Server cooling system

Abstract

The utility model belongs to the technical field of refrigeration, and discloses a server cooling system which is used for cooling a server and comprises a cooling tower, a cooling pump, a cold storage box, a heat exchanger and a supply pump. The heat exchanger comprises a first cooling flow channel and a second cooling flow channel, and the cooling tower, the cooling pump, the cold storage box and the first cooling flow channel are communicated through a pipeline to form a heat dissipation loop; the second cooling flow channel, the server and the supply pump are communicated through a pipeline to form a cooling loop; cooling liquid is arranged in the heat dissipation loop and the cooling loop, the cooling pump is used for driving the cooling liquid in the heat dissipation loop to flow, and the supply pump is used for driving the cooling liquid in the cooling loop to flow. The server cooling system provided by the utility model has a better cooling effect.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling, in particular to a server cooling system. Background Art

[0002] Data centers or servers with high computing power release a lot of heat during operation, and cooling for data centers or servers with high computing power is done through air cooling.

[0003] In the prior art, the cooling of the server is achieved by installing air conditioners and fans in the computer room where the server is located. The server dissipates heat in the computer room, and the computer room is cooled by the air conditioner and the fan, thereby cooling the server. However, in the prior art, the cooling effect of indirectly cooling the server by air conditioners and fans is not good.

[0004] Therefore, a server cooling system is urgently needed to solve the above problems. Utility Model Content

[0005] One purpose of the utility model is to provide a server cooling system with better cooling effect.

[0006] As conceived above, the technical solution adopted by the utility model is:

[0007] Server cooling system, used to cool the server, the server cooling system includes a cooling tower, a cooling pump, a cold storage tank, a heat exchanger and a supply pump;

[0008] The heat exchanger includes a first cooling channel and a second cooling channel. The cooling tower, the cooling pump, the cold storage tank and the first cooling channel are connected through a pipeline to form a heat dissipation loop; the second cooling channel, the server and the supply pump are connected through a pipeline to form a cooling loop;

[0009] The heat dissipation circuit and the cooling circuit both have coolant in them. The cooling pump is used to drive the coolant in the heat dissipation circuit to flow, and the supply pump is used to drive the coolant in the cooling circuit to flow.

[0010] Optionally, the server cooling system also includes a conductivity detector and a controller. The server has a cooling inlet and a cooling outlet. The second cooling flow channel is connected to the cooling inlet through a pipeline, and the cooling outlet is connected to the supply pump through a pipeline. The conductivity detector is arranged between the cooling outlet and the supply pump and is communicatively connected to the controller. The conductivity detector is used to detect the conductivity of the coolant.

[0011] Optionally, the server cooling system further comprises a cooling liquid source, a liquid supply valve, a first pressure relief valve and a first pressure relief pipe, the outlet of the supply pump is communicated with the inlet of the second cooling channel, the cooling liquid source is communicated with the inlet of the second cooling channel through the liquid supply pipe so as to be able to compensate the cooling liquid in the cooling circuit, and the liquid supply valve is installed on the liquid supply pipe and is communicatively connected to the controller;

[0012] The controller is used to control the liquid supply valve to open when the conductivity of the coolant detected by the conductivity detection element is greater than a first preset conductivity, and to control the liquid supply valve to close when the conductivity of the coolant detected by the conductivity detection element is less than a second preset conductivity;

[0013] The first pressure relief pipe is connected to the pipeline between the conductivity detector and the inlet of the supply pump. The first pressure relief valve is installed on the first pressure relief pipe and is configured to open when the liquid pressure in the cooling circuit is greater than a first preset pressure to relieve pressure.

[0014] Optionally, the server cooling system further includes a purge gas source, a purge pipe, a purge valve, a second pressure relief valve and a second pressure relief pipe, the purge gas source is connected to the inlet of the second cooling flow channel through the purge pipe, and the purge valve is installed on the purge pipe;

[0015] The second pressure relief pipe is connected to a pipeline between a cooling outlet of the server and an inlet of the supply pump. The second pressure relief valve is installed on the second pressure relief pipe and is configured to open when the pressure in the cooling circuit is greater than a second preset pressure.

[0016] Optionally, a plurality of the supply pumps are connected in parallel, and the plurality of supply pumps are communicatively connected to the controller, and the controller is used to control the frequency of each supply pump to be greater than or equal to the minimum operating frequency.

[0017] Optionally, the server cooling system further includes a maintenance water tank, one end of the first pressure relief pipe is connected to a pipeline between the conductivity detection element and the inlet of the supply pump, and the other end of the first pressure relief pipe is connected to the maintenance water tank.

[0018] Optionally, the server cooling system further comprises a constant pressure tank, which is connected to a pipeline between the cooling outlet of the server and the inlet of the supply pump, and is used to adjust the pressure in the cooling circuit.

[0019] Optionally, the server cooling system further includes a thermostat, which is disposed at a cooling outlet or a cooling inlet of the server and is used to adjust the temperature of the coolant entering the server.

[0020] Optionally, there are multiple cooling pumps, and the multiple cooling pumps are arranged in parallel.

[0021] Beneficial effects of the utility model:

[0022] The utility model provides a server cooling system, a heat exchanger includes a first cooling channel and a second cooling channel, a cooling tower, a cooling pump, a cold storage box and the first cooling channel are connected through a pipeline to form a heat dissipation circuit; the second cooling channel, the server and the supply pump are connected through a pipeline to form a cooling circuit, and the coolant in the heat dissipation circuit and the coolant in the cooling circuit can exchange heat in the heat exchanger to reduce the temperature of the coolant in the cooling circuit, so that the coolant in the cooling circuit can absorb the heat inside the server, and realize direct contact between the coolant and the heat dissipation components inside the server, thereby increasing the contact area between the coolant and the heat dissipation components, thereby improving the heat dissipation effect and heat dissipation efficiency of the heat dissipation components, and the heat in the heat dissipation circuit is dissipated through the cooling tower, the heat dissipation effect is more stable, and the heat dissipation reliability and efficiency are higher. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0024] Figure 1 The schematic diagram of the server cooling system provided by the embodiment of the utility model is Figure 1 ;

[0025] Figure 2 The schematic diagram of the server cooling system provided by the embodiment of the utility model is Figure 2 ;

[0026] Figure 3 It is a structural schematic diagram of a cooling tower provided by an embodiment of the utility model;

[0027] Figure 4 This is the process of the control method of the server cooling system provided by the embodiment of the utility model Figure 1 ;

[0028] Figure 5 This is the process of the control method of the server cooling system provided by the embodiment of the utility model Figure 2 .

[0029] In the figure:

[0030] 1. Cooling tower; 2. Cooling pump; 3. Cold storage box; 4. Heat exchanger; 41. First cooling channel; 42. Second cooling channel; 5. Supply pump; 6. Conductivity detection element; 7. Coolant source; 8. Liquid supply valve; 9. First pressure relief valve; 10. First pressure relief pipe; 11. Purge gas source; 12. Purge pipe; 13. Purge valve; 14. Second pressure relief valve; 15. Second pressure relief pipe; 16. Constant pressure tank; 17. Maintenance water tank; 18. Spray pump;

[0031] 100. heat dissipation circuit; 200. cooling circuit; 300. server. DETAILED DESCRIPTION

[0032] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved clearer, the technical solutions of the present invention are further described below in conjunction with the accompanying drawings and through specific implementation methods. It is understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for the convenience of description, only the parts related to the present invention are shown in the accompanying drawings, rather than all of them.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In the present utility model, unless otherwise clearly stipulated and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. In the description of this embodiment, unless otherwise specified, "multiple" specifically refers to two or more.

[0036] In the description of this embodiment, the terms "upper", "lower", "right", etc., are based on the directions or positions shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0037] It should be noted that when an element is referred to as being “fixed to” or “disposed on” another element, it may be directly on the other element or there may be a central element.

[0038] Embodiment 1

[0039] At present, the cooling method using cooling fans results in a large heat dissipation area of ​​the cabinet and poor cooling effect. Even in a clean room, after a long period of operation, it is necessary to regularly dismantle the chassis to clean the cooling duct and replace the fan, which is time-consuming and labor-intensive. The heat is dissipated in the computer room, and the air conditioner is used to cool it down. The operating energy consumption is high, and the initial investment cost of the server computer room is high. For servers above 500W, it is no longer possible to achieve better cooling through traditional fan cooling. Each server in the server cluster is equipped with an independent cooling fan. When the cooling method of one of them fails, it will cause the server with related resource interaction to fail, and the operation risk is relatively high.

[0040] Based on this, this embodiment provides a server cooling system for cooling the server 300, which has a good cooling effect.

[0041] like Figure 1 As shown, the server cooling system includes a cooling tower 1, a cooling pump 2, a cold storage tank 3, a heat exchanger 4 and a supply pump 5. It should be noted that the server 300 can be located in the computer room, and the cooling tower 1, the cooling pump 2, the cold storage tank 3, the heat exchanger 4 and the supply pump 5 of the server cooling system can all be located outside the computer room, so that the volume of the computer room is relatively small.

[0042] The heat exchanger 4 includes a first cooling channel 41 and a second cooling channel 42. The coolant in the first cooling channel 41 can exchange heat with the coolant in the second cooling channel 42 to achieve heat exchange. The cooling tower 1, the cooling pump 2, the cold storage tank 3 and the first cooling channel 41 are connected through pipelines to form a heat dissipation loop 100. The second cooling channel 42, the server 300 and the supply pump 5 are connected through pipelines to form a cooling loop 200.

[0043] Exemplarily, both the heat dissipation circuit 100 and the cooling circuit 200 have coolant, the cooling pump 2 is used to drive the coolant flow in the heat dissipation circuit 100, and the supply pump 5 is used to drive the coolant flow in the cooling circuit 200, so that the coolant can exchange heat in the heat exchanger 4.

[0044] It should be noted that the cooling tower 1 can be a cooling tower 1 in the prior art. Heat dissipation through the cooling tower 1 can have a higher heat dissipation effect and lower cost. In addition, the specific structure, installation and subsequent maintenance of the cooling tower 1 are mature, and are easy to implement and operate. Exemplarily, one or more cooling towers 1 can be provided. When there are multiple cooling towers 1, multiple cooling towers 1 are arranged in parallel, so that each cooling tower 1 can form a heat dissipation circuit 100 with the cooling pump 2, the cold storage box 3 and the first cooling channel 41. In some optional embodiments, such as Figure 3 As shown, the cooling tower 1 is provided with a spray pump 18. By controlling the power of the spray pump 18, the cooling intensity of the cooling tower 1 can be controlled, that is, the temperature of the coolant flowing out of the cooling tower 1 can be reduced.

[0045] The specific structures of the cooling pump 2 and the supply pump 5 can be the same or different, and this embodiment does not limit this. For example, the cooling pump 2 and the supply pump 5 can both be variable frequency pumps, that is, the frequency during operation can be changed to adapt to different working conditions.

[0046] The cold storage tank 3 in this embodiment is used to store the coolant that has been cooled to a temperature below a preset temperature by the cooling tower 1, so as to ensure that the amount of coolant in the heat dissipation circuit 100 meets the requirements, and can also meet the preset cooling effect on the server 300 when the power of the server 300 suddenly increases.

[0047] The heat exchanger 4 in this embodiment may be a heat exchanger 4 in the prior art, as long as it can realize heat exchange of the coolant in the first cooling channel 41 and the second cooling channel 42 .

[0048] For example, Figure 2 As shown, the coolant cooled by the cooling tower 1 flows to the cold storage tank 3, the inlet of the cooling pump 2 is connected and communicated with the outlet of the cold storage tank 3 through a pipeline, the outlet of the cooling pump 2 is communicated with the inlet of the first cooling channel 41 through a pipeline, and the outlet of the first cooling channel 41 is communicated with the inlet of the cooling tower 1 through a pipeline to form a heat dissipation circuit 100. Exemplarily, the temperature of the coolant at the inlet of the first cooling channel 41 is 30°C to 36°C, for example, 35°C; the temperature of the coolant at the outlet of the first cooling channel 41 is in the first temperature range, and the first temperature range can be 39°C to 43°C, for example, 40°C.

[0049] See also Figure 2The server 300 has a cooling inlet and a cooling outlet. The server 300 is shaped to form a relatively sealed space so that the coolant flows directly into the server 300 to directly cool the heat dissipation components in the server 300. The coolant after absorbing heat flows out through the cooling outlet and enters the supply pump 5 through the pipeline under the drive of the supply pump 5. After being accelerated in the supply pump 5, it enters the inlet of the second cooling channel 42. After releasing heat, it flows out from the outlet of the second cooling channel 42 and enters the server 300 through the cooling inlet to form a cooling circuit 200. Exemplarily, the temperature of the coolant at the inlet of the second cooling channel 42 is 48°C to 52°C, for example, 50°C; the temperature of the coolant at the outlet of the second cooling channel 42 is 39°C to 41°C, for example, 40°C.

[0050] In the server cooling system provided in this embodiment, the heat exchanger 4 includes a first cooling channel 41 and a second cooling channel 42. The cooling tower 1, the cooling pump 2, the cold storage box 3 and the first cooling channel 41 are connected through a pipeline to form a heat dissipation circuit 100; the second cooling channel 42, the server 300 and the supply pump 5 are connected through a pipeline to form a cooling circuit 200. The coolant in the heat dissipation circuit 100 and the coolant in the cooling circuit 200 can exchange heat in the heat exchanger to reduce the temperature of the coolant in the cooling circuit 200, so that the coolant in the cooling circuit 200 can absorb the heat inside the server 300, thereby achieving direct contact between the coolant and the heat dissipation components inside the server 300, increasing the contact area between the coolant and the heat dissipation components, and thereby improving the heat dissipation effect and heat dissipation efficiency of the heat dissipation components. In addition, the heat in the heat dissipation circuit 100 is dissipated through the cooling tower 1, the heat dissipation effect is relatively stable, and the heat dissipation reliability and efficiency are higher.

[0051] Furthermore, since the coolant in the heat dissipation loop 100 is not in direct contact with and does not mix with the coolant in the cooling loop 200, and the coolant in the cooling loop 200 is in direct contact with the heat dissipation components of the server 300, the coolant in the cooling loop 200 can be set to a liquid with high purity and no impurities to prevent the heat dissipation components from being affected, and the amount of the liquid with high purity and no impurities required can also be small, reducing the overall cost. For example, the coolant in the cooling loop 200 can be pure water (i.e., deionized water).

[0052] Exemplarily, the server cooling system further includes a controller (not shown in the figure), and the cooling pump 2 and the supply pump 5 are both communicatively connected to the controller, and the controller is used to control the opening and closing of the cooling pump 2 and the supply pump 5. The controller can be a controller in the prior art, such as a PLC controller, etc., which is not limited in this embodiment.

[0053] Optionally, see Figure 1The server cooling system also includes a conductivity detection component 6. The second cooling channel 42 is connected to the cooling inlet through a pipeline, and the cooling outlet is connected to the supply pump 5 through a pipeline. The conductivity detection component 6 is arranged between the cooling outlet and the supply pump 5, and is communicatively connected to the controller. The conductivity detection component 6 is used to detect the conductivity of the coolant flowing out of the cooling outlet. By detecting the conductivity of the coolant, the purity of the coolant can be determined, and then it is determined whether to replace the coolant to prevent corrosion of the internal components of the server 300 and extend the service life of the server 300. By way of example, the conductivity detection component 6 can be a conductivity detector in the prior art, such as a conductivity detector with a model of BEC-200E.

[0054] It should be noted that the conductivity detection element 6 is in communication connection with the controller, and the controller is used to obtain the conductivity detected by the conductivity detection element 6 .

[0055] Further optionally, if Figure 1 or Figure 2 As shown, the server cooling system also includes a cooling liquid source 7, a liquid supply valve 8, a first pressure relief valve 9 and a first pressure relief pipe 10. Among them, the outlet of the supply pump 5 is connected to the inlet of the second cooling channel 42, and the cooling liquid source 7 is connected to the inlet of the second cooling channel 42 through a liquid supply pipe (not shown in the figure) so as to be able to compensate the cooling liquid in the cooling circuit 200. For example, the liquid supply pipe is connected and communicated with the pipeline between the outlet of the supply pump 5 and the inlet of the second cooling channel 42. The liquid supply valve 8 is installed on the liquid supply pipe and is connected to the controller for communication. The controller is used to control the opening and closing of the liquid supply valve 8 to realize the opening and closing of the liquid supply pipe through the liquid supply valve 8.

[0056] In this embodiment, the controller is used to control the liquid supply valve 8 to open when the conductivity of the coolant detected by the conductivity detection element 6 is greater than the first preset conductivity. After the liquid supply valve 8 is opened, the coolant source 7 inputs high-purity coolant (such as pure water) into the cooling circuit 200 through the liquid supply pipe to replace the coolant in the cooling circuit 200. For example, the pressure of the coolant source 7 can be greater than the pressure in the cooling circuit 200, so that the coolant source 7 can inject the coolant into the cooling circuit 200. For example, the first preset conductivity can be 0.9μS / cm.

[0057] The controller is also used to control the liquid supply valve 8 to close when the conductivity of the coolant detected by the conductivity detection element 6 is less than the second preset conductivity, so as to stop the coolant from being continuously input into the cooling circuit 200. At this time, the conductivity of the coolant in the cooling circuit 200 meets the requirements, which can reduce the corrosion or erosion of the components inside the server 300, and ensure that the server 300 and the heat exchanger 4 are not scaled. For example, the second preset conductivity may be 0.5 μS / cm.

[0058] In this embodiment, Figure 1As shown, the first pressure relief pipe 10 is connected to the pipeline between the conductivity detection element 6 and the inlet of the supply pump 5, and the first pressure relief valve 9 is installed on the first pressure relief pipe 10, and is configured to open when the liquid pressure in the cooling circuit 200 is greater than the first preset pressure to relieve pressure. For example, the first preset pressure can be 0.8 bar. The first pressure relief valve can be a pressure relief valve in the prior art, which is not limited in this embodiment.

[0059] It should be noted that the coolant source 7 inputs coolant into the cooling circuit 200, which will cause the liquid pressure in the cooling circuit 200 to increase. When it increases to a first preset pressure, the first pressure relief valve 9 automatically opens, allowing the cooling circuit 200 to release pressure through the first pressure relief pipe 10, thereby preventing the cooling circuit 200 from having excessive pressure, thereby improving the stability of the server cooling system.

[0060] For example, please see Figure 1 or Figure 2 , the server cooling system also includes a purge gas source 11, a purge pipe 12, a purge valve 13, a second pressure relief valve 14 and a second pressure relief pipe 15. Among them, the purge gas source 11 is connected to the inlet of the second cooling channel 42 through the purge pipe 12, and the purge valve 13 is installed on the purge pipe 12. Since the server cooling system needs to be inspected or maintained after running for a period of time, it is necessary to remove the coolant in the cooling circuit 200. In this embodiment, the purge gas source 11 inputs gas (such as compressed air) into the cooling circuit 200 through the purge pipe 12, so that the gas pushes the coolant in the cooling circuit 200 to flow out of the cooling circuit 200. The purge valve 13 in this embodiment is communicatively connected to the controller, and the controller can control the opening and closing of the purge valve 13. Of course, it can be understood that the purge valve 13 can also be manually controlled, and this embodiment does not limit this.

[0061] Further optionally, if Figure 1 As shown, the second pressure relief pipe 15 is connected to the pipeline between the cooling outlet of the server 300 and the inlet of the supply pump 5, so that the liquid flowing out of the cooling outlet can flow out through the second pressure relief pipe 15. The second pressure relief valve 14 is installed on the second pressure relief pipe 15, and is configured to open when the pressure in the cooling circuit 200 is greater than the second preset pressure, so that the coolant or gas in the cooling circuit 200 is discharged, and the cooling circuit 200 is purged to prevent the coolant from remaining in the cooling circuit 200, which is convenient for maintenance. The second pressure relief valve 14 can be a pressure relief valve in the prior art, and this embodiment is not limited to this. It should be noted that the connection position of the second pressure relief pipe 15 and the pipeline is located downstream of the connection position of the first pressure relief pipe 10 and the pipeline to improve the cleanliness of the purge.

[0062] It should be noted that mechanical safety valves (not shown in the figure) can be provided on the purge pipe 12, the liquid supply pipe, the first pressure relief pipe 10 and the second pressure relief pipe 15, so as to be opened or closed when needed to control the on-off of the purge pipe 12, the liquid supply pipe, the first pressure relief pipe 10 and the second pressure relief pipe 15.

[0063] Alternatively, if Figure 1 As shown, the server cooling system also includes a maintenance water tank 17, and the first pressure relief pipe 10 and the second pressure relief pipe 15 are both connected to the maintenance water tank 17, and the coolant discharged from the first pressure relief pipe 10 and the second pressure relief pipe 15 can be collected in the maintenance water tank 17. After the coolant in the maintenance water tank 17 is processed, it can obtain a coolant that meets the requirements (such as pure water). At this time, the maintenance water tank 17 is connected to the coolant source 7, so that after the system maintenance is completed, the coolant source 7 re-injects the coolant into the cooling circuit 200 to achieve the reuse of the coolant. For example, one end of the first pressure relief pipe is connected to the pipeline between the conductivity detection element and the inlet of the supply pump, and the other end of the first pressure relief pipe is connected to the maintenance water tank.

[0064] Optionally, the supply pumps 5 in this embodiment are provided in parallel in multiple numbers, that is, each supply pump 5 can work independently and can drive the coolant in the cooling circuit 200. The multiple supply pumps 5 are all communicatively connected to the controller, and the controller is used to control the frequency of each supply pump 5 to be greater than or equal to the minimum operating frequency. Among them, the minimum operating frequency is an operating parameter of the supply pump 5, or the minimum operating frequency can also be a preset value, which is not limited in this embodiment. By controlling the frequency of each supply pump 5 to be greater than or equal to the minimum operating frequency, it is ensured that each supply pump 5 operates in its efficient operating range, so that the performance of the supply pump 5 is optimized and the service life of the supply pump 5 is extended.

[0065] Optionally, the server cooling system further includes a constant pressure tank 16, which is connected to a pipeline between the cooling outlet of the server 300 and the inlet of the supply pump 5. For example, the constant pressure tank 16 is disposed downstream of the conductivity detection element 6 of the constant pressure tank 16. The constant pressure tank 16 is used to adjust the pressure in the cooling circuit 200 so that the pressure of the cooling circuit 200 is maintained within a preset range, thereby improving the stability of the cooling circuit 200 and preventing damage to the internal components of the server 300 caused by drastic changes in pressure.

[0066] Exemplarily, the server cooling system further includes a thermostat (not shown in the figure), which is disposed at the cooling outlet or cooling inlet of the server 300. The thermostat is used to adjust the temperature of the coolant entering the server 300, so that the temperature of the coolant entering the server 300 is neither too high nor too low, thereby ensuring the stability of the coolant temperature in the server 300. Exemplarily, the opening of the thermostat can be controlled by the controller to achieve the regulating function. In this embodiment, the thermostat is a valve that controls the flow path of the coolant, which is an automatic temperature regulating device, usually containing a temperature sensing component, which opens and closes the flow of air, gas or liquid by thermal expansion or contraction.

[0067] Optionally, the server cooling system may further include a plurality of temperature sensors, pressure sensors and flow sensors. The temperature sensor is used to detect the temperature of the coolant. For example, a temperature sensor is provided at the cooling inlet to prevent the temperature of the coolant entering the server 300 from being too high or too low. The pressure sensor is used to detect the pressure in the cooling circuit 200 or the heat dissipation circuit 100 to ensure operation within a safe pressure range.

[0068] The server cooling system provided in this embodiment cools down the server 300 by liquid cooling, operates reliably, and reduces the volume of the server 300. By treating the cooling water (pure water) that meets the standards and supplying it to the heat exchanger 4 for cooling, this method of directly taking away the heat is more focused, so that the cooling capacity of the indoor air-conditioning system can be greatly reduced, the operating energy consumption is reduced, the cost of the machine room construction will also be greatly reduced, and the operation of the server cooling system is maintenance-free and fully intelligent. In addition, in this embodiment, the pipelines in the cooling circuit 200 are all food-grade standards, so that the pipelines have high pressure resistance and corrosion resistance. The pipelines in the system are all crimped, and the pipelines between the server 300 and the heat exchanger 4 are all factory-synthesized without joints in the middle, avoiding the problem of water leakage. The server cooling system design can ensure the on-demand use of the terminal, and has strong scalability and extensibility. By detecting the conductivity of the coolant in the server cooling system, the coolant is replenished and discharged.

[0069] Embodiment 2

[0070] This embodiment provides a control method for a server cooling system, which is applied to the server cooling system in Embodiment 1 and can achieve a better cooling effect.

[0071] like Figure 4 As shown, the control method of the server cooling system includes the following steps:

[0072] S1, control the supply pump 5 to start, so as to drive the coolant in the cooling circuit 200 to flow, so as to absorb the heat generated by the server;

[0073] S2, after a first preset time, controlling the cooling pump 2 to start, so as to drive the coolant in the heat dissipation circuit 100 to flow, and controlling the cooling tower 1 to operate, so as to cool the coolant in the heat dissipation circuit 100;

[0074] S3. The coolant in the heat dissipation circuit 100 absorbs heat from the coolant in the cooling circuit 200 in the heat exchanger, so that the temperature of the coolant at the outlet of the second cooling channel 42 is within the first temperature range.

[0075] In step S1, the controller may control the supply pump 5 to start, and the supply pump 5 drives the coolant in the cooling circuit 200 to flow. It should be noted that step S1 may be performed before the server 300 is started, after the server 300 is started, or simultaneously with the server 300 being started, and this embodiment does not limit this.

[0076] In step S2, after the supply pump 5 starts for the first preset time, the cooling pump 2 can be controlled to start so that the coolant in the cooling circuit 200 and the heat dissipation circuit 100 flows. For example, the first preset time can be 2 seconds, 3 seconds, etc., which is not limited in this embodiment.

[0077] After the supply pump 5 , the cooling pump 2 and the cooling tower 1 are all started, the entire server cooling system is started, so as to achieve continuous cooling of the server 300 and improve the cooling effect.

[0078] The control method of the server cooling system provided in this embodiment is that the heat exchanger 4 includes a first cooling channel 41 and a second cooling channel 42. The cooling tower 1, the cooling pump 2, the cold storage box 3 and the first cooling channel 41 are connected through a pipeline to form a heat dissipation circuit 100; the second cooling channel 42, the server 300 and the supply pump 5 are connected through a pipeline to form a cooling circuit 200. The coolant in the heat dissipation circuit 100 and the coolant in the cooling circuit 200 can exchange heat in the heat exchange to reduce the temperature of the coolant in the cooling circuit 200, so that the coolant in the cooling circuit 200 can absorb the heat inside the server 300, thereby achieving direct contact between the coolant and the heat dissipation components inside the server 300, increasing the contact area between the coolant and the heat dissipation components, and thereby improving the heat dissipation effect and heat dissipation efficiency of the heat dissipation components. In addition, the heat in the heat dissipation circuit 100 is dissipated through the cooling tower 1, the heat dissipation effect is relatively stable, and the heat dissipation reliability and efficiency are higher.

[0079] Optionally, the server cooling system further includes a controller and n supply pumps 5; in step S1, controlling the supply pump 5 to start includes the following steps:

[0080] The frequencies of the n supply pumps 5 are sequentially controlled to rise to the loading frequency, and the next supply pump 5 is started after the frequency of the previous supply pump 5 reaches the loading frequency for a second preset time. For example, the first preset time may be 2 seconds, 3 seconds, etc., which is not limited in this embodiment.

[0081] In this embodiment, the total number of supply pumps 5 may be greater than n. In this embodiment, the frequencies of n supply pumps 5 are sequentially controlled to rise to the loading frequency, and n supply pumps 5 are the number of supply pumps 5 that can be put into use.

[0082] It should be noted that after the server cooling system is running, one supply pump 5 is started first, and when the frequency rises to the loading frequency, the second preset time is delayed to control the supply pump 5 with a shorter cumulative running time in the standby state to start. If the number of supply pumps 5 in operation is greater than or equal to n, the other supply pumps 5 will not be started.

[0083] In this embodiment, the controller is communicatively connected with a plurality of supply pumps 5 , and the controller can obtain the pressure in the cooling circuit 200 , compare the pressure with the pressure setting value, and control the frequency of the supply pump 5 through PID (proportional integral differential control) reverse logic.

[0084] Optionally, in this embodiment, the n supply pumps 5 are started in sequence according to the order of the accumulated running time from small to large, that is, the supply pump 5 with the smaller accumulated running time is started first to balance the accumulated running time of the multiple supply pumps 5, so that the accumulated running time of the multiple supply pumps 5 is more balanced.

[0085] It should be noted that if one accumulated operation time corresponds to m supply pumps 5, the m supply pumps 5 are started sequentially. For example, if there are two supply pumps 5 with an accumulated operation time of 10 hours, any one of the two supply pumps 5 is driven first, and then when the frequency of the supply pump 5 reaches the loading frequency, the other of the two supply pumps 5 is started after a delay of the second preset time.

[0086] In some optional embodiments, the controller can also control the supply pump 5 to load automatically. For example, the automatic loading can be triggered by the temperature detected by the temperature sensor located at the cooling outlet. For example, when the temperature is greater than or equal to a high temperature preset value, the controller automatically enters loading control, for example, automatically controls a supply pump 5 to start, so as to increase the flow rate of the coolant in the cooling circuit 200, thereby improving the cooling efficiency and reducing the temperature of the coolant at the cooling outlet.

[0087] The loading frequency in this embodiment is greater than the minimum operating frequency.

[0088] Optionally, the server cooling system also includes a controller and n supply pumps 5, and the frequencies of the n supply pumps 5 are all greater than the load reduction frequency; the control method of the server cooling system also includes load reduction control, which is used to cooperate with the reduction of power of the server 300, that is, the heat dissipated by the server 300 is reduced.

[0089] For example, the load reduction control may be triggered by the temperature detected by a temperature sensor located at the cooling outlet. For example, when the temperature is less than or equal to a low temperature preset value, the controller automatically enters the load reduction control to implement intelligent control.

[0090] Specifically, the load reduction control includes the following steps:

[0091] Controlling the frequencies of the n supply pumps 5 to decrease synchronously to be less than or equal to the load shedding frequency;

[0092] In this embodiment, the frequencies of the n supply pumps 5 are controlled to decrease synchronously. When the frequency of each supply pump 5 is equal to or less than the load reduction frequency, the frequencies of the n supply pumps 5 can be controlled not to decrease any more.

[0093] After the third preset time, a supply pump 5 whose cumulative operation time is equal to the preset cumulative time is controlled to stop operating, and the preset cumulative time is the maximum value of the cumulative operation times of the n supply pumps 5 .

[0094] Optionally, in this embodiment, if there is a demand for load reduction, another supply pump 5 may be controlled to stop running after a third preset time period after one supply pump 5 is stopped, and so on, until all the supply pumps 5 are shut down.

[0095] It should be noted that the load reduction frequency is greater than or equal to the minimum operating frequency.

[0096] For example, the third preset time length may be 2 seconds, 3 seconds, etc., which is not limited in this embodiment.

[0097] Optionally, the controller can detect the working status of each supply pump 5. When one of the supply pumps 5 does not work or works abnormally, the controller can control the supply pump 5 to stop working and start a supply pump 5 in standby to achieve fault switching.

[0098] Optionally, when the server cooling system further includes a controller, a conductivity detection element 6, a cooling liquid source 7, a liquid supply valve 8, a first pressure relief valve 9 and a first pressure relief valve, as Figure 5 As shown, the control method of the server cooling system also includes the following steps:

[0099] S4. During the operation of the server cooling system, the conductivity detection element 6 detects the conductivity of the coolant flowing out of the cooling outlet of the server 300 in real time;

[0100] S5. The controller obtains the conductivity and determines whether the conductivity is greater than the first preset conductivity; if so, execute step S6; if not, execute step S7:

[0101] S6, control the liquid supply valve 8 to open, so that the cooling liquid source 7 inputs the cooling liquid into the cooling circuit 200, and execute step S7;

[0102] S7, the controller obtains the conductivity and determines whether the conductivity is less than the second preset conductivity. If so, the liquid supply valve 8 is controlled to be closed; if not, continue to execute step S5.

[0103] This embodiment cools down the server 300 through an intelligent server cooling system, ensuring the cooling of the high-power server 300 while avoiding the problem of too low temperature under light load, forming a relatively closed cooling loop 200, and realizing automatic water replacement of the coolant through conductivity detection, thereby achieving maintenance-free. The server 300 is cooled directly by the coolant, saving the operating energy consumption and initial production cost of the server 300 machine room. The supply pump 5 can automatically increase and decrease load and switch faults to ensure stable energy-saving operation of the server cooling system. The server 300 side ensures the stability of the temperature of the server 300 through secondary temperature adjustment of the thermostat. When the server 300 needs to be disassembled for maintenance, the coolant in the server 300 is discharged into the maintenance water tank 17 through ultra-pure compressed air, avoiding the hidden dangers caused by residual water in the server 300 during the disassembly process.

[0104] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

Claims

1. A server cooling system for cooling a server (300), characterized in that: The server cooling system comprises a cooling tower (1), a cooling pump (2), a cold storage tank (3), a heat exchanger (4) and a supply pump (5); The heat exchanger (4) comprises a first cooling channel (41) and a second cooling channel (42); the cooling tower (1), the cooling pump (2), the cold storage tank (3) and the first cooling channel (41) are connected through a pipeline to form a heat dissipation circuit (100); the second cooling channel (42), the server (300) and the supply pump (5) are connected through a pipeline to form a cooling circuit (200); The heat dissipation circuit (100) and the cooling circuit (200) both contain coolant, the cooling pump (2) is used to drive the coolant in the heat dissipation circuit (100) to flow, and the supply pump (5) is used to drive the coolant in the cooling circuit (200) to flow.

2. The server cooling system according to claim 1, characterized in that: The server cooling system further comprises a conductivity detection element (6) and a controller. The server (300) has a cooling inlet and a cooling outlet. The second cooling channel (42) is connected to the cooling inlet via a pipeline. The cooling outlet is connected to the supply pump (5) via a pipeline. The conductivity detection element (6) is arranged between the cooling outlet and the supply pump (5) and is communicatively connected to the controller. The conductivity detection element (6) is used to detect the conductivity of the coolant.

3. The server cooling system according to claim 2, characterized in that: The server cooling system further comprises a cooling liquid source (7), a liquid supply valve (8), a first pressure relief valve (9) and a first pressure relief pipe (10); the outlet of the supply pump (5) is connected to the inlet of the second cooling channel (42); the cooling liquid source (7) is connected to the inlet of the second cooling channel (42) through the liquid supply pipe so as to be able to compensate the cooling liquid in the cooling circuit (200); the liquid supply valve (8) is installed on the liquid supply pipe and is in communication connection with the controller; The controller is used to control the liquid supply valve (8) to open when the conductivity of the coolant detected by the conductivity detection element (6) is greater than a first preset conductivity, and to control the liquid supply valve (8) to close when the conductivity of the coolant detected by the conductivity detection element (6) is less than a second preset conductivity; The first pressure relief pipe (10) is connected to a pipeline between the conductivity detection element (6) and the inlet of the supply pump (5); the first pressure relief valve (9) is installed on the first pressure relief pipe (10) and is configured to open when the liquid pressure in the cooling circuit (200) is greater than a first preset pressure to relieve pressure.

4. The server cooling system according to claim 2, characterized in that: The server cooling system further comprises a purge gas source (11), a purge pipe (12), a purge valve (13), a second pressure relief valve (14) and a second pressure relief pipe (15); the purge gas source (11) is connected to the inlet of the second cooling flow channel (42) through the purge pipe (12); and the purge valve (13) is installed on the purge pipe (12); The second pressure relief pipe (15) is connected to a pipeline between a cooling outlet of the server (300) and an inlet of the supply pump (5); the second pressure relief valve (14) is installed on the second pressure relief pipe (15) and is configured to open when the pressure in the cooling circuit (200) is greater than a second preset pressure.

5. The server cooling system according to claim 2, characterized in that: A plurality of the supply pumps (5) are connected in parallel, and the plurality of supply pumps (5) are all in communication connection with the controller, and the controller is used to control the frequency of each supply pump (5) to be greater than or equal to the minimum operating frequency.

6. The server cooling system according to claim 3, characterized in that: The server cooling system further comprises a maintenance water tank (17), one end of the first pressure relief pipe (10) is connected to a pipeline between the conductivity detection element (6) and the inlet of the supply pump (5), and the other end of the first pressure relief pipe (10) is in communication with the maintenance water tank (17).

7. The server cooling system according to claim 1, characterized in that: The server cooling system further comprises a constant pressure tank (16), wherein the constant pressure tank (16) is connected to a pipeline between a cooling outlet of the server (300) and an inlet of the supply pump (5), and the constant pressure tank (16) is used to adjust the pressure in the cooling circuit (200).

8. The server cooling system according to claim 1, characterized in that: The server cooling system further comprises a thermostat, which is arranged at the cooling outlet of the server (300) and is used to adjust the temperature of the cooling liquid entering the server (300).

9. The server cooling system according to claim 1, characterized in that: The cooling pumps (2) are provided in plurality, and the plurality of cooling pumps (2) are arranged in parallel.

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