Vacuum Plate

Abstract

The present application discloses a temperature equalizing plate according to an embodiment of the present application, comprising: an upper cover, the upper cover forms a first concave cavity, the first concave cavity is used for the flow of gaseous working medium; a first capillary structure, the first capillary structure is provided with a through hole, the through hole is used for the flow of gaseous working medium; a lower cover, connected to the upper cover, the lower cover forms a second concave cavity, the first capillary structure is laid in the second concave cavity, and the through hole is connected to the first concave cavity. By forming a through hole on the first capillary structure, part of the space in the second concave cavity is used as a space for the flow of gaseous working medium, the first concave cavity and the through hole together form a steam cavity for the flow of gaseous working medium, and the height of the steam cavity is increased by the through hole, avoiding the problem of slow flow of gaseous working medium caused by the steam cavity being too short. As a result, the height of the steam cavity is the sum of the depth of the second concave cavity and the depth of the through hole, so that the temperature equalizing plate of the present application can be made thinner, and the wall thickness of the upper cover and the lower cover is within the normal strength range, and does not affect the flow of gaseous working medium.

Description

Technical Field

[0001] The present application relates to a heat dissipation structure, and in particular to a temperature homogenizing plate. Background Art

[0002] The temperature equalizer can achieve heat exchange with the heat source through the evaporation and condensation of the working fluid inside it. In the related art, the temperature equalizer includes an upper cover and a lower cover, the lower cover forms a liquid cavity for the flow of liquid working fluid, and the upper cover forms a steam cavity for the flow of gaseous working fluid. When the wall thickness of the upper cover and the lower cover is too thin, the upper cover and the lower cover will be insufficient in strength, easy to dent and deform, and affect the performance. When the height of the steam cavity in the upper cover is small, the steam resistance received by the gaseous working fluid will be greater than the steam pressure that drives it to flow, resulting in the gaseous working fluid being difficult to flow or flowing slowly. Therefore, in order to ensure the normal flow of the gaseous working fluid, the height of the steam cavity needs to be greater than or equal to 1mm. At the same time, in order to ensure the wall thickness of the upper cover and the lower cover, the thickness of the temperature equalizer needs to be greater than or equal to 0.25mm. That is, when the thickness of the temperature equalizer is less than 0.25, the working fluid in the temperature equalizer flows slowly, resulting in poor heat dissipation effect. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a temperature averaging plate, which can ensure the normal flow of gaseous working medium when the temperature averaging plate is relatively thin.

[0004] The temperature homogenizing plate according to the embodiment of the present application includes:

[0005] An upper cover, wherein the upper cover forms a first concave cavity, and the first concave cavity is used for the flow of gaseous working medium;

[0006] A first capillary structure, wherein the first capillary structure is provided with a through hole, and the through hole is used for the flow of a gaseous working medium;

[0007] The lower cover is connected to the upper cover, the lower cover forms a second concave cavity, the first capillary structure is laid in the second concave cavity, and the through hole is connected to the first concave cavity.

[0008] The temperature equalizer according to the embodiment of the present application has at least the following beneficial effects: by forming a through hole on the first capillary structure, part of the space in the second cavity is used as a space for the flow of the gaseous working medium, the first cavity and the through hole together form a steam cavity for the flow of the gaseous working medium, and the height of the steam cavity is increased by the through hole, thereby avoiding the problem of slow flow of the gaseous working medium caused by the steam cavity being too short. Therefore, the height of the steam cavity is the sum of the depth of the second cavity and the depth of the through hole, so that the temperature equalizer of the present application can be made thinner, the wall thickness of the upper cover and the lower cover is within the normal strength range, and it does not affect the flow of the gaseous working medium.

[0009] According to some embodiments of the present application, a second support column is provided on the bottom wall of the second concave cavity, and the second support column is provided corresponding to the through hole and penetrates into the through hole; a first support column is provided on the bottom wall of the first concave cavity, and part of the first support column abuts against a side of the first capillary structure away from the lower cover, and part of the first support column abuts against the second support column penetrated into the through hole.

[0010] According to some embodiments of the present application, a second capillary structure is disposed in the first cavity of the upper cover, and along the thickness direction of the temperature homogenizing plate, the second capillary structure does not overlap with a projection of the through hole.

[0011] According to some embodiments of the present application, the first capillary structure is mesh-shaped.

[0012] According to some embodiments of the present application, the second capillary structure is a groove formed by etching the bottom wall of the first cavity.

[0013] According to some embodiments of the present application, the height of the first support column is consistent with the depth of the first cavity; the height of the second support column is consistent with the depth of the second cavity.

[0014] According to some embodiments of the present application, the thickness of the temperature homogenizing plate is ≤0.25 mm, and the sum of the depth of the through hole and the depth of the first cavity is ≥0.1 mm.

[0015] According to some embodiments of the present application, the thickness of the upper cover is 0.1 to 0.13 mm, and the thickness of the lower cover is 0.1 to 0.12 mm.

[0016] According to some embodiments of the present application, the depth of the first cavity is ≥0.05 mm, and the depth of the second cavity is ≥0.05 mm.

[0017] According to some embodiments of the present application, the through hole is opened in the middle of the first capillary structure, and there is only one through hole.

[0018] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0020] Figure 1 An exploded view of a temperature homogenizing plate according to an embodiment of the present application;

[0021] Figure 2 An exploded view of the temperature vapor chamber of the embodiment of the present application from another perspective;

[0022] Figure 3 A cross-sectional view of a temperature homogenizing plate according to an embodiment of the present application;

[0023] Figure 4 for Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 for Figure 3 Enlarged view of point B in the middle.

[0025] Reference numerals:

[0026] Upper cover 100, first concave cavity 110, first support column 120, second capillary structure 130;

[0027] A first capillary structure 200 and a through hole 210;

[0028] Lower cover 300, second concave cavity 310, second support column 320;

[0029] Steam chamber 400. DETAILED DESCRIPTION

[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0031] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0033] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0034] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0035] Reference Figures 1 to 5 According to an embodiment of the present application, the temperature vapor chamber includes:

[0036] An upper cover 100, wherein the upper cover 100 forms a first concave cavity 110, and the first concave cavity 110 is used for the flow of gaseous working medium;

[0037] A first capillary structure 200, wherein the first capillary structure 200 is provided with a through hole 210, and the through hole 210 is used for the flow of a gaseous working medium;

[0038] The lower cover 300 is connected to the upper cover 100 . The lower cover 300 forms a second cavity 310 . The first capillary structure 200 is laid in the second cavity 310 . The through hole 210 is connected to the first cavity 110 .

[0039] It is understandable that the upper cover 100 and the lower cover 300 are connected to form a cover body, and the interior of the cover body is used to fill the working medium. The lower cover 300 is in contact with the heat source, and the heat source exchanges heat with the liquid working medium in the second concave cavity 310, and the liquid working medium vaporizes and absorbs heat and becomes a gaseous working medium. Since a through hole 210 is provided on the first capillary structure 200, the resistance at the through hole 210 is small, and under the guidance of the first capillary structure 200, the gaseous working medium will flow toward the through hole 210, and flow through the through hole 210 to the first concave cavity 110 of the upper cover 100. The gaseous working medium exchanges heat with the air outside the upper cover 100, and the gaseous working medium liquefies and dissipates heat to become a liquid working medium. Under the capillary action of the first capillary structure 200, the liquid working medium flows back to the second concave cavity 310 to complete the cycle.

[0040] It should be understood that by forming a through hole 210 on the first capillary structure 200, part of the space in the second cavity 310 is used as a space for the flow of the gaseous working medium, and the first cavity 110 and the through hole 210 together form a steam cavity 400 for the flow of the gaseous working medium. The through hole 210 is used to increase the height of the steam cavity 400, thereby avoiding the problem of slow flow of the gaseous working medium due to the steam cavity 400 being too short.

[0041] Therefore, the height of the steam chamber 400 is the sum of the depth of the second cavity 310 and the depth of the through hole 210 (the depth of the second cavity 310), so that the temperature equalizing plate of the present application can be made thinner, and the wall thickness of the upper cover 100 and the lower cover 300 is within the normal strength range and does not affect the flow of the gaseous working medium.

[0042] Specifically, the first cavity 110 and the second cavity 310 are formed by etching the upper cover 100 and the lower cover 300 , respectively.

[0043] Reference Figures 1 to 5 According to some embodiments of the present application, the bottom wall of the second cavity 310 is provided with a second support column 320, the second support column 320 is provided corresponding to the through hole 210 and penetrates into the through hole 210; the bottom wall of the first cavity 110 is provided with a first support column 120, referring to Figure 5 , part of the first support column 120 abuts against a surface of the first capillary structure 200 away from the lower cover 300, referring to Figure 4 , and part of the first support column 120 abuts against the second support column 320 that penetrates into the through hole 210 .

[0044] It can be understood that by setting the second support column 320 and the first support column 120, the strength of the upper cover 100 and the lower cover 300 is improved to avoid depression. Specifically, the second support column 320 is set corresponding to the through hole 210, and the second support column 320 passes through the first capillary structure 200 through the through hole 210, so that the height position of the first capillary structure 200 laid in the second cavity 310 will not be affected by the second support column 320, and the second support column 320 is prevented from increasing the thickness of the temperature equalizing plate of the present application. There are multiple first support columns 120, some of which are in contact with the second support columns 320 passing through the through hole 210, and some of which are in contact with one side of the first capillary structure 200, so that the upper cover 100 and the lower cover 300 support each other, thereby preventing the upper cover 100 and the lower cover 300 from being depressed. Furthermore, the first capillary structure 200 is limited by the second supporting column 320 , and the first capillary structure 200 is pressed by the first supporting column 120 , so as to fix the first capillary structure 200 .

[0045] Reference Figure 2 According to some embodiments of the present application, a second capillary structure 130 is disposed in the first cavity 110 of the upper cover 100 , and along the thickness direction of the temperature homogenizing plate, the projection of the second capillary structure 130 and the through hole 210 do not overlap.

[0046] It is understandable that the reflux speed of the working medium is increased by adding the second capillary structure 130 to the upper cover 100 , and the second capillary structure 130 is staggered with the through hole 210 to prevent the second capillary structure 130 from affecting the height of the steam chamber 400 .

[0047] Reference Figure 2 According to some embodiments of the present application, the second capillary structure 130 is a groove formed by etching the bottom wall of the first cavity 110 .

[0048] It can be understood that the second capillary structure 130 is prevented from affecting the height of the temperature equalizing plate by etching the groove.

[0049] Reference Figure 1 According to some embodiments of the present application, the first capillary structure 200 is mesh-shaped.

[0050] It can be understood that the first capillary structure 200 is stainless steel or titanium mesh.

[0051] Reference Figures 3 to 5 According to some embodiments of the present application, the height of the first support column 120 is consistent with the depth of the first cavity 110 ; the height of the second support column 320 is consistent with the depth of the second cavity 310 .

[0052] It is understandable that the height of the first support column 120 is consistent with the depth of the first cavity 110, and the height of the second support column 320 is consistent with the depth of the second cavity 310, so that when the upper cover 100 and the lower cover 300 are closed and connected, the first support column 120 and the second support column 320 are ensured to be connected.

[0053] Specifically, the thickness of the first capillary structure 200 is also consistent with the depth of the second cavity 310, so as to ensure that when the upper cover 100 and the lower cover 300 are closed and connected, the first support column 120 abuts against the first capillary structure 200. Alternatively, the thickness of the first capillary structure 200 is greater than the depth of the second cavity 310, and the first capillary structure 200 has a certain degree of deformability. When the first support column 120 presses the first capillary structure 200, the first capillary structure 200 can be better fixed in the second cavity 310.

[0054] According to some embodiments of the present application, the thickness of the temperature homogenizing plate is ≤0.25 mm, and the sum of the depth of the through hole 210 and the depth of the first cavity 110 is ≥0.1 mm.

[0055] It is understandable that the temperature equalizing plate of the present application can be manufactured to a thickness of ≤0.25mm, and by ensuring that the sum of the depth of the through hole 210 and the depth of the first cavity 110 is ≥0.1mm, that is, the height of the steam cavity 400 is ensured to be ≥0.1mm, the gaseous working medium can flow normally.

[0056] According to some embodiments of the present application, the thickness of the upper cover 100 is 0.1 to 0.13 mm, and the thickness of the lower cover 300 is 0.1 to 0.12 mm.

[0057] It is understandable that the upper cover 100 can be made thicker so as to further increase the volume and depth of the first cavity 110 , which is beneficial to the flow of the gaseous working medium.

[0058] According to some embodiments of the present application, the depth of the first cavity 110 is ≥ 0.05 mm, and the depth of the second cavity 310 is ≥ 0.05 mm.

[0059] It can be understood that the thickness of the upper cover 100 is 0.1 to 0.13 mm, the thickness of the lower cover 300 is 0.1 to 0.12 mm, the depth of the first cavity 110 is ≥0.05 mm, and the depth of the second cavity 310 is ≥0.05 mm, so as to ensure that the thickness of the temperature equalizing plate is ≤0.25 mm, and the height of the steam cavity 400 is ≥0.1 mm.

[0060] For example, the depth of the first cavity 110 is 0.05 mm and the depth of the second cavity 310 is 0.05 mm, wherein the depth of the through hole 210 is consistent with the depth of the second cavity 310, so as to ensure that the overall height of the steam cavity 400 is 0.01 mm. Thus, the wall thickness of the upper cover 100 is 0.05 to 0.08 mm, and the wall thickness of the lower cover 300 is 0.05 to 0.07 mm, so as to ensure the strength of the upper cover 100 and the lower cover 300. Specifically, the depth of the first cavity 110 and the depth of the second cavity 310 can also be made to be 0.07 mm to increase the overall height of the steam cavity 400, so as to improve the fluidity of the gaseous working medium, then the wall thickness of the upper cover 100 is 0.03 to 0.06 mm, and the wall thickness of the lower cover 300 is 0.03 to 0.05 mm.

[0061] Reference Figure 1 and Figure 2 According to some embodiments of the present application, the through hole 210 is opened in the middle of the first capillary structure 200 , and there is only one through hole 210 .

[0062] It is understandable that the through hole 210 is opened in the middle of the first capillary structure 200, which is conducive to the liquid working medium in the second cavity 310 to be vaporized to form a gaseous working medium and then flow to the through hole 210 more quickly. It should be noted that only one through hole 210 is provided, which can reduce the steam resistance and facilitate the flow of the gaseous working medium.

[0063] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A temperature equalizing plate, characterized in that: include: An upper cover, wherein the upper cover forms a first concave cavity, and the first concave cavity is used for the flow of gaseous working medium; A first capillary structure, wherein the first capillary structure is provided with a through hole, and the through hole is used for the flow of a gaseous working medium; The lower cover is connected to the upper cover, the lower cover forms a second concave cavity, the first capillary structure is laid in the second concave cavity, and the through hole is connected to the first concave cavity.

2. The temperature equalizing plate according to claim 1, characterized in that: The bottom wall of the second concave cavity is provided with a second support column, which is provided corresponding to the through hole and penetrates into the through hole; the bottom wall of the first concave cavity is provided with a first support column, part of the first support column abuts against a side of the first capillary structure away from the lower cover, and part of the first support column abuts against the second support column penetrated into the through hole.

3. The temperature homogenizing plate according to claim 1, characterized in that: A second capillary structure is disposed in the first concave cavity of the upper cover, and along the thickness direction of the temperature homogenizing plate, the second capillary structure does not overlap with a projection of the through hole.

4. The temperature equalizing plate according to claim 1, characterized in that: The first capillary structure is in a mesh shape.

5. The temperature homogenizing plate according to claim 3, characterized in that: The second capillary structure is a groove formed by etching the bottom wall of the first cavity.

6. The temperature equalizing plate according to claim 2, characterized in that: The height of the first support column is consistent with the depth of the first cavity; the height of the second support column is consistent with the depth of the second cavity.

7. The temperature homogenizing plate according to claim 1, characterized in that: The thickness of the temperature homogenizing plate is ≤0.25 mm, and the sum of the depth of the through hole and the depth of the first cavity is ≥0.1 mm.

8. The temperature equalizing plate according to claim 7, characterized in that: The thickness of the upper cover is 0.1 to 0.13 mm, and the thickness of the lower cover is 0.1 to 0.12 mm.

9. The temperature equalizing plate according to claim 8, characterized in that: The depth of the first cavity is ≥0.05mm, and the depth of the second cavity is ≥0.05mm.

10. The temperature homogenizing plate according to claim 1, characterized in that: The through hole is opened in the middle of the first capillary structure, and there is only one through hole.

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