Wafer bonding heating carrier

Abstract

The utility model relates to the technical field of wafer bonding, and discloses a wafer bonding heating carrier, which comprises a heating disc body, and a heating assembly is arranged in the heating disc body; the heat insulation piece is installed on the bottom face of the heating plate body, and a through opening for the heating assembly wire to pass through is formed in the bottom face of the heat insulation piece; a bottom ring part is arranged on the bottom surface of the outer sealing part, the inner side of the bottom ring part is attached to the bottom surface of the heat insulation part, a heat insulation gap is formed between the circumferential wall of the outer sealing part and the circumferential wall of the heating plate body, and the outer sealing part, the heat insulation part and the heating plate body are fixed through second mounting bolts. According to the utility model, the heat insulation piece is designed, the heat insulation piece is arranged on the bottom surface of the lower part of the heating plate, the bottom of the outer sealing piece is connected with the lower part of the heating plate through the second mounting bolt, the structure is simple, the heat insulation effect is good, and the designed heat insulation piece is simple in modeling, convenient to assemble and higher in overall practicability.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer bonding, in particular to a wafer bonding heating carrier. Background Art

[0002] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers through chemical and physical effects. As the application of wafer bonding technology becomes more and more extensive, temperature has gradually become one of the bottlenecks in the development of wafer bonding technology. Wafer bonding processes include fusion, anodic bonding, metal bonding, and polymer adhesive bonding. These wafer bonding methods require heating the two wafers to fuse or diffuse the dielectric layers on the wafer surfaces and press the two wafers together.

[0003] For example, the Chinese utility model patent with publication number CN216120221U, entitled A heating carrier and wafer bonding device for high temperature bonding, comprises an inner heating body, a ceramic insulation ring and an outer sealing ring, wherein the inner heating body is a metal cylinder, a plurality of heating rods are inserted from the bottom to the top of the inner heating body, the ceramic insulation ring is threadedly connected to the outer side of the lower part of the inner heating body, the outer sealing ring is threadedly connected to the outer side of the ceramic insulation ring, a gap is left between the top of the inner heating body and the outer sealing ring, and the top surface of the outer sealing ring is provided with a sealing groove for embedding the sealing ring. The utility model can reduce the transfer of heat to the outer sealing ring, ensure the sealing effect, and can be applied to wafer bonding in the temperature range of 0℃-300℃.

[0004] The structure of the ceramic insulation ring in this application is relatively complex, requiring threaded structures to be designed on both the inner and outer walls, and the threaded assembly between the inner heating body and the outer sealing ring is time-consuming. Also, because the structural dimensions of the three are large, the assembly operation is not simple. Therefore, there is an urgent need to provide a wafer bonding heating carrier to solve the above technical problems. Utility Model Content

[0005] The purpose of the utility model is to provide a wafer bonding heating carrier to solve the problem that the substrate, refrigerant pipeline and cover plate proposed in the above background technology are all independently designed, the material cost is relatively high, and assembly is required, which also increases the manpower and material investment in production and processing.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A wafer bonding heating carrier, comprising:

[0008] A heating plate body, wherein a heating assembly is disposed in the heating plate body;

[0009] A heat insulating member, the heat insulating member is mounted on the bottom surface of the heating plate body, and the bottom surface of the heat insulating member is provided with a through hole for the heating component wire to pass through;

[0010] An outer seal, wherein a bottom ring portion is arranged on the bottom surface of the outer seal, the inner side of the bottom ring portion is in contact with the bottom surface of the thermal insulation member, a thermal insulation gap is formed between the circumferential wall of the outer seal and the circumferential wall of the heating plate body, and the outer seal, the thermal insulation member and the heating plate body are fixed by a second mounting bolt.

[0011] As another preferred solution of the present invention, a convex ring portion is provided on the bottom surface of the thermal insulation member.

[0012] As another preferred solution of the utility model, a positioning groove is provided on the inner side of the bottom ring portion, the depth of the positioning groove is the same as the thickness of the convex ring portion, and the convex ring portion is embedded in the positioning groove.

[0013] As another preferred solution of the utility model, a sealing groove is provided on the top of the outer sealing member.

[0014] As another preferred embodiment of the present invention, the heating plate body comprises a heating plate upper portion and a heating plate lower portion, and the heating plate upper portion and the heating plate lower portion are arranged up and down and connected by a first mounting bolt.

[0015] As another preferred embodiment of the present invention, the heating component is a heating wire, a heating installation groove is provided on the upper bottom surface of the heating plate, the heating wire is coiled in the heating installation groove, and the wire of the heating installation groove extends from the through groove.

[0016] As another preferred solution of the present invention, a thermocouple is also installed on the bottom surface of the upper part of the heating plate.

[0017] As another preferred solution of the present invention, a guide piece is provided on the lower portion of the heating plate, and a guide hole adapted to the guide piece is provided on the bottom surface of the upper portion of the heating plate.

[0018] As another preferred embodiment of the present invention, the thermal insulation member is a ceramic thermal insulation ring.

[0019] Compared with the prior art, the beneficial effects of the utility model are:

[0020] The utility model is designed with a heat insulating member, which is installed on the bottom surface of the lower part of the heating plate. The bottom of the outer sealing member is connected to the heat insulating member and the lower part of the heating plate through a second mounting bolt. The structure is simple and has good heat insulation effect. The heat insulating member designed in this way has a simple shape, is easy to assemble, and has better overall practicality.

[0021] The utility model is designed with a spiral heating wire, which makes the heating effect more uniform, and divides the heating plate body into an upper heating plate part and a lower heating plate part, which is convenient for installation and positioning of the heating wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a cross-sectional schematic diagram of the utility model.

[0023] Figure 2 It is a three-dimensional schematic diagram of the upper part and the lower part of the heating plate in the utility model.

[0024] Figure 3 It is a three-dimensional schematic diagram of the upper part of the heating plate in the utility model.

[0025] Figure 4 It is an overall three-dimensional schematic diagram of the utility model.

[0026] Figure 5 It is a three-dimensional schematic diagram of the heat insulation element in the utility model.

[0027] In the figure: 1. heating plate body; 11. upper part of heating plate; 12. lower part of heating plate; 2. first mounting bolt; 21. bolt hole; 3. guide member; 31. guide hole; 4. heating wire; 41. heating mounting groove; 5. thermocouple; 51. thermocouple mounting hole; 6. through groove; 7. outer sealing member; 71. sealing groove; 72. positioning groove; 73. bottom ring; 8. thermal insulation member; 81. convex ring; 9. second mounting bolt; 10. thermal insulation gap. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] See also Figure 1-5 , the utility model provides the following embodiments:

[0030] A wafer bonding heating carrier comprises: a heating plate body 1, a thermal insulation member 8 and an outer sealing member 7, wherein the thermal insulation member 8 is an annular structure and is installed on the bottom surface of the heating plate body 1, and the bottom surface of the outer sealing member 7 has a bottom ring portion 73, and a sealing groove 71, the thermal insulation member 8 and the heating plate body 1 are connected by a second mounting bolt 9. The structural construction of the thermal insulation member 8 is simpler, the production and processing are more convenient, and there is a cost advantage. At the same time, the assembly connection between the thermal insulation member 8, the outer sealing member 7 and the heating plate body 1 is simpler, the operation difficulty is low, the connection is stable, and the assembly time can be greatly shortened.

[0031] A heating assembly is disposed in the heating plate body 1 . The heating plate body 1 is made of a heat-conducting material and has a flat surface, and the surface is used for placing wafers.

[0032] The thermal insulation member 8 is installed on the bottom surface of the heating plate body 1. A through hole is provided on the bottom surface of the thermal insulation member 8 for the heating component wire to pass through. The through hole is set at the center of the bottom surface of the thermal insulation member 8 and penetrates the thermal insulation member 8 upward to facilitate the passage of the wire. The thermal insulation member 8 has poor thermal conductivity and can effectively provide temperature insulation.

[0033] The bottom surface of the outer seal 7 is provided with a bottom ring portion 73, and the bottom ring portion 73 and the outer seal 7 are an integral structure. The circumferential wall of the outer seal 7 is cylindrical, and the bottom ring portion 73 is a ring-shaped structure located at the bottom of the outer seal 7. The bottom ring portion 73 is provided with an opening along the center to facilitate the wire of the heating component to pass through; the inner side of the bottom ring portion 73 is in contact with the bottom surface of the thermal insulation 8, and a thermal insulation gap 10 is formed between the circumferential wall of the outer seal 7 and the circumferential wall of the heating disk body 1. The thermal insulation gap 10 is an annular gap, and the spacing is kept straight to provide comprehensive thermal insulation; the outer seal 7, the thermal insulation 8 and the heating disk body 1 are fixed by a second mounting bolt 9, and the three are fixed by the second mounting bolt 9. A set of second mounting bolts 9 is sufficient, and the assembly operation is simple. While ensuring the thermal insulation effect, the assembly is simpler. The second mounting bolts 9 are preferably made of high-temperature resistant material. In the mounting hole of the thermal insulation 8, a thermal insulation sleeve can be added to strengthen the thermal insulation to avoid local heat conduction due to the connection of the second mounting bolts 9.

[0034] As a further improvement of the present invention, the bottom surface of the heat insulating member 8 is provided with a convex ring portion 81, combined with Figure 5 Specifically, the convex ring portion 81 and the thermal insulation member 8 are integrated. By adding the convex ring portion 81, the strength of the thermal insulation member 8 can be enhanced. In addition, the thermal insulation member 8 can also play a certain limiting role in the installation process of the outer sealing member 7.

[0035] As a further improvement of the present invention, a positioning groove 72 is provided on the inner side of the bottom ring portion 73. The depth of the positioning groove 72 is the same as the thickness of the convex ring portion 81. The convex ring portion 81 is embedded in the positioning groove 72. The positioning groove 72 is provided at the edge position of the inner surface of the bottom ring portion 73 and can be matched with the convex ring portion 81 to play a positioning role, facilitate assembly and alignment work, and ensure the flatness of the bottom surface of the heating carrier.

[0036] As a further improvement of the present invention, a sealing groove 71 is provided at the top of the outer sealing member 7, and an O-ring sealing member is placed in the sealing groove 71 to enhance the sealing effect.

[0037] As a further improvement of the present invention, the heating plate body 1 comprises a heating plate upper portion 11 and a heating plate lower portion 12, the heating plate upper portion 11 and the heating plate lower portion 12 are arranged up and down and connected by a first mounting bolt 2, combined with Figure 2 , Figure 3 The split design of the upper portion 11 of the heating plate and the lower portion 12 of the heating plate can make the installation of the heating component more convenient.

[0038] As a further improvement of the present invention, the heating component is a heating wire 4, and a heating installation groove 41 is provided on the bottom surface of the upper portion 11 of the heating plate. The heating wire 4 is coiled in the heating installation groove 41, and the wire of the heating installation groove 41 extends from the through groove 6. Figure 2 , Figure 3 Specifically, the through slot 6 is opened at the axis of the lower part 12 of the heating plate, and the spiral heating wire 4 has a more uniform temperature during the heating process compared with the heating rod in the lattice part.

[0039] As a further improvement of the utility model, a thermocouple 5 is also installed on the bottom surface of the upper part 11 of the heating plate for temperature detection. The thermocouple 5 is installed in the thermocouple mounting hole 51 on the bottom surface of the heating plate body 1 and passes through the through groove 6. The temperature of the heating plate body 1 can be monitored to ensure accurate heating.

[0040] As a further improvement of the utility model, a guide member 3 is provided on the lower portion 12 of the heating plate, and a guide hole 31 adapted to the guide member 3 is opened on the bottom surface of the upper portion 11 of the heating plate. Combined with the drawings, specifically, guiding and positioning are performed by the guide member 3 and the guide hole 31. In this embodiment, 3 groups of guide members 3 are provided, which are distributed in a ring array. After being inserted into the guide hole 31, the positioning of the lower portion 12 of the heating plate and the upper portion 11 of the heating plate can be guaranteed, thereby ensuring the convenience of installation.

[0041] As a further improvement to the present invention, the thermal insulation member is a ceramic thermal insulation ring, which has good thermal insulation effect, high overall stability and long service life.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer bonding heating carrier, characterized in that: include: A heating plate body (1), wherein a heating component is arranged in the heating plate body (1); A heat insulating member (8), the heat insulating member (8) being mounted on the bottom surface of the heating plate body (1), and the bottom surface of the heat insulating member (8) is provided with a through hole for the heating component wire to pass through; An outer seal (7), wherein the bottom surface of the outer seal (7) is provided with a bottom ring portion (73), the inner side of the bottom ring portion (73) is in contact with the bottom surface of the thermal insulation member (8), a thermal insulation gap (10) is formed between the circumferential wall of the outer seal (7) and the circumferential wall of the heating plate body (1), and the outer seal (7), the thermal insulation member (8) and the heating plate body (1) are fixed by a second mounting bolt (9).

2. A wafer bonding heating carrier according to claim 1, characterized in that: The bottom surface of the heat insulating member (8) is provided with a convex ring portion (81), the inner side of the bottom ring portion (73) is provided with a positioning groove (72), the depth of the positioning groove (72) is the same as the thickness of the convex ring portion (81), and the convex ring portion (81) is embedded in the positioning groove (72).

3. The wafer bonding heating carrier according to claim 1, characterized in that: A sealing groove (71) is formed on the top of the outer sealing member (7).

4. The wafer bonding heating carrier according to claim 1, characterized in that: The heating plate body (1) comprises a heating plate upper part (11) and a heating plate lower part (12), wherein the heating plate upper part (11) and the heating plate lower part (12) are arranged vertically and connected by a first mounting bolt (2).

5. The wafer bonding heating carrier according to claim 4, characterized in that: The heating component is a heating wire (4), and a heating installation groove (41) is provided on the bottom surface of the upper portion (11) of the heating disk. The heating wire (4) is coiled in the heating installation groove (41), and the wire of the heating installation groove (41) extends out from the through groove (6).

6. The wafer bonding heating carrier according to claim 5, characterized in that: A thermocouple (5) is also installed on the bottom surface of the upper portion (11) of the heating plate.

7. The wafer bonding heating carrier according to claim 6, characterized in that: A guide member (3) is provided on the lower portion (12) of the heating plate, and a guide hole (31) adapted to the guide member (3) is provided on the bottom surface of the upper portion (11) of the heating plate.

8. The wafer bonding heating carrier according to claim 1, characterized in that: The thermal insulation component (8) is a ceramic thermal insulation ring.

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