Universal plastic packaging device for integrated circuit

Abstract

The utility model relates to a universal plastic packaging device for an integrated circuit in the technical field of integrated circuits, which comprises a frame, a hollow area is arranged on the frame, an adhesive tape is adhered on the frame, and a PKG is adhered on the adhesive tape. According to the utility model, the FCCSP short edge size is mainly 95 mm, the Frame Design is designed, the hollowed-out carrier plate is manufactured, and the typesetting utilization rate of the single PKG is improved by utilizing the hollowed-out design. After a layer of adhesive tape is pasted on the frame, a single PKG is placed in a hollow area, the PKG is adhered by the adhesive tape, and then Mold is carried out, so that the purpose of sharing the same mold with different PKG sizes is achieved, and the main process point is that on the basis that FCCSP Substrate is designed as Panel, Frame design is used as a carrier plate, so that the FCBGA can share the mold of the FCCSP, and the universality and the production efficiency of the mold are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuits, in particular to a universal plastic packaging device for integrated circuits. Background Art

[0002] In the existing Flip chip packaging process, the molding process is a key step, and its process flow is as follows:

[0003] FCCSP (Flip Chip Chip Scale Package): The substrate is designed in the form of a panel, and the short side size is usually 95mm or 76.3mm. The industry usually designs different molds based on these two sizes.

[0004] FCBGA (Flip Chip Ball Grid Array): The substrate is designed as a single PKG, and the size range is usually from 1515mm to 4545mm, or even larger. Different molds are designed according to various size requirements.

[0005] The advantage of FCCSP is that when the short side size is fixed at 95mm or 76.3mm, different substrate layouts can be designed according to the size of the IC, thereby improving layout utilization and reducing costs. However, its disadvantage is that the layout design of the substrate is more complicated, the packaging process has more steps, and it needs to be cut to form a single PKG.

[0006] The advantage of FCBGA is that different monomer substrates can be designed according to the size of the PKG, the packaging process has fewer steps, and there is no need to cut the monomer PKG. However, the disadvantage is that the mold design needs to use the corresponding mold according to the size of the monomer PKG, resulting in very low mold commonality. Utility Model Content

[0007] The utility model aims to solve the shortcomings in the prior art and proposes a universal plastic packaging device for integrated circuits.

[0008] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a universal plastic packaging device for integrated circuits comprises a frame, a hollow area is arranged on the frame, a tape is attached to the frame, and PKG is adhered to the tape.

[0009] As a further description of the above technical solution:

[0010] The frame is a glass fiber board or an aluminum board.

[0011] The utility model has the following beneficial effects: the utility model designs the Frame Design based on the short side size of 95mm of FCCSP, manufactures a hollow carrier board, and uses the hollow design to improve the layout utilization rate of the monomer PKG. After a layer of tape is attached to the frame, the monomer PKG is placed in the hollow area, and the PKG is adhered with the tape before Mold is performed, so that the purpose of sharing the same mold for different PKG sizes is achieved. The main process point is that on the basis of the FCCSP Substrate being the Panel design, the Frame design is used as the carrier board, so that FCBGA can also share the FCCSP mold, thereby improving the commonality and production efficiency of the mold. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 This is a schematic diagram of the structure of the universal plastic packaging device for integrated circuits proposed by the utility model;

[0013] Figure 2 This is a structural schematic diagram of the frame of the universal plastic packaging device for integrated circuits proposed by the utility model.

[0014] Legend:

[0015] 1. Frame; 2. Hollow area; 3. Tape; 4. PKG. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] Reference Figure 1-2 The utility model provides an embodiment: a universal plastic packaging device for integrated circuits, including a frame 1, the frame 1 is a glass fiber board or an aluminum board, a hollow area 2 is provided on the frame 1, a tape 3 is attached to the frame 1, and a PKG 4 is adhered to the tape 3.

[0018] Frame 1: As the basic structure of the plastic packaging device, frame 1 can be made of glass fiber board or aluminum board. These two materials have good mechanical strength and thermal stability and are suitable as carriers for integrated circuit packaging.

[0019] Hollow area 2: Hollow areas 2 of specific shapes and sizes are designed on the frame 1. These hollow areas 2 are used to locate and fix the monomer PKG 4 to ensure its accurate position during the plastic packaging process.

[0020] Adhesive tape 3: A layer of adhesive tape 3 is attached above the hollow area 2 of the frame 1. The function of the adhesive tape 3 is to temporarily fix the PKG 4 before plastic sealing to prevent it from shifting in subsequent processes.

[0021] PKG 4: a packaged integrated circuit monomer, which can be adapted to different hollow areas 2 according to its size and shape, so as to realize universal packaging of PKG 4 of various sizes.

[0022] Working principle:

[0023] Positioning: First, according to the size and shape of PKG 4, select the appropriate hollow area 2 for positioning.

[0024] Fixing: Place PKG 4 in the corresponding hollow area 2, and use the edge of the frame 1 to preliminarily position PKG 4.

[0025] Adhesion: The tape 3 on the frame 1 is in contact with the PKG 4. The stickiness of the tape 3 ensures that the PKG 4 is stably fixed before the plastic packaging, and prevents it from shifting during the plastic packaging process.

[0026] Plastic encapsulation: After the PKG 4 is fixed by the tape 3, a plastic encapsulation process is performed, and the plastic encapsulation material (such as epoxy resin) will fill the gap between the frame 1 and the PKG 4 to form a protective layer, and at the same time fix the PKG 4 on the frame 1.

[0027] Curing: The plastic encapsulation material undergoes a curing process to form a solid package that protects the integrated circuit inside from the influence of the external environment.

[0028] The technical solution of the present invention is not limited to Substrate Design, and is also applicable to other substrate designs, such as glass substrate / Si silicon, etc.

[0029] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A universal plastic packaging device for integrated circuits, comprising a frame (1), characterized in that: The frame (1) is provided with a hollow area (2), an adhesive tape (3) is attached to the frame (1), and a PKG (4) is adhered to the adhesive tape (3).

2. The integrated circuit universal plastic packaging device according to claim 1, characterized in that: The frame (1) is a glass fiber board or an aluminum board.

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