Waterproof and sound-permeable structure of microphone and electronic equipment

Abstract

The present application belongs to the field of acoustic and electrical technology. The embodiments of the present application provide a waterproof and sound-permeable structure of a microphone and an electronic device, including a circuit board, which is constructed with a through hole; a microphone, which is arranged on one side of the circuit board and corresponds to the through hole; a patch-type waterproof component, which is used to be attached to the other side of the circuit board; the patch-type waterproof component includes a first adhesive, a waterproof film, a second adhesive, and a support member stacked in sequence, the first adhesive is constructed with a first sound-permeable hole extending to the waterproof film, the second adhesive and the support member are constructed with a second sound-permeable hole extending to the waterproof film, and the axis of the second sound-permeable hole coincides with the axis of the first sound-permeable hole. The present application attaches the finished patch-type waterproof component to the surface of the circuit board facing away from the microphone, and while achieving the functions of waterproofing and dustproofing the microphone, it can also protect the microphone from being contaminated by dirty foreign matter (volatile solder paste) and other substances when the microphone passes through a reflow oven.

Description

Technical Field

[0001] The present application relates to the field of acoustic and electrical technology, and in particular to a waterproof and sound-permeable structure of a microphone and an electronic device. Background Art

[0002] In order to apply microphones in large quantities to electronic products that require waterproof devices, such as mobile phones and laptop computers, a waterproof membrane is provided in the microphone structure to form a waterproof microphone.

[0003] At present, the waterproofing of the microphone part on the circuit board of electronic products is designed on the whole machine (shell material) product. On the one hand, this design method will cause the microphone to be easily contaminated by dirt, foreign matter, volatile solder paste, etc. when passing through equipment such as reflow soldering furnaces, which may easily damage the microphone or reduce its audio performance; on the other hand, since the waterproof membrane product has high requirements on the design, assembly, testing and other links of the whole machine, it is easy to damage the waterproof membrane during the production and assembly process, which not only affects the audio performance of the whole machine, but also reduces the assembly efficiency. Utility Model Content

[0004] The embodiments of the present application provide a waterproof and sound-permeable structure and an electronic device, which can protect the microphone from being contaminated by dirty foreign matter (volatile solder paste) and other substances while achieving the functions of waterproofing and dustproofing the microphone, and is conducive to improving assembly efficiency.

[0005] According to a first aspect of an embodiment of the present application, there is provided a waterproof and sound-permeable structure of a microphone, comprising:

[0006] In a feasible implementation, the patch-type waterproof component further includes a protective member, and the protective member is used to be stacked on the supporting member.

[0007] In a feasible implementation, the protective member is a protective film, and the side edge of the protective film protrudes from the support member so as to facilitate separation of the protective film from the support member;

[0008] The sides of the supporting member, the second adhesive member, the waterproof membrane and the first adhesive member are flush.

[0009] In a feasible implementation, the protective film is a PI film, and the temperature resistance range of the protective film is between -40°C and 350°C.

[0010] In a feasible implementation, the first adhesive component and the second adhesive component are both adhesive layers, and the temperature resistance range of the adhesive layer is between -40°C and 350°C.

[0011] In a feasible implementation, the support member is a PI layer, and the temperature resistance range of the PI layer is between -40°C and 350°C.

[0012] In a feasible implementation, the diameter of the first sound-transmitting hole is equal to the diameter of the second sound-transmitting hole, and the diameter of the first sound-transmitting hole or the second sound-transmitting hole is larger than the diameter of the through hole.

[0013] In a feasible implementation, the microphone is a patch microphone, and the microphone is fixedly bonded to the circuit board.

[0014] According to a second aspect of an embodiment of the present application, an electronic device is provided, comprising a shell and the waterproof and sound-permeable structure of the microphone described in the above example, the shell being provided with a sound inlet hole, the sound inlet hole penetrating through a side wall of the shell, the waterproof and sound-permeable structure being fixed in the shell, and the waterproof membrane being opposite to the sound inlet hole.

[0015] In a feasible implementation, a buffer sealing layer is arranged between the shell and the waterproof and sound-permeable structure, and the buffer sealing layer is constructed with a through hole that penetrates the sound inlet hole; wherein one side of the buffer sealing layer is bonded to the inner surface of the shell, and the other side of the buffer sealing layer is bonded to the surface of the support member.

[0016] The waterproof and sound-permeable structure of the microphone and the electronic device provided in the embodiments of the present application attach the finished chip-type waterproof component to the surface of the circuit board facing away from the microphone, thereby realizing the functions of waterproofing and dustproofing the microphone, and protecting the microphone from contamination by dirty foreign matter (volatile solder paste) and other substances when the microphone passes through a reflow oven. In addition, the present application pre-arranges the chip-type waterproof component on the circuit board, eliminating the steps of assembling, pressurizing, and testing the waterproof film during assembly, saving assembly procedures and thus improving assembly efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a schematic structural diagram of a waterproof and sound-permeable structure of a microphone provided in an embodiment of the present application;

[0019] Figure 2 A schematic diagram of the structure of a patch-type waterproof assembly provided according to an embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of a patch-type waterproof component (including a protective member) provided according to an embodiment of the present application;

[0021] Figure 4 A schematic diagram of a process of attaching a patch-type waterproof component to a circuit board according to an embodiment of the present application;

[0022] Figure 5 A schematic diagram of a partial structure of an electronic device provided according to an embodiment of the present application.

[0023] Reference numerals:

[0024] 100, circuit board; 110, through hole;

[0025] 200, microphone;

[0026] 300, patch-type waterproof component; 310, first adhesive member; 311, first sound-permeable hole; 320, waterproof film; 330, second adhesive member; 340, support member; 341, second sound-permeable hole; 350, protective member;

[0027] 400, housing; 410, sound inlet hole;

[0028] 500, buffer sealing layer;

[0029] 600, carrier tape;

[0030] 700. Chip mounter. DETAILED DESCRIPTION

[0031] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0032] In the description of the embodiments of the present application, it should be noted that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0033] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0034] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0035] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0036] In the related art, the waterproofing of the microphone part on the circuit board of the electronic product is designed on the whole machine (shell material) product, which can be understood as pasting the waterproof film on the shell material, and then setting the circuit board on the side of the shell with the waterproof film. This design method, on the one hand, will cause the microphone and the circuit board (without waterproof film) to be easily contaminated by dirt, foreign matter, volatile solder paste, etc. when passing through the reflow soldering furnace and other equipment, which may easily damage the microphone or reduce its audio performance; on the other hand, since the waterproof film product has high requirements for the design, assembly, testing and other links of the whole machine, it is easy to damage the waterproof film during the production and assembly process (including damage to the waterproof film during the installation of the circuit board to the shell material), which not only affects the audio performance of the whole machine, but also reduces the assembly efficiency.

[0037] Based on the above problems, the present application first provides a waterproof and sound-permeable structure of a microphone 200. Figure 1 is a schematic structural diagram of a waterproof and sound-permeable structure of a microphone provided in an embodiment of the present application; Figure 2 A schematic diagram of the structure of a patch-type waterproof assembly according to an embodiment of the present application; Figure 1 and Figure 2 As shown, the waterproof and sound-permeable structure may include a circuit board 100 , a microphone 200 and a patch-type waterproof component 300 .

[0038] The circuit board 100 is configured with a through hole 110; the microphone 200 is arranged on one side of the circuit board 100 and corresponds to the through hole 110; the patch-type waterproof component 300 is used to be attached to the other side of the circuit board 100; the patch-type waterproof component 300 includes a first adhesive 310, a waterproof membrane 320, a second adhesive 330 and a support 340 stacked in sequence, the first adhesive is configured with a first sound-permeable hole 311 extending to the waterproof membrane 320, the second adhesive 330 and the support 340 are configured with a second sound-permeable hole 341 extending to the waterproof membrane 320, and the axes of the second sound-permeable hole 341 and the first sound-permeable hole 311 coincide with each other; the first adhesive 310 is configured to fix the patch-type waterproof component 300 on the circuit board 100, and to make the first sound-permeable hole 311 coincide with the axis of the through hole 110.

[0039] It is understandable that the through hole 110 on the circuit board 100 is a microporous structure, and its main purpose is to connect the microphone 200 with external voice information. In order to ensure that the microphone 200 has waterproof performance after being installed in the electronic product, a patch-type waterproof component 300 is provided on the path of the microphone 200 and the external information transmission, that is, the patch-type waterproof component 300 is provided on the side of the circuit board 100 opposite to the microphone 200, and corresponds to the position of the through hole 110, so as to prevent external water, dust, foreign matter, etc. from contacting the microphone 200 along the through hole 110.

[0040] In this example, the finished SMD waterproof component 300 is directly attached to the circuit board 100 in the form of a patch to achieve the subsequent waterproof function of the microphone 200. Moreover, when the circuit board 100 and the microphone 200 with the SMD waterproof component 300 are passed through the reflow oven, the SMD waterproof component 300 can protect the microphone 200 from being contaminated by dirty foreign matter (volatile solder paste) and other substances.

[0041] In addition, the waterproof and sound-permeable structure of the microphone 200 can be directly assembled with other parts of the electronic product, without the need to set up an additional audio test station on the assembly line (specifically the assembly plant in this example), and the assembly plant eliminates the assembly, pressure maintenance, and testing of the waterproof membrane 320, saving assembly procedures and improving assembly efficiency; for example, the assembly efficiency can be increased by more than 10%. In addition, this setting method can also reduce the damage to the waterproof membrane 320 caused by the assembly process, thereby improving the audio performance of the entire electronic product. For example, the audio performance of the entire electronic product is improved by more than 1dB.

[0042] More specifically, Figure 4As shown, the patch-type waterproof component 300 in this example can be manufactured separately, and multiple patch-type waterproof components 300 can be packaged with a carrier tape 600. When it is necessary to paste the patch-type waterproof component 300 on the circuit board 100, the nozzle of the patch machine 700 can be used to suck up one of the patch-type waterproof components 300 on the carrier tape 600, and then the patch-type waterproof component 300 is accurately pasted at the predetermined position of the circuit board 100 with the position of the through hole 110 on the circuit board 100 as a reference. This patch-type design can increase the patch yield to 90%-100%, and can also effectively prevent dirt, foreign matter, etc. from damaging the microphone 200 through the through hole 110 of the circuit board 100.

[0043] In order to achieve effective support for the waterproof membrane 320, the structure of the patch type waterproof component 300 in this example may include a first adhesive member 310, a waterproof membrane 320, a second adhesive member 330 and a support member 340 which are stacked. The first adhesive member 310 and the second adhesive member 330 may be adhesive layers, which can not only achieve effective bonding with the surface of the circuit board 100, but also support the waterproof membrane 320; the support member 340 may be a composite adhesive with a supporting function, and the surface of the composite adhesive is sticky, which is used to protect the waterproof membrane 320 from shrinking.

[0044] A first sound-permeable hole 311 and a second sound-permeable hole 341 corresponding to the through hole 110 are provided on the first adhesive member 310 , the second adhesive member 330 and the support member 340 which do not have a waterproof function, so as to ensure the audio performance of the microphone 200 .

[0045] In one example, the material of the waterproof membrane 320 may include PTFE (polytetrafluoroethylene), PVDF (polyvinylidene fluoride), PU (polyurethane), PI (polyimide), PET (polyester resin) and other films, which are not limited here.

[0046] In one example, the circuit board 100 is a PCB board.

[0047] In the present application, the finished chip-type waterproof component 300 is attached to the surface of the circuit board 100 facing away from the microphone 200. While realizing the waterproof and dustproof functions of the microphone 200, it can also protect the microphone 200 from being contaminated by dirty foreign matter (volatile solder paste) and other substances when the microphone 200 passes through the reflow oven. In addition, the present application pre-sets the chip-type waterproof component 300 on the circuit board 100, eliminating the assembly, pressure maintenance, testing and other steps of the waterproof film 320 during assembly, saving assembly procedures and thus improving assembly efficiency.

[0048] Next, we will combine the attached Figure 1 -Attached Figure 4 The waterproof and sound-permeable structure of the microphone 200 provided in the embodiment of the present application is described in detail.

[0049] Figure 3 A schematic diagram of the structure of a patch-type waterproof assembly (including a protective member) provided in an embodiment of the present application; Figure 3 As shown, in some embodiments, the patch-type waterproof component 300 further includes a protective member 350 , and the protective member 350 is used to be stacked on the support member 340 .

[0050] Specifically, the protective member 350 is arranged on the side of the support member 340 away from the waterproof membrane 320. This arrangement can prevent the volatile solder paste and other substances from polluting the waterproof membrane 320 when the microphone 200 passes through the reflow oven, so as to maintain the sound transmission performance of the waterproof membrane 320. Of course, the protective member 350 can also provide protection for the waterproof membrane 320 when the patch waterproof component 300 is attached to the circuit board 100, and during the packaging and transportation of the microphone 200 product. For example, the protective member 350 can improve the protection of the waterproof membrane 320 to 90%-100%.

[0051] In order to improve the audio performance of the microphone 200 during use, the protective member 350 needs to be removed during the assembly process with the electronic product. To improve the removal efficiency, in some embodiments, the protective member 350 is a protective film, and the side edge of the protective film protrudes from the support member 340 to facilitate separation of the protective film from the support member 340; the side edges of the support member 340, the second adhesive member 330, the waterproof film 320 and the first adhesive member 310 are flush.

[0052] It is understandable that, for the convenience of manufacturing, the outer edges of the support member 340, the second adhesive member 330, the waterproof film 320 and the first adhesive member 310 can be arranged flush, but no specific limitation is made. Then the side of the protective film protrudes from the support member 340, that is, a gap is formed between the protruding protective film and the circuit board 100, and the gap is convenient for tearing off the protective film. For example, tweezers or other clamps can be used to tear off the protective film from the side of the protective film protruding from the support member 340, which will not affect the functional area of ​​the waterproof film 320, and can also ensure the waterproof, dustproof and sound-permeable performance of the waterproof film 320.

[0053] In some embodiments, the protective film is a PI film, and the temperature resistance range of the protective film is between -40°C and 350°C.

[0054] Specifically, PI (polyimide) material is an engineering plastic with excellent mechanical properties, and has the characteristics of light weight, thin thickness, and good bendability. The protective film made of PI material can facilitate the packaging of the entire patch-type waterproof component 300 carrier tape 600. And it can provide better protection for the waterproof film 320. In addition, in order to facilitate the removal of the protective film, the temperature can be raised. Of course, it is necessary to ensure that the temperature is less than the limit temperature of the protective film 350°C. This setting can also avoid leaving glue on the support member 340.

[0055] In some embodiments, the first adhesive member 310 and the second adhesive member 330 are both adhesive layers, and the temperature resistance range of the adhesive layers is between -40°C and 350°C.

[0056] Specifically, the adhesive layer may be a HAF layer. HAF is an adhesive made of high-performance thermosensitive phenolic resin or polyurethane. The hot pressing adhesive layer in this example not only plays a bonding role, but also plays a role in supporting the waterproof membrane 320 .

[0057] In some embodiments, the support member 340 is a PI layer, and the temperature resistance range of the PI layer is between -40°C and 350°C.

[0058] Specifically, the support member 340 made of PI (polyimide) material can have a supporting function and can alleviate the occurrence of deformation failure of the waterproof membrane 320 due to pressure.

[0059] In some embodiments, the diameter of the first sound-transmitting hole 311 is equal to the diameter of the second sound-transmitting hole 341 , and the diameter of the first sound-transmitting hole 311 or the second sound-transmitting hole 341 is greater than the diameter of the through hole 110 .

[0060] Specifically, since the through hole 110 is a microporous structure, in order to facilitate the formation of the first sound-transmitting hole 311 on the first adhesive member 310, and the formation of the second sound-transmitting hole 341 on the second adhesive member 330 and the support member 340, in other words, in order to facilitate the production of the patch-type waterproof component 300, the diameters of the first sound-transmitting hole 311 and the second sound-transmitting hole 341 are designed to be larger than the diameter of the through hole 110. In addition, this design can also facilitate the patch-type waterproof component 300 to be attached to the surface of the circuit board 100.

[0061] In some embodiments, the microphone 200 is a patch microphone 200 , and the microphone 200 is fixedly bonded to the circuit board 100 .

[0062] Specifically, to improve manufacturing efficiency, in this example, the patch microphone 200 can be adsorbed by a patch machine or other equipment, and then quickly aligned with the through hole 110, so that the microphone 200 can be quickly and accurately fixed on the circuit board 100. This arrangement improves the manufacturing efficiency of the entire waterproof and sound-permeable structure.

[0063] The embodiment of the present application also provides an electronic device, Figure 5 A schematic diagram of a partial structure of an electronic device provided in an embodiment of the present application; Figure 5As shown, the electronic device may include a shell 400 and the waterproof and sound-permeable structure of the microphone 200 in the above example; the shell 400 is provided with a sound inlet hole 410, the sound inlet hole 410 passes through the side wall of the shell 400, the waterproof and sound-permeable structure is fixed in the shell 400, and the waterproof membrane 320 is opposite to the sound inlet hole 410.

[0064] It is understandable that the waterproof and sound-permeable structure can be assembled as a small unit product in the next process, or sold to an assembly plant for assembly. During assembly, it is only necessary to ensure that the waterproof membrane 320 is facing the sound inlet 410 of the housing 400, eliminating the need for the prior art to assemble the waterproof membrane 320, maintain pressure, test and other processes, and can also avoid damage to the waterproof membrane 320 due to this series of processes. The setting method of this example can improve the audio performance of the microphone 200. And after assembly, there is no need to test the audio performance of the microphone 200 again.

[0065] like Figure 5 As shown, in some embodiments, a buffer sealing layer 500 is arranged between the shell 400 and the waterproof and sound-permeable structure, and the buffer sealing layer 500 is constructed with a through hole that passes through the sound inlet hole 410; wherein, one side of the buffer sealing layer 500 is bonded to the inner surface of the shell 400, and the other side of the buffer sealing layer 500 is bonded to the surface of the support member 340.

[0066] Specifically, the provision of the buffer sealing layer 500 can further stabilize the waterproof membrane 320 between the housing 400 and the PCB board, slowing down the failure of the waterproof membrane 320 due to deformation under pressure, thereby improving the acoustic performance of the microphone 200. Of course, sealant can be injected between the buffer sealing layer 500 and the housing 400, and between the buffer sealing layer 500 and the support 340, thereby improving its sealing and waterproof properties. Of course, the buffer sealing layer 500 can also be provided with adhesive to achieve sealing bonding with the inner surface of the housing 400 and the support 340.

[0067] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A waterproof and sound-permeable structure of a microphone, characterized in that: include: A circuit board is constructed with through holes; A microphone is disposed on one side of the circuit board and corresponds to the through hole; A patch-type waterproof component, used to be attached to the other side of the circuit board; the patch-type waterproof component comprises a first adhesive member, a waterproof film, a second adhesive member and a support member which are stacked in sequence, the first adhesive member is configured with a first sound-transmitting hole extending to the waterproof film, the second adhesive member and the support member are configured with a second sound-transmitting hole extending to the waterproof film, and the axis of the second sound-transmitting hole coincides with the axis of the first sound-transmitting hole; The first adhesive is configured to fix and bond the patch-type waterproof component to the circuit board, and to make the axis of the first sound-permeable hole coincide with the axis of the through hole.

2. The waterproof and sound-permeable structure of a microphone according to claim 1, characterized in that: The patch-type waterproof component also includes a protective member, which is used to be stacked on the supporting member.

3. The waterproof and sound-permeable structure of a microphone according to claim 2, characterized in that: The protective member is a protective film, and the side edge of the protective film protrudes from the support member so as to facilitate separation of the protective film from the support member; The sides of the supporting member, the second adhesive member, the waterproof membrane and the first adhesive member are flush.

4. The waterproof and sound-permeable structure of a microphone according to claim 3, characterized in that: The protective film is a PI film, and the temperature resistance range of the protective film is between -40°C and 350°C.

5. The waterproof and sound-permeable structure of a microphone according to any one of claims 1 to 4, characterized in that: The first adhesive component and the second adhesive component are both adhesive layers, and the temperature resistance range of the adhesive layers is between -40°C and 350°C.

6. The waterproof and sound-permeable structure of a microphone according to any one of claims 1 to 4, characterized in that: The support member is a PI layer, and the temperature resistance range of the PI layer is between -40°C and 350°C.

7. The waterproof and sound-permeable structure of a microphone according to any one of claims 1 to 4, characterized in that: The diameter of the first sound-transmitting hole is equal to the diameter of the second sound-transmitting hole, and the diameter of the first sound-transmitting hole or the second sound-transmitting hole is greater than the diameter of the through hole.

8. The waterproof and sound-permeable structure of a microphone according to any one of claims 1 to 4, characterized in that: The microphone is a patch microphone, and the microphone is fixedly bonded to the circuit board.

9. An electronic device, characterized in that: A waterproof and sound-permeable structure comprising a shell and the microphone according to claim 1, wherein the shell is provided with a sound inlet hole, the sound inlet hole passes through the side wall of the shell, the waterproof and sound-permeable structure is fixed in the shell, and the waterproof membrane faces the sound inlet hole.

10. The electronic device according to claim 9, characterized in that: A buffer sealing layer is arranged between the shell and the waterproof and sound-permeable structure, and the buffer sealing layer is constructed with a through hole that penetrates the sound inlet hole; wherein one side of the buffer sealing layer is bonded to the inner surface of the shell, and the other side of the buffer sealing layer is bonded to the surface of the support member.

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