A double soldering mechanism for a pressure plate

Abstract

The utility model relates to a pressure plate double tin feeding soldering mechanism, comprising: a frame; a tin feeding assembly connected to the frame, the tin feeding assembly is provided with multiple groups, and the multiple groups of tin feeding assemblies are all connected to the frame; a soldering assembly connected to the tin feeding assembly, the tin feeding assembly is used to provide tin to the soldering assembly, and the soldering assembly is used to perform soldering treatment on the product; a pressure plate assembly connected to the frame, the pressure plate assembly is used to perform flattening treatment on the product, and the bottom end height of the pressure plate assembly is lower than the bottom end height of the soldering assembly; a driving assembly connected to the frame, and the driving assembly is used to drive the frame to move in the direction of approaching or moving away from the product. By adopting this structure, automatic flattening and soldering treatment of the product is realized, and the efficiency of soldering is improved, and the soldering time is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of soldering devices, in particular to a pressure plate double-feeding soldering mechanism. Background Art

[0002] With the rapid development of the electronics industry, higher and higher requirements are placed on the connection quality of electronic components. As a commonly used method for connecting electronic components, welding has a direct impact on the performance and life of electronic products due to its stability and reliability. In the prior art, most soldering mechanisms are single-feed soldering machines. Although they meet the welding needs to a certain extent, their limitations gradually emerge when faced with large-scale and high-efficiency production requirements, with long welding cycles and low precision.

[0003] Therefore, there is an urgent need to provide a pressure plate double soldering mechanism to solve the above problems. Utility Model Content

[0004] The utility model aims to overcome the shortcomings and defects of the prior art and provide a pressure plate double-feeding soldering mechanism, which realizes automatic flattening and soldering treatment of products, improves soldering efficiency and reduces soldering time.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] A pressure plate double-feed soldering mechanism, characterized by comprising:

[0007] frame;

[0008] A tin delivery assembly is connected to the frame, wherein the tin delivery assembly is provided with a plurality of groups, and the plurality of groups of the tin delivery assemblies are all connected to the frame;

[0009] A solder assembly, connected to the tin delivery assembly, the tin delivery assembly is used to provide tin to the solder assembly, and the solder assembly is used to perform soldering on the product;

[0010] A pressing plate assembly is connected to the frame, the pressing plate assembly is used to flatten the product, and the bottom end height of the pressing plate assembly is lower than the bottom end height of the solder assembly;

[0011] A driving assembly is connected to the frame, and the driving assembly is used to drive the frame to move in a direction close to or away from the product.

[0012] Optionally, the tin delivery assembly includes a fixed frame, a tin wire reel and a tin cutting device, the fixed frame is connected to the frame, the tin wire reel and the tin cutting device are both connected to the fixed frame, and the tin wire reel is connected to the tin cutting device, the tin cutting device is connected to the solder assembly, the tin wire reel is used to store the tin wire, and the tin cutting device is used to cut or split the tin wire.

[0013] Optionally, the solder assembly includes a tin supply device and a heating device, the heating device is connected to the lower end of the frame, the tin supply device is provided with multiple groups, the multiple groups of tin supply devices are respectively connected one-to-one with the multiple groups of tin splitting devices, and the tin outlets of the multiple groups of tin supply devices are arranged adjacent to the bottom end of the heating device.

[0014] Optionally, the cylinder assembly is connected to the connecting frame, and the cylinder assembly and the pressing block are each provided with two groups, one cylinder assembly is drivingly connected to one pressing block, and the cylinder assembly is used to drive the pressing block to move up and down in the vertical direction.

[0015] Optionally, a mounting hole is provided at the upper end of the pressing block, and the output end of the cylinder assembly is connected to the pressing block by bolts.

[0016] Optionally, the tin supply device is provided with two groups, and the two groups of tin supply devices are arranged in parallel in sequence along the length extension direction of the frame.

[0017] Optionally, the soldering assembly further comprises a turntable assembly, the turntable assembly is connected to the lower end of the frame, and the solder supply device is connected to the turntable assembly.

[0018] Optionally, a rubber pad is provided at the lower end of the pressing block; and a buffer device is provided between the connecting frame and the frame.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] In the utility model, the press plate double tin feeding soldering mechanism comprises a frame, a tin feeding assembly, a solder assembly, a press plate assembly and a driving assembly, wherein the tin feeding assembly is connected to the frame, and the tin feeding assembly is provided with multiple groups, and the multiple groups of tin feeding assemblies are all connected to the frame, which can improve the efficiency of tin supply, thereby improving the soldering efficiency of the product; the soldering assembly is connected to the tin feeding assembly, and the soldering assembly performs soldering treatment on the product; the press plate assembly is connected to the frame, wherein the press plate assembly is used to flatten the product, and the height of the bottom end of the press plate assembly is lower than the height of the bottom end of the solder assembly, so that the press plate assembly can first flatten and position the product, and then the solder assembly performs soldering treatment on the product. The driving assembly is connected to the frame, wherein the driving assembly is used to drive the frame to move in a direction close to or away from the product to complete the soldering treatment of the product. Through the arrangement of the above-mentioned components and devices, automatic flattening and soldering treatment of the product is realized, and the efficiency of soldering is improved, and the soldering time is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front view of the utility model.

[0022] Figure 2It is a side view of the utility model.

[0023] Figure 3 It is a top view of the utility model.

[0024] Figure 4 This is a structural view of the utility model.

[0025] The above drawings include the following reference numerals:

[0026] 1. Frame, 21. Fixed frame, 22. Tin wire reel, 23. Tinning device, 31. Tin supply device, 32. Heating device, 41. Connecting frame, 42. Cylinder assembly, 43. Press block, 44. Turntable assembly. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0028] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0030] The technical solution of the utility model provides a double-feeding soldering mechanism for a pressing plate.

[0031] Reference Figures 1 to 4 , in this embodiment, includes:

[0032] Rack 1;

[0033] A tin delivery assembly is connected to the frame 1. The tin delivery assembly is provided with multiple groups, and the multiple groups of tin delivery assemblies are all connected to the frame 1;

[0034] The soldering assembly is connected to the tin feeding assembly, the tin feeding assembly is used to provide tin to the soldering assembly, and the soldering assembly is used to perform soldering on the product;

[0035] A pressing plate assembly is connected to the frame 1, and is used to flatten the product, and the bottom end height of the pressing plate assembly is lower than the bottom end height of the solder assembly;

[0036] The driving assembly is connected to the frame 1, and is used to drive the frame 1 to move in a direction close to or away from the product.

[0037] Optionally, in the present embodiment, the pressure plate double tin feeding soldering mechanism comprises a frame 1, a tin feeding assembly, a solder assembly, a pressure plate assembly and a driving assembly, wherein the tin feeding assembly is connected to the frame 1, and the tin feeding assembly is provided with a plurality of groups, and the plurality of tin feeding assemblies are all connected to the frame 1. By providing a plurality of tin feeding assemblies, it is possible to realize that the plurality of tin feeding assemblies can supply tin to the solder assembly at the same time, which can improve the efficiency of tin supply, thereby improving the soldering efficiency of the product; the solder assembly is connected to the tin feeding assembly, and the solder assembly performs soldering on the product through the tin provided by the plurality of tin feeding assemblies; the pressure plate assembly is connected to the frame 1, wherein the pressure plate assembly is used to flatten the product to prevent the product from shaking during soldering or the soldering from being not in place or inaccurate due to unevenness, and the height of the bottom end of the pressure plate assembly is lower than the height of the bottom end of the solder assembly, that is, before soldering, the pressure plate assembly is closer to the product in the vertical direction than the solder assembly, so that the pressure plate assembly can first flatten and position the product, and then the solder assembly performs soldering on the product. The driving component is connected to the frame 1, wherein the driving component is used to drive the frame 1 to move in a direction close to or away from the product to complete the soldering process of the product, that is, the driving component drives the frame 1 to approach the product. Since the height of the bottom end of the pressure plate component is lower than the height of the bottom end of the solder component, the pressure plate component first contacts the product to complete the flattening and fixation of the product, and then the driving component drives the frame 1 to continue to press down so that the bottom end of the solder component contacts the end face of the product. Multiple groups of tin feeding components supply tin to the solder component. After the tin supply is completed, the solder component performs soldering process on the product. After the soldering process is completed, the driving component drives the frame 1 to move away from the product. Through the arrangement of the above-mentioned components and devices, automatic flattening and soldering process of the product are realized, and the efficiency of soldering is improved and the soldering time is reduced.

[0038] In this embodiment, the tin feeding assembly includes a fixed frame 21, a tin wire reel 22 and a tin cutting device 23, wherein the fixed frame 21 is connected to the frame 1, the tin wire reel 22 and the tin cutting device 23 are both connected to the fixed frame 21, and the tin wire reel 22 is connected to the tin cutting device 23, the tin wire reel 22 is used to store the tin wire, that is, the tin wire reel 22 is used to store the tin wire and provide the tin wire to the tin cutting device 23, wherein the tin cutting device 23 is connected to the soldering assembly, that is, the tin cutting device 23 cuts or cuts the tin wire and then provides it to the soldering assembly, and the tin cutting device 23 is used to cut or cut the tin wire during the soldering process so as to more accurately control the length and shape of the tin wire, thereby meeting different welding requirements.

[0039] In this embodiment, the soldering assembly includes a tin supply device 31 and a heating device 32. The heating device 32 is connected to the lower end of the frame 1. The tin supply device 31 is provided with multiple groups, and the multiple groups of tin supply devices 31 are respectively connected one-to-one with the multiple groups of tin cutting devices 23, that is, multiple tin wires are cut and provided to the tin supply device 31, which improves the soldering efficiency of the product. The tin supply device 31 is used to provide the cut tin wire to the heating device 32, and the heating device 32 heats and melts the tin wire and then solders the product. The tin outlets of the multiple groups of tin supply devices 31 are arranged near the bottom of the heating device 32, that is, the tin outlets of the tin supply devices 31 are connected to the heating part, which is convenient for heating the tin wire.

[0040] In the present embodiment, the pressing plate assembly includes a connecting frame 41, a cylinder assembly 42 and a pressing block 43. The connecting frame 41 is connected to the frame 1, and the cylinder assembly 42 is connected to the connecting frame 41. There are two groups of cylinder assemblies 42 and pressing blocks 43. One group of cylinder assemblies 42 is connected to one group of pressing blocks 43. The driving assembly is used to drive the pressing blocks 43 to move up and down in the vertical direction, that is, to complete the flattening process of the product. The setting of two groups of driving cylinders and two groups of pressing blocks 43 can better complete the flattening and fixing of the product. In other embodiments, the cylinder assembly 42 and the pressing block 43 can also be set as one group or three groups or more, which is not limited here. Furthermore, in the present embodiment, a mounting hole is provided at the upper end of the pressing block 43, and the output end of the cylinder assembly 42 is connected to the pressing block 43 by bolts. The bolt connection facilitates the subsequent replacement of the pressing block 43.

[0041] In this embodiment, the solder assembly also includes a turntable assembly 44, which is connected to the lower end of the frame 1 through the turntable assembly 44, and the tin supply device 31 is connected to the turntable assembly 44. Through the setting of the turntable assembly 44, the tin supply device 31 and the solder assembly can be rotated according to needs, which is convenient for soldering products in various environments. Further, the tin supply device is provided with two groups, and the two groups of tin supply devices are arranged in parallel in sequence along the length extension direction of the frame 1. The setting of the two groups of tin supply devices can not only improve the soldering efficiency of the product, but also reduce the floor space by vertically setting.

[0042] In this embodiment, a rubber pad is provided at the lower end of the pressing block 43, and a buffer device is provided between the connecting frame 41 and the frame 1. The rubber pad provided at the lower end of the pressing block 43 can avoid hard contact between the pressing block 43 and the product when it is pressed down, thereby preventing damage to the product. The buffer device provided between the connecting frame 41 and the frame 1 can also provide buffering for the solder assembly when soldering the product, thereby preventing damage to the product or the solder assembly.

[0043] The above-mentioned embodiments only express the implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A double soldering mechanism with a pressure plate, characterized in that: include: frame; A tin delivery assembly is connected to the frame, wherein the tin delivery assembly is provided with a plurality of groups, and the plurality of groups of the tin delivery assemblies are all connected to the frame; A solder assembly, connected to the tin delivery assembly, the tin delivery assembly is used to provide tin to the solder assembly, and the solder assembly is used to perform soldering on the product; A pressing plate assembly is connected to the frame, and the pressing plate assembly is used to flatten the product, and the bottom end height of the pressing plate assembly is lower than the bottom end height of the solder assembly; A driving assembly is connected to the frame, and the driving assembly is used to drive the frame to move in a direction close to or away from the product.

2. A press plate double soldering mechanism according to claim 1, characterized in that: The tin feeding assembly includes a fixed frame, a tin wire reel and a tin cutting device, the fixed frame is connected to the frame, the tin wire reel and the tin cutting device are both connected to the fixed frame, and the tin wire reel is connected to the tin cutting device, the tin cutting device is connected to the solder assembly, the tin wire reel is used to store the tin wire, and the tin cutting device is used to cut or split the tin wire.

3. A press plate double soldering mechanism according to claim 2, characterized in that: The solder assembly includes a tin supply device and a heating device, the heating device is connected to the lower end of the frame, the tin supply device is provided with multiple groups, the multiple groups of tin supply devices are respectively connected to the multiple groups of tin splitting devices one by one, and the tin outlets of the multiple groups of tin supply devices are arranged adjacent to the bottom end of the heating device.

4. A press plate double soldering mechanism according to claim 1, characterized in that: The pressure plate assembly includes a connecting frame, a cylinder assembly and a pressure block, the connecting frame is connected to the frame, the cylinder assembly is connected to the connecting frame, and the cylinder assembly and the pressure block are each provided with two groups, one cylinder assembly is drivingly connected to one pressure block, and the cylinder assembly is used to drive the pressure block to move up and down in the vertical direction.

5. A press plate double soldering mechanism according to claim 4, characterized in that: A mounting hole is provided at the upper end of the pressing block, and the output end of the cylinder assembly is connected to the pressing block by bolts.

6. A press plate double soldering mechanism according to claim 3, characterized in that: The tin supply device is provided with two groups, and the two groups of the tin supply device are arranged in parallel in sequence along the length extension direction of the frame.

7. A press plate double soldering mechanism according to claim 3, characterized in that: The soldering assembly also includes a turntable assembly, which is connected to the lower end of the frame, and the solder supply device is connected to the turntable assembly.

8. A pressure plate double soldering mechanism according to claim 4, characterized in that: A rubber pad is arranged at the lower end of the pressing block; and a buffer device is arranged between the connecting frame and the frame.

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