Refrigeration unit

Abstract

The utility model provides a refrigeration device, including a shell, a refrigeration component and a thermal conductive member. The refrigeration component is arranged in the shell. The thermal conductive member is arranged on the surface of the shell and is thermally coupled with the refrigeration component, and a thermal conductive coating is arranged on at least part of the surface of the thermal conductive member. The refrigeration device provided by the embodiment of the present application is provided with a thermal conductive member on the surface of the shell, and the thermal conductive member is thermally coupled with the refrigeration component. The cold generated by the refrigeration component can be transferred to the user through the thermal conductive member. At the same time, a paint layer and a thermal conductive coating are arranged on the thermal conductive member. The thermal conductive coating can promote the temperature conduction efficiency of the thermal conductive member, thereby improving the overall thermal conductive efficiency of the refrigeration device. At the same time, due to the properties of the thermal conductive coating, the thickness of the thermal conductive coating is almost negligible, which improves the overall thermal conductive efficiency of the refrigeration device without increasing the overall volume of the refrigeration device.

Claims

1. A refrigeration device, characterized in that: include: shell; a refrigeration assembly, the refrigeration assembly being disposed in the housing; as well as A heat conducting component is arranged on the surface of the shell and is thermally coupled with the refrigeration component. A paint layer and a heat conducting coating are arranged on the heat conducting component.

2. The refrigeration device according to claim 1, characterized in that: The thermal conductive component comprises a first surface facing away from the refrigeration component and a second surface facing away from the first surface, and the thermal conductive coating is disposed on the first surface and / or the second surface.

3. The refrigeration device according to claim 2, characterized in that: The thermal conductive coating is a diamond coating or an electroplated copper coating.

4. The refrigeration device according to claim 3, characterized in that: The thermal conductive coating disposed on the first surface is a diamond coating, and the thermal conductive coating disposed on the second surface is an electroplated copper coating; or, the thermal conductive coating disposed on the first surface is an electroplated copper coating, and the thermal conductive coating disposed on the second surface is a diamond coating.

5. The refrigeration device according to claim 2, characterized in that: The surface of the thermal conductive coating is configured as a smooth surface, and a varnish layer is provided on the surface of the thermal conductive coating.

6. The refrigeration device according to any one of claims 1 to 5, characterized in that: An air flow channel is formed inside the housing, and the refrigeration assembly includes: a refrigeration element, wherein a cold end of the refrigeration element faces the thermal conductive element, a hot end of the refrigeration element faces the interior of the air flow channel, and the cold end of the refrigeration element is thermally coupled to the thermal conductive element; and a heat sink, the heat sink being disposed in the air flow channel and thermally coupled to a hot end of the refrigeration element; The refrigeration device further comprises a fan, which is arranged in the air flow channel and is used to promote the air flow in the air flow channel.

7. The refrigeration device according to claim 6, characterized in that: The thermal conductive coating is also provided on at least one of the refrigeration component and the heat dissipation component.

8. The refrigeration device according to claim 7, characterized in that: The heat sink comprises a heat sink substrate and a plurality of heat sink fins arranged on the heat sink substrate. The heat sink substrate is thermally coupled to the refrigeration element. The heat sink substrate and / or the heat sink fins are provided with the thermal conductive coating.

9. The refrigeration device according to claim 6, characterized in that: The refrigeration component also includes: a temperature-averaging component and a thermal conductive medium layer, wherein the temperature-averaging component is arranged between the refrigeration component and the thermal conductive component and is thermally coupled with the refrigeration component and the thermal conductive component, and the thermal conductive medium layer is arranged on the surface of the refrigeration component and located between the temperature-averaging component and the refrigeration component, and the thermal conductive medium layer is provided with diamond particles.

10. The refrigeration device according to claim 6, characterized in that: The refrigeration device is a neck-hanging air conditioner, the outer shell is surrounded to form a wearing space, and the heat conducting member is arranged on a surface of the outer shell facing the wearing space.

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