Head mounted display device

Abstract

The utility model belongs to the field of head-mounted display, and particularly relates to a head-mounted display device, including a shell, a mainboard assembly and a centrifugal fan, wherein a first heat dissipation port and a second heat dissipation port are respectively arranged at the first air outlet and the second air outlet of the shell corresponding to the centrifugal fan, and an air inlet is arranged at the side of the shell away from the first air outlet and the second air outlet; the utility model also includes a first heat sink arranged between the first air outlet and the first heat dissipation port, a second heat sink arranged between the second air outlet and the second heat dissipation port, and a heat conduction structure arranged between the mainboard assembly and the first heat sink and the second heat sink, and heat dissipation airways are respectively arranged on the first heat sink and the second heat sink. Heat is conducted to the first heat sink and the second heat sink by the heat conduction structure, and the centrifugal fan can blow out the heat of the first heat sink from the first heat dissipation port and the heat of the second heat sink from the second heat dissipation port, thereby solving the problem of poor heat dissipation effect of the existing head-mounted display device.

Description

Technical Field

[0001] The utility model belongs to the field of head-mounted display, and in particular relates to a head-mounted display device. Background Art

[0002] At present, VR head-mounted display devices, AR head-mounted display devices and MR head-mounted display devices are important consumer electronic products in the field of human-computer interaction, and have broad development prospects in games, social networking and industrial applications. With the development of technology and the improvement of user needs, head-mounted display devices have more and more functions, requiring the computing power and rendering power of the SOC chip of head-mounted display devices to gradually increase, resulting in a significant increase in power consumption and a large amount of heat.

[0003] Existing head-mounted display devices mainly dissipate heat through the combination of centrifugal fans and radiators, but the heat dissipation efficiency is relatively low, resulting in excessive temperature rise of the head-mounted display device, which seriously affects user use. Utility Model Content

[0004] The utility model aims to provide a head mounted display device, aiming to solve the problem of poor heat dissipation effect of the existing head mounted display device.

[0005] The utility model discloses a head mounted display device, which comprises a shell, a mainboard component fixedly mounted inside a cavity formed by the shell, and further comprises

[0006] a centrifugal fan, fixedly mounted inside the cavity formed by the shell and electrically connected to the mainboard assembly, the centrifugal fan being provided with a first air outlet and a second air outlet; a first heat dissipation outlet and a second heat dissipation outlet are respectively provided at locations of the shell corresponding to the first air outlet and the second air outlet, and an air inlet is provided at a side of the shell away from the first air outlet and the second air outlet;

[0007] The heat dissipation structure comprises a first heat sink arranged between the first air outlet and the first heat dissipation port, and a second heat sink arranged between the second air outlet and the second heat dissipation port, wherein the first heat sink and the second heat sink are respectively provided with heat dissipation air ducts for the air blown out by the centrifugal fan to pass through;

[0008] and a heat-conducting structure, which is arranged between the mainboard assembly and the first heat sink and the second heat sink.

[0009] As an improvement, the first heat sink and the second heat sink respectively include a rectangular tube body, the rectangular tube body encloses the heat dissipation air channel, and the heat conductive structure is attached to the side surface of the outer side of the rectangular tube body.

[0010] As an improvement, the first radiator and the second radiator further include a plurality of partitions arranged inside the rectangular tube body, the plurality of partitions extending along the axial direction of the rectangular tube body, and the plurality of partitions are arranged in sequence at intervals along the axial direction vertical to the rectangular tube body.

[0011] As an improvement, the cross-section of the rectangular tube body is a rectangle, the side of the rectangular tube body 1 corresponding to the long side of the rectangle is a wide side, and the side of the rectangular tube body corresponding to the short side of the rectangle is a narrow side; each of the partitions is connected between the wide sides on both sides of the rectangular tube body, and multiple partitions are arranged between the narrow sides on both sides of the rectangular tube body; the heat-conducting structure is attached to the wide side of one side of the rectangular tube body.

[0012] As an improvement, a first air guide cover is connected between the first heat sink and the first heat dissipation port, and a second air guide cover is connected between the second heat sink and the second heat dissipation port.

[0013] As an improvement, the heat-conducting structure includes a first heat-conducting member arranged between the mainboard assembly and the first heat sink, and a second heat-conducting member arranged between the mainboard assembly and the second heat sink.

[0014] As an improvement, the second heat conducting member is connected to the first heat sink and then to the second heat sink.

[0015] As an improvement, a heat collecting plate is attached to the mainboard assembly, and the first heat conducting member and the second heat conducting member are attached to the heat collecting plate respectively.

[0016] As an improvement, two centrifugal fans are provided, namely a first centrifugal fan and a second centrifugal fan which are arranged at intervals along the left-right direction inside the cavity enclosed by the outer shell. The heat dissipation structure is provided at the first centrifugal fan and the second centrifugal fan respectively, and the heat conductive structure is provided between the heat dissipation structure on the side corresponding to the mainboard assembly and the first centrifugal fan and the heat dissipation structure on the side corresponding to the second centrifugal fan respectively.

[0017] As an improvement, the first heat dissipation port is arranged at the upper part of the shell, the air inlet is arranged at the lower part of the shell, and the second heat dissipation port is arranged at the side part of the shell.

[0018] Due to the adoption of the above-mentioned technical scheme, the head-mounted display device of the utility model includes a shell, a mainboard assembly fixedly installed inside a cavity surrounded by the shell, and a centrifugal fan fixedly installed inside the cavity surrounded by the shell and electrically connected to the mainboard assembly, the centrifugal fan is provided with a first air outlet and a second air outlet, a first heat dissipation outlet and a second heat dissipation outlet are respectively provided at the first air outlet and the second air outlet of the shell, and an air inlet is provided at a side of the shell away from the first air outlet and the second air outlet; it also includes a heat dissipation structure, the heat dissipation structure includes a first radiator arranged between the first air outlet and the first heat dissipation outlet, a second radiator arranged between the second air outlet and the second heat dissipation outlet, and heat dissipation air ducts for air blown out by the centrifugal fan to pass through are respectively provided on the first radiator and the second radiator; and a heat conducting structure, which is arranged between the mainboard assembly and the first radiator and the second radiator.

[0019] During operation, the heat generated by the mainboard assembly is conducted to the first radiator and the second radiator by the heat-conducting structure, and the centrifugal fan blows out air from the first air outlet and the second air outlet respectively. Since the first radiator and the second radiator are respectively provided with heat dissipation air ducts for the air blown out by the centrifugal fan to pass through, the heat conducted to the first radiator can be directly blown out from the first heat dissipation outlet, and the heat conducted to the second radiator can be directly blown out from the second heat dissipation outlet, thereby increasing the heat dissipation path and preventing the air blown out by the centrifugal fan from generating turbulence at the first radiator and the second radiator and dissipating the heat to the inside of the cavity surrounded by the outer shell, thereby improving the heat dissipation effect and solving the problem of poor heat dissipation effect of existing head-mounted display devices. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the internal structure of the head mounted display device of the present utility model;

[0021] Figure 2 It is a three-dimensional structural schematic diagram of a radiator of a head-mounted display device of the present invention;

[0022] Among them, 10, shell; 11, first heat dissipation port; 12, second heat dissipation port; 13, air inlet; 20, SoC chip; 30a, first centrifugal fan; 30b, second centrifugal fan; 31, first air outlet; 32, second air outlet; 40a, first radiator; 40b, second radiator; 41, rectangular tube; 42, partition; 43, air distribution channel; 51, first heat conducting member; 52, second heat conducting member; 53, heat collecting plate; 60, first air guide cover; 70, second air guide cover. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0024] Figure 1 and Figure 2 : is a schematic diagram of the structure of the head mounted display device of the utility model, wherein: Figure 1 The figure shows the internal structure of the head mounted display device of the present invention. Figure 2 The figure shows a three-dimensional structural schematic diagram of the heat sink of the head mounted display device of the present invention. For the convenience of description, only the parts related to the present invention are shown in the figure.

[0025] It should be noted that the directional indications involved in the present invention (such as up, down, front, back, etc.) are only used to explain the relative position relationship between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly; if the descriptions of "first", "second", etc. involved in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated.

[0026] Depend on Figure 1 and Figure 2 It can be seen that the head mounted display device of the present invention includes a housing 10, a mainboard assembly fixedly mounted inside a cavity formed by the housing 10, and also includes

[0027] A centrifugal fan is fixedly installed inside the cavity formed by the housing 10 and is electrically connected to the mainboard assembly. The centrifugal fan is provided with a first air outlet 31 and a second air outlet 32. A first heat dissipation port 11 and a second heat dissipation port 12 are respectively provided at locations of the housing 10 corresponding to the first air outlet 31 and the second air outlet 32. An air inlet 13 is also provided at a side of the housing 10 away from the first air outlet 31 and the second air outlet 32.

[0028] The heat dissipation structure includes a first heat sink 40a disposed between the first air outlet 31 and the first heat dissipation port 11, and a second heat sink 40b disposed between the second air outlet 32 ​​and the second heat dissipation port 12, wherein heat dissipation air ducts for the air blown out by the centrifugal fan to pass through are respectively provided on the first heat sink 40a and the second heat sink 40b;

[0029] And a heat-conducting structure is disposed between the mainboard assembly and the first heat sink 40a and the second heat sink 40b, and is used to conduct the heat generated by the mainboard assembly to the first heat sink 40a and the second heat sink 40b.

[0030] During operation, the heat generated by the mainboard assembly is conducted to the first radiator 40a and the second radiator 40b by the heat-conducting structure, and the centrifugal fan blows out air from the first air outlet 31 and the second air outlet 32 ​​respectively. Since the first radiator 40a and the second radiator 40b are respectively provided with heat dissipation air ducts for the air blown out by the centrifugal fan to pass through, the heat conducted to the first radiator 40a can be directly blown out from the first heat dissipation port 11, and the heat conducted to the second radiator 40b can be directly blown out from the second heat dissipation port 12, thereby increasing the heat dissipation path and preventing the air blown out by the centrifugal fan from generating turbulence at the first radiator 40a and the second radiator 40b and dissipating the heat to the inside of the cavity surrounded by the shell 10, thereby improving the heat dissipation effect. The head-mounted display device of the utility model solves the problem of poor heat dissipation effect of the existing head-mounted display device.

[0031] In the present utility model, if Figure 2 As shown, the first heat sink 40 a and the second heat sink 40 b respectively include a rectangular tube body 41 , the rectangular tube body 41 encloses a heat dissipation air channel, and the heat conduction structure is attached to the side surface of the outer side of the rectangular tube body 41 .

[0032] Specifically, the first radiator 40a and the second radiator 40b also include a plurality of partitions 42 arranged inside the rectangular tube body 41, and the plurality of partitions 42 extend along the axial direction of the rectangular tube body 41 respectively, and the plurality of partitions 42 are arranged in sequence at intervals along the axial direction vertical to the rectangular tube body 41, so as to divide the heat dissipation air channel surrounded by the rectangular tube body 41 into a plurality of branch air channels 43, thereby increasing the contact area between the air and the first radiator 40a / the second radiator 40b, and further improving the heat dissipation effect.

[0033] Generally, the cross section of the rectangular tube body 41 is a rectangle, the side of the rectangular tube body 41 corresponding to the long side of the rectangle is the wide side, and the side of the rectangular tube body 41 corresponding to the short side of the rectangle is the narrow side; each partition 42 is connected between the wide sides of the two sides of the rectangular tube body 41, and multiple partitions 42 are arranged between the narrow sides of the two sides of the rectangular tube body 41; the heat conduction structure is attached to the wide side of one side of the rectangular tube body 41. Since there are many parts and limited space inside the cavity surrounded by the shell 10, the first radiator 40a and the second radiator 40b are arranged in a flat shape, which is not only convenient for arranging the first radiator 40a and the second radiator 40b inside the cavity surrounded by the shell 10, but also convenient for connecting the first radiator 40a and the second radiator 40b to the first air outlet 31 and the second air outlet 32 ​​of the centrifugal fan respectively.

[0034] In some other embodiments, the first radiator 40a and the second radiator 40b may also be directly configured as rectangular solid plates, with multiple through holes penetrating the solid plates on the long sides thereof, and each through hole forms a heat dissipation air channel.

[0035] In the utility model, in order to facilitate blowing the air passing through the first radiator 40a out from the first heat dissipation port 11 and blowing the air passing through the second radiator 40b out from the second heat dissipation port 12, a first air guide cover 60 is connected between the first radiator 40a and the first heat dissipation port 11, and a second air guide cover 70 is connected between the second radiator 40b and the second heat dissipation port 12. The first air guide cover 60 can be used to enhance the sealing performance at the first heat dissipation port 11, and the second air guide cover 70 can be used to enhance the sealing performance at the second heat dissipation port 12, so as to prevent hot air from leaking into the cavity surrounded by the shell 10 again.

[0036] Usually, the first air guide cover 60 and the second air guide cover 70 are made of materials such as plastic and rubber, which are convenient for connection and sealing.

[0037] In the present invention, the heat conduction structure includes a first heat conduction member 51 disposed between the mainboard assembly and the first heat sink 40 a , and a second heat conduction member 52 disposed between the mainboard assembly and the second heat sink 40 b .

[0038] Furthermore, the second heat conducting member 52 is connected to the first heat sink 40a and then to the second heat sink 40b.

[0039] Specifically, a heat collecting plate 53 is attached to the mainboard assembly, and the first heat conducting member 51 and the second heat conducting member 52 are attached to the heat collecting plate 53 respectively. Since the SoC chip 20 of the mainboard assembly is the main heat source, the heat collecting plate 53 is attached to the SoC chip 20 .

[0040] Typically, the first heat conducting member 51 and the second heat conducting member 52 are heat pipes. Of course, the first heat conducting member 51 and the second heat conducting member 52 may also be metal heat conducting strips.

[0041] In the utility model, two centrifugal fans are provided, namely a first centrifugal fan 30a and a second centrifugal fan 30b which are arranged at intervals along the left and right directions inside the cavity surrounded by the outer shell 10. Heat dissipation structures are respectively provided at the first centrifugal fan 30a and the second centrifugal fan 30b, and heat conducting structures are respectively provided between the mainboard assembly and the heat dissipation structure corresponding to the first centrifugal fan 30a and the heat dissipation structure corresponding to the second centrifugal fan 30b. That is, the heat generated by the SoC chip 20 is conducted to the heat dissipation structure at the first centrifugal fan 30a and the heat dissipation structure at the second centrifugal fan 30b by two groups of heat conducting structures, which can further enhance the heat dissipation effect.

[0042] like Figure 1 As shown, the first heat dissipation outlet 11 is disposed at the upper portion of the housing 10 , the air inlet 13 is disposed at the lower portion of the housing 10 , and the second heat dissipation outlet 12 is disposed at the side portion of the housing 10 .

[0043] Specifically, the first air outlet 31 of the first centrifugal fan 30a and the first air outlet 31 of the second centrifugal fan 30b are arranged toward the upper part of the outer shell 10, the second air outlet 32 ​​of the first centrifugal fan 30a is arranged toward the side of the left side of the outer shell 10, and the second air outlet 32 ​​of the second centrifugal fan 30b is arranged toward the side of the right side of the outer shell 10; first heat dissipation outlets 11 are respectively arranged at the upper part of the outer shell 10 corresponding to the first air outlet 31 of the first centrifugal fan 30a and the first air outlet 31 of the second centrifugal fan 30b, and second heat dissipation outlets 12 are respectively arranged at the side of the left side of the outer shell 10 corresponding to the second air outlet 32 ​​of the first centrifugal fan 30a and the side of the right side of the outer shell 10 corresponding to the second air outlet 32 ​​of the second centrifugal fan 30b.

[0044] The above descriptions are only some embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A head mounted display device, comprising a housing and a mainboard assembly fixedly mounted inside a cavity formed by the housing, characterized in that: Also includes a centrifugal fan, fixedly mounted inside the cavity formed by the shell and electrically connected to the mainboard assembly, the centrifugal fan being provided with a first air outlet and a second air outlet; a first heat dissipation outlet and a second heat dissipation outlet are respectively provided at locations of the shell corresponding to the first air outlet and the second air outlet, and an air inlet is provided at a side of the shell away from the first air outlet and the second air outlet; The heat dissipation structure comprises a first heat sink arranged between the first air outlet and the first heat dissipation port, and a second heat sink arranged between the second air outlet and the second heat dissipation port, wherein the first heat sink and the second heat sink are respectively provided with heat dissipation air ducts for the air blown out by the centrifugal fan to pass through; and a heat-conducting structure, which is arranged between the mainboard assembly and the first heat sink and the second heat sink.

2. The head mounted display device according to claim 1, characterized in that: The first radiator and the second radiator respectively include a rectangular tube body, the rectangular tube body surrounds the heat dissipation air channel, and the heat conduction structure is attached to the side surface of the outer side of the rectangular tube body.

3. The head mounted display device according to claim 2, characterized in that: The first radiator and the second radiator further include a plurality of partitions arranged inside the rectangular tube body, the plurality of partitions extending along the axial direction of the rectangular tube body, and the plurality of partitions being arranged in sequence and spaced apart in a direction perpendicular to the axial direction of the rectangular tube body.

4. The head mounted display device according to claim 3, characterized in that: The cross-section of the rectangular tube body is a rectangle, the side of the rectangular tube body corresponding to the long side of the rectangle is the wide side, and the side of the rectangular tube body corresponding to the short side of the rectangle is the narrow side; each of the partitions is connected between the wide sides on both sides of the rectangular tube body, and multiple partitions are arranged between the narrow sides on both sides of the rectangular tube body; the heat-conducting structure is attached to the wide side of one side of the rectangular tube body.

5. The head mounted display device according to claim 1, characterized in that: A first air guide cover is connected between the first heat sink and the first heat dissipation port, and a second air guide cover is connected between the second heat sink and the second heat dissipation port.

6. The head mounted display device according to claim 1, characterized in that: The heat-conducting structure includes a first heat-conducting member arranged between the mainboard assembly and the first heat sink, and a second heat-conducting member arranged between the mainboard assembly and the second heat sink.

7. The head mounted display device according to claim 6, characterized in that: The second heat conducting member is connected to the first heat sink and then to the second heat sink.

8. The head mounted display device according to claim 6, characterized in that: A heat collecting plate is attached to the mainboard assembly, and the first heat conducting member and the second heat conducting member are attached to the heat collecting plate respectively.

9. The head mounted display device according to any one of claims 1 to 8, characterized in that: The centrifugal fans are provided with two, namely a first centrifugal fan and a second centrifugal fan which are arranged at intervals along the left-right direction inside the cavity surrounded by the outer shell. The heat dissipation structure is provided at the first centrifugal fan and the second centrifugal fan respectively, and the heat conductive structure is provided between the heat dissipation structure on the side corresponding to the mainboard assembly and the first centrifugal fan and the heat dissipation structure on the side corresponding to the second centrifugal fan respectively.

10. The head mounted display device according to claim 9, characterized in that: The first heat dissipation port is arranged at the upper part of the housing, the air inlet port is arranged at the lower part of the housing, and the second heat dissipation port is arranged at the side part of the housing.

Images