Backflow prevention structure for heat dissipation device

Abstract

The utility model provides an anti-backflow structure for a heat dissipation device, which comprises a connecting pipe, the connecting pipe is used for connecting a valve and the heat dissipation device, and a plugging assembly is arranged in the connecting pipe in a sliding manner; the plugging assembly comprises a mounting part, a plugging part and a spring, the mounting part is connected with the connecting pipe, the plugging part is slidably mounted on the mounting part, the plugging part is connected with the mounting part through the spring, and a through groove is formed in the mounting part; a limiting inclined surface is arranged in the connecting pipe and is used for plugging the connecting pipe after being matched with the plugging part; the cooling water channel can solve the problem that in the prior art, due to the fact that a backflow prevention structure is not arranged at the inlet end of the cooling water channel, when pressure in the cooling water channel changes, cooling media can flow back into equipment connected with the inlet end of the cooling water channel from the interior of the cooling water channel, and normal operation of a heat dissipation device is affected.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation devices, in particular to a backflow prevention structure for heat dissipation devices. Background Art

[0002] The power amplifier is an important part of the audio system. Its function is to amplify the pre-stage signal so that they have enough power to drive the speakers. The output power of the power amplifier depends on its power supply voltage and output current, so a lot of heat will be generated when the power amplifier is running.

[0003] In the prior art, liquid cooling is usually used to cool the power amplifier components. The heat generated by the controller is taken away by the flowing coolant to reduce the temperature of the controller and make the controller work within a suitable temperature range. For example, the utility model with publication number CN220963324U discloses a liquid cooling radiator with uniform heat dissipation (hereinafter referred to as prior art 1), which includes a bottom plate and a cover plate, wherein a water inlet channel, a water outlet channel and a transfer channel for circulating the cooling medium are provided on the bottom plate, and a front end heat dissipation part and a middle end heat dissipation part are also provided on the bottom plate, wherein the front end heat dissipation part includes a plurality of front The front-end heat dissipation cavity, the two ends of the front-end heat dissipation cavity are connected with front-end flow channels, and the front-end flow channels are respectively connected with the water inlet flow channel and the transfer flow channel, the middle-end heat dissipation part includes a plurality of middle-end heat dissipation cavities, the two ends of the middle-end heat dissipation cavity are connected with middle-end flow channels, and the middle-end flow channels are respectively connected with the transfer flow channel and the water outlet flow channel, the front-end heat dissipation cavity is consistent in size with the middle-end heat dissipation cavity, the number of the middle-end heat dissipation cavities is less than the number of the front-end heat dissipation cavities, the front-end heat dissipation cavity and the middle-end heat dissipation cavity are both provided with some turbulent flow parts for increasing turbulence, and the cover plate is fixed to the side of the bottom plate where the water inlet flow channel is opened.

[0004] Although the prior art 1 improves the uniformity of heat dissipation of the liquid-cooled radiator, the prior art 1 does not provide an anti-backflow structure at the inlet end of the cooling water channel. When the pressure in the cooling water channel changes, the cooling medium will flow back from the cooling water channel to the equipment connected to the inlet end of the cooling water channel, thereby affecting the normal operation of the heat dissipation device. Utility Model Content

[0005] The purpose of the utility model is to provide a backflow prevention structure for a heat dissipation device, which, in actual use, can solve the problem in the prior art that no backflow prevention structure is provided at the inlet end of the cooling water channel, so that when the pressure in the cooling water channel changes, the cooling medium will flow back from the cooling water channel to the equipment connected to the inlet end of the cooling water channel, thereby affecting the normal operation of the heat dissipation device.

[0006] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0007] A backflow prevention structure for a heat dissipation device comprises a connecting pipe, the connecting pipe is used to connect a valve and the heat dissipation device, and a blocking component is slidably installed in the connecting pipe;

[0008] The plugging assembly comprises a mounting portion, a plugging portion and a spring, wherein the mounting portion is connected to the connecting pipe, the plugging portion is slidably mounted on the mounting portion, the plugging portion is connected to the mounting portion through the spring, and a through groove is provided on the mounting portion;

[0009] A limiting inclined surface is arranged in the connecting pipe, and the limiting inclined surface is used to seal the connecting pipe after cooperating with the sealing part.

[0010] Preferably, a sealing block is fixedly connected to the sealing portion, a mounting groove is provided on the connecting pipe, a sealing ring is installed in the mounting groove, and the sealing ring can seal the gap between the sealing block and the connecting pipe after contacting the sealing block.

[0011] Preferably, a guide surface is provided on the mounting portion.

[0012] Preferably, the mounting portion is detachably connected to the connecting pipe.

[0013] Preferably, the connecting pipe is detachably connected to the valve and the heat dissipation device via bolts.

[0014] Preferably, the heat dissipation device comprises a module cavity and a module cover plate, the module cavity is provided with a flow channel, and the module cover plate is mounted on the module cavity and is used to seal the flow channel.

[0015] Preferably, the module cover is detachably connected to the module cavity.

[0016] Preferably, a heat conducting plate is connected in the flow channel.

[0017] Preferably, the blocking portion is connected to a telescopic tube, the other end of the telescopic tube is connected to the mounting portion, and the spring is arranged in the telescopic tube.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] In the utility model, after the cooling medium enters the connecting pipe through the valve and the connecting pipe, the blocking part moves in a direction away from the valve under the action of the cooling medium pressure, and the spring connecting the blocking part and the mounting part is compressed. After the blocking part moves, a liquid outlet gap is formed between the blocking part and the connecting pipe, and the cooling medium enters the heat sink after passing through the liquid outlet gap and the through groove provided on the mounting part; the heat sink is used to contact with the power amplifier board, and the cooling medium can exchange heat and cool the functional board after entering the heat sink;

[0020] When the pressure change in the heat dissipation device causes the cooling medium in the heat dissipation device to flow back toward the valve, the blocking portion moves toward the valve under the action of the spring until it contacts the limiting slope; after the blocking portion contacts the limiting slope, the connecting pipe is blocked, thereby preventing the cooling medium from flowing back and causing impact on the liquid source equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 It is a three-dimensional diagram of the utility model.

[0023] Figure 2 It is a structural schematic diagram of the utility model.

[0024] Figure 3 For this utility model Figure 2 A partial enlarged view of point A in the middle.

[0025] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0026] 101-connecting pipe, 102-flow channel, 103-heat dissipation device, 104-sealing assembly, 105-installation part, 106-sealing part, 107-spring, 108-through groove, 109-telescopic tube, 110-sealing block, 111-sealing ring, 112-flow guide surface, 113-module cavity, 114-module cover, 115-heat conduction plate. DETAILED DESCRIPTION

[0027] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0028] In the description of the embodiments of the present invention, it should be understood that the terms "length", "vertical", "horizontal", "top", "bottom", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present utility model, the meaning of "multiple" is two or more, unless otherwise explicitly defined in some embodiments.

[0030] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific circumstances.

[0031] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0032] The disclosure below provides many different embodiments or examples for realizing different structures of the embodiments of the present utility model. In order to simplify the disclosure of the embodiments of the present utility model, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present utility model. In addition, the embodiments of the present utility model can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.

[0033] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0034] See also Figure 1-Figure 3 , this embodiment discloses a backflow prevention structure, specifically a backflow prevention structure for a heat dissipation device, including a connecting pipe 101, the connecting pipe 101 is used to connect the valve and the heat dissipation device 103, and a blocking component 104 is slidably installed in the connecting pipe 101;

[0035] The plugging assembly 104 includes a mounting portion 105, a plugging portion 106 and a spring 107. The mounting portion 105 is connected to the connecting pipe 101. The plugging portion 106 is slidably mounted on the mounting portion 105. The plugging portion 106 is connected to the mounting portion 105 via the spring 107. A through slot 108 is provided on the mounting portion 105.

[0036] A limiting inclined surface is disposed in the connecting pipe 101 , and the limiting inclined surface is used to seal the connecting pipe 101 after cooperating with the sealing portion 106 .

[0037] In the present invention, after the cooling medium enters the connecting pipe 101 through the valve and the connecting pipe 101, the blocking portion 106 moves in the direction away from the valve under the action of the cooling medium pressure, and the spring 107 connecting the blocking portion 106 and the mounting portion 105 is compressed. After the blocking portion 106 moves, a liquid outlet gap is formed between the blocking portion 106 and the connecting pipe 101, and the cooling medium enters the heat sink 103 after passing through the liquid outlet gap and the through groove 108 arranged on the mounting portion 105; the heat sink 103 is used to contact with the power amplifier board, and the cooling medium can exchange heat and cool the functional board after entering the heat sink 103; when the pressure change in the heat sink 103 causes the cooling medium in the heat sink 103 to flow back toward the valve, Under the action of the spring 107, the blocking portion 106 moves toward the direction of the valve until it contacts the limiting slope; after the blocking portion 106 contacts the limiting slope, it blocks the connecting pipe 101, thereby preventing the cooling medium from flowing back and causing impact on the liquid source equipment used to connect to the connecting pipe 101 and input the cooling medium into the connecting pipe 101; the valve is in a normally open state during the process of the liquid source equipment conveying the cooling medium to the connecting pipe 101. When the operator needs to repair or replace the connecting pipe 101 and the heat dissipation device 103, closing the valve can facilitate the operator's operation; in this embodiment, the liquid source equipment and valve are conventional devices in the prior art, and their structures and functions are not explained one by one here.

[0038] In some embodiments, a sealing block 110 is fixedly connected to the blocking portion 106, and a mounting groove is provided on the connecting tube 101, in which a sealing ring 111 is installed, and after the sealing ring 111 contacts the sealing block 110, the gap between the sealing block 110 and the connecting tube 101 can be sealed. By providing the sealing block 110, multiple seals can be formed between the blocking portion 106 and the connecting tube 101, thereby further improving the sealing effect after the sealing block 110 contacts the connecting tube 101; the sealing ring 111 is made of rubber material, and is used to seal the gap between the sealing block 110 and the connecting tube 101.

[0039] In some embodiments, a guide surface 112 is provided on the mounting portion 105. The guide surface 112 is used to guide the condensing medium so that the condensing medium moves toward the through groove 108, thereby preventing the condensing medium flowing into the liquid outlet gap from being blocked by the mounting portion 105 after contacting the mounting portion 105 and causing poor flow.

[0040] In some embodiments, the mounting portion 105 is detachably connected to the connecting tube 101. A thread groove is provided in the connecting tube 101, and the mounting portion 105 is threadedly connected to the thread groove; by making the mounting portion 105 detachably connected to the connecting tube 101, it is convenient to replace the plugging assembly 104.

[0041] In some embodiments, the connecting pipe 101 is detachably connected to the valve and the heat sink 103 by bolts. The left and right sides of the connecting pipe 101 are detachably connected to the valve and the heat sink 103 by bolts, respectively, so as to facilitate installation and replacement of the connecting pipe 101.

[0042] In some embodiments, the heat dissipation device 103 includes a module cavity 113 and a module cover 114. The module cavity 113 is provided with a flow channel 102. The module cover 114 is installed on the module cavity 113 and is used to seal the flow channel 102. The module cavity 113 is used to contact the surface of the power amplifier board. After the condensing medium flows into the flow channel 102 through the valve and the connecting pipe 101, it can cool the power amplifier board in contact with the module cavity 113.

[0043] In some embodiments, the module cover 114 is detachably connected to the module cavity 113. The module cover 114 is detachably connected to the module cavity 113 by bolts, and a sealing portion is installed on the module cover 114, which is made of rubber material and is used to seal the gap between the module cover 114 and the module cavity 113.

[0044] In some embodiments, a heat conducting plate 115 is connected to the flow channel 102. The heat conducting plate 115 is fixedly connected to the module cavity 113, and the heat conducting plate 115 is used to increase the contact area between the condensing medium and the module cavity 113, thereby further improving the cooling effect of the condensing medium on the power amplifier board. The heat conducting plate 115 is arranged in the direction of the condensing medium flow to guide the condensing medium.

[0045] In some embodiments, the sealing portion 106 is connected to a telescopic tube 109, the other end of the telescopic tube 109 is connected to the mounting portion 105, and the spring 107 is disposed in the telescopic tube 109. The telescopic tube 109 is provided to prevent the condensed medium from contacting the spring 107, thereby further improving the service life of the spring 107.

[0046] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present invention.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A backflow prevention structure for a heat dissipation device, characterized in that: It comprises a connecting pipe (101), the connecting pipe (101) is used to connect the valve and the heat dissipation device (103), and a blocking component (104) is slidably installed in the connecting pipe (101); The plugging assembly (104) comprises a mounting portion (105), a plugging portion (106) and a spring (107); the mounting portion (105) is connected to the connecting pipe (101); the plugging portion (106) is slidably mounted on the mounting portion (105); the plugging portion (106) is connected to the mounting portion (105) via the spring (107); and a through groove (108) is provided on the mounting portion (105); A limiting inclined surface is provided in the connecting pipe (101), and the limiting inclined surface is used to seal the connecting pipe (101) after cooperating with the sealing portion (106).

2. The backflow prevention structure for a heat dissipation device according to claim 1, characterized in that: A sealing block (110) is fixedly connected to the sealing portion (106), and a mounting groove is provided on the connecting pipe (101). A sealing ring (111) is installed in the mounting groove, and the sealing ring (111) can seal the gap between the sealing block (110) and the connecting pipe (101) after contacting the sealing block (110).

3. The backflow prevention structure for a heat dissipation device according to claim 1, characterized in that: The mounting portion (105) is provided with a flow guide surface (112).

4. The backflow prevention structure for a heat dissipation device according to claim 3, characterized in that: The mounting portion (105) is detachably connected to the connecting pipe (101).

5. The backflow prevention structure for a heat dissipation device according to claim 1, characterized in that: The connecting pipe (101) is detachably connected to the valve and the heat dissipation device (103) via bolts.

6. The backflow prevention structure for a heat dissipation device according to claim 1, characterized in that: The heat dissipation device (103) comprises a module cavity (113) and a module cover plate (114); a flow channel (102) is provided on the module cavity (113); and the module cover plate (114) is installed on the module cavity (113) and is used to seal the flow channel (102).

7. The backflow prevention structure for a heat dissipation device according to claim 6, characterized in that: The module cover plate (114) is detachably connected to the module cavity (113).

8. The backflow prevention structure for a heat dissipation device according to claim 6, characterized in that: A heat conducting plate (115) is connected inside the flow channel (102).

9. The backflow prevention structure for a heat dissipation device according to claim 1, characterized in that: The blocking portion (106) is connected to a telescopic tube (109), the other end of the telescopic tube (109) is connected to the mounting portion (105), and the spring (107) is arranged in the telescopic tube (109).

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