passing slider 31 from forming an electrical connection with the first clamping arm 21 through the first limit block 211 and to prevent the second wire-passing slider 32 from forming an electrical connection with the second clamping arm 22 through the second limit block 221, thereby ensuring that a detection loop can be formed when the wire bonding device is performing welding detection, thereby ensuring the welding detection function of the wire bonding device.

[0059] See also Figure 6 As shown, based on the wire clamp 103 described above, the present application further provides a bungee 100 , including a body 101 , a transducer 102 and the wire clamp 103 described above.

[0060] The transducer 102 is mounted on the body 101 ; the wire clip 103 is mounted on the body 101 and is located above the transducer 102 .

[0061] The bungee 100 provided in the embodiment of the present application adopts the wire clamp 103 as described above, so that the wire clamp 103 has the ability to eliminate static electricity, preventing impurities in the air and the metal lead 300 from being attracted and attached to the wire clamp 103, thereby reducing the wire release resistance of the bungee 100.

[0062] Please continue reading Figure 6 As shown, in some embodiments, the bungee 100 further includes a rotating shaft 104 , and the body 101 is rotatably mounted on the rotating shaft 104 .

[0063] In this embodiment, the body 101 rotates around the rotating shaft 104 so that the end of the metal lead 300 can move between the ignition rod 500 and the loading mechanism 400, so as to facilitate high-voltage ignition of the end of the metal lead 300 to complete the ball burning and then weld the grain 600.

[0064] Please refer again Figure 6 As shown, the embodiment of the present application further provides a wire bonding device, and the wire bonding device is the bonding head 100 as described above.

[0065] In this embodiment, the clamping assembly 2 of the wire clamp 103 of the bungee 100 is grounded.

[0066] In some embodiments, the wire bonding equipment also includes a wire pay-off mechanism 200, a spark rod 500 and a loading mechanism 400, the wire pay-off mechanism 200 is grounded, the metal wire 300 is loaded on the wire pay-off mechanism 200, and is output to the bonding head 100 by the wire pay-off mechanism 200; the loading mechanism 400 is grounded, and the loading mechanism 400 is loaded with grains 600 to be processed by the welding wire; the spark rod is located between the transducer 103 and the loading mechanism 400.

[0067] In this embodiment, after the metal lead 300 passes through the wire clamp 103 , the end of the metal lead 300 is located at the porcelain nozzle tip of the transducer 102 , and the wire clamp 103 clamps the metal lead 300 .

[0068] During operation, the wire clamp 103 clamps the metal lead 300, the main body 101 rotates clockwise around the rotating shaft 104, and the bonding head 100 is lifted to the ignition height. At this time, the porcelain nozzle tip of the transducer 102 is located at the ignition rod 500, and the ignition rod 500 performs high-voltage ignition on the end of the metal lead 300 to complete the ball burning; the wire clamp 103 releases the metal lead 300, the main body 101 rotates counterclockwise around the rotating shaft 104, and the bonding head 100 drops to the welding wire height, and the end of the metal lead 300 contacts the grain 600 on the loading bracket 400 to complete the welding wire.

[0069] The wire bonding device provided in the embodiment of the present application adopts the bonding head 100 as described above, wherein the bonding head 100 includes the wire clamp 103 as described above. When the wire clamp 103 clamps the metal lead 300, the static electricity on the wire-passing slider 3 flows through the metal lead 300 to the wire-releasing mechanism 200 and is guided to the ground, thereby eliminating the static electricity effect on the wire clamp 103, preventing impurities in the air and the metal lead 300 from being attracted and attached to the wire clamp 103, thereby reducing the wire-releasing resistance and improving the wire welding quality and production efficiency of the wire bonding device.

[0070] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A wire clamp for clamping a metal wire output from a wire bonding device, wherein: The metal lead is grounded, characterized in that the wire clamp includes a support, a clamping assembly and a wire-passing slider; The clamping assembly is mounted on the support, and the clamping assembly includes a first clamping arm and a second clamping arm, the first clamping arm and the second clamping arm are mounted on the support, and the first clamping arm and the second clamping arm cooperate to clamp the metal lead; The wire-passing slider is mounted on the clamping assembly, and the wire-passing slider includes a first wire-passing slider and a second wire-passing slider, the first wire-passing slider is mounted on the first clamping arm, the second wire-passing slider is mounted on the second clamping arm, and the side of the wire-passing slider in contact with the metal lead is made of conductive material; When the clamping assembly clamps the metal lead, the static electricity on the wire-passing slider is conducted to the ground through the metal lead.

2. The wire clamp according to claim 1, characterized in that: The wire-passing slider includes a connecting portion and a conductive portion, wherein the connecting portion is connected to the clamping assembly and is made of an insulating material; and the conductive portion is mounted on the connecting portion and is made of a conductive material.

3. The wire clamp according to claim 2, characterized in that: The wire clamp also includes a wire, and the clamping assembly is grounded through the wire.

4. The wire clamp according to claim 1, characterized in that: The line-passing slider is made of a conductive material, and the clamping assembly is made of an insulating material.

5. The wire clamp according to any one of claims 1 to 4, characterized in that: The first clamping arm is provided with a first limit block, and the first wire-passing slider is installed on the first clamping arm and is arranged close to the first limit block; The second clamping arm is provided with a second limit block, and the second line-crossing sliding block is mounted on the second clamping arm and is arranged close to the second limit block.

6. The wire clamp according to claim 5, characterized in that: The first limiting block and the second limiting block are both made of insulating material.

7. A bun head, characterized in that: It comprises a body, a transducer and a wire clamp as claimed in any one of claims 1 to 6; The transducer is mounted on the body; the wire clamp is mounted on the body and is located above the transducer.

8. The bungee according to claim 7, characterized in that: The bun head also includes a rotating shaft, and the body is rotatably mounted on the rotating shaft.

9. A wire bonding device, characterized in that: The invention comprises the bungee as claimed in claim 7 or 8.

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