Wafer dotting device with convenient replacement of reaction force spring
By designing the coordination between the electromagnetic coil and the reaction spring in the wafer dosing device, combined with the rapid disassembly mechanism of the tightening parts, the problem of difficulty in replacing the reaction spring is solved, and the production efficiency and equipment life are improved.
Patent Information
- Application Number
- CN202421666246.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-04-08
- Estimated Expiration
- 2034-07-15
AI Technical Summary
After long-term use of existing wafer dosing devices, the reaction spring is prone to elastic fatigue, resulting in difficulty in replacement, increasing production costs and affecting marking efficiency.
A wafer doser is designed to facilitate replacement of the reaction spring. Through the cooperation of the electromagnetic coil and the reaction spring, the needle tube is reciprocating and moving, and the reaction spring is quickly removed by setting the tightening parts for easy replacement.
This design makes the reaction spring easier to replace, reduces equipment downtime, improves production efficiency, and extends the service life of the equipment.
Smart Images

Figure CN222727682U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of wafer dotting devices, in particular to a wafer dotting device which is convenient for replacing a reaction force spring. Background Art
[0002] A wafer dotter is a device used to mark dots on semiconductor wafers. By dot marking, various specific locations or areas can be fixedly marked on the wafer for precise positioning or identification in subsequent process steps. This is very important in the semiconductor manufacturing field and the microelectronics industry because precise processing and manufacturing are required at the micron or even nanometer level.
[0003] In order to facilitate dotting and marking on semiconductor wafers, it is necessary to use a wafer dotting device. For example, the prior art Chinese patent publication number "CN219055771U" discloses a compatible dotting device, including a bracket body, one end of the bracket body is provided with a first or second marking component, the first and second marking components are detachably connected to the bracket body, the first marking component includes an ink storage component for storing pigment, a first channel extending along the first direction, and a first marking member arranged in the first channel, the first marking member is provided with a first dotting end away from the bracket body end, and the first dotting end carries an ink mark on the workpiece; the second marking component includes a second marking member, which has a second dotting end away from the bracket body end, and the second dotting end can be used for needle marking on the workpiece, and also includes a driving component, the driving component can drive the first and second marking members to reciprocate along the first direction, without replacing the entire dotting device, the first and second marking components can be quickly and accurately interchanged, thereby improving test efficiency.
[0004] Some wafer spotters use the elastic action of a spring to reset the marking piece. However, in actual operation, the spring may become fatigued after long-term use, and similar wafer spotters are not convenient for replacing the spring. This may require the replacement of the entire wafer spotter, increasing production costs, and will also affect the marking efficiency of semiconductors, making it less practical. Utility Model Content
[0005] The utility model aims to solve the above-mentioned shortcoming of the prior art that it is inconvenient to replace the spring, and proposes a wafer dotting device which is convenient for replacing the reaction force spring.
[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0007] A wafer dotting device which is easy to replace a reaction force spring is designed, comprising a mounting seat, a stroke adjustment bolt is threadedly connected to the top of the mounting seat, and a support portion is detachably connected to the side of the mounting seat via a fastener, a dotting portion is arranged inside the support portion, the dotting portion comprises a needle tube, and a reaction force spring is detachably connected to the top of the needle tube via a tightening piece.
[0008] Furthermore, the dotting part also includes an ink fountain, the bottom of the mounting seat extends to the side with an extension portion, the ink fountain is fixedly mounted on the top of the extension portion, and its bottom extends to the outside of the extension portion, the needle tube is arranged above the ink fountain, and a dotting core wire is connected to its interior, and the other end of the dotting core wire is arranged at the ink outlet of the ink fountain for marking with ink.
[0009] Furthermore, an electromagnetic coil is fixedly installed on the top of the support part, the needle tube is arranged in the electromagnetic coil and is slidably connected to the support part, the bottom of the electromagnetic coil is connected to a power supply line, and a clamping seat for fixing the power supply line is fixedly installed on the top of the mounting seat.
[0010] Furthermore, the tightening member includes a fixing member, a cavity passing through the center point of the fixing member, and being slidably connected to the top of the needle tube through the cavity, an installation cavity connected to the cavity is opened inside the fixing member, a resist rod is provided on the outer wall of the installation cavity at the center point, the outer sleeve of the needle tube is provided with the reaction force spring, and the two ends of the reaction force spring respectively contact the side of the electromagnetic coil and the fixing member.
[0011] Furthermore, one side of the top of the support portion extends upward and is provided with a guide groove, the push rod is slidably connected in the guide groove, one end of the push rod is threadedly connected to the outer wall of the installation cavity through a thread line, and its axial end is arranged in the installation cavity and rotatably connected to a fixed plate.
[0012] Furthermore, the fixing plate is slidably connected to the mounting cavity, and a side surface thereof is provided with an arc-shaped groove capable of engaging the needle tube, and an anti-slip pad is provided on the outer side of the arc-shaped groove.
[0013] The utility model proposes a wafer dotting device which is easy to replace the reaction force spring. The beneficial effect is that the utility model can reciprocate the needle tube through the action of the electromagnetic coil and the reaction force spring, and then use the needle tube, dotting core wire and ink fountain to mark the semiconductor. In addition, through the setting of the fastening part, the reaction force spring can be quickly disassembled, making it easier and faster to inspect, clean and replace it. This can reduce the downtime of the equipment, improve production efficiency, help to extend the service life of the equipment, and has a simple structure and strong practicality. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1It is a schematic diagram of the structure of the utility model;
[0015] Figure 2 for Figure 1 A schematic diagram of the enlarged structure of area A;
[0016] Figure 3 It is a cross-sectional view of the fastening member of the utility model.
[0017] In the figure: 1. mounting seat; 11. extension portion; 12. holder; 2. stroke adjustment bolt; 3. support portion; 4. dotting portion; 41. needle tube; 42. reaction spring; 43. ink fountain; 44. dotting core wire; 45. electromagnetic coil; 46. arc groove; 47. power supply line; 5. tightening member; 51. fixing member; 52. mounting cavity; 53. push rod; 54. guide groove; 55. threaded line; 56. fixing plate. DETAILED DESCRIPTION
[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.
[0019] Reference Figure 1-3 A wafer dotting device which is convenient for replacing a reaction force spring comprises a mounting seat 1, a stroke adjustment bolt 2 is threadedly connected to the top of the mounting seat 1, and a support portion 3 is detachably connected to the side thereof via a fastener, a dotting portion 4 is arranged inside the support portion 3, and the dotting portion 4 comprises a needle tube 41, and a reaction force spring 42 is detachably connected to the top of the needle tube 41 via a fastening member 5.
[0020] It should be supplemented that the fastener is a locking bolt threadedly connected with a nut.
[0021] Furthermore, the dotting part 4 also includes an ink fountain 43, the bottom of the mounting seat 1 has an extension portion 11 extending sideways, the ink fountain 43 is fixedly mounted on the top of the extension portion 11, and its bottom extends to the outside of the extension portion 11, the needle tube 41 is arranged above the ink fountain 43, and a dotting core wire 44 is connected to its interior, and the other end of the dotting core wire 44 is arranged at the ink outlet of the ink fountain 43 for marking with ink.
[0022] Furthermore, an electromagnetic coil 45 is fixedly installed on the top of the support part 3, the needle tube 41 is arranged in the electromagnetic coil 45 and is slidably connected to the support part 3, the bottom of the electromagnetic coil 45 is connected to the power supply line 47, and the top of the mounting seat 1 is fixedly installed with a socket 12 for fixing the power supply line 47.
[0023] It is worth mentioning that the electromagnetic coil 45 is connected to an external power source through the power supply line 47. Since the needle tube 41 is arranged inside the electromagnetic coil 45, when the electromagnetic coil 45 is energized, the needle tube 41 is driven to drive the dotting core wire 44 to move downward. Moreover, since the dotting core wire 44 is arranged in the ink fountain 43, the purpose of ink marking is achieved.
[0024] When the voltage of the electromagnetic coil 45 is reduced or the power is cut off, the needle tube 41 moves upward under the elastic support of the reaction spring 42, so as to achieve the effect of reciprocating movement for dotting. However, due to long-term movement, the reaction spring 42 will experience elastic fatigue, so it needs to be replaced.
[0025] Furthermore, the electromagnetic coil 45 is wound with enameled wire of multiple cross-sections, and the magnetic force is increased by increasing the current, so as to better drive the needle tube 41;
[0026] The needle tube 41 is a stainless steel needle tube, similar to the stainless steel needle tube at the front end of a medical syringe, which has a relatively smooth surface and reduces friction;
[0027] The dotted core wire 44 can be made of high-quality fishing gear, which has higher strength, smoother surface, reduced friction, is easy to obtain, and has lower cost.
[0028] In more detail, the tightening member 5 includes a fixing member 51, a cavity passing through the center point of the fixing member 51, and a sliding connection with the top of the needle tube 41 is formed through the cavity, and an installation cavity 52 connected to the cavity is formed inside the fixing member 51, and a push rod 53 is provided on the outer wall of the installation cavity 52 at the center point, and the outer sleeve of the needle tube 41 is provided with the reaction force spring 42, and the two ends of the reaction force spring 42 respectively conflict with the electromagnetic coil 45 and the side of the fixing member 51.
[0029] In general, one side of the top of the support portion 3 extends upward and is provided with a guide groove 54, and the push rod 53 is slidably connected in the guide groove 54, one end of the push rod 53 is threadedly connected to the outer wall of the installation cavity 52 through a thread line 55, and its axial end is arranged in the installation cavity 52 and is rotatably connected to a fixing plate 56.
[0030] Finally, the fixing plate 56 is slidably connected to the mounting cavity 52 , and a side surface thereof is provided with an arc groove 46 capable of engaging the needle tube 41 , and an anti-slip pad is provided on the outer side of the arc groove 46 .
[0031] It is worth mentioning that a slot is formed at one end of the support rod 53 away from the mounting seat 1, so as to facilitate the use of external auxiliary tools to rotate the support rod 53;
[0032] Among them, the push rod 53 cooperates with the fixing piece 51 under the action of the guide groove 54 to ensure that the movement of the needle tube 41 remains stable. In addition, when the push rod 53 rotates, the fixing plate 56 is driven to move toward one side of the mounting seat 1 through the action of the thread line 55. In this way, the fixing plate 56, driven by the push rod 53, cooperates with the mounting cavity 52 to press against the needle tube 41, so that the fixing piece 51, the push rod 53 and the needle tube 41 form a whole and move.
[0033] Working method: When working, the lever 53 is rotated by using an external auxiliary tool or manually, and the lever 53 drives the fixing plate 56 to move due to the operation of the thread line 55, and then the fixing plate 56 is separated from the needle tube 41, and the fixing member 51 can be removed, and the reaction spring 42 can be replaced;
[0034] Then, after replacing the new reaction spring 42, the push rod 53 is rotated again so that the fixing plate 56 fixes the needle tube 41 by using the arc groove 46;
[0035] Finally, after the electromagnetic coil 45 is energized, it cooperates with the reaction spring 42 to drive the needle tube 41 to move back and forth, and the dotting core wire 44 cooperates with the ink fountain 43 to perform dotting under the action of the needle tube 41.
[0036] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.
Claims
1. A wafer spotting device that is convenient for replacing a reaction force spring, comprising a mounting seat (1), characterized in that: The top of the mounting seat (1) is threadedly connected to a stroke adjustment bolt (2), and the side thereof is detachably connected to a support portion (3) via a fastener, a dotting portion (4) is arranged inside the support portion (3), the dotting portion (4) comprises a needle tube (41), and the top of the needle tube (41) is detachably connected to a reaction spring (42) via a fastening member (5).
2. The wafer spotting device for facilitating replacement of reaction force springs according to claim 1, characterized in that: The dotting portion (4) also includes an ink fountain (43); the bottom of the mounting seat (1) is extended to the side with an extension portion (11); the ink fountain (43) is fixedly mounted on the top of the extension portion (11), and its bottom extends to the outside of the extension portion (11); the needle tube (41) is arranged above the ink fountain (43), and a dotting core wire (44) is connected to the inside of the needle tube; the other end of the dotting core wire (44) is arranged at the ink outlet of the ink fountain (43) for marking with ink.
3. The wafer spotting device for facilitating replacement of reaction force springs according to claim 2, characterized in that: An electromagnetic coil (45) is fixedly mounted on the top of the support portion (3); the needle tube (41) is disposed inside the electromagnetic coil (45) and is slidably connected to the support portion (3); a power supply line (47) is connected to the bottom of the electromagnetic coil (45); and a holder (12) for fixing the power supply line (47) is fixedly mounted on the top of the mounting seat (1).
4. The wafer spotting device for facilitating replacement of reaction force springs according to claim 3, characterized in that: The abutting member (5) comprises a fixing member (51), a cavity passing through the center point of the fixing member (51) and being slidably connected to the top of the needle tube (41) through the cavity, a mounting cavity (52) communicating with the cavity is provided inside the fixing member (51), a push rod (53) is provided on the outer wall of the mounting cavity (52) at the center point, the outer sleeve of the needle tube (41) is provided with the reaction force spring (42), and the two ends of the reaction force spring (42) respectively contact the side surfaces of the electromagnetic coil (45) and the fixing member (51).
5. The wafer spotting device for facilitating replacement of reaction force springs according to claim 4, characterized in that: One side of the top of the support portion (3) extends upward and is provided with a guide groove (54), the push rod (53) is slidably connected in the guide groove (54), one end of the push rod (53) is threadedly connected to the outer wall of the installation cavity (52) through a thread line (55), and its axial end is arranged in the installation cavity (52) and is rotatably connected to a fixing plate (56).
6. The wafer spotting device for facilitating replacement of reaction force springs according to claim 5, characterized in that: The fixing plate (56) is slidably connected to the mounting cavity (52), and a side surface thereof is provided with an arc-shaped groove (46) capable of engaging the needle tube (41), and an anti-slip pad is provided on the outer side of the arc-shaped groove (46).
Citation Information
Patent Citations
Compatible dotting device
CN219055771U