A semiconductor refrigeration industrial control computer

Abstract

The utility model relates to the technical field of industrial control computers, a semiconductor refrigeration industrial control computer, comprising a chassis and side panels, the outer wall of the chassis is equipped with the side panels, the outer wall of the chassis is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a connecting strip, the outer wall of the connecting strip is fixedly connected to the chassis, the outer wall of the connecting strip is slidably connected to a mounting frame, the upper end of the mounting frame is fixedly connected to a top plate, the inner wall mounting tube of the top plate is threadedly connected, the wind force generated by the rotation of the heat dissipation blades driven by a motor on the mounting frame generates airflow on the surface of the heat dissipation fins, so that the heat on the surface of the heat dissipation fins is quickly dissipated, the lower end of the mounting frame slides into the connecting strip at the lower end of the chassis, so that the upper end of the chassis is shielded by the top plate, ensuring that dust will not fall into the inner part of the heat dissipation fin groove at the upper end of the chassis, making the upper end of the chassis cleaner, and the handle can be manually lifted, the handle is more convenient for carrying the chassis, and the user's experience is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of industrial control computers, in particular to a semiconductor refrigeration industrial control computer. Background Art

[0002] The full name of IPC is industrial control computer. It is a computer specially designed for industrial control. It is used to monitor and control the machinery and equipment, production processes, data parameters, etc. used in the production process. With the continuous development of industrial control computer technology, the application field of IPC is not limited to industrial sites. It is also increasingly used in various industries such as electronic information, electricity, and transportation. Users in different industries have more diverse requirements for the use of products and put forward higher requirements.

[0003] For example, a semiconductor refrigeration industrial computer with the authorization announcement number "CN220438876U" has solved the problem of existing semiconductor refrigeration industrial computers that a large amount of dust will enter the inside of the chassis and the dust will attach to the circuit board, affecting the service life. The above-mentioned shock absorption and buffering effects prevent the internal parts of the industrial computer from being damaged. In addition, the device uses semiconductor refrigeration plates to discharge the heat in the chassis, so there is no need to open a large number of heat dissipation holes, which can reduce the entry of dust and extend the service life of the industrial computer. Considering the existing semiconductor refrigeration industrial computers, the heat dissipation fins at the upper end are in a fully exposed state, and there are very narrow grooves in each part, which makes it difficult to clean after dust falls in. When picking up the device, the dust will stick to the user, resulting in a reduced user experience. Utility Model Content

[0004] The utility model aims to solve the problem that dust is difficult to clean after falling into the existing semiconductor refrigeration industrial control computer, and the dust will stick to the user when picking up the device, resulting in a reduced user experience. A semiconductor refrigeration industrial control computer is proposed.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor refrigeration industrial computer, comprising a chassis and side panels, the outer wall of the chassis is equipped with side panels, the outer wall of the chassis is provided with a heat dissipation mechanism, the heat dissipation mechanism comprises a connecting strip, the outer wall of the connecting strip is fixedly connected to the chassis, the outer wall of the connecting strip is slidably connected to a mounting frame, the upper end of the mounting frame is fixedly connected to a top plate, the inner wall of the top plate is threadedly connected to a mounting tube, a through hole is installed on the surface of the mounting tube, a motor is installed on the inner wall of the mounting tube, and the output end of the motor is fixedly connected to a heat dissipation leaf.

[0006] Preferably, the inner wall of the chassis is provided with a protective mechanism, and the protective mechanism includes a mounting column, the lower end of the mounting column is fixedly connected to the chassis, the end of the mounting column is fixedly connected to the mainboard, the surface of the mainboard is fixedly connected to the protective frame, the protective frame is fastened to the protective cover by bolts, the inner wall of the protective cover is in contact with the first silicone sheet, and the lower end of the first silicone sheet is in contact with the semiconductor refrigeration sheet.

[0007] Preferably, an upper cover is fixedly connected to the upper end of the chassis, and a surface of the upper cover is fixedly connected to the heat dissipation fins.

[0008] Preferably, a chip is mounted on the surface of the mainboard, the surface of the chip is in contact with the second silicone sheet, and the surface of the second silicone sheet is in contact with the semiconductor refrigeration sheet.

[0009] Preferably, the surface of the top plate is fixedly connected to the handle, and the inner wall of the mounting frame is fixedly connected to the heat pipe.

[0010] Preferably, the side panel is fixedly connected to the interface panel by bolts.

[0011] The utility model proposes a semiconductor refrigeration industrial control computer, which has the beneficial effects of: the wind force generated by the rotation of the heat dissipation blades driven by the motor on the mounting frame generates airflow on the surface of the heat dissipation fins, so that the heat on the surface of the heat dissipation fins is quickly dissipated, and the lower end of the mounting frame slides into the connecting strip at the lower end of the chassis, so that the upper end of the chassis is shielded by the top plate, ensuring that dust does not fall into the groove of the heat dissipation fins at the upper end of the chassis, making the upper end of the chassis cleaner, and the handle can be manually lifted, which makes it more convenient to carry the chassis, thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the structure of the utility model;

[0013] Figure 2 for Figure 1 Schematic diagram of the cross-sectional structure in the middle front view;

[0014] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure from top view;

[0015] Figure 4 for Figure 2 The enlarged structural diagram at A in the middle;

[0016] Figure 5 for Figure 2 The enlarged structural diagram at B in the middle;

[0017] Figure 6 for Figure 1 Schematic diagram of the enlarged structure of the heat dissipation mechanism.

[0018] In the figure: 1, chassis, 2, side panel, 3, heat dissipation mechanism, 301, connecting strip, 302, mounting frame, 303, top plate, 304, mounting tube, 305, through hole, 306, motor, 307, heat dissipation leaf, 4, protection mechanism, 401, mounting column, 402, main board, 403, protection frame, 404, protection cover, 405, first silicone sheet, 406, semiconductor refrigeration sheet, 5, upper cover, 6, heat dissipation fins, 7, chip, 8, second silicone sheet, 9, handle, 10, interface panel, 11, heat pipe. DETAILED DESCRIPTION

[0019] Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present utility model.

[0020] See also Figure 1-6 The utility model provides a technical solution: a semiconductor refrigeration industrial control computer, comprising a chassis 1 and a side panel 2, the outer wall of the chassis 1 is installed with the side panel 2, the outer wall of the chassis 1 is provided with a heat dissipation mechanism 3, the wind force generated by the rotation of the heat dissipation blade 307 driven by the machine 306 generates airflow on the surface of the heat dissipation fin 6, so that the heat on the surface of the heat dissipation fin 6 can be quickly dissipated, the heat dissipation mechanism 3 comprises a connecting bar 301, the outer wall of the connecting bar 301 is fixedly connected to the chassis 1, the outer wall of the connecting bar 301 is slidably connected to the mounting frame 302, the upper end of the mounting frame 302 is fixedly connected to the top plate 303, the inner wall of the top plate 303 is threadedly connected to the mounting cylinder 304, the surface of the mounting cylinder 304 is installed with a through hole 305, the inner wall of the mounting cylinder 304 is installed with a motor 306, the model of the motor 306 is based on actual needs, and it can meet the work, and the output end of the motor 306 is fixedly connected to the heat dissipation blade 307;

[0021] The motor 306 on the mounting frame 302 drives the heat dissipation blades 307 to rotate, and the wind force generated generates airflow on the surface of the heat dissipation fins 6, so that the heat on the surface of the heat dissipation fins 6 is quickly dissipated. The lower end of the mounting frame 302 slides into the connecting strip 301 at the lower end of the chassis 1, so that the upper end of the chassis 1 is shielded by the top plate 303, ensuring that dust will not fall into the groove of the heat dissipation fins 6 at the upper end of the chassis 1, making the upper end of the chassis 1 cleaner, and the handle 9 can be manually lifted. The handle 9 makes it more convenient to carry the chassis 1, thereby improving the user experience.

[0022] See also Figure 1 , Figure 2 and Figure 5A protective mechanism 4 is provided on the inner wall of the chassis 1. The protective cover 404 is restricted by the protective frame 403 so that the inside of the protective cover 404 can wrap and protect the first silicone sheet 405 and the second silicone sheet 8. The protective mechanism 4 includes a mounting column 401. The lower end of the mounting column 401 is fixedly connected to the chassis 1. The end of the mounting column 401 is fixedly connected to the mainboard 402. The surface of the mainboard 402 is fixedly connected to the protective frame 403. The protective frame 403 is tightly pressed against the protective cover 404 by bolts. The inner wall of the protective cover 404 is in contact with the first silicone sheet 405, and the lower end of the first silicone sheet 405 is in contact with the semiconductor refrigeration sheet 406.

[0023] See also Figure 1 and Figure 2 A top cover 5 is fixedly connected to the upper end of the chassis 1, the surface of the top cover 5 is fixedly connected to the heat sink fins 6, a chip 7 is installed on the surface of the mainboard 402, the surface of the chip 7 is fitted with the second silicone sheet 8, the inner wall of the mounting frame 302 is fixedly connected to the heat pipe 11, the surface of the second silicone sheet 8 is fitted with the semiconductor refrigeration sheet 406, the surface of the top plate 303 is fixedly connected to the handle 9, and the side panel 2 is fixedly connected to the interface panel 10 by bolts.

[0024] Working principle:

[0025] Working stage

[0026] When the industrial computer is running, the heat generated by the chip 7 on the mainboard 402 can be quickly transferred to the semiconductor refrigeration sheet 406 through the second silicone sheet 8. After the heat is accumulated in the first silicone sheet 405 at the upper end of the semiconductor refrigeration sheet 406, an opening is opened at the upper end of the protective cover 404, so that the copper heat pipe 11 dissipates the heat to the heat dissipation fins 6 on the top plate 303, and a small amount of heat inside the chassis 1 will gradually come into contact with the heat dissipation fins 6 to ensure the normal operation of the industrial computer. At the same time, the protective cover 404 made of copper is restricted by the protective frame 403, so that the first silicone sheet 405 and the second silicone sheet 8 are wrapped inside the protective cover 404 to prevent the parts of the industrial computer from being damaged. The external power supply of the motor 306 is turned on, and the motor 306 starts to work. The wind force generated by the rotation of the heat dissipation blades 307 driven by the motor 306 generates airflow on the surface of the heat dissipation fins 6, ensuring that the heat on the surface of the heat dissipation fins 6 is quickly lost.

[0027] Protection Phase

[0028] By sliding the lower end of the mounting frame 302 into the connecting strip 301 at the lower end of the chassis 1, the upper end of the chassis 1 is shielded by the top plate 303, ensuring that the heat dissipation fins 6 at the upper end of the chassis 1 will not be covered with dust, making the upper end of the chassis 1 cleaner, and the top plate 303 and the mounting frame 302 are used to strengthen the thickness around the chassis 1 to enhance the anti-collision performance, and the handle 9 can be manually lifted, which makes it more convenient to carry the chassis 1.

[0029] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor refrigeration industrial computer, comprising a chassis (1) and a side panel (2), wherein the outer wall of the chassis (1) is provided with the side panel (2), characterized in that: The outer wall of the chassis (1) is provided with a heat dissipation mechanism (3), and the heat dissipation mechanism (3) comprises a connecting bar (301), the outer wall of the connecting bar (301) is fixedly connected to the chassis (1), the outer wall of the connecting bar (301) is slidably connected to a mounting frame (302), the upper end of the mounting frame (302) is fixedly connected to a top plate (303), the inner wall of the top plate (303) is threadedly connected to a mounting cylinder (304), a through hole (305) is installed on the surface of the mounting cylinder (304), a motor (306) is installed on the inner wall of the mounting cylinder (304), and the output end of the motor (306) is fixedly connected to a heat dissipation leaf (307).

2. A semiconductor refrigeration industrial computer according to claim 1, characterized in that: The inner wall of the chassis (1) is provided with a protective mechanism (4), and the protective mechanism (4) includes a mounting column (401), the lower end of the mounting column (401) is fixedly connected to the chassis (1), the end of the mounting column (401) is fixedly connected to the mainboard (402), the surface of the mainboard (402) is fixedly connected to the protective frame (403), the protective frame (403) is tightly abutted against the protective cover (404) by bolts, the inner wall of the protective cover (404) is in contact with the first silicone sheet (405), and the lower end of the first silicone sheet (405) is in contact with the semiconductor refrigeration sheet (406).

3. A semiconductor refrigeration industrial computer according to claim 1, characterized in that: An upper cover (5) is fixedly mounted on the upper end of the chassis (1), and a surface of the upper cover (5) is fixedly connected to the heat dissipation fins (6).

4. A semiconductor refrigeration industrial computer according to claim 2, characterized in that: A chip (7) is mounted on the surface of the main board (402), the surface of the chip (7) is in contact with the second silicone sheet (8), and the surface of the second silicone sheet (8) is in contact with the semiconductor cooling sheet (406).

5. A semiconductor refrigeration industrial computer according to claim 1, characterized in that: The surface of the top plate (303) is fixedly connected to the handle (9), and the inner wall of the mounting frame (302) is fixedly connected to the heat conducting pipe (11).

6. A semiconductor refrigeration industrial computer according to claim 1, characterized in that: The side plate (2) is fixedly connected to the interface panel (10) via bolts.

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