Circuit board structure and electronic equipment

Abstract

The utility model discloses a circuit board structure and an electronic device. The circuit board structure comprises: a circuit board, which has a main body, wherein the main body is provided with a clearance area and a metal conductive layer, and the circuit board also has a radio frequency output part; a ceramic antenna, which is arranged in the clearance area, the ceramic antenna is connected to the radio frequency output part through a signal line, and the ceramic antenna is also connected to the metal conductive layer through a first grounding wire and a second grounding wire, and the first grounding wire is arranged separately from the second grounding wire; wherein the maximum length of the main body is L1, and the maximum width is W1; the maximum length of the clearance area is L2, and the maximum width is W2; the maximum length of the ceramic antenna is L3, and the maximum width is W3; and the following conditions are satisfied: L1≥35.0mm, W1≥5.0mm, 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm, 3.1mm≤L3≤3.3mm, and 1.5mm≤W3≤1.7mm.

Description

Technical Field

[0001] The utility model relates to the technical field of antennas, and in particular to a circuit board structure and electronic equipment. Background Art

[0002] With the development of the electronics industry, electronic products such as headphones, smart phones, and tablet computers have been widely used in people's daily lives; in order to meet the demand for miniaturization of related wireless electronic products, the design requirements for antennas are becoming increasingly higher.

[0003] In the related technology, traditional board-mounted antennas need to occupy a large area on the circuit board and require a high height, which makes it difficult to meet the miniaturization requirements of the product; while for ceramic antennas, their performance is related to the size of the circuit board. The smaller the circuit board area, the worse the performance of the ceramic antenna. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a circuit board structure, which can improve the performance of the ceramic antenna on the circuit board of the same area, so as to minimize the area of ​​the circuit board while ensuring the performance of the ceramic antenna, thereby making the electronic product smaller.

[0005] The utility model also provides an electronic device with the circuit board structure.

[0006] The circuit board structure according to the embodiment of the first aspect of the utility model includes: a circuit board having a main body, the main body being provided with a clearance area and a metal conductive layer, the circuit board also having a radio frequency output part; a ceramic antenna arranged in the clearance area, the ceramic antenna being connected to the radio frequency output part through a signal line, the ceramic antenna being further connected to the metal conductive layer through a first grounding line and a second grounding line, the first grounding line being arranged separately from the second grounding line;

[0007] The maximum length of the main body is L1, and the maximum width is W1; the maximum length of the clearance area is L2, and the maximum width is W2; the maximum length of the ceramic antenna is L3, and the maximum width is W3;

[0008] Meet the following requirements: L1≥35.0mm, W1≥5.0mm, 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm, 3.1mm≤L3≤3.3mm, 1.5mm≤W3≤1.7mm.

[0009] The circuit board structure according to the embodiment of the utility model has at least the following beneficial effects:

[0010] The circuit board structure of the present invention adopts the above-mentioned size design, which can maximize the performance of the ceramic antenna. In other words, the circuit board structure of the present invention can improve the performance of the ceramic antenna by designing the size of the clearance area on the circuit board of the same area, so as to minimize the area of ​​the circuit board while ensuring the performance of the ceramic antenna, thereby making the electronic device smaller. Specifically, under the premise that the size of the ceramic antenna is selected as a standard part with L3 of 3.2mm and W3 of 1.6mm, and under the premise that the size of the circuit board meets the maximum performance requirements of the ceramic antenna, the antenna performance can be improved by setting the size of the clearance area to 8.9mm≤L2≤9.1mm and 2.7mm≤W2≤2.9mm. It is understandable that if the size of the clearance area is increased, the signal transmission path from the RF output part through the signal line to the ceramic antenna and then from the ceramic antenna through the first ground line (second ground line) will become longer, resulting in a lower operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band; and if the size of the clearance area is reduced, the signal transmission path from the RF output part through the signal line to the ceramic antenna and then from the ceramic antenna through the first ground line (second ground line) will become shorter, resulting in a higher operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band. The size of the clearance area of ​​the utility model is designed to be within the above range, which can just ensure the antenna's frequency band performance between 2.4Ghz-2.5Ghz.

[0011] According to some embodiments of the utility model, the ceramic antenna is provided with solder pads at both ends along its length direction, and the solder pads are soldered to the clearance area;

[0012] Wherein, along the length direction of the ceramic antenna, the maximum width of the pad is W4, and satisfies: 0.15mm≤W4≤0.25mm.

[0013] According to some embodiments of the present invention, one of the pads is defined as a first pad, a side of the clearance area opposite to the first pad is defined as a first side, and the shortest distance between the first side and the first pad is T; satisfying: 3.4mm≤T≤3.8mm.

[0014] According to some embodiments of the present invention, the maximum diameter of the signal line is D1, which satisfies: 0.15 mm ≤ D1 ≤ 0.25 mm.

[0015] According to some embodiments of the present invention, the maximum diameter of the first grounding wire is D2, satisfying: 0.4mm≤D2≤0.6mm.

[0016] According to some embodiments of the present invention, the maximum diameter of the second grounding wire is D3, satisfying: 0.4mm≤D3≤0.6mm.

[0017] According to some embodiments of the utility model, in the length direction of the main body, the clearance area is centrally arranged; in the width direction of the main body, the clearance area is arranged sideways, and the metal conductive layer does not surround one side of the clearance area sideways.

[0018] According to some embodiments of the present invention, in the width direction of the clearance area, the ceramic antenna is arranged close to the edge, and the ceramic antenna is arranged on one side of the clearance area close to the edge.

[0019] According to some embodiments of the present invention, the ceramic antenna is a PIFA ceramic antenna.

[0020] An electronic device according to an embodiment of the second aspect of the utility model includes the circuit board structure as described above.

[0021] The electronic device according to the embodiment of the utility model has at least the following beneficial effects:

[0022] In the electronic device of the utility model, the circuit board structure adopts the above-mentioned size design, which can maximize the performance of the ceramic antenna. In other words, the circuit board structure of the utility model can improve the performance of the ceramic antenna by designing the size of the clearance area on the circuit board of the same area, so as to minimize the area of ​​the circuit board while ensuring the performance of the ceramic antenna, thereby making the electronic device smaller. Specifically, under the premise that the size of the ceramic antenna is selected as a standard part with L3 of 3.2mm and W3 of 1.6mm, and under the premise that the size of the circuit board meets the maximum performance requirements of the ceramic antenna, the antenna performance can be improved by setting the size of the clearance area to 8.9mm≤L2≤9.1mm and 2.7mm≤W2≤2.9mm. It is understandable that if the size of the clearance area is increased, the signal transmission path from the RF output part through the signal line to the ceramic antenna and then from the ceramic antenna through the first ground line (second ground line) will become longer, resulting in a lower operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band; and if the size of the clearance area is reduced, the signal transmission path from the RF output part through the signal line to the ceramic antenna and then from the ceramic antenna through the first ground line (second ground line) will become shorter, resulting in a higher operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band. The size of the clearance area of ​​the utility model is designed to be within the above range, which can just ensure the antenna's frequency band performance between 2.4Ghz-2.5Ghz.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 This is a schematic structural diagram of a circuit board structure according to an embodiment of the utility model;

[0026] Figure 2 for Figure 1 A magnified view of the local structure.

[0027] Figure Number:

[0028] 100, circuit board; 110, main body; 111, clearance area; 112, metal conductive layer;

[0029] 200, ceramic antenna; 201, signal line; 202, first ground line; 203, second ground line; 210, soldering pad. DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0031] In the description of the present utility model, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, unless otherwise specified, "multiple" means two or more.

[0032] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0033] like Figure 1 As shown, as described in the background technology, for the ceramic antenna 200, in some circuit board structures, its performance is related to the size of the circuit board 100. The smaller the area of ​​the circuit board 100, the worse the performance of the ceramic antenna 200. The reason is that the circuit board 100 is usually provided with a clearance area 111, and copper foil is laid outside the clearance area 111. The ceramic antenna 200 is arranged in the clearance area 111 and connected to the copper foil through a grounding wire. The copper foil becomes a part of the antenna and plays a role in radiating signals. For the circuit board 100, the smaller the circuit board 100 is, the smaller the area of ​​the copper foil will be, which will cause the radiation ability of the ceramic antenna 200 to deteriorate, resulting in lower performance. However, it does not mean that the larger the area of ​​the circuit board 100, the stronger the radiation performance of the ceramic antenna 200. Within a certain range, the larger the area of ​​the circuit board 100 and the larger the area of ​​the copper foil, the stronger the radiation performance of the ceramic antenna 200. However, when the area of ​​the circuit board 100 exceeds a certain range, which also makes the area of ​​the copper foil exceed a certain range, then even if the area of ​​the circuit board 100 (copper foil) is increased, the performance of the ceramic antenna 200 will not be increased.

[0034] like Figure 1 As shown, the utility model provides a circuit board structure, including a circuit board 100 and a ceramic antenna 200.

[0035] The circuit board 100 has a main body 110 , on which a clearance area 111 and a metal conductive layer 112 are provided, wherein the metal conductive layer 112 is provided around the clearance area 111 ; it can be understood that the metal conductive layer 112 is a copper foil laid on the circuit board 100 , while no copper foil is laid in the clearance area 111 .

[0036] The ceramic antenna 200 is arranged in the clearance area 111; it can be understood that by setting the ceramic antenna 200 in the clearance area 111, the interference of other circuits on the ceramic antenna 200 can be reduced, which helps to improve the receiving and transmitting performance of the ceramic antenna 200. At the same time, the clearance area 111 provides a space without other conductive materials, which can avoid the interference of other conductors near the ceramic antenna 200 with the electromagnetic field, thereby maintaining the radiation pattern and impedance characteristics of the ceramic antenna 200, which helps the antenna achieve optimal performance parameters, such as gain, bandwidth and radiation efficiency. In addition, the clearance area 111 can avoid the influence of other components on the circuit board 100 on the radiation efficiency of the ceramic antenna 200, thereby improving the overall efficiency and signal strength of the ceramic antenna 200.

[0037] In addition, the ceramic antenna 200 is also connected to the metal conductive layer 112 through the first ground wire 202 and the second ground wire 203, and the first ground wire 202 and the second ground wire 203 are separated from each other; it can be understood that the ceramic antenna 200 is connected to the metal conductive layer 112, and the metal conductive layer 112 will become a part of the antenna, playing the role of radiating signals. In addition, the ceramic antenna 200 also plays the role of grounding, which can effectively reduce electromagnetic interference, improve anti-interference ability and improve circuit safety.

[0038] Furthermore, the circuit board 100 has a radio frequency output portion, and the ceramic antenna 200 is connected to the radio frequency output portion.

[0039] It should be noted that the RF output part refers to the output end of the RF circuit on the circuit board 100, and the ceramic antenna 200 is connected to the output end of the RF circuit. The signal generated by the RF circuit can be transmitted to the ceramic antenna 200 through the RF output part and finally transmitted through the antenna.

[0040] The main body 110 has a maximum length of L1 and a maximum width of W1.

[0041] It is understandable that, specifically Figure 1 In the illustrated embodiment, the maximum length of the main body 110 is the length of the entire circuit board 100; the maximum width of the main body 110 is the width of the portion of the circuit board 100 where the clearance area 111 is provided; when measuring L1, the longest part of the main body 110 can be measured by using a vernier caliper; when measuring W1, the widest part of the main body 110 can be measured by using a vernier caliper.

[0042] Among them: L1≥35.0mm, W1≥5.0mm; specifically, the value of L1 can be 35.0mm, 36.0mm, 37.0mm, 38.0mm, 39.5mm or 40.0mm, and the value of W1 can be 5.0mm, 6.0mm or 7.0mm.

[0043] like Figure 2 As shown, further, the maximum length of the clearance area 111 is L2, and the maximum width is W2.

[0044] It can be understood that the clearance area 111 is a rectangular structure. When measuring L2, the longest part of the clearance area 111 can be measured by a vernier caliper; when measuring W2, the widest part of the clearance area 111 can be measured by a vernier caliper.

[0045] It should be noted that the length direction of the clearance area 111 is the same as the length direction of the main body 110 , and the width direction of the clearance area 111 is the same as the width direction of the main body 110 .

[0046] Among them, 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm; specifically, the value of L2 can be 8.9mm, 9.0mm or 9.1mm, and the value of W2 can be 2.7mm, 2.8mm or 2.9mm.

[0047] It should be noted that, when the size of the clearance area 111 takes the above value, the size of the main body 110 is selected according to L1≥35.0mm, W1≥5.0mm, so that the area of ​​the metal conductive layer 112 is large enough to meet the greater performance requirements of the ceramic antenna 200.

[0048] Furthermore, the maximum length of the ceramic antenna 200 is L3, and the maximum width is W3.

[0049] It is understandable that the ceramic antenna 200 is a rectangular structure. When measuring L3, the longest part of the ceramic antenna 200 can be measured by using a vernier caliper; when measuring W3, the widest part of the ceramic antenna 200 can be measured by using a vernier caliper.

[0050] It should be noted that the length direction of the ceramic antenna 200 is the same as the length direction of the clearance area 111 , and the width direction of the ceramic antenna 200 is the same as the width direction of the clearance area 111 .

[0051] Among them, 3.1 mm ≤ L3 ≤ 3.3 mm, 1.5 mm ≤ W3 ≤ 1.7 mm. Specifically, the value of L3 may be 3.1 mm, 3.2 mm or 3.3 mm, and the value of W3 may be 1.5 mm, 1.6 mm or 1.7 mm.

[0052] It should be noted that the size L3 of the ceramic antenna 200 is 3.2 mm, and W3 is 1.6 mm, which are currently standard parts. The circuit board structure of the present invention uses the standard ceramic antenna 200 with the size L3 of 3.2 mm and W3 of 1.6 mm.

[0053] The circuit board structure of the present invention adopts the above-mentioned size design, which can maximize the performance of the ceramic antenna 200. In other words, the circuit board structure of the present invention can improve the performance of the ceramic antenna 200 by designing the size of the clearance area 111 on the circuit board 100 of the same area, so as to minimize the area of ​​the circuit board 100 while ensuring the performance of the ceramic antenna 200, thereby making the electronic device smaller. Specifically, under the premise that the size of the ceramic antenna 200 is selected as a standard part with L3 of 3.2mm and W3 of 1.6mm, and under the premise that the size of the circuit board 100 meets the maximum performance requirements of the ceramic antenna 200, the antenna performance can be improved by setting the size of the clearance area 111 to 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm. It can be understood that if the size of the clearance area 111 is increased, the signal transmission path transmitted from the RF output part through the signal line 201 to the ceramic antenna 200 and then from the ceramic antenna 200 through the first ground line (the second ground line 203) will become longer, resulting in a lower operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band; and if the size of the clearance area 111 is reduced, the signal transmission path transmitted from the RF output part through the signal line 201 to the ceramic antenna 200 and then from the ceramic antenna 200 through the first ground line (the second ground line 203) will become shorter, resulting in a higher operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band. The size of the clearance area 111 of the utility model is designed to be within the above range, which can just ensure the antenna's frequency band performance between 2.4Ghz-2.5Ghz.

[0054] Combination Figure 1 and Figure 2 It should be noted that in the length direction of the main body 110, the clearance area 111 is arranged in the center, and in the width direction of the main body 110, the clearance area 111 is arranged on the side, and the metal conductive layer 112 does not surround the side of the clearance area 111. In this way, the ceramic antenna 200 is arranged in the clearance area 111, and the conductive material around the ceramic antenna 200 is more evenly distributed beside the ceramic antenna 200, and the signal radiated by the metal conductive layer 112 is more uniform.

[0055] Further, in the width direction of the clearance area 111, the ceramic antenna 200 is arranged sideways, and the ceramic antenna 200 is arranged on one side of the clearance area 111. It can be understood that when the ceramic antenna 200 is arranged sideways, it can contact the external space more directly, reducing the signal attenuation caused by the circuit board 100 material and other components, which helps to improve the efficiency of the antenna, enabling it to transmit and receive signals more effectively.

[0056] In some embodiments, the ceramic antenna 200 is provided with solder pads 210 at both ends along its length direction, and the solder pads 210 are welded to the clearance area 111; in addition, the signal line 201, the first ground line 202 and the second ground line 203 are all connected to the solder pads 210, thereby achieving electrical connection with the ceramic antenna 200.

[0057] like Figure 2 As shown, along the length direction of the ceramic antenna 200, the maximum width of the pad 210 is W4, which satisfies 0.15 mm ≤ W4 ≤ 0.25 mm. Specifically, the value of W4 can be 0.15 mm, 0.20 mm or 0.25 mm.

[0058] It can be understood that the pad 210 is a rectangular structure, and when measuring W4, the widest part of the ceramic antenna 200 can be measured by using a vernier caliper.

[0059] It should be noted that the width direction of the pad 210 is the same as the length direction of the clearance area 111 .

[0060] Further, one of the pads 210 is defined as a first pad, the side of the clearance area 111 opposite to the first pad is defined as a first side, and the shortest distance between the first side and the first pad 210 is T; and the following conditions are satisfied: 3.4 mm ≤ T ≤ 3.8 mm. Specifically, the value of T may be 3.4 mm, 3.5 mm, 3.6 mm, 3.7 mm, or 3.8 mm.

[0061] It can be understood that when measuring T, the narrowest point between the first pad 210 and the first side of the clearance area 111 can be measured by using a vernier caliper.

[0062] like Figure 2 As shown, in some embodiments, the maximum diameter of the signal line 201 is D1, which satisfies: 0.15 mm ≤ D1 ≤ 0.25 mm. Specifically, the value of D1 can be 0.15 mm, 0.20 mm or 0.25 mm.

[0063] Furthermore, the maximum diameter of the first grounding wire 202 is D2, which satisfies: 0.4 mm≤D2≤0.6 mm. Specifically, the value of D2 may be 0.4 mm, 0.5 mm or 0.5 mm.

[0064] Furthermore, the maximum diameter of the second grounding wire 203 is D3, 0.4 mm≤D3≤0.6 mm. Specifically, the value of D3 may be 0.4 mm, 0.5 mm or 0.5 mm.

[0065] It should be noted that the wire diameters of the signal wire 201, the first ground wire 202 and the second ground wire 203 are designed according to the above requirements, which can reduce the influence of various wires themselves (all conductive wires) on the antenna signal while ensuring a certain tensile effect.

[0066] It should be noted that the routing of the signal line 201 , the first ground line 202 and the second ground line 203 are all straight lines, so that branches, corners and right angles can be avoided to reduce signal reflection and loss.

[0067] It should be noted that the ceramic antenna 200 in the above embodiments may be a PIFA ceramic antenna 200 (inverted-F ceramic antenna 200).

[0068] After the circuit board structure of the present invention is designed according to the above dimensions, experiments have shown that the antenna has better performance in the 2.4Ghz-2.5Ghz frequency band, wherein the efficiency and gain of the antenna in the 2.4Ghz-2.5Ghz frequency band are specifically shown in the following table.

[0069] Frequency (Mhz) efficiency(%) Gain(dBi) 2400 53.8 0.18 2410 58.0 0.20 2420 61.5 0.36 2430 63.0 0.67 2440 64.9 0.87 2450 65.6 0.73 2460 64.3 0.91 2470 63.2 0.91 2480 58.2 0.79 2490 52.8 0.47 2500 49.9 -0.02

[0070] The utility model also provides an electronic device, comprising the circuit board structure of each of the above embodiments.

[0071] In the electronic device of the present invention, the circuit board structure adopts the above-mentioned size design, which can maximize the performance of the ceramic antenna 200. In other words, the circuit board structure of the present invention can improve the performance of the ceramic antenna 200 by designing the size of the clearance area 111 on the circuit board 100 of the same area, so as to minimize the area of ​​the circuit board 100 while ensuring the performance of the ceramic antenna 200, thereby making the electronic device smaller. Specifically, under the premise that the size of the ceramic antenna 200 is selected as a standard part with L3 of 3.2mm and W3 of 1.6mm, and under the premise that the size of the circuit board 100 meets the maximum performance requirements of the ceramic antenna 200, the antenna performance can be improved by setting the size of the clearance area 111 to 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm. It can be understood that if the size of the clearance area 111 is increased, the signal transmission path transmitted from the RF output part through the signal line 201 to the ceramic antenna 200 and then from the ceramic antenna 200 through the first ground line (the second ground line 203) will become longer, resulting in a lower operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band; and if the size of the clearance area 111 is reduced, the signal transmission path transmitted from the RF output part through the signal line 201 to the ceramic antenna 200 and then from the ceramic antenna 200 through the first ground line (the second ground line 203) will become shorter, resulting in a higher operating frequency (relative to 2.4Ghz-2.5Ghz), resulting in poor performance in the 2.4Ghz-2.5Ghz frequency band. The size of the clearance area 111 of the utility model is designed to be within the above range, which can just ensure the antenna's frequency band performance between 2.4Ghz-2.5Ghz.

[0072] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A circuit board structure, characterized in that: include: A circuit board, comprising a main body, wherein the main body is provided with a clearance area and a metal conductive layer, and the circuit board also comprises a radio frequency output part; A ceramic antenna is arranged in the clearance area, the ceramic antenna is connected to the RF output unit through a signal line, and the ceramic antenna is also connected to the metal conductive layer through a first grounding line and a second grounding line, and the first grounding line is arranged separately from the second grounding line; The maximum length of the main body is L1, and the maximum width is W1; the maximum length of the clearance area is L2, and the maximum width is W2; the maximum length of the ceramic antenna is L3, and the maximum width is W3; Meet the following requirements: L1≥35.0mm, W1≥5.0mm, 8.9mm≤L2≤9.1mm, 2.7mm≤W2≤2.9mm, 3.1mm≤L3≤3.3mm, 1.5mm≤W3≤1.7mm.

2. The circuit board structure according to claim 1, characterized in that: The ceramic antenna is provided with soldering pads at both ends along the length direction thereof, and the soldering pads are soldered to the clearance area; Wherein, along the length direction of the ceramic antenna, the maximum width of the pad is W4, and satisfies: 0.15mm≤W4≤0.25mm.

3. The circuit board structure according to claim 2, characterized in that: One of the pads is defined as a first pad, a side of the clearance area opposite to the first pad is defined as a first side, and the shortest distance between the first side and the first pad is T; satisfying: 3.4 mm ≤ T ≤ 3.8 mm.

4. The circuit board structure according to claim 1, characterized in that: The maximum diameter of the signal line is D1, which satisfies: 0.15 mm ≤ D1 ≤ 0.25 mm.

5. The circuit board structure according to claim 1, characterized in that: The maximum diameter of the first grounding wire is D2, which satisfies: 0.4 mm ≤ D2 ≤ 0.6 mm.

6. The circuit board structure according to claim 1, characterized in that: The maximum diameter of the second grounding wire is D3, which satisfies: 0.4 mm ≤ D3 ≤ 0.6 mm.

7. The circuit board structure according to any one of claims 1 to 6, characterized in that: In the length direction of the main body, the clearance area is centrally arranged; in the width direction of the main body, the clearance area is arranged close to the edge, and the metal conductive layer does not surround the side of the clearance area close to the edge.

8. The circuit board structure according to claim 7, characterized in that: In the width direction of the clearance area, the ceramic antenna is arranged close to the edge, and the ceramic antenna is arranged on one side of the clearance area close to the edge.

9. The circuit board structure according to any one of claims 1 to 6, characterized in that: The ceramic antenna is a PIFA ceramic antenna.

10. An electronic device, characterized in that: It comprises the circuit board structure as claimed in any one of claims 1 to 9.

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