Micro-LED receiving substrate fixing device

Abstract

The utility model discloses a Micro-LED receiving substrate fixing device. The Micro-LED receiving substrate fixing device comprises a lower light source, the positioning ring is arranged at the upper end of the lower light source; the annular adsorption groove is formed in the upper end of the positioning ring, the customized slide is detachably connected to the upper end of the positioning ring, and a sealing cavity is formed by the upper end of the lower light source, the inner wall of the positioning ring and the lower end of the customized slide; the through hole is formed in the customized slide in a penetrating manner; the through hole is positioned right above the sealing cavity; the receiving substrate is adsorbed by the through hole, and the receiving position of the receiving substrate does not coincide with the through hole. Different types of customized slides are matched with different types of receiving substrates, and the customized slides are simple and convenient to replace; the receiving substrate is adsorbed on the customized slide to prevent position deviation; meanwhile, the upper light source and the lower light source are arranged, the position of the chip is accurately positioned and recognized, and the visual recognition precision is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of Micro-LED, and in particular relates to a Micro-LED receiving substrate fixing device. Background Art

[0002] Micro-LED laser transfer technology is a precision production process used to accurately transfer tiny LED devices from a source substrate to a target substrate. This technology is essential for the manufacture of high-density, high-performance display products such as MicroLED displays. Micro-LED transfer substrate is a special substrate material used to pick up and place LED die during the transfer printing process. This substrate usually has a high-precision structure that can effectively control the position of the LED die and maintain its integrity during the transfer process. The choice of transfer substrate has an important impact on the production efficiency and product quality of Micro-LED display technology.

[0003] The Chinese patent document with publication number CN112687604B discloses a mass transfer device for LED chips and a manufacturing method thereof, wherein an elastic component is arranged between the substrate and the transfer head, and based on the elastic characteristics of the elastic component, elastic deformation can occur when subjected to external force to adjust the spatial position of each transfer head in the first direction, such as adjusting the height of each transfer head in the first direction. In other words, the plane where the transfer head is located can be flexibly deformed based on the placement position of the docking substrate and the surface morphology of the docking substrate through the elastic component, thereby greatly improving the success rate of mass transfer of LED chips.

[0004] In order to adapt to different transfer tasks or test tasks, or for different types of receiving substrates and chips, it is necessary to replace different types of receiving substrates (different sizes, shapes, adsorption materials, etc.). The above-mentioned patent solution requires major changes when replacing different types of receiving substrates, which is inconvenient to replace. In addition, the visual imaging quality also plays a vital role in the laser transfer quality. The visual imaging of the above-mentioned patent solution relies solely on the camera, without multi-directional auxiliary light sources, so the imaging quality is poor, resulting in low transfer quality and work efficiency. Utility Model Content

[0005] In order to overcome the technical problems in the prior art that the receiving substrate and the corresponding fixing device are inconvenient to replace and there is no auxiliary light source set in multiple directions, resulting in low imaging quality and work efficiency; one purpose of the utility model is to provide a Micro-LED receiving substrate fixing device, by setting an adsorption ring on the upper end of the planar light source, the adsorption ring can adsorb a customized glass slide with a through hole in the middle, and the closed inner cavity composed of the adsorption ring and the planar light source adsorbs and fixes the receiving substrate through the through hole.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical solutions: a Micro-LED receiving substrate fixing device, including a lower light source, which is arranged on a lifting module; a positioning ring, which is arranged at the upper end of the lower light source; an annular adsorption groove, which is coaxially arranged at the upper end of the positioning ring, a customized glass slide, which is detachably connected to the upper end of the positioning ring, and the customized glass slide completely covers the annular adsorption groove, and the upper end of the lower light source, the inner wall of the positioning ring, and the lower end of the customized glass slide are tightly fitted to form a sealed cavity; a through hole, which is arranged through the customized glass slide; the through hole is located directly above the sealed cavity; wherein the gas exchange device is connected to the annular adsorption groove and the sealed cavity respectively through two independent solenoid valves; the receiving substrate is adsorbed on the upper end of the customized glass slide by the through hole, and the chip receiving position of the receiving substrate does not overlap with the through hole.

[0007] The receiving substrate may have different sizes and shapes, or be spin-coated with different attachment materials depending on the type of the corresponding working chip, which also requires different models of customized glass slides to adapt to different types of receiving substrates; two independently arranged solenoid valves are respectively connected to the annular adsorption groove and the sealed cavity, thereby facilitating the replacement of the customized glass slide and the receiving substrate, being compatible with different transfer tasks or test tasks, and being simple and convenient to replace, which helps to improve the working efficiency of laser transfer.

[0008] Furthermore, there are a plurality of through holes, which are evenly distributed along a circumferential direction; and the distribution circumference of the through holes is coaxially arranged with the positioning ring.

[0009] Specifically, the customized glass slide has various models; various models of the customized glass slide have distribution circles of the through holes with different diameters.

[0010] Specifically, the diameter of the distribution circle of the through holes is less than or equal to the diameter of the inscribed circle of the receiving substrate.

[0011] The through hole will affect the visual module's recognition of Micro-LED. Under the premise of ensuring that the receiving substrate is firmly adsorbed, the through hole is as close to the outer periphery of the positioning ring as possible to provide a sufficient working area for the visual module to avoid errors.

[0012] Preferably, there are four through holes.

[0013] Furthermore, the outer wall of the positioning ring is provided with a first air path communicating with the interior of the positioning ring; the outer wall of the positioning ring is provided with a second air path communicating with the annular adsorption groove.

[0014] The two solenoid valves are respectively connected to the first gas path and the second gas path.

[0015] Preferably, the second gas path is located below the annular adsorption groove; the first gas path and the second gas path are staggered with each other in the circumferential direction; and the structural strength of the positioning ring is improved.

[0016] Furthermore, the lower light source is a surface light source; the customized glass slide and the receiving substrate are both made of transparent materials.

[0017] Furthermore, a rotary fine-tuning platform is disposed at the upper end of the lifting module; and the lower light source is disposed at the upper end of the rotary fine-tuning platform.

[0018] Furthermore, a visual module is arranged above the customized glass slide; and an upper light source is arranged above the customized glass slide.

[0019] During the Micro-LED laser transfer process, the positioning of the chip requires the help of the lower light source, while the judgment requires the use of the upper light source; when using the lower light source for positioning, only the outline of the chip can be seen, and the visual recognition algorithm will not be affected by slight differences in the surface between chips, while the upper light source can see the surface of the chip, and can clearly see the stains or damage on the chip to determine whether the chip is damaged.

[0020] Compared with the prior art, the beneficial effects of the present invention are:

[0021] 1. By setting different types of customized glass slides, different types of receiving substrates can be adapted to meet different work or test tasks, and the customized glass slides can be replaced easily and conveniently;

[0022] 2. The receiving substrate is adsorbed on the customized glass slide to prevent the position deviation of the receiving substrate caused by high-speed movement during the laser transfer process, thereby improving the accuracy of laser transfer;

[0023] 3. Set up the upper and lower light sources at the same time to accurately locate and identify the position of the chip, improve visual recognition accuracy, and help improve printing quality and work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a structural schematic diagram of the utility model;

[0025] Figure 2 It is a schematic diagram of the parts explosion of the utility model;

[0026] Figure 3 It is a structural schematic diagram of the positioning ring of the utility model;

[0027] Figure 4 This is a schematic diagram of the structure of the customized glass slide of the utility model.

[0028] In the figure: 1. lower light source; 2. positioning ring; 21. annular adsorption groove; 22. sealed cavity; 23. first gas path; 24. second gas path; 3. customized glass slide; 31. through hole; 4. upper glass slide; 5. upper loading platform; 6. lifting module; 7. rotary fine-tuning platform. DETAILED DESCRIPTION

[0029] The present invention is further described below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form a new embodiment.

[0030] In the description of the present invention, it should be noted that directional words, such as the terms "center", "lateral", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions and positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of narrating the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific protection scope of the present invention.

[0031] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features. Therefore, the definition of "first" and "second" features can explicitly or implicitly include one or more of the features. In the description of the utility model, the meaning of "several" is two or more, unless otherwise clearly and specifically defined.

[0032] In the present invention, unless otherwise specified and limited, the terms "setting", "installation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can also be a mechanical connection; it can be directly connected, or it can be connected through an intermediate medium, or two elements can be internally connected. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] See also Figure 1-Figure 4, a Micro-LED receiving substrate fixing device, including a lifting module 6 arranged in sequence from bottom to top, the lifting module 6 is arranged on a horizontal displacement platform; a rotary fine-tuning platform 7, the rotary fine-tuning platform 7 is arranged at the upper end of the lifting module 6; a lower light source 1, the lower light source 1 is arranged at the upper end of the rotary fine-tuning platform 7; a positioning ring 2, the positioning ring 2 is arranged at the upper end of the lower light source 1; a customized glass slide 3, the customized glass slide 3 is detachably connected to the upper end of the positioning ring 2; an upper loading platform 5, the upper loading platform 5 is arranged directly above the customized glass slide 3; an upper glass slide 4, the upper glass slide 4 is arranged at the upper end of the upper loading platform 5; a visual module is arranged above the upper glass slide 4; an upper light source is arranged above the upper glass slide 4; the lower light source 1 is a surface light source; the customized glass slide 3 and the receiving substrate are both made of transparent materials.

[0034] An annular adsorption groove 21 is coaxially arranged at the upper end of the positioning ring 2; the customized glass slide 3 completely covers the annular adsorption groove 21, and the upper end of the lower light source 1, the inner wall of the positioning ring 2, and the lower end of the customized glass slide 3 are tightly fitted to form a sealed cavity 22; four through holes 31 evenly distributed along the circumferential direction are arranged at the upper end of the customized glass slide 3; the through holes 31 are located directly above the sealed cavity 22; the receiving substrate is adsorbed on the upper end of the customized glass slide 3 by the through holes 31, and the chip receiving position of the receiving substrate does not overlap with the through holes 31.

[0035] The gas exchange device is connected to the annular adsorption groove 21 and the sealed cavity 22 respectively through two independent electromagnetic valves; the gas exchange device can be a compressor or other gas source.

[0036] The distribution circle of the through holes 31 is coaxially arranged with the positioning ring 2; the customized glass slide 3 has various models; various models of the customized glass slide 3 have distribution circles of the through holes 31 with different diameters; the diameter of the distribution circle of the through holes 31 is less than or equal to the diameter of the inscribed circle of the receiving substrate.

[0037] The outer wall of the positioning ring 2 is provided with a first gas path 23 connected to the inside of the positioning ring 2; the outer wall of the positioning ring 2 is provided with a second gas path 24 connected to the annular adsorption groove 21; two independently arranged solenoid valves are respectively connected to the first gas path 23 and the second gas path 24; the second gas path 24 is located below the annular adsorption groove 21; the first gas path 23 and the second gas path 24 are staggered with each other in the circumferential direction.

[0038] The above description is only a specific embodiment of the present invention, but the technical features of the present invention are not limited thereto. Any changes or modifications made by any technician in the field of the present invention are included in the patent scope of the present invention.

Claims

1. A Micro-LED receiving substrate fixing device, characterized in that: It includes a lower light source, and the lower light source is arranged on the lifting module; A positioning ring, the positioning ring being arranged at the upper end of the lower light source; An annular adsorption groove, the annular adsorption groove is coaxially arranged on the upper end of the positioning ring; A customized glass slide, wherein the customized glass slide is detachably connected to the upper end of the positioning ring, the customized glass slide completely covers the annular adsorption groove, and the upper end of the lower light source, the inner wall of the positioning ring, and the lower end of the customized glass slide are closely fitted to form a sealed cavity; A through hole, wherein the through hole is arranged through the customized glass slide; the through hole is located directly above the sealed cavity; The gas exchange device is connected to the annular adsorption groove and the sealed cavity respectively through two independent solenoid valves; the receiving substrate is adsorbed on the upper end of the customized glass slide by the through hole, and the chip receiving position of the receiving substrate does not overlap with the through hole.

2. The fixing device according to claim 1, characterized in that: There are a plurality of through holes, which are evenly distributed along a circumferential direction; the distribution circumference of the through holes is coaxially arranged with the positioning ring.

3. The fixing device according to claim 2, characterized in that: The customized glass slide has various models; various models of the customized glass slide have distribution circumferences of the through holes with different diameters.

4. The fixing device according to claim 2, characterized in that: The diameter of the distribution circle of the through holes is less than or equal to the diameter of the inscribed circle of the receiving substrate.

5. The fixing device according to claim 2, characterized in that: The number of the through holes is four.

6. The fixing device according to any one of claims 1 to 5, characterized in that: The outer wall of the positioning ring is provided with a first gas path communicating with the interior of the positioning ring; the outer wall of the positioning ring is provided with a second gas path communicating with the annular adsorption groove.

7. The fixing device according to claim 6, characterized in that: The second gas path is located below the annular adsorption groove; the first gas path and the second gas path are staggered with each other in the circumferential direction.

8. The fixing device according to any one of claims 1 to 5, characterized in that: The lower light source is a surface light source; the customized glass slide and the receiving substrate are both made of transparent materials.

9. The fixing device according to any one of claims 1 to 5, characterized in that: A rotary fine-tuning platform is arranged at the upper end of the lifting module; and the lower light source is arranged at the upper end of the rotary fine-tuning platform.

10. The fixing device according to any one of claims 1 to 5, characterized in that: A visual module is arranged above the customized glass slide; an upper light source is arranged above the customized glass slide.

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