PCB automatic feeding device and PCB automatic warping detection equipment

Abstract

The utility model provides a PCB automatic feeding device and PCB automatic warping detection equipment. The PCB automatic warping detection equipment comprises a rack, a detection device, a feeding bin, a discharging bin and a PCB automatic feeding device. The PCB automatic feeding device comprises a buffer adsorption assembly, a vertical driving assembly and a transverse driving assembly. The buffer adsorption assembly comprises a moving frame and a plurality of buffer adsorption mechanisms, and each buffer adsorption mechanism comprises an adsorption pipe, a compression spring and a corrugated adsorption nozzle. When the PCB is adsorbed, the buffer adsorption assembly moves downwards, the corrugated adsorption nozzles abut against the PCB, and the compression springs are compressed to deform, so that the PCB is prevented from being damaged, meanwhile, if the PCB warps and the deformation degrees of the compression springs are different, all the corrugated adsorption nozzles can make contact with the PCB, reliable adsorption is ensured, and the situation that the normal operation of the whole equipment is affected due to the fact that the PCB falls off in the transferring process is avoided; and the PCB is moved through the PCB automatic feeding device, so that the detection efficiency is effectively improved.

Description

Technical Field

[0001] The utility model relates to the field of PCB detection, in particular to an automatic PCB feeding device and an automatic PCB warping detection device. Background Art

[0002] The PCB is provided with a printed circuit, which is a plate material and may have warping phenomenon; especially the thinner PCB is prone to warping. If the PCB substrate is warped, it will be difficult to print the circuit on it later; or after the circuit is printed, the stress of the PCB substrate is changed, causing the PCB to warp. The warped PCB affects the subsequent assembly and may interfere with other components to cause the circuit. Therefore, it is necessary to detect the warping of the PCB to ensure product quality. Due to the warping of the PCB, some suction cups of ordinary adsorption robots cannot adsorb the PCB normally, which may cause problems such as the PCB falling off, affecting the progress of the inspection. Therefore, in the prior art, the PCB is usually manually placed on the vacuum adsorption platform for inspection one by one. Due to manual operation, the inspection efficiency is low. Utility Model Content

[0003] The utility model provides a PCB automatic feeding device and PCB automatic warping detection equipment, which can effectively improve the detection efficiency.

[0004] On the one hand, the utility model provides a PCB automatic feeding device, including a buffer adsorption component, a vertical drive component and a horizontal drive component;

[0005] The buffer adsorption assembly includes a moving frame and a plurality of buffer adsorption mechanisms, wherein a vacuum air passage is arranged in the moving frame, and each of the buffer adsorption mechanisms includes an adsorption tube, a compression spring and a corrugated adsorption nozzle, wherein the adsorption tube is arranged vertically and is arranged on the moving frame in a vertical sliding manner; the top end of the adsorption tube is connected to the vacuum air passage through a hose, and the bottom end is connected to the top of the corrugated adsorption nozzle; the compression spring is sleeved outside the adsorption tube and is arranged between the moving frame and the bottom end of the adsorption tube, and is used to provide elastic force to move the adsorption tube downward; the bottom of the corrugated adsorption nozzle is used to abut against the PCB;

[0006] The vertical driving assembly is connected to the moving frame and is used to drive the buffer adsorption assembly to move vertically to pick up and place the PCB;

[0007] The lateral driving assembly is connected to the vertical driving assembly and is used to drive the buffer adsorption assembly and the PCB to move in the lateral direction.

[0008] Among them, the movable frame includes a column and a flat rod, the column is arranged vertically, and the flat rod is arranged horizontally along the longitudinal direction. The bottom end of the column is fixedly connected to the flat rod. The column and the flat rod are both hollow structures, and the inner cavities of the two are connected to form the vacuum airway. The top end of the column is connected to the vacuum generator; the buffer adsorption mechanism is connected to the flat rod.

[0009] Among them, a plurality of connecting plates are arranged at the bottom of the flat rod, and the connecting plates are arranged one by one corresponding to the buffer adsorption mechanism; one end of the connecting plate is fixed to the bottom surface of the flat rod, and the other end protrudes from the side of the flat rod facing the other flat rod, and the adsorption tube is slidably connected to the protruding end of the connecting plate; the compression spring is arranged between the connecting plate and the bottom end of the adsorption tube.

[0010] The hose is in an inverted U shape, one end of which is connected to the top of the adsorption tube and the other end is connected to the inner cavity of the flat rod through the top surface of the flat rod; the two arms of the hose are arranged horizontally and are both arranged vertically.

[0011] The top outer side of the adsorption tube is threadedly connected with an adjusting nut, and the adjusting nut is located above the connecting plate; a flange is provided at the bottom of the adsorption tube, and the two ends of the compression spring are respectively abutted against the connecting plate and the flange.

[0012] Among them, the buffer adsorption assembly also includes a mounting plate and a spacing adjustment drive mechanism, the mounting plate is connected to the vertical drive assembly; there are two mobile racks in the buffer adsorption assembly, and the two mobile racks are adjustably connected to the mounting plate along the lateral distance; the spacing adjustment drive mechanism is connected to the mobile rack and is used to adjust the lateral spacing between the two mobile racks; multiple buffer adsorption mechanisms are divided into two groups, which are respectively connected to the flat rods of the two mobile racks; the buffer adsorption mechanisms in each group are arranged longitudinally.

[0013] Wherein, the vertical drive assembly includes a vertical plate, a vertical motor and a screw module; the screw module is vertically arranged on the vertical plate and connected to the mounting plate; the vertical plate is parallel to the mounting plate and perpendicular to the longitudinal direction, and the screw module is located between the vertical plate and the mounting plate;

[0014] The vertical motor is arranged at the top of the screw module, and the two are connected in transmission, so as to drive the buffer adsorption assembly to move vertically through the screw module;

[0015] The lateral drive assembly is connected to the riser.

[0016] Wherein, a vacuum manifold block is arranged at the top of the vertical plate, and the vacuum manifold block is U-shaped as a whole, and includes a manifold arm and two connecting arms, the two connecting arms are arranged in parallel, one end of each of which is fixedly connected to the vertical plate, and the other end is respectively fixedly connected to the two ends of the manifold arm; the screw module is located between the two connecting arms; a manifold channel is arranged in the manifold arm, and a collecting port is arranged at one end of the manifold arm, and two collecting ports are arranged on the side of the manifold arm away from the connecting arm, and the collecting port and the two collecting ports are both connected to the manifold channel, and the collecting port is connected to the vacuum generator through a first pipeline, and the two collecting ports are respectively connected to the tops of the two columns through second pipelines, and are connected to the vacuum air duct; the vacuum generator is fixed to the vertical plate.

[0017] On the other hand, the utility model provides a PCB automatic warpage detection device, including a frame, a detection device, a loading bin, a unloading bin and the aforementioned PCB automatic loading device;

[0018] The loading bin, the detection device and the lowering bin are sequentially arranged on the frame in a transverse direction, and are all located below the PCB automatic loading device.

[0019] Among them, a base is arranged on the frame, and the detection device includes a vacuum adsorption platform and a detection module; the vacuum adsorption platform is arranged on the base for carrying the PCB; the detection module is arranged on the base for scanning and detecting the PCB on the vacuum adsorption platform.

[0020] The utility model provides a PCB automatic warping detection device and a PCB automatic warping detection method with convenient loading. When the PCB is adsorbed, the buffer adsorption component moves downward under the drive of the vertical driving component to make the corrugated adsorption nozzle abut against the PCB; the buffer adsorption component continues to move downward, and the compression spring between the moving frame and the adsorption tube is compressed and deformed to avoid the downward force of the buffer adsorption component on the PCB causing damage to the PCB. At the same time, if the PCB is warped, the deformation degree of the compression spring of each buffer adsorption mechanism is different, so that the corrugated adsorption nozzle can contact with the PCB, and the bottom surface of the corrugated adsorption nozzle can be tilted according to the warping of the PCB, ensuring that each corrugated adsorption nozzle is tightly connected with the PCB and adsorbed reliably, avoiding the PCB from falling during the transfer process and affecting the normal operation of the entire equipment; the PCB is moved by the PCB automatic feeding device, and the detection efficiency is effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the structure of a PCB automatic warpage detection device provided in a preferred embodiment of the utility model;

[0022] Figure 2 yes Figure 1A schematic diagram of the structure of a PCB automatic feeding device of a PCB automatic warpage detection device that is convenient for feeding;

[0023] Figure 3 yes Figure 2 A schematic diagram of the structure of the buffer adsorption component and the vertical drive component of the PCB automatic feeding device;

[0024] Figure 4 yes Figure 3 A schematic diagram of the structure of the mobile frame and the buffer adsorption mechanism of the buffer adsorption assembly;

[0025] Figure 5 yes Figure 4 A schematic diagram of the cross-sectional structure of the middle moving frame and the buffer adsorption mechanism;

[0026] Figure 6 yes Figure 3 A schematic diagram of the structure of the vacuum manifold of the PCB automatic feeding device;

[0027] Figure 7 yes Figure 6 Schematic diagram of the cross-sectional structure of the medium vacuum manifold;

[0028] Figure 8 yes Figure 1 Schematic diagram of the structure of the detection device of the PCB automatic warpage detection equipment with convenient loading. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0030] Please refer to Figure 1 The preferred embodiment of the utility model provides a convenient PCB automatic warpage detection device, which includes a frame 800, a detection device 200, a PCB automatic loading device 100, a loading bin 71 and a lowering bin 72. The frame 800 is used to provide support for the entire device, and the detection device 200 is arranged on the frame 800, and is used to scan and detect the PCB to detect qualified and unqualified products. The PCB automatic loading device 100 is used to move the PCB, so as to move the PCB in the loading bin 71 to the vacuum adsorption platform 9, and can move the PCB from the vacuum adsorption platform 9 to the lowering bin 72.

[0031] The PCB automatic loading device 100 is arranged on the frame 800, located above the vacuum adsorption platform 9, and is used to place the PCB on the vacuum adsorption platform 9 and remove the PCB from the vacuum adsorption platform 9. Figure 2 As shown, the PCB automatic feeding device 100 includes a buffer adsorption component 1, a vertical drive component 2 and a horizontal drive component 3. The buffer adsorption component 1 is used to adsorb the PCB. The vertical drive component 2 is connected to the buffer adsorption component 1, and is used to drive the buffer adsorption component 1 to move up and down in the vertical direction Z to suck up or put down the PCB. The horizontal drive component 3 is arranged on the frame 800 and is connected to the vertical drive component 2, and is used to drive the vertical drive component 2 and the buffer adsorption component 1 to move in the horizontal direction X to move the PCB from the upper bin 71 to the lower bin 72.

[0032] like Figure 3 , Figure 4 and Figure 5 As shown, the buffer adsorption assembly 1 includes a mobile frame 11 and a plurality of buffer adsorption mechanisms 12. The plurality of buffer adsorption mechanisms 12 are arranged on the mobile frame 11 and are used to adsorb PCBs. Figure 5 As shown, a vacuum air passage 110 is provided in the movable frame 11 , and the vacuum air passage 110 can connect the vacuum generator 13 with the buffer adsorption mechanism 12 .

[0033] like Figure 4 , Figure 5 As shown, each buffer adsorption mechanism 12 is movably arranged on the mobile frame 11 in the vertical direction, and includes an adsorption tube 121, a compression spring 122 and a corrugated adsorption nozzle 123. The adsorption tube 121 is arranged vertically and is slidably arranged on the mobile frame 11 in the vertical direction. The top of the adsorption tube 121 is connected to the vacuum air passage 110 through a hose 124, and the bottom is connected to the top of the corrugated adsorption nozzle 123. The compression spring 122 is sleeved outside the adsorption tube 121 and is arranged between the mobile frame 11 and the bottom end of the adsorption tube 121, and is used to provide elastic force to move the adsorption tube 121 downward. The bottom of the corrugated adsorption nozzle 123 is used to abut against the PCB 900.

[0034] When adsorbing the PCB, the buffer adsorption component 1 moves downward under the drive of the vertical drive component 2, so that the corrugated adsorption nozzle 123 abuts against the PCB900; the buffer adsorption component 1 continues to move downward, and the compression spring 122 between the mobile frame 11 and the adsorption tube 121 is compressed and deformed to avoid the downward force of the buffer adsorption component 1 on the PCB causing damage to the PCB. At the same time, if the PCB is warped, the compression spring 122 of each buffer adsorption mechanism 12 has a different degree of deformation, so that the corrugated adsorption nozzle 123 can contact the PCB, and the bottom surface of the corrugated adsorption nozzle 123 can be tilted according to the warping of the PCB, ensuring that each corrugated adsorption nozzle 123 is tightly connected to the PCB and adsorbed reliably, avoiding the PCB from falling during the transfer process and affecting the normal operation of the entire equipment. The PCB is moved by the PCB automatic feeding device, which effectively improves the detection efficiency.

[0035] In this embodiment, the mobile frame 11 includes a column 111 and a flat rod 112, the column 111 is arranged along the vertical direction Z, the flat rod 112 is arranged horizontally along the longitudinal direction Y, the bottom end of the column 111 is fixedly connected to the flat rod 112, the column 111 and the flat rod 112 are both hollow structures, the inner cavities of the two are connected to form a vacuum airway 110, the top of the column 111 is connected to the vacuum generator 13, and the buffer adsorption mechanism 12 is connected to the flat rod 112. The use of the hollow structure of the column 111 and the flat rod 112 is convenient for processing and preparation, conducive to forming the vacuum airway 110, and reduces the pipeline setting.

[0036] A plurality of connecting plates 113 are provided at the bottom of the flat rod, and the connecting plates 113 are provided one by one corresponding to the buffer adsorption mechanism 12; one end of the connecting plate 113 is fixed to the bottom surface of the flat rod 112, and the other end protrudes from the side of the flat rod 112 facing the other flat rod 112, and the adsorption tube 121 is slidably connected to the protruding end of the connecting plate 113, and the compression spring 122 is provided between the connecting plate 113 and the bottom end of the adsorption tube 121. The connecting plate 113 can facilitate the vertical movement of the adsorption tube 121 relative to the mobile frame 11, and facilitate the installation of the adsorption tube 121, without providing a sliding hole on the flat rod 112 to avoid interference with the internal vacuum air passage 110.

[0037] The top outer side of the adsorption tube 121 is threadedly connected with an adjusting nut 125, and the adjusting nut 125 is located above the connecting plate 113. By rotating the adjusting nut 125, the position of the adsorption tube 121 on the connecting plate 113 can be changed, thereby adjusting the length of the adsorption tube 121 below the connecting plate 113, and then the elastic force of the compression spring 122 can be adjusted, which is conducive to the deformation of the compression spring 122 when adsorbing the PCB. A flange is provided at the bottom of the adsorption tube 121, and the two ends of the compression spring 122 are respectively abutted against the connecting plate 113 and the flange. The flange can be used to limit the compression spring 122 on the adsorption tube 121, which is convenient for the assembly of the compression spring 122.

[0038] The hose 124 is in an inverted U shape, one end of which is connected to the top of the adsorption tube 121, and the other end is connected to the inner cavity of the flat rod 112 through the top surface of the flat rod 112. The two arms of the hose 124 are arranged in the horizontal direction and are both arranged in the vertical direction. When the adsorption tube 121 moves in the vertical direction, it can facilitate the deformation of the hose 124, and the multiple hoses 124 will not interfere with each other.

[0039] like Figure 3 As shown, the buffer adsorption assembly 1 also includes a mounting plate 14 and a spacing adjustment drive mechanism 15. The mounting plate 14 is connected to the vertical drive assembly 2 so as to move vertically under the drive of the vertical drive assembly 2. There are two mobile racks 11 in the buffer adsorption assembly 1, and the two mobile racks 11 are connected to the mounting plate 14 with an adjustable distance along the horizontal direction X; the spacing adjustment drive mechanism 15 is arranged on the mounting plate 14 and connected to the mobile racks 11 to adjust the horizontal spacing between the two mobile racks 11. The multiple buffer adsorption mechanisms 12 are divided into two groups, which are respectively connected to the flat rods 112 of the two mobile racks 11; the buffer adsorption mechanisms 12 in each group are arranged along the longitudinal direction Y.

[0040] PCB900 is usually rectangular, and its length direction is longitudinal and width direction is transverse, and it is placed in the PCB automatic warpage detection equipment for convenient loading. Two groups of buffer adsorption mechanisms 12 can be adsorbed on the two long sides of the PCB respectively. Two mobile racks 11 are arranged on the mounting plate 14 with adjustable transverse distance. The two mobile racks 11 can be moved closer to or away from each other in the transverse direction through the spacing adjustment driving mechanism 15, so as to adjust the distance between the two mobile racks 11 to adapt to PCBs of different widths, so that the two groups of buffer adsorption mechanisms 12 are adsorbed at the appropriate position of the PCB, ensuring that the PCB is reliably adsorbed and the PCB is stably and reliably transferred.

[0041] In this embodiment, the spacing adjustment driving mechanism 15 is a combination of a motor and a ball screw, and the spacing adjustment driving mechanism 15 is connected to one mobile frame 11 to drive the mobile frame 11 to move in the lateral direction, and the other mobile frame 11 is fixedly arranged with the mounting plate 14. Here, in other embodiments, the spacing adjustment driving mechanism can also adopt other mechanisms that can drive the mobile frame to move linearly, and can also be connected to two mobile frames 11 at the same time, and drive the two mobile frames 11 to move closer to or away from each other in the lateral direction.

[0042] like Figure 1 As shown, the upper bin 71, the detection device 200 and the lower bin 72 are sequentially arranged in the horizontal direction on the frame 800, and are all located below the PCB automatic loading device 100. The upper bin 71 is used to store the PCBs to be detected, and the lower bin 72 is used to store the PCBs that have been detected. The lower bin 72 may include a qualified bin 721 and a discarded bin 722, the qualified bin 721 is used to place the PCBs that have passed the test, and the discarded bin 722 is used to place the unqualified PCBs, and the two are also arranged in the horizontal direction.

[0043] The PCB automatic feeding device 100 includes two buffer adsorption components 1 and two vertical drive components 2, wherein one buffer adsorption component 1 and one vertical drive component 2 move above both the upper bin 71 and the vacuum adsorption platform 9, and are used to move the PCB in the upper bin 71 to the vacuum adsorption platform 9. A code reading component 4 is also provided on one side of the buffer adsorption component 1, and is used to read the identification code of the currently detected PCB; another buffer adsorption component 1 and another vertical drive component 2 move above both the vacuum adsorption platform 9 and the lower bin 72, and are used to move the PCB that has been tested to the lower bin 72. With the two buffer adsorption components 1, loading and unloading can be carried out simultaneously to improve the detection efficiency. The lateral drive component 3 is a linear motor, which is connected to the two buffer adsorption components 1 at the same time to simplify the structure and reduce costs.

[0044] like Figure 3 As shown, the vertical drive assembly 2 includes a vertical plate 21, a vertical motor 22 and a screw module 23. The screw module 23 is vertically arranged on the vertical plate 21 and connected to the mounting plate 14 of the buffer adsorption assembly 1. The vertical motor 22 is arranged at the top of the screw module 23, and the two are transmission-connected to drive the buffer adsorption assembly 1 to move vertically through the screw module 23. The vertical plate 21 is parallel to the mounting plate 14 and is perpendicular to the longitudinal direction. The screw module 23 is located between the vertical plate 21 and the mounting plate 14 to make the structure compact.

[0045] The vertical motor 22 is located at the top of the screw module 23, which is convenient for the circuit layout of the vertical motor 22. The drag chain structure of its circuit cable can be set on the top of the horizontal drive component 3 to avoid interference with other components during the horizontal movement.

[0046] The lateral driving assembly 3 is connected to the vertical plate 21 to drive the vertical driving assembly 2 and the buffer adsorption assembly 1 to move in the lateral direction through the vertical plate 21 .

[0047] like Figure 3 As shown, a vacuum manifold block 16 is provided at the top of the vertical plate 21. Figure 6 and Figure 7As shown, the vacuum confluence block 16 is U-shaped as a whole, and includes a confluence arm 161 and two connecting arms 162. The two connecting arms 162 are arranged in parallel, and one end of each of them is fixedly connected to the vertical plate 21, and the other end is fixedly connected to the two ends of the confluence arm 161. The screw module 23 is located between the two connecting arms 162. A confluence channel 160 is arranged in the confluence arm 161, and a collection port 163 is arranged at one end of the confluence arm 161. Two confluence ports 164 are arranged on the side of the confluence arm 161 away from the connecting arm 162. The collection port 163 and the two confluence ports 164 are both connected to the confluence channel 160. The collection port 163 is connected to the vacuum generator 13 through a first pipeline (not shown in the figure), and the two confluence ports 164 are respectively connected to the top of the two columns 111 through a second pipeline (not shown in the figure), and are connected to the vacuum air duct 110. The vacuum generator 13 is fixed to the vertical plate 21 so that the vacuum generator 13 and the vacuum manifold block 16 are relatively fixed and will not move, which facilitates the communication between the two. The second pipeline can use a spiral hose 124 to adapt to the lifting and lowering movement of the buffer adsorption assembly 1.

[0048] A pressure gauge 17 is provided in the middle of the confluence arm 161 , and the pressure gauge 17 is connected to the confluence channel 160 to detect the pressure in the channel and improve the adsorption stability.

[0049] The vacuum air passages 110 of the two mobile racks 11 are respectively connected to the confluence channel 160 through the second pipeline and the confluence port 164, and then connected to the vacuum generator 13 through the confluence port 164 and the first pipeline. The vacuum generator 13 generates a vacuum so that the buffer adsorption assembly on the mobile rack 11 adsorbs the PCB.

[0050] The screw module 23 is located between the two connecting arms 162, and its structure is compact and easy to assemble.

[0051] like Figure 1 and Figure 2 As shown, a base 801 is provided on the frame 800, and the detection device 200 includes a vacuum adsorption platform 9 and a detection module 8. The vacuum adsorption platform 9 is provided on the base 801, and has a detection surface for carrying the PCB, and the PCB can be placed on the detection surface for detection. The detection module 8 is provided on the base 801, and is used to scan and detect the PCB on the vacuum adsorption platform 9. In this embodiment, the vacuum adsorption platform 9 can provide adsorption force to the PCB, that is, a plurality of adsorption holes for adsorbing the PCB are provided on the detection surface (not shown in the figure). When performing a warpage detection, the PCB is placed on the vacuum adsorption platform 9, and the warpage of the PCB is first detected when the vacuum adsorption platform 9 has no adsorption force; then the vacuum adsorption platform 9 is started to provide adsorption force to the PCB, and the warpage of the PCB is detected again to detect whether the warpage of the PCB can be corrected under the action of the predetermined adsorption force.

[0052] like Figure 8 As shown, the detection module 8 includes a transverse scanning component 81, a longitudinal scanning component 82 and a vertical scanning component 83; the transverse scanning component 81 is slidably arranged on the base 801 along the transverse direction X, and is used to scan the PCB along the transverse direction; the longitudinal scanning component 82 is slidably arranged on the base 801 along the longitudinal direction Y, and is used to scan the PCB along the longitudinal direction; the vertical scanning component 83 is located above the vacuum adsorption platform 9, and is slidably arranged on the base 801 along the transverse and longitudinal directions, and is used to locate the warping position of the PCB.

[0053] The warping degree of the PCB and the position where the warping will occur can be detected by the transverse axis scanning component 81, the longitudinal axis scanning component 82 and the vertical axis scanning component 83, so as to determine whether the PCB is qualified.

[0054] The transverse scanning assembly 81 includes a transverse sliding member 811, a transverse transmitter 812 and a transverse receiver 813. The transverse sliding member 811 is a bar arranged along the longitudinal direction Y, and is located above the vacuum adsorption platform 9. Its two ends are respectively connected to the base 801 by sliding along the transverse direction X to ensure the stability of the transverse sliding member 811 in the transverse direction. The transverse transmitter 812 and the transverse receiver 813 are respectively arranged at the longitudinal ends of the transverse sliding member 811 and at the longitudinal sides of the vacuum adsorption platform 9 to scan the PCB on the vacuum adsorption platform 9.

[0055] The base 801 is provided with a transverse drive mechanism 84, which is connected to the transverse slide 811 to drive the transverse scanning assembly 81 to move transversely. In this embodiment, the transverse drive mechanism 84 is a combination of a motor and a conveyor belt mechanism, which has a simple structure and stable operation.

[0056] The longitudinal scanning assembly 82 includes a longitudinal sliding member 821, a longitudinal transmitter 822 and a longitudinal receiver 823. The longitudinal sliding member 821 is a strip arranged along the horizontal direction X, and is located above the vacuum adsorption platform 9 and the transverse sliding member 811. Its two ends are respectively connected to the base 801 by sliding along the longitudinal direction Y to ensure the stability of the longitudinal sliding member 821 in the longitudinal movement. The longitudinal transmitter 822 and the longitudinal receiver 823 are respectively arranged at the two transverse ends of the longitudinal sliding member 821 and at the two transverse sides of the vacuum adsorption platform 9 to scan the PCB on the vacuum adsorption platform 9.

[0057] The base 801 is provided with a longitudinal drive mechanism 85, which is connected to the longitudinal slide 821 to drive the longitudinal scanning assembly 82 to move longitudinally. In this embodiment, the longitudinal drive mechanism 85 is a combination of a motor and a conveyor belt mechanism, which has a simple structure and stable operation.

[0058] The longitudinal axis sliding member 821 is provided with a vertical axis driving mechanism 86, which is connected to the vertical axis scanning assembly 83 to drive the vertical axis scanning assembly 83 to slide in the horizontal direction. When the longitudinal axis driving mechanism 85 drives the longitudinal axis sliding member 821 to move in the longitudinal direction, the vertical axis driving mechanism 86 and the vertical axis scanning assembly 83 can be driven to move in the longitudinal direction, thereby enabling the vertical axis scanning assembly 83 to move in the horizontal and longitudinal directions, so as to perform a height scan on a certain position of the PCB, thereby accurately measuring the height of the PCB warping.

[0059] The entire detection module 8 has a reasonable structure and can accurately detect the warping of the PCB.

[0060] The process of PCB automatic warpage detection equipment detecting PCB is as follows.

[0061] In the first step, the PCB is moved to the vacuum adsorption platform 9 by using the PCB automatic feeding device 100. The vacuum adsorption platform 9 is a vacuum adsorption platform and is in a non-suction state.

[0062] More specifically, the buffer adsorption assembly 1 is moved to the top of the upper bin 71 by the transverse driving assembly 3, the vertical driving assembly 2 drives the buffer adsorption assembly 1 to move downward, and the buffer adsorption mechanism 12 is used to adsorb the PCB in the upper bin 71; then the vertical driving assembly 2 drives the buffer adsorption assembly 1 and the PCB to be lifted, and the transverse driving assembly 3 moves the buffer adsorption assembly 1 and the PCB to the top of the vacuum adsorption platform 9; the vertical driving assembly 2 drives the buffer adsorption assembly 1 to move downward, and places the PCB on the vacuum adsorption platform; the buffer adsorption assembly 1 is removed from the top of the vacuum adsorption platform 9.

[0063] In the second step, the warping state of the PCB in its natural state is detected by the detection module 8 to determine whether the PCB is qualified in its natural state.

[0064] First, check whether the PCB is warped. Specifically, the longitudinal scanning component 82 and the transverse scanning component 81 of the detection module 8 are used to scan the PCB in the length and width directions respectively. If the upper surface of the PCB in both directions is straight, and the lower surface of the PCB is parallel to the detection surface, the PCB is not warped, and the detection is qualified, and the PCB automatic feeding device 100 moves the PCB to the qualified bin; otherwise, the PCB is warped. Usually, the PCB has a certain degree of warping, so this step can be omitted, or the upper surface shape is directly used to determine the position of the highest point of the warping.

[0065] Then, the warped PCB is inspected to see whether the highest point of the warping is within a preset height.

[0066] Here, the high point position of the upper surface can be determined based on the PCB upper surface curve scanned by the longitudinal scanning component 82 and the transverse scanning component 81, and then the position of the highest point and the height corresponding to the position can be determined in combination with the vertical scanning component 83.

[0067] In this step, the vacuum adsorption platform 9 is in a closed state without suction. After the PCB is placed on the vacuum adsorption platform 9, no other external force acts on the PCB, so as to detect whether the PCB is warped in a natural state and the highest point of the warping. The specific method for detecting and judging the warping state of the PCB is not limited to this, and various mature scanning methods in the prior art can be used to measure the warping state of the PCB in a natural state.

[0068] Then, the vertical axis scanning assembly 83 is used to detect the highest point of the warping of the PCB in both the length and width directions, and the height of the highest point of the warping is determined to be the first height. The first height is compared with the preset height. In this embodiment, the preset height includes the first preset height and the second preset height, and the first preset height is less than the second preset height. If the first height is less than or equal to the first preset height, the PCB is qualified in the inspection, and the PCB automatic feeding device 100 moves the PCB to the qualified bin; if the first height is greater than the second preset height, the PCB is unqualified in the inspection; if the first height is greater than the first preset height and less than or equal to the second preset height, the next step of inspection is performed.

[0069] In the third step, the buffer adsorption assembly 1 is moved to the top of the vacuum adsorption platform 9 through the lateral drive assembly 3, and the buffer adsorption assembly 1 is driven downward by the vertical drive assembly 2, and a force is applied to the PCB through the corrugated adsorption nozzle 123, so that the warped part of the PCB moves toward the direction close to the vacuum adsorption platform 9, thereby approaching the adsorption hole of the vacuum adsorption platform, so that the vacuum adsorption platform 9 can better apply adsorption force to the PCB.

[0070] The preset force applied to the PCB by the buffer adsorption component 1 is greater than the preset adsorption force of the vacuum adsorption platform 9, so that the PCB is as close to the detection surface as possible.

[0071] In the fourth step, the vacuum adsorption platform 9 is turned on to provide a preset adsorption force to the PCB, and the lateral driving component 3 moves the buffer adsorption component 1 away from the vacuum adsorption platform 9 to remove the force. At this time, the PCB is subjected to the preset adsorption force of the vacuum adsorption platform 9 to simulate the force during PCB installation.

[0072] Step 5: Check whether the warping state of the PCB is qualified again by the detection module 8. The warping state detection method in this step can be the same as that in the previous step 2, and will not be repeated here.

[0073] If the PCB is qualified, the warping of the PCB can be restored to a normal range under the action of a preset adsorption force; if the PCB is unqualified, after removing the action of the buffer adsorption component 1, the warping of the PCB can be restored to a warped state only under the adsorption force of the vacuum adsorption platform 9, that is, its deformation stress is large and it is not convenient for installation.

[0074] In this step, the height of the highest point of the warping is determined as the second height by the detection module 8. The second height is compared with the first preset height. If the second height is less than the first preset height, it indicates that the PCB can change the warping state value within the normal range under the force of the screw during assembly, that is, the PCB is qualified in the detection; otherwise, it indicates that the PCB cannot change the warping state under the force of the screw, or the change of the warping state needs to exceed the force of the screw, and forced installation may cause problems such as screw damage and PCB damage. The PCB is unqualified in the detection, and the PCB automatic feeding device 100 moves the PCB to the elimination bin.

[0075] In this embodiment, a predetermined force is first applied to the PCB through the buffer adsorption component 1, and then an adsorption force is applied to the PCB through the vacuum adsorption platform 9. This can preliminarily simulate the stress on the PCB installation to detect whether the PCB can be assembled on the product, and then detect whether the PCB is qualified.

[0076] In the above embodiment, the vacuum adsorption platform 9 can adopt a mature vacuum adsorption platform in the prior art, and use a plurality of adsorption holes thereon to apply adsorption force to the PCB.

[0077] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A PCB automatic feeding device, characterized in that: It includes a buffer adsorption component, a vertical drive component and a horizontal drive component; The buffer adsorption assembly includes a moving frame and a plurality of buffer adsorption mechanisms, wherein a vacuum air passage is arranged in the moving frame, and each of the buffer adsorption mechanisms includes an adsorption tube, a compression spring and a corrugated adsorption nozzle, wherein the adsorption tube is arranged vertically and is arranged on the moving frame in a vertical sliding manner; the top end of the adsorption tube is connected to the vacuum air passage through a hose, and the bottom end is connected to the top of the corrugated adsorption nozzle; the compression spring is sleeved outside the adsorption tube and is arranged between the moving frame and the bottom end of the adsorption tube, and is used to provide elastic force to move the adsorption tube downward; the bottom of the corrugated adsorption nozzle is used to abut against the PCB; The vertical driving assembly is connected to the moving frame and is used to drive the buffer adsorption assembly to move vertically to pick up and place the PCB; The lateral driving assembly is connected to the vertical driving assembly and is used to drive the buffer adsorption assembly and the PCB to move in the lateral direction.

2. The PCB automatic feeding device according to claim 1, characterized in that: The movable frame includes a column and a flat rod, wherein the column is arranged vertically, and the flat rod is arranged horizontally along the longitudinal direction. The bottom end of the column is fixedly connected to the flat rod. Both the column and the flat rod are hollow structures, and their inner cavities are connected to form the vacuum airway. The top end of the column is connected to the vacuum generator; the buffer adsorption mechanism is connected to the flat rod.

3. The PCB automatic feeding device according to claim 2 is characterized in that: A plurality of connecting plates are arranged at the bottom of the flat rod, and the connecting plates are arranged one by one corresponding to the buffer adsorption mechanism; one end of the connecting plate is fixed to the bottom surface of the flat rod, and the other end protrudes from the side of the flat rod facing the other flat rod, and the adsorption tube is slidably connected to the protruding end of the connecting plate; the compression spring is arranged between the connecting plate and the bottom end of the adsorption tube.

4. The PCB automatic feeding device according to claim 3 is characterized in that: The hose is in an inverted U shape, one end of which is connected to the top of the adsorption tube and the other end is connected to the inner cavity of the flat rod through the top surface of the flat rod; the two arms of the hose are arranged horizontally and are both set vertically.

5. The PCB automatic feeding device according to claim 3, characterized in that: The top outer side of the adsorption tube is threadedly connected with an adjusting nut, and the adjusting nut is located above the connecting plate; a flange is provided at the bottom of the adsorption tube, and the two ends of the compression spring are respectively in contact with the connecting plate and the flange.

6. The PCB automatic feeding device according to any one of claims 2 to 5, characterized in that: The buffer adsorption assembly also includes a mounting plate and a spacing adjustment drive mechanism, the mounting plate is connected to the vertical drive assembly; there are two mobile racks in the buffer adsorption assembly, and the two mobile racks are adjustably connected to the mounting plate along the lateral distance; the spacing adjustment drive mechanism is connected to the mobile rack and is used to adjust the lateral spacing between the two mobile racks; multiple buffer adsorption mechanisms are divided into two groups, which are respectively connected to the flat rods of the two mobile racks; the buffer adsorption mechanisms in each group are arranged longitudinally.

7. The PCB automatic feeding device according to claim 6, characterized in that: The vertical drive assembly includes a vertical plate, a vertical motor and a screw module; the screw module is vertically arranged on the vertical plate and connected to the mounting plate; the vertical plate is parallel to the mounting plate and both are perpendicular to the longitudinal direction, and the screw module is located between the vertical plate and the mounting plate; The vertical motor is arranged at the top of the screw module, and the two are connected in transmission, so as to drive the buffer adsorption assembly to move vertically through the screw module; The lateral drive assembly is connected to the riser.

8. The PCB automatic feeding device according to claim 7, characterized in that: A vacuum manifold block is provided at the top of the vertical plate. The vacuum manifold block is U-shaped as a whole, and includes a manifold arm and two connecting arms. The two connecting arms are arranged in parallel, and one end of each is fixedly connected to the vertical plate, and the other end is respectively fixedly connected to the two ends of the manifold arm; the screw module is located between the two connecting arms; a manifold channel is provided in the manifold arm, and a collecting port is provided at one end of the manifold arm. Two collecting ports are provided on a side of the manifold arm away from the connecting arm, and the collecting port and the two collecting ports are both connected to the manifold channel, and the collecting port is connected to the vacuum generator through a first pipeline, and the two collecting ports are respectively connected to the tops of the two columns through second pipelines, and are connected to the vacuum air duct; the vacuum generator is fixed to the vertical plate.

9. A PCB automatic warpage detection device, characterized in that: It comprises a frame, a detection device, a loading bin, a unloading bin and the PCB automatic loading device according to any one of claims 1 to 8; The loading bin, the detection device and the lowering bin are sequentially arranged on the frame in a transverse direction, and are all located below the PCB automatic loading device.

10. The PCB automatic warpage detection device according to claim 9, characterized in that: The frame is provided with a base, and the detection device comprises a vacuum adsorption platform and a detection module; the vacuum adsorption platform is provided on the base for carrying the PCB; the detection module is provided on the base for scanning and detecting the PCB on the vacuum adsorption platform.

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