A mold for processing circuit boards

By designing quick installation components in online circuit board processing molds, the rapid installation and disassembly of mold components is achieved, the problem of inconvenient replacement when the mold base plate is worn is solved, and the use efficiency and life of the mold is improved.

CN222750649UActive Publication Date: 2025-04-11WUHAN JINGYITE ELECTRONICS CO LTD
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Patent Information

Application Number
CN202421455717.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-25
Publication Date
2025-04-11
Estimated Expiration
2034-06-25

AI Technical Summary

Technical Problem

Existing circuit board processing molds are prone to wear after long-term use, resulting in a decrease in accuracy and life, and inconvenient replacement of the bottom mold.

Method used

A mold for circuit board processing is designed, using quick installation components, including limit blocks, installation slots, moving blocks, elastic ropes and installation blocks, to achieve rapid installation and disassembly of mold components and facilitate rapid replacement of the base plate.

Benefits of technology

Through the design of the quick installation component, the problem of inconvenient replacement when the mold base plate is worn is solved, and the rapid replacement of the mold assembly and efficient operation of the stamping process is achieved.

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Abstract

The utility model relates to the technical field of circuit board processing, specifically to a mold for circuit board processing, comprising a bottom connecting frame, a support frame fixedly installed on the top of the bottom connecting frame, a control panel fixedly installed on the side wall of the support frame, a stamping component cooperatively installed on the top of the inner wall of the support frame, a fixing frame fixedly installed in the middle of the inner wall of the bottom connecting frame, quick installation components distributed in a rectangular shape on the top of the fixing frame, and a mold component clamped on the fixing frame through four quick installation components; by utilizing the mutual cooperation between the limit block, the installation groove, the moving block, the elastic rope and the installation block in the component, the device can achieve the benefit of quickly installing and disassembling the mold component during use, and the benefit of quickly replacing the bottom plate when the bottom plate is worn.
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Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a mold for circuit board processing. Background Art

[0002] PCB circuit board, also known as printed circuit board, is the provider of electrical connection of electronic components. With the rapid development of the electronics industry, circuit boards, which occupy an important position in the parts of electronic products, are becoming more and more mature in terms of production technical requirements and industrial manufacturing. The existing Chinese utility model patent for a circuit board processing mold (publication number: CN215395597U) is provided with a groove, an ejector block, a first guide rod, a second groove and a first spring. The first guide rod slides in the second groove, and the ejector block slides in the first groove. The elasticity of the first spring is used to eject and demould the circuit board.

[0003] When the existing device is used for a long time, since circuit board processing usually requires repeated use of molds, long-term use will cause wear on the mold surface, especially under high-speed operation and high pressure. Wear will affect the precision and life of the mold, and the mold needs to be repaired or replaced regularly. The existing device adopts an integrated design, which makes it inconvenient to replace the bottom mold. Therefore, a mold for circuit board processing is needed to improve the above problems. Utility Model Content

[0004] The purpose of the utility model is to provide a mold for processing a circuit board to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A mold for processing a circuit board, comprising a bottom connection frame, a support frame fixedly installed on the top of the bottom connection frame, a control panel fixedly installed on the side wall of the support frame, a stamping assembly cooperatively installed on the top of the inner wall of the support frame, a fixing frame fixedly installed in the middle of the inner wall of the bottom connection frame, quick installation assemblies distributed in a rectangular shape on the top of the fixing frame, and a mold assembly clamped on the fixing frame through four quick installation assemblies;

[0007] The quick installation component includes a limit block, and the limit blocks are distributed in a rectangular shape on the top of the fixed frame. The top of the limit block is provided with a mounting groove and the bottom is fixedly installed with an elastic rope. A moving block is fixedly installed on the side of the elastic rope away from the limit block, and mounting blocks are symmetrically fixedly installed on the side wall of the moving block.

[0008] As a preferred solution of the utility model, the mold assembly includes a base plate, through holes are symmetrically opened on both sides of the top of the base plate, and punching holes are evenly distributed on the top of the base plate. The four corners of the base plate are respectively fixed with snap-in holes, and the four snap-in holes are respectively matched with the limit blocks.

[0009] As a preferred solution of the utility model, the four clamping holes are symmetrically provided with clamping grooves on two sides which are symmetrical to each other, and the clamping grooves match the mounting blocks.

[0010] As a preferred solution of the utility model, the stamping assembly includes a hydraulic telescopic rod, a hydraulic telescopic rod is fixedly installed on the top of the inner wall of the support frame, a fixed plate is fixedly installed on the telescopic end of the hydraulic telescopic rod, sliding rods are respectively fixedly installed on both sides of the fixed plate that are symmetrical to each other, and a punch is fixedly installed on the bottom of the fixed plate.

[0011] As a preferred solution of the utility model, the top of the bottom connecting frame is symmetrically provided with sliding grooves, and through grooves are respectively provided on the sides where the two sliding grooves are close to each other, sliding rods are respectively slidably installed in the sliding grooves, and a transverse plate is fixedly installed below the side where the two sliding rods are close to each other, and the transverse plate is slidably installed in the two through grooves.

[0012] As a preferred solution of the utility model, push blocks are symmetrically fixedly installed on the top of the transverse plate, the two push blocks match each other with the through holes, and the side walls of the bottom connecting frame are provided with push-pull grooves, in which a collection frame is slidably installed.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] In the utility model, by arranging a quick installation component in the mold for circuit board processing, the mutual cooperation among the limit block, the installation groove, the moving block, the elastic rope and the installation block in the component is utilized, so that the advantage of being able to quickly install and disassemble the mold component during the use of the device is achieved, and the advantage of being able to quickly replace the bottom plate when it is worn is achieved, which solves the problem of the inconvenience of quickly replacing the bottom plate when it is worn during the use of the existing device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0016] Figure 2 It is a schematic diagram of the assembly structure of the utility model;

[0017] Figure 3 This is a schematic diagram of the assembly structure of the mold assembly of the utility model;

[0018] Figure 4 For the utility model Figure 3 Schematic diagram of the enlarged structure at point A in the middle.

[0019] In the figure: 1. bottom connecting frame; 2. support frame; 3. control panel; 4. stamping assembly; 401. hydraulic telescopic rod; 402. fixed plate; 403. punch; 404. sliding rod; 405. pushing block; 406. transverse plate; 5. slide groove; 6. through groove; 7. push-pull groove; 8. collecting frame; 9. fixed frame; 10. mold assembly; 1001. bottom plate; 1002. through hole; 1003. stamping hole; 1004. snap-in hole; 1005. snap-in groove; 11. quick installation assembly; 1101. limit block; 1102. installation groove; 1103. moving block; 1104. elastic rope; 1105. installation block. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings, in which several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0024] Example: See Figure 1-4A circuit board processing mold shown in the figure comprises a bottom connection frame 1, a support frame 2 is fixedly installed on the top of the bottom connection frame 1, a control panel 3 is fixedly installed on the side wall of the support frame 2, a stamping component 4 is matched and installed on the top of the inner wall of the support frame 2, a fixing frame 9 is fixedly installed on the middle of the inner wall of the bottom connection frame 1, and quick installation components 11 are distributed in a rectangular shape on the top of the fixing frame 9, and the fixing frame 9 is clamped with a mold component 10 through four quick installation components 11;

[0025] The quick installation component 11 includes a limit block 1101, which is used to quickly install the base plate 1001. The limit blocks 1101 are distributed in a rectangular shape on the top of the fixed frame 9. The limit blocks 1101 are provided with a mounting groove 1102 on the top and an elastic rope 1104 is fixedly installed on the bottom. A moving block 1103 is fixedly installed on the side of the elastic rope 1104 away from the limit block 1101, and mounting blocks 1105 are symmetrically fixedly installed on the side wall of the moving block 1103. The mounting blocks 1105 are installed on.

[0026] In this embodiment, refer to Figure 3 and Figure 2 As shown, the mold assembly 10 includes a base plate 1001, through holes 1002 are symmetrically opened on both sides of the top of the base plate 1001, and punching holes 1003 are evenly distributed on the top of the base plate 1001. The four corners of the base plate 1001 are respectively fixed with snap-in holes 1004, and the four snap-in holes 1004 are respectively matched with the limit blocks 1101 in the snap-in grooves 1005 to keep the top of the base plate 1001 flat.

[0027] In this embodiment, refer to Figure 3 and Figure 2 As shown, the four clamping holes 1004 are symmetrically provided with clamping grooves 1005 on two sides which are symmetrical to each other, and the clamping grooves 1005 match with the mounting blocks 1105 .

[0028] In this embodiment, refer to Figure 3 and Figure 2 As shown, the stamping assembly 4 includes a hydraulic telescopic rod 401, the hydraulic telescopic rod 401 is fixedly installed on the top of the inner wall of the support frame 2, a fixed plate 402 is fixedly installed on the telescopic end of the hydraulic telescopic rod 401, sliding rods 404 are fixedly installed on both sides of the fixed plate 402 that are symmetrical to each other, and a punch 403 is fixedly installed on the bottom of the fixed plate 402. The structure and working principle of the punch 403 are the same as the stamping structure in a Chinese utility model patent for a mold for processing a circuit board (publication number: CN215395597U), and will not be described in detail here.

[0029] In this embodiment, refer to Figure 3 and Figure 2As shown, the top of the bottom connecting frame 1 is symmetrically provided with slide grooves 5, and a through groove 6 is respectively provided on the side where the two slide grooves 5 are close to each other. Sliding rods 404 are slidably installed in the slide grooves 5, and a transverse plate 406 is fixedly installed below the side where the two sliding rods 404 are close to each other, and the transverse plate 406 is slidably installed in the two through grooves 6.

[0030] In this embodiment, refer to Figure 3 and Figure 2 As shown, push blocks 405 are symmetrically fixedly installed on the top of the transverse plate 406, and the two push blocks 405 match each other with the through holes 1002. The push blocks 405 slide in the through holes 1002 to eject the circuit board, and a push-pull groove 7 is opened on the side wall of the bottom connecting frame 1, and a collection frame 8 is slidably installed in the push-pull groove 7.

[0031] Working principle: When the bottom plate 1001 is worn during use, the moving block 1103 is pulled to drive the elastic rope 1104 to stretch, and the moving block 1103 and the mounting block 1105 are turned sideways and taken out from the clamping hole 1004, and the limit of the bottom plate 1001 is released, and the bottom plate 1001 is quickly replaced, which solves the problem that it is inconvenient to quickly replace the bottom plate 1001 when it is worn during use of the existing device;

[0032] After replacing the base plate 1001, start the stamping assembly 4 and the punch 403 through the control panel 3 for stamping. When the hydraulic telescopic rod 401 descends, it will drive the fixed plate 402 and the sliding rod 404 to slide downward. When the sliding rod 404 slides to the lower level, the sliding rod 404 will drive the transverse plate 406 and the push block 405 to descend. When the push block 405 descends, it will slide out of the through hole 1002. When the stamping is completed, the rise of the hydraulic telescopic rod 401 will drive the push block 405 to slide into the through hole 1002, and the circuit board will be ejected and removed.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mold for processing a circuit board, comprising a bottom connection frame (1), characterized in that: The bottom connection frame (1) has a support frame (2) fixedly mounted on the top, a control panel (3) fixedly mounted on the side wall of the support frame (2), a punching assembly (4) cooperatively mounted on the top of the inner wall of the support frame (2), a fixing frame (9) fixedly mounted on the middle of the inner wall of the bottom connection frame (1), quick-installation assemblies (11) distributed in a rectangular shape on the top of the fixing frame (9), and a mold assembly (10) clamped on the fixing frame (9) via four quick-installation assemblies (11); The quick installation component (11) comprises a limit block (1101), the limit block (1101) is distributed in a rectangular shape on the top of the fixed frame (9), the limit block (1101) is provided with a mounting groove (1102) on the top and an elastic rope (1104) is fixedly installed on the bottom, a moving block (1103) is fixedly installed on the side of the elastic rope (1104) away from the limit block (1101), and a mounting block (1105) is symmetrically fixedly installed on the side wall of the moving block (1103).

2. A circuit board processing mold according to claim 1, characterized in that: The mold assembly (10) comprises a bottom plate (1001), through holes (1002) are symmetrically provided on both sides of the top of the bottom plate (1001), punching holes (1003) are evenly distributed on the top of the bottom plate (1001), and clamping holes (1004) are fixedly installed at four corners of the bottom plate (1001), and the four clamping holes (1004) are matched with the limit blocks (1101) respectively.

3. A circuit board processing mold according to claim 2, characterized in that: The four clamping holes (1004) are symmetrically provided with clamping grooves (1005) on two sides that are stacked symmetrically with each other, and the clamping grooves (1005) match the mounting blocks (1105).

4. A circuit board processing mold according to claim 1, characterized in that: The punching assembly (4) comprises a hydraulic telescopic rod (401), the hydraulic telescopic rod (401) is fixedly mounted on the top of the inner wall of the support frame (2), a fixed plate (402) is fixedly mounted on the telescopic end of the hydraulic telescopic rod (401), sliding rods (404) are respectively fixedly mounted on two symmetrical sides of the fixed plate (402), and a punch (403) is fixedly mounted on the bottom of the fixed plate (402).

5. A circuit board processing mold according to claim 1, characterized in that: The top of the bottom connection frame (1) is symmetrically provided with sliding grooves (5), and a through groove (6) is respectively provided on the side where the two sliding grooves (5) are close to each other. Sliding rods (404) are respectively slidably installed in the sliding grooves (5), and a transverse plate (406) is fixedly installed below the side where the two sliding rods (404) are close to each other, and the transverse plate (406) is slidably installed in the two through grooves (6).

6. A circuit board processing mold according to claim 5, characterized in that: A push block (405) is symmetrically fixedly mounted on the top of the transverse plate (406), and the two push blocks (405) match the through holes (1002). A push-pull groove (7) is provided on the side wall of the bottom connection frame (1), and a collection frame (8) is slidably mounted in the push-pull groove (7).

Citation Information

Patent Citations

  • Die for processing circuit board

    CN215395597U