Cutting and film pasting device for wafer application

Abstract

A cutting and film pasting device for wafer application comprises a workbench, a cutting and film pasting mechanism, a cutting positioning mechanism, an electric air compressor and a guide mechanism. The cutting and film pasting mechanism comprises an air cylinder, a cutting blade, an electromagnet and a push plate, the air cylinder is installed at the front end of the supporting frame, the upper end of the cutting blade and the lower end of a piston rod of the air cylinder are installed together, a guide hole is formed in the upper end of the cutting blade, a guide rod is installed at the upper end of the push plate, and the outer side end of the guide rod is sleeved with a spring. The guide rod is sleeved in the guide hole; a limiting plate is mounted at the top of the guide rod; an electromagnet is mounted at the inner upper end of the cutting blade; the cutting positioning mechanism comprises an air cylinder A, a push plate A and a positioning barrel, a positioning groove is formed in the outer side of the positioning barrel, the lower end of the air cylinder A is installed at the lower end in the positioning barrel, the lower end of the push plate A is installed at the upper end of a piston rod of the air cylinder A, and the lower end of the positioning barrel is installed on the workbench. According to the utility model, the probability that the film pasting sheet is clamped in the blade is prevented, and a worker can conveniently take out a wafer after film pasting.

Description

Technical Field

[0001] The utility model relates to the technical field of auxiliary equipment used in wafer production, in particular to a cutting and film pasting device used for wafers. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. During production, high-purity polysilicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form a cylindrical single silicon crystal rod. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. After production, the wafer needs to be coated on its surface to protect the wafer surface, improve the mechanical strength and corrosion resistance of the wafer, reduce the reflection and optical interference of the wafer surface, and adjust the electrical characteristics.

[0003] The existing films used in wafer production generally have three layers, a film layer and a release film protective layer outside the upper layer and the lower layer of the film layer. In specific production, the film roll is generally unwound by an electric unwinding device, and the release film protective layer at the lower end of the film is separated (manually torn off), and the release film protective layer at the lower end is reeled up by the electric film separation device at the lower end of the electric unwinding device. The film layer and the upper release film protective layer are first output laterally through the guide mechanism on the right side of the film table (mainly relying on the tension movement generated by the reel reeling of the electric rewinding device) and enter under the circular cutting knife The cutting knife goes down to cut a circular film sheet and sticks it on the wafer. The waste film roll after cutting (with circular holes formed by the film sheet after cutting at a certain interval) is rolled up by the winding drum of the electric winding device (before cutting and sticking the film sheet each time, turn on the power of the electric winding device, the electric unwinding device, and the electric film separation device. When cutting the adhesive film sheet, turn off the power of the electric winding device, the electric unwinding device, and the electric film separation device. After cutting the adhesive film sheet, turn on the power of the electric winding device, the electric unwinding device, and the electric film separation device again). Although the existing cutting and film sticking equipment meets the actual production to a certain extent, it is limited by the structure and still has the following disadvantages. Existing cutting and film laminating equipment uses a cutter that reciprocates up and down to perform film cutting operations. When the cutter moves up and down, the outer circle of the cut film sheet is consistent with the inner diameter of the cutter. In this way, when the cutter moves upward, if the inner side of the lower end of the cutter and the outer circle of the cut film sheet are pulled together for various reasons and the two are not effectively separated (especially if the waste generated after cutting enters between the inner side of the cutter and the outer circle of the film sheet), there is a problem that the film sheet is stuck in the blade after cutting and cannot be laminarized, which has an adverse effect on normal cutting work (usually the staff needs to stop the machine to eliminate the problem). In addition, after the wafer film is placed in the film laminating station, the limit ring at the outer end of the film laminating station is not much different from the outer diameter of the wafer (the wafer is located in the limit ring of the film laminating station to prevent the wafer from shifting during film laminating), so it is relatively inconvenient to remove the filmed wafer from the film laminating station after film laminating, which is correspondingly not conducive to improving work efficiency. Utility Model Content

[0004] In order to overcome the drawbacks of the existing cutting and film-sticking equipment as described in the background due to structural limitations, the utility model provides a cutting and film-sticking device for wafer application that can automatically push the cut film sheet downward from the blade after the cutting knife cuts and sticks the film sheet under the joint action of relevant mechanisms, thereby preventing the film sheet from being stuck in the blade, etc., and can automatically push the wafer upward after film sticking, so that the wafer is higher than the height of the limiting ring of the cutting station, making it convenient for the staff to take out the wafer after film sticking.

[0005] The technical solution adopted by the utility model to solve its technical problems is:

[0006] A wafer cutting and film pasting device, comprising a workbench, a cutting and film pasting mechanism, a cutting positioning mechanism, an electric air compressor, and a guide mechanism; characterized in that a support frame is installed at the upper rear end of the workbench, the cutting and film pasting mechanism comprises a cylinder, a cutting blade, an electromagnet and a push plate, the cylinder is installed at the front end of the support frame, the upper end of the cutting blade and the lower end of the piston rod of the cylinder are installed together, the upper end side of the cutting blade has a guide hole, the upper end side of the push plate is installed with a guide rod, the outer end of the guide rod is movably sleeved with a spring, and the guide rod is movably sleeved in the guide hole; a limiting plate is installed on the top of the guide rod, the electromagnet is installed on the inner upper end of the cutting blade, and the upper end of the push plate is installed with an iron suction plate; the cutting positioning mechanism comprises a cylinder A, a push plate A, and a positioning cylinder, the outer side of the positioning cylinder is provided with a positioning groove, the lower end of the cylinder A is installed at the lower end of the positioning cylinder, the lower end of the push plate A is installed at the upper end of the piston rod of the cylinder A, and the lower end of the positioning cylinder is installed on the workbench.

[0007] Furthermore, the inner diameter of the cutting blade is larger than the outer diameter of the push plate, and the outer diameter of the push plate A is smaller than the inner diameter of the positioning cylinder.

[0008] Furthermore, the lower end of the cutting blade and the upper end of the positioning cylinder are in a vertical plane, the inner diameter of the lower end of the cutting blade is larger than the inner diameter of the inner side of the positioning groove and the outer diameter of the lower end is smaller than the outer diameter of the positioning groove.

[0009] Furthermore, when the guide rod is located at the lower dead point, the push plate and the lower end of the cutting blade are in the same plane.

[0010] Furthermore, when the piston rod of the cylinder A is located at the top dead center, the upper end of the push plate A and the upper end of the positioning cylinder are in the same plane.

[0011] The beneficial effects of the utility model are as follows: the utility model cooperates with electric winding equipment, electric unwinding equipment, electric film separation equipment, etc. After the cylinder controls the cutting blade to cut the film sheet downward, the electromagnet can push out the circular cut film sheet through the push plate after power failure, thereby preventing the film sheet from getting stuck in the blade, etc., and the wafer can be pushed upward through the electric push rod A and the push plate A after film pasting, so that the wafer is higher than the height of the cutting station limit ring, which is convenient for the staff to take out the wafer after film pasting. The utility model brings convenience to the staff and correspondingly improves the work efficiency. Based on the above, the utility model has a good application prospect. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0014] Figure 2 It is a partial structural schematic diagram of the utility model.

[0015] Figure 3 This is a circuit diagram of the utility model. DETAILED DESCRIPTION

[0016] Figure 1 , 2As shown in FIG. 3 , a wafer cutting and film pasting device includes a workbench 1, a cutting and pasting mechanism, a cutting positioning mechanism, a power module A1, a power switch, an electric air compressor (not shown), and a guide mechanism 2; a support frame 101 is welded to the middle of the outer side of the upper rear end of the workbench 1, and the cutting and pasting mechanism includes a cylinder 31, a circular hollow cutting blade 32 (the upper end is a closed mechanism, and the outer side of the lower end is a blade), an electromagnet DC4, and a push plate 33. The cylinder 31 is vertically distributed and installed on the support frame 1 by bolts. 01, the middle of the upper end of the cutting blade 32 is welded to the lower end of the piston rod of the cylinder 31, and the middle of the upper end of the cutting blade 32 is respectively provided with a guide hole 36, and the middle of the upper end of the circular push plate is respectively vertically welded with a guide rod 34, and the outer end of each guide rod 34 is movably sleeved with a spring 35, and the upper ends of the two guide rods 34 are led to the outer end of the cutting blade 32 through the two guide holes 36 of the cutting blade (the spring 35 is located at the inner upper end of the cutting blade 32); the top part of the guide rod A stop plate 37 with an outer diameter larger than the inner diameter of the guide hole is welded (to prevent the guide rod 34 from slipping out of the blade), the electromagnet DC4 is bolted to the middle of the inner upper end of the cutting blade 32, and a steel-made suction plate 38 (spaced from the suction surface of the lower end of the electromagnet) is glued to the middle of the upper end of the push plate 33; the cutting positioning mechanism includes a cylinder A41, a push plate A42, and a positioning cylinder 43. The upper end of the positioning cylinder 43 is an open structure and the lower end is a closed structure. The outer side of the upper part of the positioning cylinder has a circle of concave positioning grooves 44 The lower end of the cylinder A41 is vertically installed in the middle of the lower end of the positioning cylinder 43 through bolts, the middle of the lower end of the push plate A42 is welded to the upper end of the piston rod of the cylinder A41, and the lower end of the positioning cylinder 43 is welded to the middle of the workbench 1. The exhaust pipe of the electric air compressor and the cylinder 31 and the air inlet ends of the solenoid valves at the upper and lower ends of the cylinder A41 are respectively connected through hoses; the power module A1 (AC 220V to DC 12V power module finished product) and the power switch are installed in the component box 5, and the component box 5 is installed at the upper left end of the front of the workbench.

[0017] Figure 1 , 2As shown in Figure 3, the inner diameter of the cutting blade 32 is slightly larger than the outer diameter of the push plate 33 by 0.2 mm, and the outer diameter of the push plate A42 is slightly smaller than the inner diameter of the positioning cylinder 43 by 0.2 mm. The lower end of the cutting blade 32 and the upper end of the positioning cylinder 43 are in a vertical plane from top to bottom, and the inner diameter of the lower end of the cutting blade 32 is slightly larger than the inner diameter of the inner side of the positioning groove 44 by 0.1 mm, and the outer diameter of the lower end is slightly smaller than the outer inner diameter of the positioning groove by 0.1 mm. When the guide rod 34 is at the lower dead center, the push plate 33 and the lower end of the cutting blade 32 are in the same plane. When the guide rod 34 is at the upper dead center, the upper and lower spacing between the push plate 33 and the inner lower end of the cutting blade 32 is consistent with the thickness of the film sheet 6 to be cut. When the piston rod of the cylinder A41 is at the upper dead center, the upper end of the push plate A42 and the upper end of the positioning cylinder 43 are in the same plane. When the piston rod of the cylinder A41 is at the lower dead center, the spacing between the upper end of the push plate A42 and the inner upper end of the positioning cylinder 43 is slightly lower than the thickness of the wafer 8. There are two sets of guide mechanisms 2, each set of guide mechanisms 2 includes two guide rollers 21 (the gap between the two is close to the thickness of the film roll after tearing off the lower release film), and the two guide rollers 2 of the two sets of guide mechanisms are respectively installed on the left and right sides of the upper end of the workbench 1 with a vertical spacing. The power input terminals 1 and 2 of the power module A1 and the two poles of the AC 220V power supply are connected through wires, the positive power output terminal 3 of the power module A1 and the power input terminals of the five power switches S, S1, S2, S3, and S4 are connected through wires, and the power output terminals of the five power switches S, S1, S2, S3, and S4 and the negative power output terminal of the power module A1 are connected to the upper solenoid valve DC and the lower solenoid valve DC1 of the cylinder, the upper solenoid valve DC2 and the lower solenoid valve DC3 of the cylinder A, and the power input terminals of the electromagnet DC4 are connected through wires. The handles of the five power switches are located outside the five openings at the front end of the component box (including the power switches of the electric winding device, electric unwinding device, and electric film separation device are also located outside the openings at the front end of the component box), and the wires connected to the electromagnet (a strong suction electromagnet with a power of 20W) with a length margin are led out through the opening at the upper end of the rear side of the upper end of the cutting blade (the opening is sealed with glue). The wires connected to the electromagnetic valve of cylinder A are led out through the opening at the lower right end of the positioning cylinder.

[0018] Figure 1 , 2As shown in Figure 3, after the power module A1 is powered, its 3rd and 4th pins output a stable DC 12V power supply, which enters the power input terminals of the five power switches S, S1, S2, S3, and S4. The new type unwinds the film roll 7 through an electric unwinding device, and after the release film protective layer at the lower end of the film roll 7 is separated (manually torn off), the release film protective layer at the lower end is reeled up by the reel-dividing drum of the electric film-dividing device (not shown in the figure) at the lower end of the electric unwinding device (not shown in the figure), and the film layer and the upper release film protective layer are first inputted through the guide mechanism 2 at the right end of the film table horizontally, and then outputted from the guide mechanism 2 (which plays a guiding role, mainly relying on the tension movement generated by the reel reeling of the electric rewinding device (not shown in the figure)) and enter the lower part of the circular cutting knife 32, and the cutting knife 32 moves downward to cut off the next The circular film sheet 6 is bonded to the wafer 8, and the waste film roll 7 after cutting (with circular holes formed by the film sheet after cutting at certain intervals) is wound up by the winding drum of the electric winding device (before each cutting and bonding of the film sheet, turn on the power of the electric winding device, the electric unwinding device, and the electric film separation device; when cutting the adhesive film sheet, turn off the power of the electric winding device, the electric unwinding device, and the electric film separation device; after cutting the adhesive film sheet, turn on the power of the electric winding device, the electric unwinding device, and the electric film separation device again. The above is the existing mature technology and will not be described in detail in this application). The front end of the new film roll 7 is pulled forward between the two guide rollers 21 of the right end guide mechanism 2, and is pulled forward from between the two guide rollers 21 of the left end guide mechanism 2 (the film roll can be pulled toward the front end by turning one guide roller by hand). The new working process is as follows. (1) The staff puts the wafer 8 to be laminated on the upper end of the positioning cylinder 43, and then turns on the power switch S (the power switch S4 is turned on in advance, and the electromagnet DC4 is energized to generate magnetic attraction to attract and close the plate 38, overcoming the elastic force of the spring 35 to drive the push plate 33 upward, and the guide rod 34 is the upward guide for the push plate 33). The solenoid valve DC at the upper outer end of the cylinder 31 is energized to open the valve core, and the highly compressed air in the air tank of the air compressor enters the upper end of the cylinder 31 through the air inlet of the solenoid valve DC (the air at the lower end of the cylinder 31 is discharged through the exhaust port of the lower solenoid valve DC1), and the piston rod of the cylinder 31 quickly pushes the cutting blade 32 downward (the lower end of the blade enters the positioning groove 44), and cuts off a piece of the film roll 7 and bonds it to the surface of the wafer 8 (the downward pressure of the push plate makes the film adhere to the wafer); after the operation is completed, turn off the power switch S.(2) The staff turns on the power switch S1 and turns off the power switch S4. The electromagnet DC4 loses power and no longer generates magnetic attraction to attract and engage the plate 38. The engaging plate 38 pushes the push plate 33 downward under the elastic force (pushing out the cut film sheet). The solenoid valve DC1 at the lower outer end of the cylinder 41 is energized to open the valve core. The highly compressed air in the air tank of the air compressor enters the lower end of the cylinder 31 through the air inlet of the solenoid valve DC1 (the air at the upper end of the cylinder 31 is discharged through the exhaust port of the upper solenoid valve DC). The piston rod of the cylinder 31 quickly drives the cutting blade 32 upward, preparing for the next cutting of the film roll 7 and attaching it to the surface of the wafer 8. After the operation is completed, turn off the power switch S1. (3) The staff turns on the power switch S3, and the solenoid valve DC3 at the lower outer end of the cylinder A42 is opened. The highly compressed air in the air tank of the air compressor enters the lower end of the cylinder A41 through the air inlet of the solenoid valve DC3 (the air at the upper end of the cylinder A41 is discharged through the exhaust port of the upper solenoid valve DC2). The piston rod of the cylinder A41 quickly pushes the push plate A41 upward, and the staff can easily remove the wafer 8 after film bonding. After the operation is completed, turn off the power switch S3. (4) The staff turns on the power switch S2, and the solenoid valve DC2 at the upper outer end of the cylinder A42 is opened. The highly compressed air in the air tank of the air compressor enters the upper end of the cylinder A41 through the air inlet of the solenoid valve DC2 (the air at the lower end of the cylinder A41 is discharged through the exhaust port of the lower solenoid valve DC3). The piston rod of the cylinder A41 quickly pushes the push plate A41 downward, preparing for the next ejection of the wafer after film bonding. Through the above, the cylinder controls the cutting blade to cut the film sheet downward, and the circular film sheet after cutting can be pushed out through the push plate after the electromagnet loses power, which prevents the film sheet 6 from getting stuck in the blade, and can push the wafer upward through the electric push rod A and the push plate A after film pasting, so that the wafer is higher than the height of the cutting station limit ring (positioning groove 44), which is convenient for the staff to take out the wafer 8 after film pasting. The new type brings convenience to the staff and correspondingly improves the work efficiency.

[0019] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the utility model.

[0020] In addition, it should be understood that although the present specification is described according to the implementation mode, the implementation mode does not only include an independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in the embodiments can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A wafer cutting and film laminating device, comprising a workbench, a cutting and film laminating mechanism, a cutting positioning mechanism, an electric air compressor, and a guide mechanism; characterized in that: A support frame is installed at the upper rear end of the workbench, and the cutting and film-sticking mechanism includes a cylinder, a cutting blade, an electromagnet and a push plate. The cylinder is installed at the front end of the support frame, and the upper end of the cutting blade and the lower end of the piston rod of the cylinder are installed together. The upper end side of the cutting blade is provided with a guide hole, and the upper end side of the push plate is provided with a guide rod, and the outer end of the guide rod is movably sleeved with a spring, and the guide rod is movably sleeved in the guide hole; a limiting plate is installed on the top of the guide rod, the electromagnet is installed at the inner upper end of the cutting blade, and the upper end of the push plate is installed with an iron suction plate; the cutting positioning mechanism includes a cylinder A, a push plate A, and a positioning cylinder, and a positioning groove is provided on the outer side of the positioning cylinder, the lower end of the cylinder A is installed in the lower end of the positioning cylinder, the lower end of the push plate A is installed in the upper end of the piston rod of the cylinder A, and the lower end of the positioning cylinder is installed on the workbench.

2. The wafer cutting and film laminating device according to claim 1, characterized in that: The inner diameter of the cutting blade is larger than the outer diameter of the push plate, and the outer diameter of the push plate A is smaller than the inner diameter of the positioning cylinder.

3. The wafer cutting and film laminating device according to claim 1, characterized in that: The lower end of the cutting blade and the upper end of the positioning cylinder are in a vertical plane, the inner diameter of the lower end of the cutting blade is larger than the inner diameter of the inner side of the positioning groove, and the outer diameter of the lower end is smaller than the outer diameter of the positioning groove.

4. The wafer cutting and film laminating device according to claim 1, characterized in that: When the guide rod is located at the lower dead point, the push plate and the lower end of the cutting blade are in the same plane.

5. The wafer cutting and film laminating device according to claim 1, characterized in that: When the piston rod of cylinder A is at the top dead center, the upper end of push plate A and the upper end of the positioning cylinder are in the same plane.

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