A double-chamber magnetron sputtering coating equipment

Abstract

The utility model discloses a double-layer chamber magnetron sputtering coating equipment, comprising: a chamber door, a first chamber, a second chamber, an argon gas bottle, a diffusion pump, a vacuum pump, and a water chiller; the first chamber comprises: a first shell, an air inlet pipe, a vacuum valve, and a pressure relief valve; the second chamber comprises: a second shell, a mounting column, a magnet, a rotating disk, a bearing platform for bearing a substrate, and a target material platform for mounting a target material; the mounting column is fixedly connected to the first shell and the second shell; the magnet is fixedly mounted on the top of the second shell; the bearing platform is fixedly connected to the rotating disk; the double-layer coating chamber adopted by the utility model utilizes the temperature difference between the first chamber and the second chamber during the coating process to increase the contact rate between the plasma and the substrate, improve the deposition rate of target atoms, improve the coating efficiency, and reduce the consumption of argon gas.

Description

Technical Field

[0001] The utility model relates to the field of magnetron sputtering coating equipment, in particular to a double-chamber magnetron sputtering coating equipment. Background Art

[0002] Magnetron sputtering is a physical vapor deposition (PVD) process widely used in industrial coating. The core of this technology is to use magnetic fields to control the behavior of charged ion particles to achieve high-efficiency and high-quality thin film deposition.

[0003] In the magnetron sputtering process, the target material needs to be placed in a vacuum chamber filled with an inert gas (such as argon) and a DC voltage is applied between the metal target and the substrate on which the film is to be deposited. The voltage causes the gas to decompose into Ar+ ions and electrons, forming a glow discharge. The positively charged ions are accelerated and bombard the target material. The ionized positive ions will accelerate to move toward the cathode (target material) and bombard the surface of the target material with high energy, causing the target atoms or molecules to be sputtered out and eventually deposited on the substrate to form a thin film. In the prior art, a single coating chamber is generally used for magnetron sputtering coating. During the coating process, argon gas needs to be continuously filled to ensure the ionization rate. The consumption of argon gas is relatively large. Due to the space limitation of a single coating chamber, the coating rate and film quality are limited. In addition, it is difficult for a single chamber structure to effectively control the temperature distribution in the chamber during the coating process, which may lead to uneven deposition of the film, affecting the performance and application of the film. Utility Model Content

[0004] In view of the above problems, the utility model provides a double-chamber magnetron sputtering coating device, comprising: a chamber door, a first chamber, a second chamber, an argon gas bottle, a diffusion pump for diffusing argon in the argon gas bottle, a vacuum pump for providing a vacuum environment for the first chamber and the second chamber, and a water chiller for adjusting the temperature of the first chamber; the cold end of the water chiller is fixedly connected to the first shell; the first chamber comprises: a first shell, an air inlet pipe, a vacuum valve, and a pressure relief valve; the air inlet pipe and the argon gas bottle are airtightly connected to the diffusion pump; the vacuum valve is airtightly connected to the vacuum pump; the air inlet pipe, the pressure relief valve, and the vacuum valve are airtightly connected to the first shell; the second chamber comprises: a second shell, a mounting column, an electrode plate, a permanent magnet group, a rotating disk, a bearing platform for bearing a substrate, and a target platform for mounting a target material; the mounting column is fixedly connected to the first shell and the second shell; the electrode plate is respectively fixed to the top and bottom of the second shell; the permanent magnet group is fixedly mounted on the electrode plate; and the bearing platform is fixedly connected to the rotating disk.

[0005] In this technical solution, the user first places the substrate on the carrier platform and the target on the target platform; then closes the chamber door; turns on the vacuum pump, and when the first chamber and the second chamber reach the vacuum condition, turns on the argon gas bottle and the diffusion pump, and the argon gas enters and fills the first chamber and the second chamber through the air inlet pipe; applies a DC voltage to the electrode plate, and the voltage ionizes the argon gas into argon ions and free electrons to form a glow discharge, and the positively charged argon ions are accelerated and collide with the target and sputter target atoms; the permanent magnet is placed at the center of the target material, and the remaining permanent magnets are placed at the edge of the target material, and a magnetic field is generated at the position of the target material, which increases the residence time of electrons in the substrate argon plasma; the target atoms are deposited on the surface of the substrate under the action of the electric field; heat is generated in the process of the bombarded target material and the deposited substrate, and the temperature of the second chamber rises; the temperature of the first chamber is regulated by the ice water machine and is relatively low; the plasma in the second chamber will diffuse to the first chamber; the contact rate between the plasma and the substrate is increased, and the deposition rate of the target atoms is improved.

[0006] In a specific embodiment, a spherical adjustment rod is provided at the bottom of the supporting platform.

[0007] In this technical solution, the spherical adjustment rod allows the user to adjust the angle orientation of the support platform, which helps the user to adjust a suitable coating angle.

[0008] In a specific embodiment, the target platform is provided with a quick-tightening screw.

[0009] In this technical solution, the quick-tightening screws enable users to quickly replace target materials, thereby enhancing the versatility and convenience of the equipment.

[0010] In a specific embodiment, the device further comprises a gas control system.

[0011] In this technical solution, the double-layer coating chamber improves the contact rate between the plasma and the substrate, and also allows the argon molecules to diffuse more fully in the coating chamber. The gas control system can detect the vacuum rate in the coating chamber and control the flow rate of the argon bottle, thereby reducing the consumption of the argon gas.

[0012] In a specific embodiment, the cavity door panel is made of a transparent material.

[0013] In this technical solution, the panel of the chamber door is made of transparent material, which is beneficial for the user to observe the coating condition in the coating chamber.

[0014] In a specific embodiment, a plurality of the supporting platforms distributed in an annular shape are mounted on the rotating disk.

[0015] In this technical solution, the rotating disk is used to increase the contact rate between the substrate and the target atoms; a plurality of the supporting platforms can be carried on the rotating disk at the same time, thereby improving the coating efficiency of the equipment.

[0016] In a specific embodiment, a mesh air inlet hole is provided on the second shell.

[0017] In this technical solution, the mesh air inlet holes are beneficial to the mutual diffusion of the plasma in the first chamber and the second chamber.

[0018] The beneficial effects of the utility model are as follows: the double-layer coating chamber adopted by the utility model utilizes the temperature difference between the first chamber and the second chamber during the coating process to increase the contact rate between the plasma and the substrate, improve the deposition rate of the target atoms, and improve the coating efficiency; reduce the consumption of argon gas; multiple carriers can be carried on the rotating disk, increasing the coating speed and coating uniformity of the magnetron sputtering coating equipment; the quick-tightening screws of the target platform improve the efficiency of users replacing the target. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a front view of the overall structure of a double-chamber magnetron sputtering coating device in a specific implementation of the utility model;

[0020] Figure 2 It is a bottom view of the first chamber structure of a double-chamber magnetron sputtering coating device in a specific implementation of the utility model;

[0021] Figure 3 It is a schematic diagram of the second chamber structure of a double-chamber magnetron sputtering coating device in a specific implementation of the utility model.

[0022] Figure 4 This is a detailed front view of the second chamber of a double-chamber magnetron sputtering coating device in a specific implementation of the utility model.

[0023] Figure 5 This is a schematic diagram of a magnetron sputtering device for double-chamber magnetron sputtering coating in a specific implementation of the utility model. DETAILED DESCRIPTION

[0024] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0025] like Figure 1-Figure 5A double-chamber magnetron sputtering coating device provided in the first embodiment of the utility model includes: a chamber door 100, a first chamber 200, a second chamber 300, an argon gas bottle 400, a diffusion pump 500 for diffusing argon gas in the argon gas bottle 400, a vacuum pump 600 for providing a vacuum environment for the first chamber 200 and the second chamber 300, and a chiller 700 for adjusting the temperature of the first chamber 200; the cold end 701 of the chiller 700 is fixedly connected to the first shell 2001; the first chamber 200 includes: a first shell 2001, an air inlet pipe 2002, a vacuum valve 2003, and a pressure relief valve 2004; the air inlet pipe 2002 and the argon gas bottle 400 are airtightly connected to the diffusion pump 500; the vacuum valve 200 3 is airtightly connected to the vacuum pump 600; the air inlet pipe 2002, the pressure relief valve 2004, and the vacuum valve 2003 are airtightly connected to the first shell 2001; the second chamber 300 includes: a second shell 3001, a mounting column 3002, an electrode plate 3003, a permanent magnet group 3004, a rotating disk 3005, a carrier 3006 for carrying a substrate, and a target material table 3007 for mounting a target material; the mounting column 3002 is fixedly connected to the first shell 2001 and the second shell 3001; the electrode plate 3003 is respectively fixed to the top and bottom of the second shell 3001; the permanent magnet group 3004 is fixedly installed on the electrode plate 3003; the carrier 3006 is fixedly connected to the rotating disk 3005.

[0026] In this embodiment, the user first places the substrate on the carrier 3006 and the target on the target platform 3007; then closes the chamber door 100; turns on the vacuum pump 600, and when the first chamber 200 and the second chamber 300 reach the vacuum condition, turns on the argon bottle 400 and the diffusion pump 500, and the argon enters through the inlet pipe 2002 and fills the first chamber 200 and the second chamber 300; applies a DC voltage to the electrode plate 3003, and the voltage ionizes the argon into argon ions and free electrons, forming a glow discharge, and the positively charged argon ions are accelerated and collide with the target and sputter the target atoms; the permanent A magnet is placed at the center of the target material, and the remaining permanent magnets are placed at the edges of the target material, generating a magnetic field at the position of the target material, thereby increasing the residence time of electrons in the argon plasma of the substrate; the target atoms are deposited on the surface of the substrate under the action of the electric field; heat is generated during the bombardment of the target material and the deposition of the substrate, and the temperature of the second chamber 300 rises; the temperature of the first chamber 200 is regulated by the ice machine 700 and is relatively low; the plasma in the second chamber 300 diffuses to the first chamber 200; the contact rate between the plasma and the substrate is increased, and the deposition rate of the target atoms is improved.

[0027] Furthermore, a spherical adjustment rod 3013 is provided at the bottom of the support platform 3006. The spherical adjustment rod 3013 facilitates the user to adjust the angle direction of the support platform 3006, which is helpful for the user to adjust a suitable coating angle.

[0028] In this embodiment, the target platform 3007 is provided with a quick-tightening screw 3014. The quick-tightening screw 3014 is used by the user to quickly replace the target material, thereby enhancing the versatility and convenience of the equipment.

[0029] Furthermore, the device also includes a gas control system; the double-layer coating chamber improves the contact rate between the plasma and the substrate, and also allows the argon molecules to diffuse more fully in the coating chamber. The gas control system can detect the vacuum rate in the coating chamber and control the flow rate of the argon bottle 400, thereby reducing the consumption of the argon gas.

[0030] In this embodiment, the panel material of the chamber door 100 is a transparent material; the panel of the chamber door 100 is a transparent material, which is beneficial for the user to observe the coating condition in the coating chamber.

[0031] In this embodiment, a plurality of the carriers 3006 distributed in an annular shape are installed on the rotating disk 3005; the rotating disk 3005 is used to increase the contact rate between the substrate and the target atoms; a plurality of the carriers 3006 can be carried on the rotating disk 3005 at the same time, thereby improving the coating efficiency of the equipment.

[0032] In this embodiment, a mesh air inlet hole is provided on the second shell 3001 ; the mesh air inlet hole is beneficial to the mutual diffusion of the plasma in the first chamber 200 and the second chamber 300 .

[0033] The preferred specific embodiments of the utility model are described in detail above. It should be understood that ordinary technicians in this field can make many modifications and changes based on the concept of the utility model without creative work. Therefore, all technical solutions that can be obtained by technicians in this technical field based on the concept of the utility model through logical analysis, reasoning or limited experiments on the basis of the existing technology should be within the scope of protection determined by the claims.

Claims

1. A double-chamber magnetron sputtering coating device, characterized in that: include: A chamber door, a first chamber, a second chamber, an argon gas bottle, a diffusion pump for diffusing the argon gas in the argon gas bottle, a vacuum pump for providing a vacuum environment for the first chamber and the second chamber, and a water chiller for adjusting the temperature of the first chamber; the first chamber comprises: a first shell, an air inlet pipe, a vacuum valve, and a pressure relief valve; the cold end of the water chiller is fixedly connected to the first shell; the air inlet pipe and the argon gas bottle are airtightly connected to the diffusion pump; the vacuum valve is airtightly connected to the vacuum pump; the air inlet pipe, the pressure relief valve, and the vacuum valve are airtightly connected to the first shell; the second chamber comprises: a second shell, a mounting column, an electrode plate, a permanent magnet group, a rotating disk, a bearing platform for bearing a substrate, and a target platform for mounting a target material; the mounting column is fixedly connected to the first shell and the second shell; the electrode plate is respectively fixed to the top and bottom of the second shell; the permanent magnet group is fixedly mounted on the electrode plate; the bearing platform is fixedly connected to the rotating disk.

2. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: A spherical adjusting rod is provided at the bottom of the bearing platform.

3. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: The target platform is provided with quick-tightening screws.

4. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: The apparatus also includes a gas control system.

5. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: The cavity door panel is made of transparent material.

6. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: A plurality of annularly distributed supporting platforms are mounted on the rotating disk.

7. A double-chamber magnetron sputtering coating device as claimed in claim 1, characterized in that: The second shell is provided with a mesh air inlet hole.

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