A semiconductor thermal distribution test system

Abstract

The utility model discloses a semiconductor thermal distribution test system, including a test chamber, a synchronous belt arranged transversely inside the test chamber, the conveying start and conveying end of the synchronous belt are both located outside the test chamber, the synchronous belt is wound on two synchronous pulleys, the two synchronous pulleys are distributed on the left and right sides of the test chamber, and a plurality of equally spaced load holes are opened on the synchronous belt; a conductive table is provided in the middle of the inner cavity of the test chamber, the conductive table is installed on the upper surface of a support block, the periphery of the support block is fixedly connected to the inner wall of the test chamber, and the conductive table is connected to a power supply heating system; a thermal imaging device is fixedly installed on the top of the inner cavity of the test chamber, and two symmetrically arranged swing arms are installed on the upper part of the inner cavity of the test chamber. The semiconductor thermal distribution test system provided by the utility model can realize automatic transmission and clamping of semiconductor devices, significantly improve the efficiency of testing, and facilitate uninterrupted testing of batch semiconductor devices.

Description

Technical Field

[0001] The utility model relates to a semiconductor heat distribution test system, belonging to the technical field of heat testing. Background Art

[0002] Semiconductor devices are accompanied by many failures and malfunctions during use, and the culprit of these problems is the heating problem of semiconductor devices. Uneven heating of semiconductor devices often becomes the reason for their reduced function or even failure, and the temperature and temperature field distribution of semiconductor devices have always been difficult to detect in existing technologies, hindering the development of the semiconductor industry.

[0003] Patent No. CN202223013080.3 discloses a high-power semiconductor chip thermal distribution test system, including a power heating system and a thermal imager searchlight system. The power heating system includes a high-voltage, low-current heating power supply and a low-voltage, high-current heating power supply. The power heating system is connected to the thermal imager searchlight system. The thermal imager searchlight system includes a thermal imager fixing mechanism, a box, a chip clamping mechanism, and a safety protection door mechanism. The power heating system provides the heating power required for the tested chip in the thermal imager searchlight system. The thermal imager searchlight system is a platform that provides clamping and thermal imager searchlighting for the tested chip.

[0004] The thermal distribution test system disclosed in the above patent has the following shortcomings during use: manually taking and placing semiconductor devices into the test box, and manually clamping the semiconductor devices in place, resulting in low test efficiency and being unfavorable for uninterrupted testing of batch semiconductor devices.

[0005] In summary, the existing technology obviously has inconveniences and defects in practical use, so it is necessary to improve it. Utility Model Content

[0006] The utility model aims at the deficiencies in the background technology and provides a semiconductor thermal distribution testing system, which can realize automatic transmission and clamping of semiconductor devices, significantly improve the testing efficiency and facilitate uninterrupted testing of batch semiconductor devices.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A semiconductor heat distribution test system includes a test chamber, wherein a synchronous belt is arranged transversely inside the test chamber, and a conveying start end and a conveying end end of the synchronous belt are both located outside the test chamber;

[0009] The synchronous belt is wound on two synchronous pulleys, which are distributed on the left and right sides of the test chamber, and a plurality of loading holes are opened on the synchronous belt at equal intervals;

[0010] A conductive platform is provided in the middle of the inner cavity of the test chamber, the conductive platform is installed on the upper surface of the support block, the periphery of the support block is fixedly connected to the inner wall of the test chamber, and the conductive platform is connected to the power supply heating system;

[0011] A thermal imaging device is fixedly installed on the top of the inner cavity of the test chamber, and two symmetrically arranged swing arms are installed on the upper part of the inner cavity of the test chamber.

[0012] Furthermore, the test chamber is installed above the fixed platform, and upper openings and lower openings are provided on the left and right side walls of the test chamber. The upper opening is used for the lateral penetration of the upper part of the synchronous belt body, and the lower opening is used for the lateral penetration of the lower part of the synchronous belt body.

[0013] Furthermore, the synchronous belt pulley is connected to the outer wall of the test chamber through a support arm, and the support arm rotatably supports the synchronous belt pulley, and one of the synchronous belt pulleys is connected to the stepper motor.

[0014] Furthermore, the thermal imaging device is located directly above the conductive platform.

[0015] Furthermore, the loading hole is a stepped structure.

[0016] Furthermore, a boss is provided on the conductive platform.

[0017] Furthermore, the top end of the swing arm is connected to the top wall of the test chamber via a hinge, and a pressure claw is fixedly mounted on the bottom end of the swing arm.

[0018] Furthermore, a horizontally arranged telescopic cylinder is installed between the two swing arms, and the head and tail of the telescopic cylinder are both hingedly connected to the swing arm.

[0019] Furthermore, an observation window is provided on the side of the test chamber.

[0020] Compared with the prior art, the utility model has the following advantages after adopting the above technical solution:

[0021] The semiconductor device to be tested is conveyed by the synchronous belt, and the semiconductor device is automatically conveyed to the top of the conductive table. The telescopic cylinder drives the two swing arms to swing downward, so that the pressing claw automatically fixes the semiconductor device on the conductive table to complete the clamping. After the test is completed, the semiconductor device is output with the synchronous belt. The utility model can significantly improve the efficiency of the test and is conducive to the uninterrupted test of batch semiconductor devices.

[0022] The utility model is described in detail below with reference to the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the utility model;

[0024] Figure 2It is a schematic diagram of the internal structure of the utility model;

[0025] Figure 3 It is a schematic diagram of the connection between the swing arm and the pressure claw.

[0026] In the figure, 1-test chamber, 2-fixed platform, 3-synchronous belt, 4-upper opening, 5-lower opening, 6-synchronous pulley, 7-support arm, 8-carrying hole, 9-semiconductor device, 10-conductive table, 11-support block, 12-thermal imaging device, 13-swing arm, 14-hinge, 15-telescopic cylinder, 16-pressure claw. DETAILED DESCRIPTION

[0027] In order to have a clearer understanding of the technical features, purposes and effects of the utility model, the specific implementation methods of the utility model are now described with reference to the accompanying drawings.

[0028] like Figure 1-Figure 3 As shown together, the utility model provides a semiconductor thermal distribution test system, including a test chamber 1, which is installed above a fixed platform 2, and a horizontally arranged synchronous belt 3 is provided inside the test chamber 1, and the conveying start end and the conveying end end of the synchronous belt 3 are both located outside the test chamber 1.

[0029] The left and right side walls of the test chamber 1 are both provided with an upper opening 4 and a lower opening 5 . The upper opening 4 is used for the upper part of the main body of the synchronous belt 3 to pass through laterally, and the lower opening 5 is used for the lower part of the main body of the synchronous belt 3 to pass through laterally.

[0030] The synchronous belt 3 is wound around two synchronous pulleys 6, which are distributed on the left and right sides of the test chamber 1. The synchronous pulleys 6 are connected to the outer wall of the test chamber 1 through support arms 7, and the support arms 7 support the synchronous pulleys 6 for rotation. One of the synchronous pulleys 6 is connected to a stepper motor.

[0031] The synchronous belt 3 is provided with a plurality of equally spaced holes 8 , the holes 8 being a stepped structure, and the holes 8 are used for placing semiconductor devices 9 .

[0032] A conductive platform 10 is provided in the middle of the inner cavity of the test chamber 1 . The conductive platform 10 is installed on the upper surface of a support block 11 . The periphery of the support block 11 is fixedly connected to the inner wall of the test chamber 1 .

[0033] The conductive platform 10 is connected to a power heating system, and the power heating system provides heating power required for generating heat to the semiconductor device 9 through the conductive platform 10 .

[0034] The conductive platform 10 is provided with a boss, which is used for clamping the semiconductor device 9 and as a thermal imaging search platform.

[0035] A thermal imaging device 12 is fixedly installed on the top of the inner cavity of the test chamber 1 , and the thermal imaging device 12 is located directly above the conductive platform 10 .

[0036] Two symmetrically arranged swing arms 13 are installed on the upper part of the inner cavity of the test chamber 1. The top ends of the swing arms 13 are connected to the top wall of the test chamber 1 through hinges 14. The swing arms 13 can swing along the hinges 14.

[0037] A pressing claw 16 is fixedly mounted on the bottom end of the swing arm 13 , and the pressing claw 16 swings along with the swing arm 13 , thereby pressing the semiconductor device 9 to be tested onto the conductive platform 10 .

[0038] A horizontally arranged telescopic cylinder 15 is installed between the two swing arms 13 , and the head and tail of the telescopic cylinder 15 are both hingedly connected to the swing arms 13 .

[0039] The side of the test chamber 1 is provided with an observation window.

[0040] The specific working principle of this utility model:

[0041] The semiconductor device 9 to be tested is placed on the carrying hole 8 at the starting end of the synchronous belt 3. The stepper motor drives the synchronous belt 3 to rotate step by step, and the semiconductor device 9 is transported to the top of the conductive table 10. The telescopic cylinder 15 extends to drive the two swing arms 13 to swing downward, so that the pressure claws 16 press the edge of the conductive table 10, and then fix the semiconductor device 9 on the conductive table 10. The power heating system provides the heating power required for the semiconductor device 9 to generate heat through the conductive table 10, and the heating state of the semiconductor device 9 during the test is monitored in real time through the thermal imaging device 12. After the test is completed, the telescopic cylinder 15 retracts, and the semiconductor device 9 moves with the synchronous belt 3 and can be removed at the end of the conveying. The utility model can significantly improve the efficiency of the test and is conducive to the uninterrupted testing of batch semiconductor devices 9.

[0042] The above is an example of the best implementation of the utility model, and the parts not described in detail are common knowledge of ordinary technicians in this field. The protection scope of the utility model is based on the content of the claims, and any equivalent transformation based on the technical inspiration of the utility model is also within the protection scope of the utility model.

Claims

1. A semiconductor thermal distribution test system, characterized in that: The test chamber (1) comprises a synchronous belt (3) arranged transversely inside the test chamber (1), the conveying start and conveying end of the synchronous belt (3) are both located outside the test chamber (1), the synchronous belt (3) is wound around two synchronous belt pulleys (6), the two synchronous belt pulleys (6) are distributed on the left and right sides of the test chamber (1), and the synchronous belt (3) is provided with a plurality of carrying holes (8) distributed at equal intervals; A conductive table (10) is provided in the middle of the inner cavity of the test chamber (1), the conductive table (10) is mounted on the upper surface of a support block (11), the periphery of the support block (11) is fixedly connected to the inner wall of the test chamber (1), and the conductive table (10) is connected to a power supply heating system; A thermal imaging device (12) is fixedly mounted on the top of the inner cavity of the test chamber (1), and two symmetrically arranged swing arms (13) are mounted on the upper part of the inner cavity of the test chamber (1).

2. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The test chamber (1) is installed above the fixed platform (2), and an upper opening (4) and a lower opening (5) are provided on the left and right side walls of the test chamber (1). The upper opening (4) is used for the transverse penetration of the upper part of the main body of the synchronous belt (3), and the lower opening (5) is used for the transverse penetration of the lower part of the main body of the synchronous belt (3).

3. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The synchronous pulley (6) is connected to the outer wall of the test chamber (1) via a support arm (7), and the support arm (7) rotatably supports the synchronous pulley (6), wherein one of the synchronous pulleys (6) is connected to a stepping motor.

4. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The thermal imaging device (12) is located directly above the conductive platform (10).

5. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The loading hole (8) is a stepped structure.

6. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The conductive platform (10) is provided with a boss.

7. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: The top end of the swing arm (13) is connected to the top wall of the test chamber (1) via a hinge (14), and a pressure claw (16) is fixedly mounted on the bottom end of the swing arm (13).

8. A semiconductor thermal distribution testing system as claimed in claim 7, characterized in that: A horizontally arranged telescopic cylinder (15) is installed between the two swing arms (13), and the head and tail of the telescopic cylinder (15) are both hingedly connected to the swing arms (13).

9. A semiconductor thermal distribution testing system as claimed in claim 1, characterized in that: An observation window is provided on the side of the test chamber (1).

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