Wafer cleaning device for semiconductor production

Abstract

The utility model discloses a wafer cleaning device for semiconductor production, which relates to the technical field of cleaning and comprises a base, a cleaning tank arranged on the inner side of the top end of the base, a water spraying mechanism arranged on the top end of the cleaning tank, a placing box arranged on the inner side of the cleaning tank, and a movable disc arranged on the inner side of the placing box. A driving mechanism and a jacking mechanism are arranged at the bottom end of the moving disc, a bottom plate is fixedly connected to the bottom end of the inner side of the base, a supporting plate is fixedly connected to the bottom end of the containing box, and the driving mechanism comprises a driving motor. The movable disc is arranged on the inner side of the placing box, the movable disc can move up and down on the inner side of the placing box, a wafer to be cleaned can be placed at the top end of the movable disc, cleaning work is facilitated, the hydraulic cylinder is arranged at the bottom end of the placing box, the wafer placed on the movable disc can be effectively pushed upwards, and the wafer can be conveniently cleaned. The wafer is prevented from being clamped on the inner side of the placing box, the wafer can be conveniently and rapidly taken down, and the use effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning, in particular to a wafer cleaning device for semiconductor production. Background Art

[0002] Wafers can be processed into various circuit component structures on silicon wafers and are a commonly used semiconductor structure.

[0003] According to the patent number 201921348303.7, a wafer cleaning device for semiconductor production includes a cabinet, a cleaning table is welded on the upper surface of the cabinet, and the cleaning table is a funnel-shaped structure, bushings are vertically arranged in the middle position of the edges of both sides of the upper surface of the cleaning table, and pillars are arranged inside the bushings, a load plate is fixedly installed between the upper ends of the two groups of pillars, and the load plate is arranged parallel to the cabinet, a linear guide is arranged in the middle position of the lower surface of the load plate, and a slider is slidably installed on the lower surface of the linear guide, a guide column is welded on the lower surface of the slider, and a water inlet pipe is fixedly connected to the middle position of the front wall of the guide column, the bottom of the guide column is vertically connected to a nozzle, and a slide groove is opened in the middle position of the front and rear walls of the bushing. In this utility model, the wafer of the cleaning device is convenient to fix and the rotation stability of the load body is good. At the same time, the height of the cleaning mechanism is adjustable and the loading and unloading of the wafer is convenient.

[0004] However, after actual application by technicians in this field, it was found that the above-mentioned device still has some shortcomings. When the wafer is placed on the carrier plate for cleaning, the water tension between the carrier plate and the wafer will cause the wafer to be adsorbed on the carrier plate. The wafer will be stuck in the carrier plate, making it inconvenient to remove the wafer from the carrier plate, resulting in poor use effect.

[0005] Therefore, it is necessary to invent a wafer cleaning device for semiconductor production to solve the above problems. Utility Model Content

[0006] The purpose of the utility model is to provide a wafer cleaning device for semiconductor production to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: A wafer cleaning device for semiconductor production, comprising a base, a top end of which is provided with a flip cover;

[0008] A cleaning tank is arranged inside the top of the base, a water spray mechanism is arranged at the top of the cleaning tank, a placement box is arranged inside the cleaning tank, a movable plate is arranged inside the placement box, and a driving mechanism and a lifting mechanism are arranged at the bottom of the movable plate;

[0009] The bottom end of the inner side of the base is fixedly connected with a bottom plate, the bottom end of the placement box is fixedly connected with a support plate, the driving mechanism includes a driving motor, the driving motor is fixedly connected to the top of the bottom plate, the support plate is fixedly connected to the output end of the driving motor, and the lifting mechanism includes a hydraulic cylinder, and a push plate is provided at the top of the hydraulic cylinder.

[0010] Preferably, an inner groove is provided on the inner side of the placement box, the movable plate is slidably connected to the inner side of the inner groove, an annular groove is provided on the inner side of the bottom end of the support plate, and the push plate is provided on the inner side of the annular groove.

[0011] Preferably, both sides of the top of the bottom plate are fixedly connected with guide rods, the tops of the guide rods are provided with rollers, and the rollers are arranged on the inner side of the placement box.

[0012] Preferably, a clamping mechanism is provided at the top of the placement box, a water leakage groove is provided between the placement box and the cleaning groove, and a plurality of water leakage holes are evenly provided on the inner sides of the movable plate and the support plate.

[0013] Preferably, the water spray mechanism comprises a water inlet pipe, an extension pipe is provided at the end of the water inlet pipe, a fixing block is fixedly connected to the outer side of the extension pipe, and the fixing block is provided at the top end of the movable plate.

[0014] The technical effects and advantages of the utility model are as follows: the utility model is provided with a movable plate on the inner side of the placement box, and the movable plate can move up and down on the inner side of the placement box. The wafer to be cleaned can be placed on the top of the movable plate, which is convenient for cleaning. The bottom end of the placement box is provided with a hydraulic cylinder, which can effectively push up the wafer placed on the movable plate to avoid the wafer being stuck on the inner side of the placement box, making it convenient to quickly remove the wafer, thereby improving the use effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0016] Figure 2 It is a schematic diagram of the top structure of the utility model.

[0017] Figure 3 It is a cross-sectional structural schematic diagram of the utility model.

[0018] In the figure: 1. base; 11. flip cover; 12. cleaning tank; 13. leakage tank; 2. placement box; 21. clamping mechanism; 22. inner tank; 23. support plate; 231. annular groove; 3. movable plate; 31. leakage hole; 4. water inlet pipe; 41. extension pipe; 42. fixing block; 5. bottom plate; 51. guide rod; 511. roller; 6. drive motor; 7. hydraulic cylinder; 71. push plate. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] The utility model provides Figure 1-3 A semiconductor wafer cleaning device shown includes a base 1, a top of which is provided with a flip cover 11;

[0021] A cleaning tank 12 is provided inside the top of the base 1, a water spray mechanism is provided at the top of the cleaning tank 12, a placement box 2 is provided inside the cleaning tank 12, a moving plate 3 is provided inside the placement box 2, and a driving mechanism and a lifting mechanism are provided at the bottom of the moving plate 3;

[0022] The bottom end of the inner side of the base 1 is fixedly connected with a bottom plate 5, and the bottom end of the placement box 2 is fixedly connected with a support plate 23. The driving mechanism includes a driving motor 6, and the driving motor 6 is fixedly connected to the top of the bottom plate 5. The support plate 23 is fixedly connected to the output end of the driving motor 6. The lifting mechanism includes a hydraulic cylinder 7, and a push plate 71 is arranged on the top of the hydraulic cylinder 7. The support plate 23 is fixedly connected to the bottom end of the placement box 2. The driving motor 6 drives the support plate 23 to rotate, that is, drives the placement box 2 to rotate, and then reverses after rotating 180°. The driving motor 6 drives the support plate 23 to repeat the rotation and then reverse action, so that the fixed part between the support plate 23 and the placement box 2 will not affect the rotation of the placement box 2. By arranging the hydraulic cylinder 7 and the push plate 71, the movable plate 3 can be effectively lifted up, so that the wafer arranged on the top of the movable plate 3 can be taken out, which is convenient to use.

[0023] An inner groove 22 is provided on the inner side of the placing box 2, and the movable plate 3 is slidably connected to the inner side of the inner groove 22. An annular groove 231 is provided on the inner side of the bottom end of the supporting plate 23, and the push plate 71 is provided on the inner side of the annular groove 231. By providing the inner groove 22, the wafer can be provided on the inner side of the inner groove 22 and on the top of the movable plate 3, so as to facilitate the placement of the wafer and facilitate the subsequent cleaning work.

[0024] Both sides of the top of the bottom plate 5 are fixedly connected with guide rods 51, and the top of the guide rods 51 is provided with rollers 511, and the rollers 511 are provided on the inner side of the placement box 2. By providing the guide rods 51, the placement box 2 can be effectively lifted above the bottom plate 5, and by providing the rollers 511, and the rollers 511 are provided on the inner side of the placement box 2, the placement box 2 can be effectively rotated on the top of the rollers 511;

[0025] A clamping mechanism 21 is provided at the top of the placement box 2, a drainage groove 13 is provided between the placement box 2 and the cleaning groove 12, and a plurality of drainage holes 31 are evenly provided on the inner sides of the movable disk 3 and the support plate 23. By providing the clamping mechanism 21, the wafer can be effectively limited and fixed on the inner side of the placement box 2, thereby improving the stability of the wafer during use. By providing the drainage groove 13, the cleaned water can be effectively discharged, and by providing the drainage holes 31, the water can also be discharged.

[0026] The water spraying mechanism includes a water inlet pipe 4, an extension pipe 41 is provided at the end of the water inlet pipe 4, a fixed block 42 is fixedly connected to the outer side of the extension pipe 41, the fixed block 42 is arranged at the top of the movable plate 3, a water tank and a water pump are arranged on the inner side of the base 1, the water inlet pipe 4 is arranged on the inner side of the base 1, the extension pipe 41 can slide on the inner side of the water inlet pipe 4 to adjust the position of the fixed block 42, and a nozzle is provided at the bottom end of the fixed block 42 to communicate with the extension pipe 41, so as to effectively carry out water spray cleaning work.

[0027] Working principle of the utility model: when in use, the wafer to be cleaned is placed inside the placement box 2, placed on the top of the moving plate 3, and then the clamping mechanism 21 is pressed to the outside of the wafer to limit the wafer;

[0028] The driving motor 6 is started to drive the support plate 23 to rotate, that is, to drive the placement box 2 to rotate. After rotating 180°, the driving motor 6 drives the placement box 2 to reverse. During the rotation, the water inlet pipe 4 arranged above the moving plate 3 works to spray water to clean the wafers.

[0029] After cleaning is completed, the hydraulic cylinder 7 is started to drive the push plate 71 upward, and finally the movable plate 3 is pushed out from the inner side of the inner groove 22, and the wafer is pushed out to the outside of the placement box 2 for easy removal.

[0030] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer cleaning device for semiconductor production, comprising a base (1), wherein a flip cover (11) is provided at the top of the base (1); Features: A cleaning tank (12) is arranged on the inner side of the top of the base (1), a water spraying mechanism is arranged on the top of the cleaning tank (12), a placement box (2) is arranged on the inner side of the cleaning tank (12), a moving plate (3) is arranged on the inner side of the placement box (2), and a driving mechanism and a lifting mechanism are arranged on the bottom end of the moving plate (3); The bottom end of the inner side of the base (1) is fixedly connected to a bottom plate (5), the bottom end of the placement box (2) is fixedly connected to a support plate (23), the driving mechanism comprises a driving motor (6), the driving motor (6) is fixedly connected to the top end of the bottom plate (5), the support plate (23) is fixedly connected to the output end of the driving motor (6), and the lifting mechanism comprises a hydraulic cylinder (7), the top end of the hydraulic cylinder (7) is provided with a push plate (71).

2. A semiconductor wafer cleaning device according to claim 1, characterized in that: The inner side of the placement box (2) is provided with an inner groove (22), the movable plate (3) is slidably connected to the inner side of the inner groove (22), the inner side of the bottom end of the support plate (23) is provided with an annular groove (231), and the push plate (71) is arranged on the inner side of the annular groove (231).

3. A semiconductor wafer cleaning device according to claim 2, characterized in that: Both sides of the top of the bottom plate (5) are fixedly connected with guide rods (51), and the top of the guide rods (51) is provided with rollers (511), and the rollers (511) are arranged on the inner side of the placement box (2).

4. A semiconductor wafer cleaning device according to claim 3, characterized in that: A clamping mechanism (21) is provided at the top of the placement box (2), a water leakage groove (13) is provided between the placement box (2) and the cleaning groove (12), and a plurality of water leakage holes (31) are evenly provided on the inner sides of the movable plate (3) and the support plate (23).

5. The semiconductor wafer cleaning device according to claim 4, characterized in that: The water spray mechanism comprises a water inlet pipe (4), an extension pipe (41) is arranged at the end of the water inlet pipe (4), a fixing block (42) is fixedly connected to the outer side of the extension pipe (41), and the fixing block (42) is arranged at the top end of the movable plate (3).

Images