Double-row connector and device having the same

By setting ordinary solder pads and drag pads in the middle of the double-row connector, the tin absorption function of the drag pads is used to solve the problem of high tin rate caused by the small PIN spacing of the double-row connectors, which improves production efficiency and reduces costs.

CN222749720UActive Publication Date: 2025-04-11DONGGUAN CYBER ENERGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421487014.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-26
Publication Date
2025-04-11
Estimated Expiration
2034-06-26

AI Technical Summary

Technical Problem

During the mass production process, the PIN spacing of the double row connectors is small, resulting in a high tin connection rate, requiring manual inspection and re-repair, reducing efficiency and increasing costs.

Method used

A dual row connector is designed to arrange the common pads and the drag pads between the two rows of pads. The tin portion of the tin solder pad absorbs excess tin through the traction force between the tin, thereby avoiding the connection of tin.

Benefits of technology

It effectively avoids the connection between the PIN pins of the connector, improves production efficiency and reduces costs.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222749720U_ABST
    Figure CN222749720U_ABST
Patent Text Reader

Abstract

The present application provides a double-row connector, the double-row connector comprising: a first row of solder pads arranged at intervals and a second row of solder pads arranged on one side of the first row of solder pads along the direction of passing through the tin furnace; at least one row of solder pads between the first and second rows of solder pads are arranged at intervals with a number of first common solder pads and tin-drag solder pads, the tin-drag solder pads being arranged between every two of the first common solder pads; the tin-drag solder pads comprising: a base and tin-drag portions extending from both sides of the middle of the base in a direction relative to the direction of passing through the tin furnace; the length of the tin-drag portion is 1 to 1.5 times the width of the first common solder pad, and the width of the tin-drag portion is the same as the width of the first common solder pad; a number of common solder pads are arranged at intervals in the second row of solder pads. The present application also provides a device with a double-row connector. The tin-drag solder pads absorb excess tin from nearby solder pads through the mutual pulling force of the tins, thereby avoiding bridging.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present application relates to the field of connectors, and in particular to a double-row connector and a device having the double-row connector. Background Art

[0002] In the prior art, in the mass production process, due to the requirement of product miniaturization, some double-row connectors are placed vertically to the direction of the soldering furnace. The PIN spacing of the connector is small, so the soldering rate is very high, and manual inspection and repair are required, which reduces efficiency and increases costs. Utility Model Content

[0003] The present application provides a double-row connector and a device having the double-row connector, which can avoid soldering between connector PIN pins.

[0004] In the first aspect, the present application provides a double-row connector, which includes: a first row of solder pads arranged at intervals and a second row of solder pads arranged on one side of the first row of solder pads along a direction passing through a tin furnace; at least one row of solder pads between the first row of solder pads and the second row of solder pads includes a plurality of first ordinary solder pads and tin-drag solder pads arranged at intervals, and the tin-drag solder pads are arranged between every two of the first ordinary solder pads; the tin-drag solder pads include: a base and tin-drag portions that are dragged out from both sides of the middle of the base toward the direction relative to the tin-drag direction; the length of the tin-drag portion is 1 to 1.5 times the width of the first ordinary solder pad, and the width of the tin-drag portion is the same as the width of the first ordinary solder pad.

[0005] Furthermore, the side of the tin dragging portion close to the base is in an arc shape, and the side away from the base is in a rectangular shape.

[0006] Furthermore, two ends of the double-row connector are common pads, and the tin-drag pads are arranged between the first common pads at intervals.

[0007] Furthermore, the center of the base and the center of the first common solder pad are located on the same straight line, and the straight line is perpendicular to the direction of the solder furnace.

[0008] Furthermore, the first row of pads is symmetrical to the second row of pads.

[0009] In the second aspect, the present application also provides a device with a double-row connector, the device with a double-row connector comprising: a PCB board, and a double-row connector connected to the PCB board, the double-row connector comprising: a first row of solder pads arranged at intervals and a second row of solder pads arranged on one side of the first row of solder pads along a direction passing through the tin furnace; at least one row of solder pads of the first row of solder pads and the second row of solder pads comprises a plurality of first ordinary solder pads and tin-drag solder pads arranged at intervals, the tin-drag solder pads being arranged between every two first ordinary solder pads; the tin-drag solder pads comprising: a base and tin-drag portions extending from both sides of the middle of the base toward the direction relative to the tin-drag furnace; the length of the tin-drag portion is 1 to 1.5 times the width of the first ordinary solder pad, and the width of the tin-drag portion is the same as the width of the first ordinary solder pad.

[0010] Furthermore, the side of the tin dragging portion close to the base is in an arc shape, and the side away from the base is in a rectangular shape.

[0011] Furthermore, two ends of the double-row connector are common pads, and the tin-drag pads are arranged between the first common pads at intervals.

[0012] Furthermore, the center of the base and the center of the first common solder pad are located on the same straight line, and the straight line is perpendicular to the direction of the solder furnace.

[0013] Furthermore, the first row of pads is symmetrical to the second row of pads.

[0014] The present application separates ordinary solder pads by using tin-drag solder pads, and the tin-drag solder pads absorb excess tin from nearby solder pads through the mutual pulling force of the tin, thereby achieving the effect of avoiding tin bridging. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0016] Figure 1 A schematic diagram of the structure of a double-row connector provided in an embodiment of the present application.

[0017] Figure 2 A schematic diagram of the structure of the tin-drag pad provided in an embodiment of the present application.

[0018] Figure 3 A schematic structural diagram of a device with a double-row connector provided in an embodiment of the present application.

[0019] The numbers in the figure are as follows:

[0020] PCB board 1 Double row connector 2 The first row of pads 20 The second row of pads 21 First common pad 200 Tinning pad 201 Base 2010 Tin Drag Department 2011 Direction of soldering furnace 3 Ordinary pad 210

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. Specific embodiments

[0022] In the description of the present application, it needs to be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship described in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implying the number of technical features indicated by the term. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the feature. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0024] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] In order to make the content of this application more clearly and accurately understood, it will now be described in detail with reference to the accompanying drawings. The accompanying drawings in the specification illustrate examples of embodiments of the present application, wherein the same reference numerals represent the same elements. It is understood that the scales shown in the accompanying drawings in the specification are not the scales actually implemented in this application, and are only for the purpose of illustrative description, and are not drawn according to the original size.

[0026] like Figure 1As shown, the double-row connector 2 includes two rows of pads arranged at intervals, namely, a first row of pads 20 and a second row of pads 21. In this embodiment, the first row of pads 20 and the second row of pads 21 are arranged side by side along the tin furnace passing direction 3. At least one row of pads in the first row of pads 20 and the second row of pads 21 are arranged at intervals with a plurality of first common pads 200 and tin-drag pads 201. In some feasible embodiments, the first row of pads 20 and the second row of pads 21 are arranged at intervals with a plurality of first common pads 200 and tin-drag pads 201. In some other feasible embodiments, the first row of pads 20 are arranged with common pads 210 at intervals, and the second row of pads 21 are arranged with a plurality of first common pads 200 and tin-drag pads 201 at intervals.

[0027] In this embodiment, a plurality of first common pads 200 and tinning pads 201 are arranged at intervals in the first pad row 20, and the tinning pad 201 is arranged between every two first common pads 200. Common pads 210 are arranged at intervals in the second pad row 21.

[0028] The two pads of the first row of pads 200 of the double-row connector 2, which are close to the tinning furnace and far away from the tinning furnace, are first common pads 200. A plurality of first common pads 200 are arranged between the first common pads 200 at both ends, and each two first common pads 200 are separated by a tinning pad 201. A spacing is arranged between the first common pads 200 and the tinning pads 201. The spacing between the tinning pads 201 and the first common pads 200 is the same. The position and quantity of the first common pads 200 and the tinning pads 201 are merely examples, and are not limited here, and can be arranged according to actual needs.

[0029] like Figure 2 As shown, the tinning pad 201 includes a base 2010 and tinning portions 2011 extending from the middle of the base 2010 on both sides in a direction 3 relative to the tinning furnace. The length B of the tinning portion 2011 is between 1 and 1.5 times the width A of the first common pad 200, and the width C of the tinning portion 2011 is the same as the width A of the first common pad 200. The first common pad 200 is the same as the common pad 210. For example, the width A of the first common pad 210 is 0.5 mm, the width C of the tinning pad 201 is also 0.5 mm, and the length B of the tinning pad 201 is between 0.5 mm and 1.5 mm (including 0.5 mm and 1.5 mm).

[0030] Specifically, the base 2010 of the tinning pad 201 is a circular ring, and the tinning portion 2011 is tightly connected to the base 2010, that is, there is no gap. The length B of the tinning pad 201 is from the center of the base 2010 to the bottom of the tinning portion 2011, and the width C of the tinning pad 201 is the diameter of the outer circle of the base 2010. When passing through the tin furnace, the tinning pad absorbs the excess tin of the nearby pads through the mutual traction of the tin, thereby achieving the effect of avoiding tinning. Among them, the side of the tinning portion 201 close to the base 2010 is arc-shaped, and the side away from the base 2010 is rectangular.

[0031] The second row of pads 21 is arranged on one side of the first row of pads 20 along the direction 3 of passing through the tin furnace. The second row of pads 21 includes ordinary pads 210 arranged at intervals. The center of the base 2010 is located on the same straight line as the center of the first ordinary pad 200. The straight line is perpendicular to the direction 3 of passing through the tin furnace. Specifically, a spacing is provided between each ordinary pad 210, and each spacing is equal. In this embodiment, the center of the ordinary pad 210 of the second row of pads 21 is symmetrical with the center of the first ordinary pad 200 of the first row of pads 200 and the tinning pad 210. The ordinary pad 210 is a circular ring, and the width of the ordinary pad 210 is the diameter of the outer circle of the circular ring.

[0032] like Figure 3 As shown, an embodiment of the present application provides a schematic structural diagram of a device with a double-row connector.

[0033] The device with a double-row connector includes a PCB board 1 and a double-row connector 2 connected to the PCB board 1. A plurality of double-row connectors 2 are arranged at intervals on the device with a double-row connector. The device with a double-row connector includes but is not limited to electronic devices (computers, mobile phones, etc.) and communication devices (routers, switches, etc.). The double-row connector 2 has been described in detail and will not be repeated here.

[0034] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

[0035] The above examples are only preferred embodiments of the present invention, and certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope covered by the present invention.

Claims

1. A double-row connector, characterized in that: The double-row connector includes: a first row of solder pads arranged at intervals and a second row of solder pads arranged on one side of the first row of solder pads along the direction of passing through the tin furnace; at least one row of solder pads between the first row of solder pads and the second row of solder pads includes a plurality of first common solder pads and tin-drag solder pads arranged at intervals, and the tin-drag solder pads are arranged between every two of the first common solder pads; the tin-drag solder pads include: a base and tin-drag portions extended from both sides of the middle of the base toward the direction relative to the tin-drag direction; the length of the tin-drag portion is 1 to 1.5 times the width of the first common solder pad, and the width of the tin-drag portion is the same as the width of the first common solder pad.

2. The double-row connector according to claim 1, wherein: The side of the tin dragging part close to the base is in an arc shape, and the side away from the base is in a rectangular shape.

3. The double-row connector according to claim 1, wherein: Both ends of the double-row connector are first common pads, and the tin-drag pads are arranged between the first common pads.

4. The double-row connector according to claim 1, wherein: The center of the base and the center of the first common solder pad are located in the same straight line, and the straight line is perpendicular to the direction of the solder furnace.

5. The double-row connector according to claim 1, wherein: The first row of pads is symmetrical to the second row of pads.

6. A device having a double-row connector, characterized in that: The device with a double-row connector includes: a PCB board, and a double-row connector connected to the PCB board, the double-row connector includes: a first row of solder pads arranged at intervals and a second row of solder pads arranged on one side of the first row of solder pads along a direction passing through a tin furnace; at least one row of solder pads between the first row of solder pads and the second row of solder pads includes a plurality of first common solder pads and tin-drag solder pads arranged at intervals, and the tin-drag solder pad is arranged between every two of the first common solder pads; the tin-drag solder pad includes: a base and tin-drag portions that are dragged from both sides of the middle of the base toward the direction passing through the tin furnace; the length of the tin-drag portion is 1 to 1.5 times the width of the first common solder pad, and the width of the tin-drag portion is the same as the width of the first common solder pad. 7 . The device with a double-row connector as claimed in claim 6 , wherein a side of the tin-drag portion close to the base is in an arc shape, and a side away from the base is in a rectangular shape. 8 . The device with a double-row connector as claimed in claim 6 , wherein two ends of the double-row connector are common pads, and the soldering pads are arranged between the first common pads with the soldering pads as an interval.

9. The device with a double-row connector according to claim 6, characterized in that: The center of the base and the center of the first common solder pad are located in the same straight line, and the straight line is perpendicular to the direction of the solder furnace.

10. The device having a double-row connector as claimed in claim 6, characterized in that: The first row of pads is symmetrical to the second row of pads.