Packaging structure integrating multiple light-emitting chips

Abstract

The utility model relates to a packaging structure for integrating multiple light-emitting chips. The packaging structure for integrating multiple light-emitting chips includes: a flexible substrate, including a first plate body and a second plate body located at the end of the first plate body and connected to the first plate body, the first plate body and the second plate body intersect obliquely, and the angle between the first plate body and the second plate body is an obtuse angle; a plurality of light-emitting chips are distributed on the first plate body and the second plate body of the flexible substrate, the light-emitting chip includes a light-emitting surface and a back surface opposite to the light-emitting surface, the plurality of light-emitting chips are all located on the same side of the flexible substrate and the back surfaces of the plurality of light-emitting chips are all facing the flexible substrate, and the light-emitting chip is electrically connected to the flexible substrate. The utility model solves the aperture problem caused by the independent packaging of a single light-emitting chip, and also reduces the generation of dark shadows.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit manufacturing, in particular to a packaging structure integrating multiple light-emitting chips. Background Art

[0002] The packaging structure of the integrated light-emitting chip is to mount the light-emitting chip on the packaging substrate, so that the packaging structure has a light-emitting function. At present, the packaging structure of a single light-emitting chip is difficult to meet the user's demand for high brightness due to its low light-emitting power, so the packaging structure integrating multiple light-emitting chips came into being. The current packaging structure integrating multiple light-emitting chips includes a packaging substrate, a light-emitting chip mounted on the packaging substrate, and a circuit board (such as a PCB circuit board) for supplying power to the light-emitting chip. However, in the current packaging structure integrating multiple light-emitting chips, each light-emitting chip is packaged separately, so that there is a gap between adjacent light-emitting chips, so that there is a shadow between the bright spot halo and the light source when emitting light, affecting the light-emitting display effect. Moreover, the current packaging structure integrating multiple light-emitting chips has poor heat dissipation performance, which can easily cause the device to decay too quickly.

[0003] Therefore, how to improve the light-emitting effect of the packaging structure integrating multiple light-emitting chips and enhance the uniformity and brightness of the light is a technical problem that needs to be solved urgently. Summary of the invention

[0004] The utility model provides a packaging structure integrating multiple light-emitting chips, which is used to improve the light-emitting effect of the packaging structure integrating multiple light-emitting chips and to increase the light-emitting brightness and light-emitting uniformity of the packaging structure.

[0005] According to some embodiments, the utility model provides a packaging structure integrating multiple light-emitting chips, including:

[0006] A flexible substrate, comprising a first plate body and a second plate body located at an end of the first plate body and connected to the first plate body, wherein the first plate body and the second plate body intersect obliquely, and an angle between the first plate body and the second plate body is an obtuse angle;

[0007] A plurality of light-emitting chips are distributed on the first board body and the second board body of the flexible substrate, the light-emitting chip comprises a light-emitting surface and a back surface opposite to the light-emitting surface, the plurality of light-emitting chips are all located on the same side of the flexible substrate and the back surfaces of the plurality of light-emitting chips are all facing the flexible substrate, and the light-emitting chip is electrically connected to the flexible substrate.

[0008] In some embodiments, the angle between the first plate and the second plate is 150 degrees to 165 degrees.

[0009] In some embodiments, the flexible substrate includes two second plates connected to opposite ends of the first plate, and each of the second plates is obliquely intersected with the first plate, and the angles between the first plate and each of the second plates are obtuse angles;

[0010] At least one light emitting chip is disposed on the first plate and each of the second plates.

[0011] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0012] The dam glue is located on the flexible substrate and distributed between adjacent light-emitting chips.

[0013] In some embodiments, the flexible substrate further includes a bending portion located between the first plate body and the second plate body;

[0014] The dam glue is located on the bending portion.

[0015] In some embodiments, it also includes:

[0016] A transparent plastic sealing layer is located on the flexible substrate, and the transparent plastic sealing layer seals the plurality of light emitting chips, and the light signals emitted by the light emitting chips can pass through the transparent plastic sealing layer.

[0017] In some embodiments, it also includes:

[0018] The transparent cover plate is arranged on the transparent plastic sealing layer by means of an adhesive cover, and a convex spherical lens array is arranged on the surface of the transparent cover plate away from the transparent plastic sealing layer.

[0019] In some embodiments, the transparent cover plate is a curved transparent cover plate, and a tangent line of the curved transparent cover plate is parallel to the light-emitting chip on the second plate body.

[0020] In some embodiments, it also includes:

[0021] The heat dissipation bracket is located on the surface of the flexible substrate facing away from the light-emitting chip.

[0022] In some embodiments, the heat dissipation bracket is located on a surface of the second plate body facing away from the light emitting chip, and a bottom surface of the heat dissipation bracket is flush with a surface of the first plate body facing away from the light emitting chip.

[0023] The utility model provides a packaging structure for integrating multiple light-emitting chips. A flexible substrate is provided, and the flexible substrate includes a first plate body and a second plate body connected to the end of the first plate body and obliquely intersecting with the first plate body. The angle between the first plate body and the second plate body is an obtuse angle, so that multiple light-emitting chips can be mounted on the first plate body and the second plate body of the flexible substrate. The multiple light-emitting chips are all located on the same side of the flexible substrate and the light-emitting surfaces of the multiple light-emitting chips are all facing the top of the flexible substrate. This not only improves the luminous brightness of the packaging structure, but also solves the aperture problem caused by the independent packaging of a single light-emitting chip because the multiple light-emitting chips are packaged as one. The first plate body and the second plate body connected obliquely shorten the distance between adjacent light-emitting chips, reduce the generation of dark shadows, improve the uniformity of luminescence of the packaging structure, and effectively improve the luminous effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Attached Figure 1 It is a cross-sectional schematic diagram of a packaging structure integrating multiple light-emitting chips in a specific embodiment of the utility model;

[0025] Attached Figure 2 It is a cross-sectional schematic diagram of a flexible substrate in a specific implementation mode of the utility model;

[0026] Attached Figure 3 It is a cross-sectional schematic diagram of the utility model after a plurality of light-emitting chips are mounted on a flexible substrate;

[0027] Attached Figure 4 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after the flexible substrate is bent to form a heat dissipation bracket;

[0028] Attached Figure 5 It is a cross-sectional schematic diagram of a specific implementation mode of the utility model after the plastic sealing layer and the transparent cover plate are formed. DETAILED DESCRIPTION

[0029] The specific implementation of the packaging structure of integrated multi-light-emitting chips provided by the utility model is described in detail below with reference to the accompanying drawings.

[0030] This specific embodiment provides a packaging structure integrating multiple light-emitting chips, Figure 1 is a schematic cross-sectional view of a packaging structure integrating multiple light-emitting chips in a specific embodiment of the present invention, Figure 2 Schematic diagram of the cross section of the flexible substrate in the specific implementation mode of the utility model. Figure 1 and Figure 2 As shown, the packaging structure of the integrated multi-light-emitting chip includes:

[0031] A flexible substrate, comprising a first plate body 101 and a second plate body 102 located at an end of the first plate body 101 and connected to the first plate body 101, wherein the first plate body 101 and the second plate body 102 intersect obliquely, and an angle between the first plate body 101 and the second plate body 102 is an obtuse angle;

[0032] A plurality of light-emitting chips 11 are distributed on the first board body 101 and the second board body 102 of the flexible substrate, the light-emitting chip 11 includes a light-emitting surface and a back surface opposite to the light-emitting surface, the plurality of light-emitting chips 11 are all located on the same side of the flexible substrate and the back surfaces of the plurality of light-emitting chips 11 are all facing the flexible substrate, and the light-emitting chip 11 is electrically connected to the flexible substrate.

[0033] Specifically, the flexible substrate includes a top surface and a bottom surface that are relatively distributed, a circuit layer is arranged inside the flexible substrate, and a plurality of lead solder balls 12 are arranged on the bottom surface of the first board body 101 in the flexible substrate, and the lead solder balls 12 are electrically connected to the circuit layer in the flexible substrate 10. In one example, a plurality of light-emitting chips 11 are simultaneously encapsulated in the packaging structure of the integrated multi-light-emitting chip, and the plurality of light-emitting chips 11 are distributed on the first board body 101 and the second board body 102 of the flexible substrate. In one example, the plurality of light-emitting chips 11 are electrically connected to the flexible substrate through the lead wire 17, and in another example, the plurality of light-emitting chips 11 can also be electrically connected to the flexible substrate through the solder balls. Each of the light-emitting chips 11 includes the light-emitting surface and the back surface that are relatively distributed, and the light-emitting chip 11 emits a light signal to the outside through the light-emitting surface. The plurality of light-emitting chips 11 located on the flexible substrate are all electrically connected to the circuit layer in the flexible substrate. The plurality described in this specific embodiment refers to more than two.

[0034] In this specific embodiment, a flexible substrate is provided, and the flexible substrate includes the first plate body 101 and the second plate body 102 which are connected obliquely, and a plurality of the light-emitting chips 11 are distributed on the first plate body 101 and the second plate body 102 of the flexible substrate. Since the angle between the first plate body 101 and the second plate body 102 is an obtuse angle, the plurality of light-emitting chips 11 are all located on the same side of the flexible substrate and the light-emitting surfaces of the plurality of light-emitting chips 11 are all facing upward from the flexible substrate, so that not only a plurality of the light-emitting chips 11 can be packaged in the packaging structure at the same time, thereby improving the light-emitting brightness of the packaging structure integrating multiple light-emitting chips, but also the aperture problem caused by the independent packaging of a single light-emitting chip can be solved, thereby improving the uniformity of light emission of the packaging structure and effectively improving the light-emitting effect. At the same time, since the flexible substrate is bent to form the first plate body 101 and the second plate body 102 which are connected to each other obliquely, the light-emitting chip 11 located on the first plate body 101 and the light-emitting chip 11 located on the second plate body 102 are relatively inclined, thereby shortening the distance between adjacent light-emitting chips, reducing the generation of shadows, and helping to further reduce the size of the packaging structure of the integrated multi-light-emitting chip.

[0035] In some embodiments, the angle A between the first plate 101 and the second plate 102 is 150 degrees to 165 degrees. On the one hand, glare caused by the small spacing between adjacent light-emitting chips 11 is avoided; on the other hand, the problem of shadows easily generated due to the large spacing between adjacent light-emitting chips 11 can be further avoided.

[0036] In some embodiments, the flexible substrate includes two second plates 102 connected to opposite ends of the first plate 101, and each of the second plates 102 is obliquely intersected with the first plate 101, and the angles between the first plate and each of the second plates are obtuse angles;

[0037] At least one light emitting chip 11 is disposed on the first board 101 and each of the second boards 102 .

[0038] For example, if Figure 1 and Figure 2 As shown, the first plate 101 extends in the horizontal direction, the two second plates 102 are connected to opposite ends of the first plate 101 in the horizontal direction, and the three light-emitting chips 11 are placed one by one on the first plate 101 and the two second plates 102. In one example, the light-emitting chips 11 on the two second plates 102 are symmetrically distributed with respect to the light-emitting chip 11 on the first plate 101, so as to further improve the light-emitting uniformity of the packaging structure of the integrated multi-light-emitting chips.

[0039] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0040] The dam glue 15 is located on the flexible substrate and distributed between adjacent light emitting chips 11 .

[0041] In some embodiments, the flexible substrate further includes a bending portion located between the first plate body 101 and the second plate body 102;

[0042] The dam glue 15 is located on the bending portion.

[0043] Specifically, by arranging the dam glue 15 between adjacent light-emitting chips 11, it is possible to prevent the side of the light-emitting chip 11 from being crushed or damaged due to being squeezed during the process of bending the flexible substrate (for example, during the process of bending the flat flexible substrate to form the first plate body 101 and the second plate body 102 that are obliquely connected), and the blocking of the dam glue can prevent the bonding wires of adjacent light-emitting chips from bridging. By arranging the dam glue 15 on the bending portion for connecting the first plate body 101 and the second plate body 102, it is possible to avoid occupying the space on the first plate body 101 and the second plate body 102, so as to facilitate the integration of more light-emitting chips 11 or light-emitting chips of different sizes.

[0044] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0045] The transparent plastic sealing layer 14 is located on the flexible substrate, and the transparent plastic sealing layer 14 seals the plurality of light-emitting chips 11. The plastic sealing material forming the transparent plastic sealing layer 14 is a transparent material. The light signal emitted by the light-emitting chip 11 can pass through the transparent plastic sealing layer 14, so as to protect the light-emitting chip 11 while not affecting the light signal emitted by the light-emitting chip 11 to the outside world.

[0046] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0047] The transparent cover plate 13 is arranged on the transparent plastic sealing layer 14 by means of adhesive cover, and a convex spherical lens array is arranged on the surface of the transparent cover plate 13 which is away from the transparent plastic sealing layer 14 .

[0048] Specifically, the transparent cover plate 13 is located above the flexible substrate and is bonded to the transparent plastic layer 14 by adhesive, so that the transparent cover plate 13 is simultaneously covered on the plurality of light-emitting chips 11, and the light-emitting surfaces of the plurality of light-emitting chips 11 are all facing the transparent cover plate. In one example, the transparent cover plate 13 is a transparent glass cover plate. Among them, the light-emitting surfaces of the plurality of light-emitting chips 11 are all facing the transparent cover plate 13, which means that the light signal emitted by each light-emitting chip 11 is emitted to the outside through the transparent cover plate 13. A spherical lens array is protrudingly provided on the surface of the transparent cover plate 13 away from the transparent plastic layer 14, so that the light signal emitted by the light-emitting chip 11 located on the first plate body 101 and the second plate body 102 is emitted through the spherical lens matrix to control the emission direction of the light signal emitted by the light-emitting chip 11, and avoid the light signal emitted by the light-emitting chip 11 on the second plate body 102 located on the opposite sides of the first plate body 101 to generate glare due to convergence. The transparent cover plate 13 in this specific implementation refers to a cover plate that allows the light signal emitted by the light emitting chip 11 to pass through.

[0049] In some embodiments, the transparent cover plate 13 is a curved transparent cover plate, and the tangent line of the curved transparent cover plate is parallel to the light-emitting chip 11 on the second plate 102, so as to further improve the light-emitting effect of the packaging structure of the integrated multi-light-emitting chip and avoid the formation of light spots.

[0050] In some embodiments, the packaging structure of the integrated multi-light-emitting chip further includes:

[0051] The heat dissipation bracket 16 is located on the surface of the flexible substrate facing away from the light emitting chip 11 .

[0052] In some embodiments, the heat dissipation bracket 16 is located on the surface of the second board 102 facing away from the light emitting chip 11 , and the bottom surface of the heat dissipation bracket 16 is flush with the surface of the first board 101 facing away from the light emitting chip 11 .

[0053] Specifically, if Figure 1As shown, by setting the heat dissipation bracket 16 on the surface of the second plate body 102 of the flexible substrate away from the light-emitting chip 11, on the one hand, the heat dissipation performance of the flexible substrate and the light-emitting chip 11 is enhanced, the heat accumulation inside the packaging structure is reduced, and the problem of too fast light decay of the device caused by poor heat dissipation is avoided; on the other hand, the heat dissipation bracket 16 is also used to support the second plate body 102, thereby improving the stability of the flexible substrate after bending. In one example, the material of the heat dissipation bracket 16 can be a metal material with high thermal conductivity. The bottom surface of the heat dissipation bracket 16 is flush with the surface of the first plate body 101 away from the light-emitting chip 11, which helps to further reduce the size of the packaging structure of the integrated multi-light-emitting chip.

[0054] Figure 3-Figure 5 The method for forming the packaging structure of the integrated multi-light-emitting chip provided in this specific embodiment is shown, wherein the attached Figure 3 It is a cross-sectional schematic diagram of the utility model after multiple light-emitting chips are mounted on a flexible substrate, Figure 4 is a cross-sectional schematic diagram of a specific embodiment of the utility model after the flexible substrate is bent to form a heat dissipation bracket, and Figure 5 It is a cross-sectional schematic diagram of a specific embodiment of the utility model after the plastic sealing layer and the transparent cover are formed. For example, a sacrificial layer is first set on the carrier 31, and the flat flexible substrate 30 is fixed to the carrier through the sacrificial layer. Then, a plurality of the light-emitting chips 11 are mounted on the flexible substrate, and the back of the light-emitting chip 11 faces the flexible substrate. The leads 17 electrically connecting the flexible substrate and the light-emitting chip 11 are formed by bonding. Solder balls can also be set on the back of the light-emitting chip to achieve electrical connection between the light-emitting chip and the flexible substrate through the solder balls, and a dam glue 15 is formed on the flexible substrate between adjacent light-emitting chips 11, such as Figure 3 The dam glue 5 is used to prevent the side of the light emitting chip 11 from being squeezed and damaged during the subsequent bending of the flat flexible substrate. Afterwards, the flexible substrate is bent to form the first plate body 101 and the second plate body 102 connected obliquely, and the heat dissipation bracket 16 is arranged on the surface of the second plate body 102 away from the light emitting chip 11, as shown in FIG. Figure 4As shown. Among them, the heat dissipation bracket 16 enhances the heat dissipation performance of the flexible substrate and the light-emitting chip 11, reduces the accumulation of heat inside the packaging structure, and avoids the problem of excessive light decay of the device due to poor heat dissipation. Moreover, the heat dissipation bracket 16 is also used to support the second plate body 102, thereby improving the stability of the flexible substrate after bending. In one example, the material of the heat dissipation bracket 16 can be a metal material with high thermal conductivity. The bottom surface of the heat dissipation bracket 16 is flush with the surface of the first plate body 101 away from the light-emitting chip 11, which helps to further reduce the size of the packaging structure of the integrated multi-light-emitting chip. Then, the light-emitting chip 11 and the flexible substrate are encapsulated with a transparent encapsulation material to form the transparent encapsulation layer 14. A transparent cover plate 13 is disposed on the surface of the transparent plastic sealing layer 14 away from the flexible substrate, and a spherical lens matrix is ​​protrudingly disposed on the surface of the transparent cover plate 13 away from the transparent plastic sealing layer 14, so that the light signal emitted by the light emitting chip 11 located on the first plate body 101 and the second plate body 102 is emitted through the spherical lens matrix to control the emission direction of the light signal emitted by the light emitting chip 11, and avoid glare caused by the convergence of the light signals emitted by the first plate body 101 and the second plate body 102 located on the opposite sides of the first plate body 101. After removing the sacrificial layer and the carrier 31, the following is obtained: Figure 5 Then, a lead solder ball 12 is arranged on the surface of the first plate 101 away from the light emitting chip 11, so as to obtain Figure 1 The structure shown.

[0055] The packaging structure of integrated multiple light-emitting chips provided in this specific embodiment is provided with a flexible substrate, and the flexible substrate includes a first plate body and a second plate body connected to the end of the first plate body and obliquely intersecting with the first plate body, so that multiple light-emitting chips are mounted on the first plate body and the second plate body of the flexible substrate. The multiple light-emitting chips are all located on the same side of the flexible substrate and the light-emitting surfaces of the multiple light-emitting chips are all facing the upper side of the flexible substrate, which not only improves the luminous brightness of the packaging structure, but also solves the aperture problem caused by the independent packaging of a single light-emitting chip because the multiple light-emitting chips are packaged as one, and the interval between adjacent light-emitting chips is shortened by the obliquely connected first plate body and second plate body, and the generation of dark shadows is also reduced, thereby improving the uniformity of luminescence of the packaging structure and effectively improving the luminous effect.

[0056] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A packaging structure integrating multiple light-emitting chips, characterized in that: include: A flexible substrate, comprising a first plate body and a second plate body located at an end of the first plate body and connected to the first plate body, wherein the first plate body and the second plate body intersect obliquely, and an angle between the first plate body and the second plate body is an obtuse angle; A plurality of light-emitting chips are distributed on the first board body and the second board body of the flexible substrate, the light-emitting chip comprises a light-emitting surface and a back surface opposite to the light-emitting surface, the plurality of light-emitting chips are all located on the same side of the flexible substrate and the back surfaces of the plurality of light-emitting chips are all facing the flexible substrate, and the light-emitting chip is electrically connected to the flexible substrate.

2. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: The included angle between the first plate body and the second plate body is 150 degrees to 165 degrees.

3. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: The flexible substrate comprises two second plates connected to opposite ends of the first plate, and each of the second plates is obliquely intersected with the first plate, and the angles between the first plate and each of the second plates are obtuse angles; At least one light emitting chip is disposed on the first plate and each of the second plates.

4. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: The packaging structure of the integrated multi-light-emitting chip further includes: The dam glue is located on the flexible substrate and distributed between adjacent light-emitting chips.

5. The packaging structure of integrated multi-light-emitting chips according to claim 4, characterized in that: The flexible substrate further includes a bending portion located between the first plate body and the second plate body; The dam glue is located on the bending portion.

6. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: Also includes: A transparent plastic sealing layer is located on the flexible substrate, and the transparent plastic sealing layer seals the plurality of light-emitting chips, and the light signals emitted by the light-emitting chips can pass through the transparent plastic sealing layer.

7. The packaging structure of integrated multi-light-emitting chips according to claim 6, characterized in that: Also includes: The transparent cover plate is arranged on the transparent plastic sealing layer by means of an adhesive cover, and a convex spherical lens array is arranged on the surface of the transparent cover plate away from the transparent plastic sealing layer.

8. The packaging structure of integrated multi-light-emitting chips according to claim 7, characterized in that: The transparent cover plate is a curved transparent cover plate, and a tangent line of the curved transparent cover plate is parallel to the light emitting chip on the second plate body.

9. The packaging structure of integrated multi-light-emitting chips according to claim 1, characterized in that: Also includes: The heat dissipation bracket is located on a surface of the flexible substrate facing away from the light-emitting chip.

10. The packaging structure of integrated multi-light-emitting chips according to claim 9, characterized in that: The heat dissipation bracket is located on the surface of the second plate body facing away from the light emitting chip, and the bottom surface of the heat dissipation bracket is flush with the surface of the first plate body facing away from the light emitting chip.

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