Data transmission line and data protection device

Abstract

The present application discloses a data transmission line and a data protection device. The data transmission line includes: a memory chip and a flat cable, one end of the flat cable is connected to the memory chip, and the other end of the flat cable is used to receive the stored data. The flat cable includes a plurality of data transmission segments, which are connected in sequence, and a gold finger for transmitting data is formed between adjacent data transmission segments. The technical solution of the present application can effectively complete the download of data and ensure the smooth analysis of data.

Description

Technical Field

[0001] The present application belongs to the technical field of data storage, and in particular relates to a data transmission line and a data protection device. Background Art

[0002] Accidents occasionally occur during the driving of vehicles. In order to analyze the causes of the accidents, it is necessary to save the data during the driving process in real time, so as to analyze the driving process of the vehicles and find the real causes of the accidents.

[0003] However, the line for transmitting data may be damaged due to an accident, resulting in line breakage, so that in the process of downloading the saved data, it is difficult to download the data smoothly and the analysis of the data cannot be completed smoothly. Utility Model Content

[0004] The purpose of the present application is to provide a data transmission line that can effectively complete data downloading and ensure smooth data analysis.

[0005] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by the practice of the present application.

[0006] According to one aspect of an embodiment of the present application, the present application provides a data transmission line, the data transmission line comprising:

[0007] Memory chips;

[0008] A flat cable, one end of which is connected to the storage chip, and the other end of which is used to receive storage data. The flat cable includes a plurality of data transmission segments, which are connected in sequence, and gold fingers for transmitting data are formed between adjacent data transmission segments.

[0009] In one aspect, the golden finger is provided with one or more than one.

[0010] In one aspect, the data transmission line further includes an insulating protective layer, and the insulating protective layer is disposed around the gold finger.

[0011] In one aspect, the data transmission line further includes a reinforcing sheet, the memory chip is disposed on the reinforcing sheet, and the flat cable is connected to the memory chip via the reinforcing sheet.

[0012] In one aspect, the data transmission line further comprises a shielding layer, and the shielding layer is disposed on the outer surface of the cable;

[0013] The shielding layer includes shielding wires, and the shielding wires are distributed in parallel on the outer surface of the cable, or the shielding wires are cross-arranged on the outer surface of the cable.

[0014] In one aspect, the data transmission line further comprises a protective cover, the protective cover forms a protective cavity with one end open, and the storage chip and a partial structure of the cable are arranged in the protective cavity;

[0015] The opening of the protective cover has four sides arranged opposite to each other in pairs, and the four sides are respectively a first arcuate side, a first straight side, a second arcuate side, and a second straight side, the first arcuate side, the first straight side, the second arcuate side, and the second straight side are connected in sequence, and the first arcuate side and the second arcuate side are symmetrical in center, and the first straight side and the second straight side are symmetrical in center;

[0016] Alternatively, the opening of the protective cover has two oppositely disposed sides, one side is an arc-shaped structure, and the other side is a straight line;

[0017] Alternatively, the opening of the protective cover is symmetrically arranged at the center, and the opening of the protective cover is convex in the length direction.

[0018] In one aspect, the data transmission line further includes a sealing block, which is disposed at an opening position of the protection cavity, and the cable is passed through the sealing block and connected to the storage chip.

[0019] In one aspect, the data transmission line further includes a heat sink, and the heat sink is embedded in the outer wall of the protective cover.

[0020] In one aspect, the data transmission line further includes a protective shell, the protective shell forms a heat dissipation space, the protective cover is fixed in the heat dissipation space, the protective shell includes an upper cover and a lower cover buckled up and down, one of the upper cover and the lower cover is provided with a wire opening, the cable is passed through the wire opening and connected to the storage chip;

[0021] A part of the structure of the wiring harness is attached to the wall surface of the upper cover, or a part of the structure of the wiring harness is attached to the wall surface of the lower cover.

[0022] In addition, in order to solve the above problems, the present application also provides a data protection device, which includes a housing and a data transmission line as described above, and the data transmission line is arranged in the housing.

[0023] In this application, the cable can transmit the received storage data to the storage chip. The position of the gold finger can directly transmit data, so you can directly choose to download and read data at the position of the gold finger. In this way, you can avoid the data transmission section where the line is damaged, complete the data download, and ensure that the data analysis is carried out smoothly.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings herein are incorporated into the specification and constitute a part of the specification, illustrate embodiments consistent with the present application, and together with the specification are used to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 The structural diagram of the data transmission line of the present application is schematically shown.

[0027] Figure 2 Another structural diagram of the data transmission line of the present application is schematically shown.

[0028] Figure 3 The schematic diagram of the structure of the protective cover and the heat sink of the present application is shown schematically.

[0029] Figure 4 The structural diagram of the protective cover of the present application is schematically shown.

[0030] Figure 5 The cross-sectional structure diagram of the protective cover of the present application is schematically shown.

[0031] Figure 6 A first structural diagram of the opening of the protective cover in the present application is schematically shown.

[0032] Figure 7 A second structural diagram of the opening of the protective cover in the present application is schematically shown.

[0033] Figure 8 A third structural schematic diagram of the opening of the protective cover in the present application is schematically shown.

[0034] Fig. 9 The schematic diagram shows a structure in which a part of the memory chip and the wiring of the present application are arranged in a protective cover.

[0035] Fig.10 The cross-sectional structure diagram of the data transmission line of the present application is schematically shown.

[0036] Fig.11 The schematic diagram shows the structure of the protective shell of the present application being arranged on the periphery of the protective sleeve.

[0037] Fig.12 The schematic diagram shows the structure in which the protective shell of the present application is entirely wrapped around the periphery of the protective cover.

[0038] Fig.13 The schematic diagram shows the structure of the horizontal arrangement of the shielding wires in the present application.

[0039] Fig.14 The schematic diagram shows the structure of the cross-setting of shielding lines in the present application.

[0040] Fig.15 The schematic diagram shows the structure of the cable passing through the upper shell in the data protection device of the present application.

[0041] Fig.16 The schematic diagram shows the structure of the cable passing through the lower shell in the data protection device of the present application.

[0042] The following are the descriptions of the reference numerals:

[0043] 100, memory chip; 200, cable; 300, insulation protection layer; 310, shielding layer; 400, reinforcement sheet; 500, protective cover; 600, sealing block; 700, heat sink; 800, protective shell; 900, housing; 910, card sleeve;

[0044] 210, data transmission section; 211, copper wire; 201, gold finger; 510, protection cavity; 520, opening; 530, flange; 710, heat dissipation through hole; 810, heat dissipation space; 820, upper cover; 830, lower cover. DETAILED DESCRIPTION

[0045] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more comprehensive and complete and fully convey the concept of the example embodiments to those skilled in the art.

[0046] See also Figure 1 and Figure 2 As shown, the present application provides a data transmission line, and the data transmission line in the present application can be applied to cars, airplanes, and ships. A car may have a traffic accident while driving, an airplane may have a flight accident while flying, and similarly, a ship may have a navigation accident while sailing on the water. In order to accurately analyze the specific occurrence process of these accidents, a data transmission line can be set on such vehicles.

[0047] The data transmission line includes: a memory chip 100 and a bus line 200; a memory unit is provided in the memory chip 100, and the memory unit is used to store data. The bus line 200 includes a plurality of copper wires 211, which are arranged side by side, and data can be transmitted through the plurality of copper wires 211.

[0048] One end of the cable 200 is connected to the memory chip 100, and the other end of the cable 200 is used to receive and store data. The cable 200 includes a plurality of data transmission segments 210, which are connected in sequence, and a gold finger 201 (connecting finger) for transmitting data is formed between adjacent data transmission segments 210. The driving data is sent to the cable 200 in real time, and the cable 200 then sends the data to be stored to the memory chip 100, and the memory chip 100 saves the data, which may include the driving speed, driving route, and driving height of the vehicle, as well as the driver's call records, the overall operating parameters of the vehicle, and abnormal information such as alarms.

[0049] In this embodiment, the flat cable 200 can transmit the received storage data to the storage chip 100. The position of the gold finger 201 can directly transmit data, so the position of the gold finger 201 can be directly selected to download and read data. In this way, the data transmission section 210 with damaged lines can be avoided, the data download is completed, and the data analysis is ensured to proceed smoothly.

[0050] For example, the data transmission segment 210 far away from the memory chip 100 is damaged, which may be broken or burned. Therefore, the damaged data transmission segment 210 can be cut at the position of the gold finger 201 to remove the damaged data transmission segment 210. The gold finger 201 is a hardware structure. Usually, the gold finger 201 is composed of many golden conductive contacts. Because its surface is gold-plated and the conductive contacts are arranged like fingers, it is called the gold finger 201. The gold finger 201 is actually a layer of gold coated on the copper clad board through the electroplating process, because gold has a strong anti-oxidation property that can protect the internal circuit from corrosion, and it also has strong conductive properties and will not cause signal loss. At the same time, gold has very strong ductility. Under appropriate pressure, the contact area between the contacts can be larger, thereby reducing the contact resistance and improving the signal transmission efficiency.

[0051] After the position of the gold finger 201 is cut, data is downloaded corresponding to each conductive chip position of the gold finger 201, thereby avoiding the damaged data transmission segment 210. In addition to being able to download data smoothly, the impact of the damaged data transmission segment 210 on the data download process can also be reduced.

[0052] In one embodiment of the present application, one or more gold fingers 201 are provided. When multiple gold fingers 201 are provided, there are multiple locations where data can be downloaded. Since the location of the gold finger 201 is between two data transmission segments 210, it can be known that the gold fingers 201 are also arranged in sequence at a location away from the memory chip 100. Generally speaking, the more gold fingers 201 are provided, the more locations where data can be downloaded, and the more the impact of damaged data transmission segments 210 can be reduced.

[0053] For example, a gold finger 201 may be disposed at the farthest end away from the memory chip 100 , and when the flat cable 200 is not damaged, data may be downloaded directly through the farthest gold finger 201 .

[0054] In addition, during the installation process of the flat cable 200 , there are inevitably some bends, and these bends are more likely to be damaged when impacted. Therefore, gold fingers 201 can be set at the bends of the flat cable 200 .

[0055] Furthermore, a gold finger 201 can be set at the position closest to the memory chip 100, that is, a gold finger 201 is set at the position where the cable 200 connects to the memory chip 100. Through this gold finger 201, even if the entire cable 200 is damaged, the data in the memory chip 100 can be directly read.

[0056] It should be further explained that the protection of the data transmission line is usually divided into multiple different protection zones, with layers of protection from the inside to the outside, and a gold finger 201 can be set at each different protection zone. The location of each protection zone is relatively isolated, so each gold finger 201 is also protected at different levels. Generally, the closer to the memory chip 100, the higher the protection level of the data transmission line. In this way, the protection level of the data transmission line and the memory chip 100 can be improved.

[0057] In one embodiment of the present application, the data transmission line further includes an insulating protective layer 300, which is disposed around the gold finger 201. The insulating protective layer 300 can provide insulation protection for the gold finger 201, preventing the gold finger 201 from being directly exposed to the outside, and can also reduce the line short circuit caused by the gold finger 201 during the data transmission process, thereby ensuring that the data transmission of the flat cable 200 is carried out normally. Specifically, the insulating protective layer 300 can also wrap the gold finger 201, provide sealing protection for the gold finger 201, and reduce the corrosion and oxidation of the gold finger 201 by the external environment.

[0058] In addition, the insulating protective layer 300 is thicker and higher than the surface of the data transmission section 210, that is, the insulating protective layer 300 protrudes from the surface of the data transmission section 210. In this way, the insulating protective layer 300 also plays a certain supporting role. In addition, the protruding setting of the insulating protective layer 300 can quickly determine the position of the gold finger 201, which is convenient for cutting the gold finger 201. The gold finger 201 can be quickly docked, and the efficiency of downloading data is improved.

[0059] Of course, in addition to confirming the position of the gold finger 201 by the thickness of the insulating protection layer 300, the insulating protection layer 300 can also be set to different colors so that the color of the insulating protection layer 300 is obviously different from the data transmission segment 210. In this way, the position of the gold finger 201 can also be quickly determined by color distinction.

[0060] In one embodiment of the present application, the data transmission line also includes a reinforcing sheet 400. The reinforcing sheet 400 mainly plays a supporting role. The memory chip 100 is arranged on the reinforcing sheet 400. The reinforcing sheet 400 can provide certain support and protection for the memory chip 100, improve the overall strength of the memory chip 100, and reduce the damage of the memory chip 100. The reinforcing sheet 400 is usually a metal sheet with high strength, or it can be a plastic sheet with high strength. The flat cable 200 is connected to the memory chip 100 through the reinforcing sheet 400. For example, the data transmission line includes a circuit board, the circuit board is arranged on the reinforcing sheet 400, the memory chip 100 is arranged on the circuit board, and the flat cable 200 is connected to the circuit board, and the electrical connection with the memory chip 100 is achieved through the circuit board.

[0061] When the reinforcing sheet 400 is a metal sheet, the reinforcing sheet 400 also has a certain heat dissipation effect. The heat generated by the memory chip 100 can be transferred to the reinforcing sheet 400 and then dissipated through the surface of the reinforcing sheet 400.

[0062] In the present application, the data transmission line is usually in a complex signal environment, and external signals can easily interfere with the normal data transmission of the data transmission line.

[0063] See also Fig. 9 and Fig.10 As shown, in one embodiment of the present application, the data transmission line further includes a shielding layer 310, which is disposed on the outer surface of the flat cable 200. The shielding layer 310 can protect the flat cable 200, reduce interference of external signals on signal transmission of the flat cable 200, and reduce distortion of data transmission.

[0064] The shielding layer 310 may be provided by coating an antimagnetic coating. The antimagnetic coating may also be called an electromagnetic wave shielding layer 310. The electromagnetic wave shielding layer 310 is an electromagnetic wave shielding coating applied to the outer surface of the flat cable 200. The electromagnetic wave shielding coating is a material that is sprayed with conductive particles mixed in a chemical solvent. The electromagnetic wave shielding coating is a functional coating that can shield electromagnetic waves. It has the advantages of room temperature curing and strong adhesion. It is an effective treatment method for electromagnetic shielding of various electronic devices.

[0065] It should be noted that an insulating layer is provided between the shielding layer 310 and the flat cable 200 to prevent the shielding layer 310 from directly contacting the flat cable 200 and reduce the impact on data transmission of the flat cable 200. For example, an insulating layer is formed around the copper wire 211 to reduce short circuits of the flat cable 200.

[0066] See also Figures 3 to 5 As shown, in one embodiment of the present application, the data transmission line further includes a protective cover 500, the protective cover 500 forms a protective cavity 510 with an opening 520 at one end, and the memory chip 100 and part of the structure of the flat cable 200 are arranged in the protective cavity 510. The protective cover 500 can reduce the impact of the external environment on the memory chip 100. In this embodiment, the protective cover 500 can be made of metal, such as copper metal, and the copper metal can form a shielding layer 310 on the periphery of the memory chip 100, so that the protective cover 500 can also play a certain shielding role, reduce the interference of external signal noise on the memory chip 100, and reduce the situation of inaccurate data stored in the memory chip 100.

[0067] In the above embodiments of the present application, the opening 520 of the protective cover 500 is provided in at least three situations.

[0068] See also Figure 6 As shown, the first setting is that the opening 520 of the protective cover 500 has four sides arranged opposite to each other in pairs, and the four sides are respectively a first arcuate side, a first straight side, a second arcuate side and a second straight side, the first arcuate side, the first straight side, the second arcuate side and the second straight side are connected in sequence, and the first arcuate side and the second arcuate side are symmetrical about the center, and the first straight side and the second straight side are symmetrical about the center.

[0069] See also Figure 7 As shown, the second setting is that the opening 520 of the protective cover 500 has two opposite sides, one side is an arc structure, and the other side is a straight line. The arc structure can increase the space of the protective cover 500 on one side to ensure that the memory chip 100 can be smoothly placed in the protective cover 500.

[0070] See also Figure 8As shown in the third configuration, the opening 520 of the protective cover 500 is symmetrically arranged at the center, and the opening 520 of the protective cover 500 is convex in the length direction. The convex part can increase the length of the opening, and the flat cable 200 or the reinforcing sheet 400 can be clamped at the convex position to improve the stability of the memory chip 100.

[0071] See again Figure 1 and Figure 3 As shown in one embodiment of the present application, when an accident occurs or when it rains, moisture may enter the protective cover 500, causing the memory chip 100 to be soaked in water, and the memory chip 100 is prone to failure. For this reason, the data transmission line also includes a sealing block 600, which is arranged at the opening 520 of the protective cavity 510, and the cable 200 is passed through the sealing block 600 and connected to the memory chip 100. A huge number of transistors are integrated in the memory chip 100, and the memory chip 100 will generate a lot of heat when storing data. If this heat is not dissipated in time, it will reduce the working efficiency of the memory chip 100, or even burn the memory chip 100. For this reason, in one embodiment of the present application, the data transmission line also includes a heat sink 700, which is embedded in the outer wall of the protective cover 500. The heat generated by the memory chip 100 is first transferred to the protective cover 500 and then transferred to the heat sink 700 through the protective cover 500. The heat sink 700 can increase the heat dissipation area of ​​the protective cover 500 and improve the heat dissipation effect on the memory chip 100.

[0072] Furthermore, a heat dissipation through hole 710 may be provided on the surface of the heat sink 700. The provision of the heat dissipation through hole 710 is equivalent to increasing the contact area between the heat sink 700 and the surrounding air, thereby increasing the heat dissipation effect.

[0073] It can be seen from the above that the protective cover 500 can not only protect the memory chip 100 and reduce the damage of the memory chip 100 caused by external forces, but also play the role of the shielding layer 310. At the same time, the protective cover 500 can also dissipate heat.

[0074] See also Fig.13 and Fig.14 As shown, the shielding layer 310 includes shielding wires, and a plurality of shielding wires are provided. The shielding wires can shield external signals and reduce interference with internal signals of the cable 200. There are at least two arrangements of the shielding wires. The first arrangement is that the shielding wires are distributed in parallel on the outer surface of the cable 200. The extension direction of the shielding is the same as the extension direction of the cable 200. The second arrangement is that the shielding wires are cross-arranged on the outer surface of the cable 200, and the shielding wires can cross to form a grid.

[0075] See also Fig.11 and Fig.12As shown, in one embodiment of the present application, the data transmission line further includes a protective shell 800, the protective shell 800 forms a heat dissipation space 810, the protective cover 500 is fixed in the heat dissipation space 810, the flat cable 200 is passed through the protective shell 800 and connected to the memory chip 100, and a part of the structure of the flat cable 200 is attached to the surface of the protective shell 800. The protective shell 800 is made of metal, and the heat generated by the memory chip 100 can be first transmitted to the protective cover 500, and then transferred to the heat dissipation space 810 through the protective cover 500.

[0076] The protective shell 800 includes an upper cover 820 and a lower cover 830 that are buckled together. The upper cover 820 can be buckled on the lower cover 830, or the lower cover 830 can be buckled on the upper cover 820. One of the upper cover 820 and the lower cover 830 is provided with a wire opening, and the cable 200 is passed through the wire opening and connected to the memory chip 100; in order to improve the heat dissipation effect of the cable 200.

[0077] The cable 200 can be attached to the protective shell 800, so that the cable 200 can have a larger contact area with the protective shell 800. Among them, there are at least two ways to protect the cable 200. The first way of arranging the cable 200 is that part of the structure of the cable 200 is attached to the wall surface of the upper cover 820. The second way of arranging the cable 200 is that part of the structure of the cable 200 is attached to the wall surface of the lower cover 830.

[0078] It should be noted that the flat cable 200 may be attached to the inner wall surface of the protective shell 800 , or may be attached to the outer wall surface of the protective shell 800 .

[0079] The heat is transferred to the protective shell 800 through the heat dissipation space 810. A heat dissipation medium may also be injected into the heat dissipation space 810 to transfer the heat of the protective cover 500 to the protective shell 800 more quickly.

[0080] The flat cable 200 will also generate a certain amount of heat when transmitting data. In order to improve the heat dissipation effect of the flat cable 200, part of the structure of the flat cable 200 can be attached to the outer surface or inner surface of the protective shell 800, so that surface-to-surface contact can be achieved, and the heat generated by the flat cable 200 can be directly transferred to the protective shell 800. Fig.11 As shown, the flat cable 200 is bent at the position of the protective shell 800 to fit with the outer surface of the protective shell 800 .

[0081] The protective shell 800 can also play a certain protective role on the memory chip 100, reducing the impact of the external environment on the memory chip 100. It should be emphasized that in this embodiment, through the provision of the protective cover 500 and the protective shell 800, a double layer of protection is formed for the memory chip 100, which can more effectively reduce the impact on the memory chip 100.

[0082] In one embodiment of the present application, the protective shell 800 is provided with a through opening, and the opening 520 of the protective cover 500 corresponds to the through opening position of the fixed protective shell 800. Specifically, the opening 520 of the protective cover 500 corresponds to the through opening of the protective shell 800, and the protective cover 500 is fixed to the through opening of the protective shell 800. For example, a flange 530 is provided at the opening 520 of the protective cover 500, and the flange 530 of the protective cover 500 can be snapped at the through opening position of the protective shell 800, or can be welded and fixed at the through opening position of the protective shell 800.

[0083] See also Fig.15 and Fig.16 As shown, the present application also provides a data protection device, which includes a housing 900 and a data transmission line as described above, and the data transmission line is arranged in the housing 900. For example, the protective shell 800 and the protective cover 500 are both arranged in the housing 900. It can be understood that from the position of the memory chip 100 to the outside, the protective cover 500, the protective shell 800 and the housing 900 are arranged in sequence, thereby forming three layers of protection, further improving the protection of the memory chip 100.

[0084] A ferrule 910 is provided at the position where the flat cable 200 is connected to the housing 900. The ferrule 910 is generally made of rubber. The flat cable 200 can pass through the ferrule 910. The ferrule 910 can be embedded in the housing 900 to provide certain support and protection for the flat cable 200 and reduce the friction between the flat cable 200 and the housing 900. In addition, a ferrule 910 can also be provided at the opening of the protective shell 800 to similarly reduce the friction between the protective shell 800 and the flat cable 200. The flat cable 200 can pass through the upper part of the housing 900 or the lower part of the housing 900.

[0085] The specific implementation methods and beneficial effects of the data protection device refer to the content of the data transmission line above, which will not be repeated here.

[0086] Those skilled in the art will readily come up with other embodiments of the present application after considering the specification and practicing the utility model disclosed herein. The present application is intended to cover any variations, uses or adaptations of the present application, which follow the general principles of the present application and include common knowledge or customary technical means in the art that are not disclosed in the present application.

[0087] It should be understood that the present application is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A data transmission line, characterized in that: The data transmission line comprises: Memory chips; A flat cable, one end of which is connected to the storage chip, and the other end of which is used to receive storage data. The flat cable includes a plurality of data transmission segments, which are connected in sequence, and gold fingers for transmitting data are formed between adjacent data transmission segments.

2. The data transmission line according to claim 1, characterized in that: The golden finger is provided with one or more than one.

3. The data transmission line according to claim 1, characterized in that: The data transmission line further comprises an insulating protective layer, and the insulating protective layer is arranged around the gold finger.

4. The data transmission line according to claim 1, characterized in that: The data transmission line further includes a reinforcing sheet, the memory chip is disposed on the reinforcing sheet, and the flat cable is connected to the memory chip via the reinforcing sheet.

5. The data transmission line according to claim 1, characterized in that: The data transmission line further comprises a shielding layer, and the shielding layer is arranged on the outer surface of the cable; The shielding layer includes shielding wires, and the shielding wires are distributed in parallel on the outer surface of the cable, or the shielding wires are cross-arranged on the outer surface of the cable.

6. The data transmission line according to claim 1, characterized in that: The data transmission line further comprises a protective cover, wherein the protective cover forms a protective cavity with one end open, and the memory chip and a part of the structure of the cable are arranged in the protective cavity; The opening of the protective cover has four sides arranged opposite to each other in pairs, and the four sides are respectively a first arcuate side, a first straight side, a second arcuate side, and a second straight side, the first arcuate side, the first straight side, the second arcuate side, and the second straight side are connected in sequence, and the first arcuate side and the second arcuate side are symmetrical in center, and the first straight side and the second straight side are symmetrical in center; Alternatively, the opening of the protective cover has two oppositely disposed sides, one side is an arc-shaped structure, and the other side is a straight line; Alternatively, the opening of the protective cover is symmetrically arranged at the center, and the opening of the protective cover is convex in the length direction.

7. The data transmission line according to claim 6, characterized in that: The data transmission line further includes a sealing block, which is disposed at the opening of the protection cavity. The cable passes through the sealing block and is connected to the storage chip.

8. The data transmission line according to claim 6, characterized in that: The data transmission line further comprises a heat sink, and the heat sink is embedded in the outer side wall of the protective cover.

9. The data transmission line according to claim 6, characterized in that: The data transmission line also includes a protective shell, the protective shell forms a heat dissipation space, the protective cover is fixed in the heat dissipation space, the protective shell includes an upper cover and a lower cover buckled up and down, one of the upper cover and the lower cover is provided with a wire opening, the cable is passed through the wire opening and connected to the storage chip; A part of the structure of the wiring harness is attached to the wall surface of the upper cover, or a part of the structure of the wiring harness is attached to the wall surface of the lower cover.

10. A data protection device, characterized in that: The data protection device comprises a housing and a data transmission line as claimed in any one of claims 1 to 9, wherein the data transmission line is arranged in the housing.

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