A sensor device

Abstract

The utility model relates to the field of semiconductor light emitting technology, and discloses a sensor device, which includes a substrate, a receiving portion, an optical chip, a first light-transmitting adhesive layer, a high-reflective adhesive layer, and a second light-transmitting adhesive layer. The receiving portion is arranged on the substrate, and includes at least two cavity structures. The optical chip is arranged on the substrate and in the cavity structure. At least one optical chip is arranged in the cavity structure. The first light-transmitting adhesive layer is arranged in the cavity structure and covers the optical chip, and the side of the first light-transmitting adhesive layer is arranged as a reflective surface for reflecting edge large-angle light. The high-reflective adhesive layer covers the reflective surface or covers the reflective surface and the side of the optical chip. The second light-transmitting adhesive layer tightly covers the side of the first light-transmitting adhesive layer away from the optical chip, and is used to further optically shape the light. The utility model improves the utilization rate of light energy and the accuracy of light reaching a preset angle by setting a double-layer lens structure, so that the detection accuracy and reaction speed of the sensor device are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is composed of at least two optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system and irradiates the object to be measured. The light beam reflected or absorbed by the object passes through the optical system and irradiates the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and then output.

[0003] Existing sensor devices only cover the outside of the optical chip with a layer of light-transmitting adhesive for packaging. It does not have an optical shaping function and has problems such as low light energy utilization, poor light control effect, and low accuracy.

[0004] Based on the above, a sensor device with high light energy utilization rate, precise light control and high detection accuracy is currently needed. Utility Model Content

[0005] The utility model aims to provide a sensor device, aiming to solve the problems of low light energy utilization rate, poor light control effect and low detection accuracy of the sensor device in the prior art.

[0006] The utility model is implemented as follows: a sensor device comprises:

[0007] substrate;

[0008] A receiving portion, which is arranged on the substrate, and includes at least two cavity structures;

[0009] An optical chip is disposed on the substrate and in the cavity structure, and at least one optical chip is disposed in the cavity structure;

[0010] A first light-transmitting adhesive layer is disposed in the cavity structure and covers the optical chip, and a side surface of the first light-transmitting adhesive layer is configured as a reflective surface for reflecting edge large-angle light;

[0011] A high-reflective adhesive layer covers the reflective surface or covers the reflective surface and the side surface of the optical chip.

[0012] A second light-transmitting adhesive layer, which tightly covers a side of the first light-transmitting adhesive layer away from the optical chip, and is used to further optically shape the light;

[0013] The second light-transmitting adhesive layer only covers the upper surface of the first light-transmitting adhesive layer, and there is a space between the second light-transmitting adhesive layer and the inner side surface of the cavity structure.

[0014] Furthermore, the upper surface of the first light-transmitting adhesive layer is configured to be a flat surface or a curved surface.

[0015] Furthermore, the upper surface of the second light-transmitting adhesive layer is configured to be a flat surface or a curved surface.

[0016] Furthermore, a light-transmitting hole or a lens is provided on a side of the cavity structure away from the substrate corresponding to the first light-transmitting adhesive layer.

[0017] Furthermore, the lens is a convex lens, a concave lens or a plane lens.

[0018] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0019] The utility model sequentially adheres the first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 8 to the optical chip 3, and the first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 8 form a "double-layer lens" structure, and adjusts the light by using the principle of different refractive indices of the first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 8 to emit and refraction. The performance of the entire system is further improved, the light extraction rate is high, and precise light control is achieved.

[0020] In summary, by setting up a double-layer lens structure, the utilization rate of light energy is improved, the accuracy of light reaching a preset angle is improved, and the detection accuracy and reaction speed of the sensor device are improved. At the same time, the utility model has a simple and reasonable structure and high reliability; it is small in size and easy to design optically. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0022] Figure 2 It is a schematic cross-sectional structure diagram of another sensor device provided by the utility model;

[0023] In the figure: 1-substrate; 2-receiving part; 21-cavity structure; 3-optical chip; 4-first light-transmitting adhesive layer; 41-reflecting surface; 5-light-transmitting hole; 6-lens; 7-high-reflective adhesive layer; 8-second light-transmitting adhesive layer. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0026] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] Reference Figure 1-2 As shown, it is a preferred embodiment provided by the utility model.

[0028] A sensor device, referring to Figure 1-2 , including a substrate 1, a receiving portion 2, an optical chip 3, a first light-transmitting adhesive layer 4, a highly reflective adhesive layer 7 and a second light-transmitting adhesive layer 8. The receiving portion 2 is arranged on the substrate 1, and it includes at least two cavity structures 21. The cavity structure 21 is used to accommodate the optical chip 3 and light propagation. The optical chip 3 is arranged in the cavity structure 21 on the substrate 1, and each cavity structure 21 is provided with at least one optical chip 3. The utility model is only described by taking two cavity structures 21 corresponding to two optical chips 3 as an example, and three or more cavity structures 21 can also be arranged as needed, and multiple optical chips 3 can be accommodated in each cavity structure 21, and multiple optical chips 3 are regularly displayed or irregularly arrayed in the cavity structure 21. The above situations are all within the concept of the utility model.

[0029] The optical chip 3 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The sensor device of the utility model integrates a light-emitting chip for emitting light. When the emitted light is incident on the object to be detected or the object to be sensed, reflection occurs. The emitted light is incident on the photosensitive area of ​​the photosensitive chip and is received. The photosensitive chip converts the optical signal into an electrical signal, thereby making corresponding feedback. In order to prevent the emitted light and the received light of the light-emitting chip and the photosensitive chip from interfering with each other and preventing crosstalk, the receiving part 2 can be set as a light-absorbing part of an opaque material (such as black glue). According to the different functional requirements of different application scenarios, the receiving part 2 can also be set to be made of a translucent material. There is no limit on the height of the receiving part 2.

[0030] In order to improve light extraction, the optical chip 3 is coated with a first light-transmitting adhesive layer 4. The first light-transmitting adhesive layer 4 can be set to cover only the upper surface of the optical chip 3; it can also be set to cover the upper surface of the optical chip 3, and part or all of the side surfaces, and the first light-transmitting adhesive layer 4 can also extend to the upper surface of the substrate 1. A light-transmitting hole 5 or a lens 6 is correspondingly arranged on the side of the cavity structure 21 away from the substrate 1 and above the first light-transmitting adhesive layer 4. The cross-section of the light-transmitting hole 5 can be set to be rectangular (refer to Figure 1 ), inverted "convex" shape, etc., the light-transmitting hole 5 is used for light transmission. The receiving portion 2 near the light-transmitting hole 5 can limit the divergence range of light as needed to obtain a preset light spot shape.

[0031] In order to optically shape the outgoing light or incident light of the first light-transmitting adhesive layer 4 to meet the preset angle, brightness, uniformity and spot shape of the outgoing light / incident light, a lens 6 is arranged in the cavity structure 21. Figure 1 . The lens 6 is arranged on the side of the cavity structure 21 away from the substrate 1, corresponding to the top of the first light-transmitting adhesive layer 4. The lens 6 is set as a convex lens, or a concave lens, or a plane lens whose incident surface and exit surface are both planes as needed. The lens 6 corresponding to the optical chip 3 that receives light energy is a Fresnel lens. Through the converging effect of the Fresnel lens, the area of ​​the optical chip 3 used to receive the incident light energy is greatly reduced, thereby reducing the cost. In addition, 1. The adapted optical chip 3 is small in size; 2. The Fresnel lens is smaller in size than other convex lenses, so the volume of the overall device is greatly reduced, and it is easy to integrate the design. Specifically, the lens 6 includes a first lens set corresponding to the light-emitting chip 3 and a second lens set corresponding to the photosensitive chip. The first lens and the second lens are used to optically adjust the outgoing light of the light-emitting chip and the received light of the photosensitive chip, respectively. The first lens and the second lens can be set as lenses of the same or different types to meet the needs of different optical functions.

[0032] In order to further improve the utilization rate of light energy and enhance the brightness, the side of the first light-transmitting adhesive layer 4 is set as a first reflection surface 41 for reflecting edge large-angle light. The first reflection surface 41 is a plane or curved surface in the shape of an inverted cone, that is, the side of the first light-transmitting adhesive layer 4 is set as a plane or curved surface that is at a certain angle to the upper surface of the optical chip 3. The side of the first light-transmitting adhesive layer 4 and the side of the optical chip 3 are tightly surrounded by a high-reflection adhesive layer 7, and the high-reflection adhesive layer 7 is arranged in the cavity structure 21 on the substrate 1. Light incident on the interface between the reflection surface 41 and the high-reflection adhesive layer 7 is reflected in the direction close to the optical axis of the optical chip 3, that is, emitted toward the front of the optical chip 3 or incident on the photosensitive area of ​​the optical chip 3. The high-reflection adhesive layer 7 covers part or all of the upper surface of the substrate 1, and can be arranged to be connected to the inner wall of the receiving portion 2. The high-reflective adhesive layer 7 makes the light incident on the interface between the reflective surface 41 and the high-reflective adhesive layer 7 fully reflect toward the front of the optical chip 3 or the photosensitive area of ​​the optical chip 3, cuts off the refracted light, and thus reduces the design difficulty and manufacturing accuracy of the first reflective surface 41, and fully utilizes the light energy. At the same time, the high-reflective adhesive layer 7 covers the side of the optical chip 3, so that the optical chip 3 can not only dissipate heat through the substrate 1 connected to the bottom surface, but also dissipate heat through the high-reflective adhesive layer 7 connected to the side surface, thereby increasing the heat dissipation channel of the optical chip 2 and extending the product life.

[0033] In addition, the high-reflective adhesive layer 7 is also used to fix the optical chip 3 and the receiving portion 2 on the substrate 1, making the entire structure more stable and reliable. This configuration utilizes the large-angle light that is not easily utilized on the edges, improves the utilization rate of light energy, and enhances the overall brightness. The upper surface of the first light-transmitting adhesive layer 4 is set to be a flat surface or a curved surface.

[0034] The upper surface of the first light-transmitting adhesive layer 4 is also tightly covered with a second light-transmitting adhesive layer 8. There is a space between the second light-transmitting adhesive layer 8 and the inner side of the cavity structure 21. The second light-transmitting adhesive layer 8 has different functions in different application scenarios. Here are two benefits:

[0035] 1. The first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 8 form a "double lens" structure: light is optically adjusted by utilizing the principle of refraction due to the different refractive indices of the first light-transmitting adhesive layer 4 and the second light-transmitting adhesive layer 8, and the first light-transmitting adhesive layer 8 and the gas layer in the cavity structure 21. Preferably, the refractive index of the second light-transmitting adhesive layer 8 is greater than the refractive index of the first light-transmitting adhesive layer 4.

[0036] 2. Process requirements: When a curved surface is formed on the upper surface of the optical chip 3 by dispensing glue, the formation of the curved surface utilizes the gravity, fluidity and surface tension of the light-transmitting glue; however, the height of the curved surface formed by natural flow is sometimes difficult to reach a preset height. For this reason, a first light-transmitting glue layer 4 of a certain thickness can be molded on the surface of the optical chip 3 in advance, and then a second light-transmitting glue layer 8 is formed by dispensing glue on the first light-transmitting glue layer 4.

[0037] The lens 6, the first light-transmitting adhesive layer 4, the high-reflective adhesive layer 7 and the second light-transmitting adhesive layer 8 in each cavity structure 21 of the sensor device of the present invention may be arranged the same or different, and various forms may be combined and designed, which are not listed here one by one.

[0038] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: base(1); A receiving portion (2) disposed on the substrate (1), the receiving portion (2) comprising at least two cavity structures (21); An optical chip (3) disposed on the substrate (1) and in the cavity structure (21), wherein at least one optical chip (3) is disposed in the cavity structure (21); A first light-transmitting adhesive layer (4), which is arranged in the cavity structure (21) and covers the optical chip (3), and a side surface of the first light-transmitting adhesive layer (4) is arranged as a reflection surface (41) for reflecting edge large-angle light; A high-reflective adhesive layer (7), which covers the reflective surface (41) or covers the reflective surface (41) and the side surface of the optical chip (3); A second light-transmitting adhesive layer (8), which tightly covers a side of the first light-transmitting adhesive layer (4) away from the optical chip (3), and is used for further optical shaping of the light; The second light-transmitting adhesive layer (8) only covers the upper surface of the first light-transmitting adhesive layer (4), and there is a space between the second light-transmitting adhesive layer (8) and the inner side surface of the cavity structure (21).

2. The sensor device according to claim 1, characterized in that The upper surface of the first light-transmitting adhesive layer (4) is arranged to be a flat surface or a curved surface.

3. The sensor device according to claim 1, characterized in that: The upper surface of the second light-transmitting adhesive layer (8) is arranged to be a flat surface or a curved surface.

4. The sensor device according to claim 1, characterized in that A light-transmitting hole (5) or a lens (6) is provided on a side of the cavity structure (21) away from the substrate (1) corresponding to the first light-transmitting adhesive layer (4).

5. The sensor device according to claim 4, characterized in that: The lens (6) is a convex lens, a concave lens or a plane lens.

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