Bracket and semiconductor process equipment

Abstract

The utility model discloses a bracket and semiconductor process equipment, the disclosed bracket comprises a bracket body (10) and a body supporting structure (20), the bracket body (10) is used for supporting a bearing boat (30), the body supporting structure (20) is connected with the bracket body (10), the body supporting structure (20) is used for supporting the bracket body (10), and the body supporting structure (20) is used for supporting the bearing boat (30). The bracket body (10) and the body supporting structure (20) are arranged on the body supporting structure (20) so that the bracket body (10) and the inner wall of a semiconductor process chamber (40) can be distributed at intervals when the bracket body (10) is located in the semiconductor process chamber (40), and the melting point of the bracket body (10) and the melting point of the body supporting structure (20) are both higher than the process temperature of the semiconductor process chamber (40) during process. The difference value between the melting point of the bracket body (10) and the process temperature and the difference value between the melting point of the body supporting structure (20) and the process temperature are both larger than or equal to a preset threshold value. According to the scheme, the problem that the bracket related to the related technology is easy to deform during the semiconductor process can be solved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor technology, and specifically relates to a bracket for supporting a carrying boat and semiconductor process equipment. Background Art

[0002] The diffusion process is a relatively important semiconductor process and is commonly used in the production of photovoltaic solar silicon wafers. The bracket is one of the most important tooling in the diffusion process. During the diffusion process, the bracket will support the carrier boat filled with silicon wafers and be placed on the conveying mechanism. The conveying mechanism will transport the bracket and the carrier boat to the semiconductor process chamber (such as a horizontal tubular chamber), and then slowly lower the bracket and the carrier boat, thereby leaving the bracket and the carrier boat loaded with silicon wafers in the semiconductor process chamber for subsequent processes. After the diffusion process is completed, the conveying mechanism extends into the opened semiconductor process chamber and lifts the bracket, and finally outputs the carrier boat and the silicon wafers loaded on the carrier boat together through the bracket.

[0003] The process temperature of the diffusion process is relatively high. The melting point of the bracket involved in the related technology (such as a quartz bracket) is close to the process temperature of the semiconductor process chamber during the process. The high temperature environment is more likely to cause the bracket to soften and twist. If the bracket is deformed significantly, it is easy to cause the conveying mechanism to fail in the subsequent grasping, and ultimately affect the output of the bracket, the carrier boat and the silicon wafer from the semiconductor process chamber after the process is completed. In addition, the bracket is prone to adhesion with the contact area of ​​the semiconductor process chamber due to the reaction with the oxides generated during the process. During the process of the conveying mechanism conveying the bracket, due to the adhesion between the bracket and the semiconductor process chamber, it is easier to cause damage to the conveying mechanism, and it is also easier to cause damage to the bracket, the semiconductor process chamber, the carrier boat and the silicon wafer. Utility Model Content

[0004] The utility model discloses a bracket and semiconductor process equipment, so as to solve the problem that the bracket involved in the related technology is easy to be deformed when the semiconductor process is carried out.

[0005] In order to solve the above technical problems, the utility model provides the following technical solutions:

[0006] In a first aspect, an embodiment of the present application discloses a bracket, which includes a bracket body and a body support structure, wherein the bracket body is used to support a carrying boat, and the body support structure is connected to the bracket body, and the body support structure is used to support the bracket body so that the bracket body can be spaced apart from the inner wall of the semiconductor process chamber when it is in the semiconductor process chamber, the melting point of the bracket body and the melting point of the body support structure are both higher than the process temperature when the semiconductor process chamber is performing a process, and the difference between the melting point of the bracket body and the process temperature and the difference between the melting point of the body support structure and the process temperature are both greater than or equal to a preset threshold.

[0007] In the second aspect, an embodiment of the present application discloses a semiconductor process equipment, which includes a semiconductor process chamber, a conveying mechanism and the bracket described in the first aspect, wherein the conveying mechanism is used to convey the bracket, and when the bracket is conveyed into the semiconductor process chamber by the conveying mechanism, the bracket body is supported on the inner wall of the semiconductor process chamber by the body support structure, so that the body support structure and the inner wall of the semiconductor process chamber are spaced apart and distributed.

[0008] The technical solution adopted by the utility model can achieve the following technical effects:

[0009] The bracket disclosed in the embodiment of the present application improves the structure of the bracket in the related art, and designs the bracket to include a bracket body and a body support structure, and at the same time, the melting points of the bracket body and the body support structure are both higher than the process temperature when the semiconductor process chamber is in process, and the difference between the melting point of the bracket body and the process temperature and the difference between the melting point of the body support structure and the process temperature are both greater than or equal to a preset threshold, so that the melting point of the bracket is not close to the process temperature, so that the body support structure and the bracket body supporting the carrying boat are not easy to soften and deform in a high-temperature process environment. Since the bracket body and the body support structure are not easy to deform, it is not easy to cause the subsequent grasping failure of the conveying mechanism due to deformation. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural schematic diagram of a bracket disclosed in an embodiment of the utility model. Figure 1 Some of the notches 12 are not equipped with support feet 21;

[0011] Figure 2 yes Figure 1 A magnified schematic diagram of the local structure;

[0012] Figure 3 A schematic diagram of the structure of a semiconductor process equipment disclosed in an embodiment of the utility model;

[0013] Figure 4yes Figure 3 AA section view;

[0014] Figure 5 It is a schematic diagram of the structure of the support foot disclosed in the embodiment of the utility model.

[0015] Description of reference numerals:

[0016] 10-bracket body, 11-accommodating groove, 12-notch, 121-circular area, 122-sector area, 13-first protrusion, 14-second protrusion, 15-bottom surface, 16-positioning space, 17-end surface, 18-recessed structure, 19-weight reduction hole,

[0017] 20 - main body supporting structure, 21 - supporting foot, 211 - circular portion, 212 - fan-shaped portion, 213 - second blind hole, 30 - carrying boat, 40 - semiconductor process chamber, 50 - positioning pin. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be clearly and completely described below in combination with the specific embodiments of the utility model and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] The technical solutions disclosed in various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0020] Please refer to Figures 1 to 5 The embodiment of the utility model discloses a bracket. The disclosed bracket is used to support a carrier boat 30, so that the carrier boat 30 performs a semiconductor process, such as a diffusion process, in a semiconductor process chamber 40. Of course, the bracket can also carry the carrier boat 30 into the semiconductor process chamber 40 to perform other types of semiconductor processes, and the embodiment of the utility model does not limit the specific types of semiconductor processes.

[0021] The bracket disclosed in the embodiment of the utility model comprises: a bracket body 10 and a body support structure 20 .

[0022] The bracket body 10 is the main part of the bracket, and is also the part of the bracket used to support the carrying boat 30, and is also the part of the bracket that cooperates with the conveying mechanism of the semiconductor process equipment. In the specific use process, the carrying boat 30 is placed on the bracket body 10 after being loaded with a substrate (such as a silicon wafer), and then enters and exits the semiconductor process chamber 40 with the bracket. The bracket body 10 can be a plate-like structure, and the embodiment of the utility model does not limit the specific structure of the bracket body 10. In order to achieve more stable bearing, in other embodiments, the bracket body 10 can be a groove-like structure. Specifically, the bracket body 10 can be provided with a receiving groove 11, and the receiving groove 11 can accommodate the carrying boat 30, so that the carrying boat 30 can be better positioned.

[0023] In the embodiment of the utility model, the melting points of the bracket body 10 and the body support structure 20 are both higher than the process temperature when the semiconductor process chamber is performing a process (such as a diffusion process), and the difference between the melting point of the bracket body 10 and the process temperature and the difference between the melting point of the body support structure 20 and the process temperature are both greater than or equal to a preset threshold value. If the difference is the preset threshold value, the melting points of the bracket body 10 and the body support structure 20 are not close to the process temperature. Since the melting points of the bracket body 10 and the body support structure 20 are both higher than the preset threshold value, they are not easy to become soft and deform during the process, and thus are not easy to affect the coordination effect with the conveying mechanism due to deformation.

[0024] It should be noted that in the embodiment of the present invention, the preset threshold value can make the melting point of the bracket body 10 and the process temperature different from each other, and the melting point of the body support structure 20 and the process temperature different from each other. In the embodiment of the present invention, the preset threshold value can be as low as 1000°C.

[0025] In one embodiment, the bracket body 10 can be made of silicon carbide, in other words, the bracket body 10 is a silicon carbide structural member. In the prior art, the bracket is made of quartz, and the melting point of quartz is close to the process temperature. Compared with quartz being close to the process temperature, the melting point of silicon carbide is higher than the process temperature when the semiconductor process chamber is in process by at least a preset threshold, so it is not easy to deform. Of course, the bracket body 10 can also be made of silicon nitride, and the melting point of silicon nitride is also higher than the process temperature by at least a preset threshold, and is also higher than the melting point of quartz. The embodiment of the utility model does not limit the specific material of the bracket body 10, as long as it can meet the requirements of the semiconductor process, and the material whose melting point is higher than the process temperature when the semiconductor process chamber is in process by a preset threshold can be used as the material of the bracket body 10.

[0026] In an embodiment of the utility model, the body support structure 20 is used to support the bracket body 10 so that the bracket body 10 can be spaced apart from the inner wall of the semiconductor process chamber 40 when it is in the semiconductor process chamber 40, that is, under the support of the body support structure 20, the bracket body 10 does not contact the inner wall of the semiconductor process chamber 40. The difference between the melting point of the body support structure 20 and the process temperature when the semiconductor process chamber is in process is at least a preset threshold. In one embodiment, the body support structure 20 can be made of ceramics that do not contain silicon carbide. In other words, the body support structure 20 is a ceramic structural member. The melting point of the ceramic is higher than the process temperature when the semiconductor process chamber 40 is in process by at least a preset threshold.

[0027] In the embodiment of the present invention, the material of the main body support structure 20 and the material of the bracket body 10 may be the same or different, and the embodiment of the present invention is not limited thereto.

[0028] The bracket disclosed in the embodiment of the utility model has improved the structure of the bracket in the related art, and the bracket is designed to include a bracket body 10 and a body support structure 20. At the same time, the melting point of the bracket body 10 and the melting point of the body support structure 20 are both higher than the process temperature when the semiconductor process chamber is in process, and the difference between the melting point of the bracket body 10 and the process temperature and the difference between the melting point of the body support structure 20 and the process temperature are both greater than or equal to the preset threshold value, so that the melting point of the bracket is not close to the process temperature, so that the body support structure 20 and the bracket body 10 supporting the carrying boat 30 are not easy to soften and deform in a high-temperature process environment. Since the bracket body 10 is not easy to deform, it is not easy to cause the subsequent grasping failure of the conveying mechanism due to deformation.

[0029] In one embodiment, the materials used for the bracket body 10 and the body support structure 20 will not react with reactants generated when the semiconductor process chamber 40 is in process. For example, the bracket body 10 may be a silicon carbide structure or a silicon nitride structure, and silicon carbide and silicon nitride will not react with reactants such as oxides (such as boron oxide) generated when the semiconductor process chamber 40 is in process. The body support structure 20 may be a ceramic structure, and the ceramic structure will not react with reactants such as oxides (such as boron oxide) generated when the semiconductor process chamber 40 is in process.

[0030] In this case, since the materials used for the body support structure 20 and the bracket body 10 will not react with the reactants generated during the process in the semiconductor process chamber 40, the body support structure 20 is not easy to adhere to the semiconductor process chamber 40 under the high temperature process environment, so that the bracket is not easy to adhere to the semiconductor process chamber 40. In this case, it is possible to avoid the bracket, the semiconductor process chamber 40, the carrier boat, the substrate (such as a silicon wafer), etc. being damaged due to the easy adhesion between the bracket and the semiconductor process chamber 40.

[0031] In an optional solution, the expansion coefficient of the body support structure 20 may be smaller than the expansion coefficient of the bracket body 10, the expansion coefficient of the body support structure 20 may be smaller than the expansion coefficient of the semiconductor process chamber 40, and the expansion coefficient of the bracket body 10 may be greater than the expansion coefficient of the semiconductor process chamber 40. In this structure, since the expansion coefficient of the body support structure 20 directly in contact with the semiconductor process chamber 40 is smaller than that of the semiconductor process chamber 40, it is not easy to crush the semiconductor process chamber 40 due to a large expansion amount during the process. Optionally, the body support structure 20 is made of ceramic.

[0032] In another embodiment, the entire bracket can be made of ceramic, which can also satisfy the requirement that the melting points of the bracket body 10 and the body support structure 20 are both higher than the process temperature of the semiconductor process chamber 40 when the process is carried out by at least a preset threshold. However, the inventors found in the process of research and development that it is difficult to ensure the purity of a large amount of ceramics during the manufacturing process, and it is easy to mix in more impurities, which is more likely to pollute the semiconductor process, and the processing cost of ceramics is high, which is not conducive to controlling the manufacturing cost of the bracket. In the embodiment of the utility model, only the partial body support structure 20 can be made of ceramic material, which can avoid crushing the semiconductor process chamber 40, and can also avoid the problem that the entire bracket is made of ceramic, which leads to excessively high manufacturing costs of the entire bracket and difficult to control impurities.

[0033] In one embodiment, the material of the bracket body 10 may be silicon carbide, and the material of the body support structure 20 may be ceramic. In another embodiment, the material of the bracket body 10 may be silicon nitride, and the material of the body support structure 20 may be ceramic.

[0034] In the embodiment of the utility model, the semiconductor process chamber 40 may be a horizontal tubular chamber, and the semiconductor process chamber 40 may be a quartz member. Alternatively, the tubular chamber may be a quartz tube.

[0035] In the embodiment of the utility model, the body support structure 20 can support the bracket body 10, and the number of the body support structures 20 can be one or at least two, which is not limited by the embodiment of the utility model. In order to better support the bracket body 10, there can be at least two body support structures 20, and among the at least two body support structures 20, the two body support structures 20 can be respectively arranged at both ends of the bracket body 10. Specifically, the two body support structures 20 are respectively arranged at the two ends of the bracket body 10 along the length direction (of the bracket body 10). The length direction of the bracket body 10 is parallel to the axial direction of the circular portion 211 mentioned later.

[0036] The structure of the main body support structure 20 can be various. For example, the main body support structure 20 can be an integral support block that is compatible with the inner wall shape of the semiconductor process chamber 40. In other embodiments, in order to take into account the stability of the support and avoid that the contact area between the main body support structure 20 and the semiconductor process chamber 40 is too large, in an optional scheme, the main body support structure 20 may include at least two support feet 21. The at least two support feet 21 may include a first support foot and a second support foot. The first support foot and the second support foot are arranged at intervals on opposite sides of the bottom of the bracket body 10. In the embodiment in which the bracket body 10 is provided with a receiving groove 11, the bottom of the bracket body 10 faces away from the notch of the receiving groove 11.

[0037] In one embodiment, the main body support structure 20 and the bracket body 10 can be connected in a non-detachable manner. In an embodiment where the bracket body 10 and the main body support structure 20 are made of different materials, in order to facilitate separate manufacturing and separate replacement of components, the main body support structure 20 can be connected to the bracket body 10 in a detachable manner. In the case where the main body support structure 20 includes at least two support feet 21, the support feet 21 can be detachably mounted on the bracket body 10. The embodiment of the utility model does not limit the specific detachable connection method between the main body support structure 20 and the bracket body 10, and the main body support structure 20 can be detachably connected to the bracket body 10 by means of snap connection, connection with a connector, etc.

[0038] Similarly, in the embodiment where the main body support structure 20 includes at least two support legs 21, the support legs 21 can also be detachably connected to the bracket body 10. Specifically, the support legs 21 can be detachably connected to the bracket body 10 by means of snap connection, connection with a connector, etc., and the embodiment of the utility model does not limit the detachable connection method between the support legs 21 and the bracket body 10. In one embodiment, the bracket body 10 can be provided with a notch 12, and the support legs 21 can be detachably installed in the corresponding notch 12. The shapes of the support legs 21 and the notch 12 are adapted, and the support legs 21 and the notch 12 are limitedly matched at least in a preset direction, so that when the support legs 21 are suspended as the bracket is removed from the semiconductor process chamber 40, the support legs 21 will not fall off from the notch 12 due to gravity. This method can reduce the use of connectors and alleviate the pollution problem caused by operating the connectors to perform more connection operations. The notch 12 may have a variety of shapes as long as it can meet the requirement of not falling off. The embodiment of the utility model does not limit the specific shape of the notch 12.

[0039] In an embodiment of the utility model, the relative mating parts between the main body support structure 20 and the bracket body 10 can be in contact everywhere. In a specific process, the process temperature in the semiconductor process chamber 40 is high, and the bracket body 10 and the main body support structure 20 will both undergo thermal expansion. In an embodiment where the two materials are different, the main body support structure 20 and the bracket body 10 have different thermal expansion amounts after assembly, and are prone to mutual extrusion, which is not conducive to the structural stability of the bracket. Based on this, in a further embodiment, there may be a gap between the support foot 21 and the edge of the corresponding notch 12, thereby reserving space for the thermal expansion of the main body support structure 20 and the bracket body 10. In one embodiment, the width of the gap may be at least 0.5 mm.

[0040] As described above, the notch 12 may have a variety of shapes. In one embodiment, the notch 12 may include a circular area 121 and a fan-shaped area 122 that are interconnected. The support foot 21 may include a circular portion 211 and a fan-shaped portion 212 connected to the circular portion 211. Specifically, the circular portion 211 and the fan-shaped portion 212 may be connected by welding, connecting pieces, etc. In order to reduce on-site assembly operations, the circular portion 211 and the fan-shaped portion 212 may be an integral structure, so that no on-site assembly is required. The circular portion 211 is arranged in the circular area 121 and is limitedly cooperated with the bracket body 10 in the direction close to the fan-shaped area 122, so that when the support foot 21 is suspended in the air as the bracket is moved out of the semiconductor process chamber 40, the support foot 21 will not fall off from the notch 12 due to gravity. The fan-shaped portion 212 is arranged in the fan-shaped area 122, and the arc edge of the fan-shaped portion 212 is used to contact and be tangent to the inner wall of the semiconductor process chamber 40, thereby avoiding the generation of large contact compressive stress between the support foot 21 and the inner wall of the semiconductor process chamber 40, which is beneficial to alleviate the phenomenon of the semiconductor process chamber 40 being crushed.

[0041] During the specific installation process, the support foot 21 can be installed in the notch 12 along the axial direction of the circular portion 211. After the support foot 21 is installed in the notch 12, the support foot 21 may move along the axial direction of the circular portion 211 and detach from the notch 12, which may cause support failure. Based on this, the bracket disclosed in the embodiment of the utility model may also include a positioning pin 50, and the two ends of the positioning pin 50 may be respectively plugged into the bracket body 10 and the support foot 21. The support foot 21 can be positioned and matched with the bracket body 10 in the axial direction of the circular area 121 by the positioning pin 50. This structure can be further connected by the positioning pin 50, thereby avoiding the support foot 21 along the axial direction of the circular area 121 (such as Figure 1 The supporting leg 21 moves in a direction parallel to the arrow A in the middle (in a direction parallel to the arrow A in the middle) and falls off from the notch 12, which can improve the stability of the assembly between the supporting leg 21 and the bracket body 10.

[0042] In order to improve the positioning effect, in a further technical solution, there are at least two positioning pins 50. At least two positioning pins 50 may include a first positioning pin and a second positioning pin. The two ends of the first positioning pin are respectively plugged with the circular portion 211 and the bracket body 10, and the circular portion 211 can be axially positioned with the bracket body 10 in the circular area 121 through the first positioning pin. The two ends of the second positioning pin can be respectively plugged with the fan-shaped portion 212 and the bracket body 10. The fan-shaped portion 212 can be axially positioned with the bracket body 10 in the circular area 121 through the second positioning pin. This structure can respectively position and match the circular portion 211 and the fan-shaped portion 212 in the axial direction through the first positioning pin and the second positioning pin, so that the support foot 21 can be better restricted in the axial direction of the circular area 121, achieving a better restriction effect. It should be noted that the axial direction of the circular portion 211 can be perpendicular to the direction close to the fan-shaped area 122 described above, and the axial direction of the circular portion 211 is the axial direction of the circular area 121.

[0043] In the embodiment of the utility model, the first positioning pin and the second positioning pin intersect or are not aligned with the axial direction of the circular area 121, so as to achieve the purpose of axially positioning the circular portion 211 and the fan-shaped portion 212 based on the bracket body 10. In the specific structural design, it is sufficient as long as holes that match the first positioning pin and the second positioning pin can be opened on the corresponding parts of the bracket body 10 and the supporting foot 21. The hole can be a through hole or a blind hole.

[0044] In order to prevent the locating pin from falling off, in a further embodiment, the bracket body 10 may be provided with a first blind hole that is plugged and matched with the locating pin 50. The support foot 21 may be provided with a second blind hole 213 that is plugged and matched with the locating pin 50. The length of the first blind hole is greater than or equal to the length of the locating pin 50. The length of the second blind hole 213 is less than the length of the locating pin 50. In the specific installation process, the bracket body 10 can be turned upside down, at which time the bottom of the bracket body 10 faces upward and the top of the bracket body 10 faces downward. The operator can first insert the locating pin 50 into the first blind hole. Since the first blind hole is relatively long, the locating pin 50 will not extend out of the first blind hole and block the support foot 21 from being installed in the notch 12 along the axial direction of the circular area 121. The operator can then install the support foot 21 into the notch 12, and then reset the bracket body 10 so that the top of the bracket body 10 faces upward and the bottom of the bracket body 10 faces downward. The positioning pin 50 will spring out of the first blind hole under the action of gravity and extend into the second blind hole 213. Since the second blind hole 213 is shorter, the two ends of the positioning pin 50 remain in the first blind hole and the second blind hole 213 respectively, and finally the support foot 21 and the bracket body 10 are positioned and matched in the axial direction of the circular area 121. This method can realize the installation of the positioning pin 50, and since the first blind hole and the second blind hole 213 are not transparent, the positioning pin 50 can be prevented from falling off, and the stability of the positioning and matching can be ensured.

[0045] In the embodiment of the utility model, the bottom of the bracket body 10 may include a first protrusion 13 and a second protrusion 14. The first protrusion 13 and the second protrusion 14 are arranged between the first supporting foot and the second supporting foot. The first protrusion 13 and the second protrusion 14 are arranged at intervals. The bracket body 10 has a bottom surface 15 facing away from the notch of the accommodating groove 11, and the first protrusion 13 and the second protrusion 14 protrude from the bottom surface 15 of the bracket body 10, and form a positioning space 16 with the bottom surface of the bracket body 10. The positioning space 16 is used to position and cooperate with the conveying mechanism of the semiconductor process equipment. The conveying mechanism can support the bracket body 10 by positioning and cooperating with the positioning space 16, and finally realize the support of the bracket, so that the conveying mechanism drives the bracket to enter and exit the semiconductor process chamber 40. The opposite surfaces of the first protrusion 13 and the second protrusion 14 are used to form a part of the edge of the corresponding notch 12. In this case, in addition to the function of forming the positioning space 16, the first protrusion 13 and the second protrusion 14 also assist in forming the function of forming the notch 12.

[0046] In the embodiment of the utility model, one of the two ends of the bracket body 10 distributed along its length direction is the tail end. The end face 17 of the tail end is provided with a recessed structure 18, and the plane of the end face 17 except the recessed structure 18 is the positioning surface. This structure can be provided with a recessed structure 18 on the end face 17, so that the area of ​​other areas on the end face 17 except the recessed structure 18 is reduced, so that the area of ​​the plane as the positioning surface is smaller. The machining accuracy of the positioning surface is high. Since the area of ​​the positioning surface is reduced, there is no need to process a larger area of ​​the positioning surface, which leads to the problem of high machining cost. It should be noted that the tail end of the bracket body 10 refers to the end of the bracket body 10 facing the inlet and outlet of the semiconductor process chamber 40 when the bracket enters the semiconductor process chamber 40 with the bracket. It should be explained that the inlet and outlet of the semiconductor process chamber are the same port, that is, the inlet and outlet in this article. It should be explained that in the embodiment of the utility model, the positioning surface is used to contact with the conveying mechanism for positioning, so as to ensure the matching effect of the conveying mechanism and the bracket.

[0047] Since the bracket body 10 has a high melting point, it is not easy to deform in a high temperature process environment. Based on this, please refer to Figure 1 In other embodiments, the bracket body 10 may be provided with a weight-reducing hole 19 to reduce the overall weight of the bracket. Specifically, there may be one weight-reducing hole 19 or at least two weight-reducing holes 19. The embodiment of the utility model does not limit the specific number of weight-reducing holes 19.

[0048] Based on the bracket disclosed in the embodiment of the utility model, the embodiment of the utility model further discloses a semiconductor process equipment. The disclosed semiconductor process equipment includes a semiconductor process chamber 40, a conveying mechanism and the bracket described in the above embodiment, the conveying mechanism is used to convey the bracket, when the bracket is conveyed into the semiconductor process chamber 40 by the conveying mechanism, the bracket body 10 is supported on the inner wall of the semiconductor process chamber 40 by the body support structure 20, so that the bracket body 10 and the inner wall of the semiconductor process chamber 40 are spaced apart.

[0049] The above embodiments of the present invention focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0050] The embodiments of the utility model are described above in conjunction with the accompanying drawings, but the utility model is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the enlightenment of the utility model, ordinary technicians in this field can also make many forms without departing from the scope of protection of the utility model and the claims, all of which are within the protection of the utility model.

Claims

1. A bracket, characterized in that: The invention comprises a bracket body (10) and a body support structure (20), wherein the bracket body (10) is used to support a carrying boat (30), and the body support structure (20) is connected to the bracket body (10). The body support structure (20) is used to support the bracket body (10) so that the bracket body (10) can be spaced apart from the inner wall of the semiconductor process chamber (40) when the bracket body (10) is in the semiconductor process chamber (40). The melting point of the bracket body (10) and the melting point of the body support structure (20) are both higher than the process temperature when the semiconductor process chamber (40) is performing a process, and the difference between the melting point of the bracket body (10) and the process temperature and the difference between the melting point of the body support structure (20) and the process temperature are both greater than or equal to a preset threshold.

2. The bracket according to claim 1, characterized in that The expansion coefficient of the main body support structure (20) is smaller than the expansion coefficient of the semiconductor process chamber (40), and the expansion coefficient of the bracket body (10) is larger than the expansion coefficient of the semiconductor process chamber (40).

3. The bracket according to claim 1, characterized in that: The materials used for the bracket body (10) and the body support structure (20) will not react with reactants generated when the semiconductor process chamber (40) is performing a process.

4. The bracket according to any one of claims 1 to 3, characterized in that: The semiconductor process chamber (40) is a quartz component, the bracket body (10) is a silicon carbide structural component, and the body support structure (20) is a ceramic structural component; or, The semiconductor process chamber (40) is a quartz component, the bracket body (10) is a silicon nitride structural component, and the body support structure (20) is a ceramic structural component.

5. The bracket according to claim 1, characterized in that: The main body support structure (20) includes at least two supporting legs (21), and the bracket body (10) is provided with a receiving groove (11) for accommodating the carrying boat (30). The at least two supporting legs (21) include a first supporting leg and a second supporting leg. The first supporting leg and the second supporting leg are arranged at the bottom of a notch of the bracket body (10) facing away from the receiving groove (11), and are respectively located on two opposite sides of the bottom of the bracket body (10). The bracket body (10) is provided with a notch (12), and the supporting legs (21) are detachably installed in the corresponding notch (12).

6. The bracket according to claim 5, characterized in that There is a gap between the supporting foot (21) and the edge of the corresponding notch (12).

7. The bracket according to claim 5, characterized in that: The notch (12) comprises a circular area (121) and a fan-shaped area (122) which are interconnected; the supporting foot (21) comprises a circular portion (211) and a fan-shaped portion (212) connected to the circular portion (211); the circular portion (211) is arranged in the circular area (121) and is limitedly matched with the bracket body (10) in a direction close to the fan-shaped area (122); the fan-shaped portion (212) is arranged in the fan-shaped area (122); and the arc edge of the fan-shaped portion (212) is used to contact and be tangent to the inner wall of the semiconductor process chamber (40).

8. The bracket according to claim 7, characterized in that The bracket further comprises a positioning pin (50), the two ends of which are respectively plugged into the bracket body (10) and the supporting foot (21), and the supporting foot (21) is positioned and matched with the bracket body (10) in the axial direction of the circular area (121) through the positioning pin (50).

9. The bracket according to claim 8, characterized in that There are at least two positioning pins (50), and the at least two positioning pins (50) include a first positioning pin and a second positioning pin, wherein two ends of the first positioning pin are respectively plugged into the circular portion (211) and the bracket body (10), and the circular portion (211) is axially positioned and matched with the bracket body (10) through the first positioning pin, and two ends of the second positioning pin are respectively plugged into the fan-shaped portion (212) and the bracket body (10), and the fan-shaped portion (212) is axially positioned and matched with the bracket body (10) through the second positioning pin.

10. The bracket according to claim 8 or 9, characterized in that: The bracket body (10) is provided with a first blind hole plugged into and matched with the positioning pin (50), and the supporting foot (21) is provided with a second blind hole (213) plugged into and matched with the positioning pin (50), the length of the first blind hole is greater than or equal to the length of the positioning pin (50), and the length of the second blind hole (213) is less than the length of the positioning pin (50).

11. The bracket according to claim 5, characterized in that: The bottom of the bracket body (10) includes a first protrusion (13) and a second protrusion (14), the first protrusion (13) and the second protrusion (14) are arranged between the first supporting foot and the second supporting foot, the first protrusion (13) and the second protrusion (14) are arranged at an interval, the bracket body (10) has a bottom surface (15) facing away from the notch, the first protrusion (13) and the second protrusion (14) protrude from the bottom surface (15), and form a positioning space (16) with the bottom surface (15), the positioning space (16) is used for positioning and cooperating with the conveying mechanism, and the surfaces opposite to each other of the first protrusion (13) and the second protrusion (14) are used to form a partial edge of the corresponding notch (12).

12. The bracket according to claim 1, characterized in that One of the two ends of the bracket body (10) distributed along its length direction is a tail end, an end surface (17) of the tail end is provided with a recessed structure (18), and the plane of the end surface (17) excluding the recessed structure (18) is a positioning surface.

13. A semiconductor process equipment, characterized in that: It comprises a semiconductor process chamber (40), a conveying mechanism and a bracket according to any one of claims 1 to 12, wherein the conveying mechanism is used to convey the bracket, and when the bracket is conveyed into the semiconductor process chamber (40) by the conveying mechanism, the bracket body (10) is supported on the inner wall of the semiconductor process chamber (40) by the body support structure (20) so that the bracket body (10) is spaced apart from the inner wall of the semiconductor process chamber (40).

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