A self-heating size-adjustable mobile phone chip testing platform

Abstract

The utility model relates to a self-heating size-adjustable mobile phone chip testing platform, which specifically comprises a platform base and a chip limiting groove, wherein a detection structure is arranged on the chip limiting groove, and the detection structure is divided into a lifting and pressing part and a heating part, wherein the heating part comprises a heat dissipation part, wherein a blind hole is arranged on the side of the heat dissipation part, and a heating rod is arranged in the blind hole, wherein the lifting and pressing part comprises a pressing block passing through the heat dissipation part, wherein the pressing block moves in a vertical direction in the heat dissipation part, the pressing block matches with the chip limiting groove, and a partial structure capable of performing pressure testing is realized by heating, thereby achieving a technical effect of dual detection of pressure and heat.

Description

Technical Field

[0001] The utility model relates to the technical field of chip test benches, in particular to a self-heating size-adjustable mobile phone chip test platform. Background Art

[0002] Package testing is the process of confirming the structure and electrical functions of the manufactured semiconductor components after the semiconductor chip is packaged to ensure that the semiconductor components meet the system requirements.

[0003] The mobile phone test platform is an indispensable consumable in semiconductor packaging testing. It plays an important role in connecting the tested chip and the mobile phone PCB board for electrical signal transmission. The existing chip test is to put the chip into a high temperature box for stability testing, so as to obtain the chip's tolerance value for high temperature, and then put it on the mobile phone test platform for pressure testing. Different mobile phone test platform specifications are adjusted for different chip models to achieve the detection function of temperature and pressure of different types of chips.

[0004] The mobile phone testing platform of the prior art needs to test the temperature test and the pressure test separately. The test is troublesome and the process flow is cumbersome when replacing the chip, which reduces the test efficiency of the chip test. Therefore, the prior art has the problem that testing the chip separately will greatly slow down the chip testing process. Utility Model Content

[0005] The purpose of the utility model is to combine temperature testing and pressure testing on a mobile phone testing platform to realize a high-efficiency chip testing process.

[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a self-heating size-adjustable mobile phone chip testing platform, comprising a platform base and a chip limiting groove, the chip limiting groove is provided with a detection structure, the detection structure is divided into a lifting and pressing part and a heating part, the heating part comprises a heat dissipation part, a blind hole is provided on the side of the heat dissipation part, a heating rod is placed in the blind hole, the lifting and pressing part comprises a pressing block passing through the heat dissipation part, the pressing block moves in the heat dissipation part in a vertical direction, and the pressing block matches the chip limiting groove.

[0007] Preferably, the lifting and pressing part further comprises a rotating knob arranged above the heat dissipation component, and the rotating knob is engraved with scale marks.

[0008] Preferably, a driving rotating disk is threadedly connected to the top of the rotating knob, a plurality of threaded rods are threadedly connected to the center of the driving rotating disk, the threaded rods pass through the driving rotating disk and the rotating knob, and one end of the threaded rods is connected to the pressing block.

[0009] Preferably, a plurality of operating members extend from one end of the driving rotating disk away from the rotating knob, and the height of the operating members is greater than the thickness of the driving rotating disk.

[0010] Preferably, a receiving structure is fixedly connected above the heat dissipation component, the pressing block passes through the receiving structure, and the receiving structure divides the lifting and pressing part into a part located inside the heating part and a part located above the receiving structure.

[0011] Preferably, a clamping piece is provided on one side of the receiving structure, and a clamping groove body for the clamping piece to extend into is provided on the side opposite to the chip limiting groove.

[0012] Preferably, a plurality of heat dissipation grooves are provided on one side of the chip limiting groove.

[0013] The beneficial effects of the utility model are:

[0014] 1. A heating part and a lifting and pressing part are arranged on the detection structure, so that the chip surface can be heated while the chip test pressure is lifted and pressed, and the heat resistance coefficient of the chip surface can be detected at the same time.

[0015] 2. A size adjustment structure is set on the lifting and pressing part to adapt to different chips for pressure testing.

[0016] 3. A heat dissipation structure is also provided on the platform base to ensure that the heating heat can be maintained within a certain range and that excessive heat will not damage the function of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a structural diagram of a self-heating size-adjustable mobile phone chip testing platform of the utility model;

[0018] Figure 2 The structure of the detection structure of the utility model Figure 1 ;

[0019] Figure 3 The structure of the detection structure of the utility model Figure 2 ;

[0020] Figure 4 The utility model is an exploded view of a self-heating size-adjustable mobile phone chip testing platform.

[0021] In the figure,

[0022] 1. Platform base; 11. Chip limiting slot; 12. Card slot body; 13. Heat dissipation slot body;

[0023] 2. Detection structure; 21. Lifting and pressing part; 211. Pressing block; 212. Turning knob; 213. Driving rotating disk; 214. Threaded rod; 215. Operating rod; 22. Heating part; 221. Heat dissipation parts; 222. Blind hole placement; 223. Heating rod; 23. Supporting structure; 231. Connecting part. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0025] refer to Figure 1 The present application is arranged on a platform base 1, which includes a mobile phone screen, a thermostat, a central adjustment operating table and a placement part for placing the chip. The placement part is a detection mechanism arranged based on a chip limiting groove 11 opened on the platform base 1. The chip is placed at the detection mechanism for processing and detection, and the detected values ​​will be operated and displayed on the mobile phone screen and the thermostat respectively.

[0026] refer to Figure 2 The detection mechanism is divided into a lifting and pressing part 21 and a heating part 22. The lifting and pressing part 21 is responsible for detecting the pressure of the chip, and the heating part 22 is responsible for detecting the temperature of the chip. The heating part 22 includes a heat dissipation part 221. The heat dissipation part 221 is a copper heat sink. A blind hole 222 is opened on the side of the heat dissipation part 221. A heating rod 223 is placed in the blind hole 222. The heating rod 223 is connected to the circuit in the blind hole 222 to form a closed process of power-on heating. When the heating rod 223 is energized externally, the heating rod 223 will heat up, and the temperature is transmitted and dissipated on the surface of the heat dissipation part 221. Since copper has good thermal conductivity, the heat dissipation part 221 can completely conduct the temperature of the heat dissipation part 221.

[0027] refer to Figure 2-3A through hole is provided at the center of the heat dissipation part 221, and the pressing block 211 of the lifting and pressing part 21 passes through the through hole and slides up and down. The pressing block 211 is also made of copper material, so it can absorb and have the same temperature as the heat dissipation part 221. A rotating knob 212 is connected above the pressing block 211 of the lifting and pressing part 21, and the rotating knob 212 and the pressing block 211 are connected by a screw structure. By rotating the rotating knob 212, the pressing block 211 can be driven to move perpendicular to the radial direction of the rotating knob 212, so that the pressing block 211 can be driven to expand and contract on the surface of the heating part by rotating the rotating knob 212. There is a receiving structure 23 between the heating part and the rotating knob 212. The receiving structure 23 divides the lifting and pressing part 21 into two parts, one part is inside the heating part 22, and the other part is displaced above the receiving structure 23. The rotary knob 212 is located above the receiving structure 23, and the surface of the rotary knob 212 is engraved with scale marks, so that the pressing effect and the size of the applied pressure of the pressing block 211 can be adjusted by observing the scale marks. A driving rotating disk 213 is threadedly connected above the rotary knob 212, and a plurality of threaded rods 214 are threadedly connected to the center of the driving rotating disk 213. The threaded rods 214 penetrate the driving rotating disk 213 and the rotary knob 212, and one end of the threaded rods 214 is connected to the pressing block 211, forming a second screw structure, so that the pressing block 211 can be driven to move and be adjusted by twisting the threaded rods 214, thereby achieving the fine-tuning effect of the pressing block 211. Four operating members extend from the end of the driving rotating disk 213 away from the rotary knob 212, and the height of the operating members is greater than the thickness of the driving rotating disk 213, so that the operator can operate the driving rotating disk 213 conveniently.

[0028] refer to Figure 2 and Figure 4 The receiving structure 23 is made of plastic material and has certain elastic deformation performance. A clamping piece 231 is arranged on one side thereof. A clamping slot 12 is opened at the corresponding position of the placement portion. There is a chip limiting slot 11 on one side of the clamping slot 12. When the clamping piece 231 is clamped in the clamping slot 12, the pressing block 211 will extend into the chip limiting slot 11 to form a stable structure. Several heat dissipation slots 13 are opened next to the chip limiting slot 11. When the surface temperature of the pressing block 211 is too high and affects the function of the chip placed in the chip limiting slot 11, the temperature of the surface of the pressing block 211 will be dissipated, thereby maintaining the temperature of the chip surface at a controllable value.

[0029] When this mechanism is started, the chip is placed in the chip limiting groove 11. At this time, the detection mechanism is placed above the chip limiting groove 11, so that the card slot body 12 and the card connector 231 are engaged to fix the detection mechanism. At this time, the heating rod 223 is energized, and the pressure block 211 will heat up under the heat transfer effect of the heating rod 223 and the heat dissipation part 221. The rotating disk 213 and the rotating knob 212 are twisted and driven according to the numerical value that needs to be tested on the product. When turning, keep an eye on the scale on the rotating knob 212, so that the pressure block 211 approaches the chip surface and applies pressure. At this time, the high temperature will be transmitted to the chip surface. At this time, you can observe the readings of the effects of heat and pressure on the chip by observing the mobile phone screen, thereby completing the technical effect of double inspection of chip pressure and heat-bearing capacity.

[0030] The above embodiments are used to further illustrate the present invention, but the present invention is not limited to these specific implementations. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention should be understood to be within the protection scope of the present invention.

Claims

1. A self-heating size-adjustable mobile phone chip testing platform, comprising a platform base (1) and a chip limiting groove (11), characterized in that: The chip limiting groove (11) is provided with a detection structure (2), the detection structure (2) is divided into a lifting and pressing part (21) and a heating part (22), the heating part (22) comprises a heat dissipation part (221), a side of the heat dissipation part (221) is provided with a placement blind hole (222), a heating rod (223) is placed in the placement blind hole (222), the lifting and pressing part (21) comprises a pressing block (211) passing through the heat dissipation part (221), the pressing block (211) moves in the heat dissipation part (221) along a vertical direction, and the pressing block (211) matches the chip limiting groove (11).

2. The self-heating size-adjustable mobile phone chip testing platform according to claim 1, characterized in that: The lifting and pressing part (21) further comprises a rotating knob (212) arranged above the heat dissipation component (221), and the rotating knob (212) is engraved with scale marks.

3. The self-heating size-adjustable mobile phone chip testing platform according to claim 2, characterized in that: The upper part of the rotating knob (212) is threadedly connected to a driving rotating disk (213), and the center of the driving rotating disk (213) is threadedly connected to a plurality of threaded rods (214). The threaded rods (214) penetrate the driving rotating disk (213) and the rotating knob (212), and one end of the threaded rods (214) is connected to the pressing block (211).

4. The self-heating size-adjustable mobile phone chip testing platform according to claim 3, characterized in that: A plurality of operating members extend from one end of the driving rotating disk (213) away from the rotating knob (212), and the height of the operating members is greater than the thickness of the driving rotating disk (213).

5. The self-heating size-adjustable mobile phone chip testing platform according to claim 1, characterized in that: A receiving structure (23) is fixedly connected above the heat dissipation component (221), the pressing block (211) passes through the receiving structure (23), and the receiving structure (23) divides the lifting and pressing part (21) into a part located inside the heating part (22) and a part located above the receiving structure (23).

6. The self-heating size-adjustable mobile phone chip testing platform according to claim 5, characterized in that: A clamping piece (231) is provided on one side of the receiving structure (23), and a clamping groove body (12) for the clamping piece (231) to extend into is provided on a side opposite to the chip limiting groove (11).

7. The self-heating size-adjustable mobile phone chip testing platform according to claim 1, characterized in that: A plurality of heat dissipation slots (13) are provided on one side of the chip limiting slot (11).

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