Rubber wheel mechanism suitable for edge covering and gluing of silicon wafer

Abstract

The utility model discloses a rubber wheel mechanism suitable for edge covering and gluing of a silicon wafer. The rubber wheel mechanism comprises a supporting table; the rubber wheel assembly comprises two supporting frames which are arranged above the supporting table in pairs, a gluing wheel which is arranged between the two supporting frames and is suitable for performing autorotation motion, and a driving unit which is connected with the gluing wheel and is used for driving the gluing wheel to perform autorotation motion; and the deviation rectifying assembly is arranged below the supporting table and used for driving the supporting table to do deflection motion. The silicon wafer gluing device can meet the gluing requirements of silicon wafers with tiny position changes.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a rubber wheel mechanism suitable for gluing the edge of silicon wafers. Background Art

[0002] Wafer hemming is usually used in the wafer edge packaging process in the semiconductor manufacturing industry. In the process of hemming silicon wafers, rubber wheels are generally required. Such rubber wheels are sometimes also called rollers or rubber coating wheels. They are mainly used to apply hemming materials on the edge of silicon wafers to prevent debris and contaminants from entering the effective area during subsequent wafer processing, affecting chip quality and yield.

[0003] Specifically, the glue wheel mechanism commonly used in general technology has glue on the glue wheel, and after the silicon wafer is transferred, the two rubber wheels are close to each other to achieve the glue brushing operation on the edge of the rubber wheel. This glue coating mechanism is only suitable for the neat position of the silicon wafer, that is, the edge of the silicon wafer needs to be arranged in parallel with the coating surface of the glue coating wheel in the glue wheel mechanism for coating glue to meet the use requirements.

[0004] However, in reality, when the silicon wafer is transferred to the glue coating position, it needs to go through different processes, so the position of the silicon wafer may float in a small range during the transmission process. When the position of the silicon wafer changes slightly, the glue coating wheel only coats the silicon wafer by being relatively close, which may cause the problem of uneven glue coating.

[0005] Therefore, in order to meet the actual glue coating needs when there are slight changes in the position of silicon wafers when they flow between serial processing steps, it is also necessary to further optimize the overall structure of the rubber wheel mechanism used. Utility Model Content

[0006] The utility model aims to provide a glue wheel mechanism suitable for gluing the edge of silicon wafers, so as to solve the technical problem of satisfying the gluing requirements of silicon wafers with slight position changes.

[0007] The rubber wheel mechanism of the utility model suitable for gluing the edge of silicon wafer is realized as follows:

[0008] A glue wheel mechanism suitable for gluing the edge of a silicon wafer, comprising:

[0009] Support table;

[0010] The rubber wheel assembly comprises two supporting frames arranged in pairs above the supporting platform, a rubber coating wheel disposed between the two supporting frames and suitable for self-rotation, and a driving unit connected to the rubber coating wheel for driving the rubber coating wheel to self-rotate;

[0011] The deflection correction component is arranged below the support platform to drive the support platform to perform deflection movement.

[0012] In an optional implementation of the present invention, the driving unit includes a driving motor and a pulley structure for connecting the driving motor and one end of the rubber coating wheel.

[0013] In an optional implementation of the utility model, the pulley structure includes a driving gear plate connected to the driving motor, a driven gear plate connected to one end of the rubber coating wheel, and a transmission belt for simultaneously connecting the driving gear plate and the driven gear plate.

[0014] In an optional implementation of the present invention, the rubber wheel assembly also includes a paving knife disposed on two support frames and used for scraping the glue on the rubber coating wheel.

[0015] In an optional implementation of the utility model, both ends of the glue coating surface of the glue coating wheel are also provided with annular parts;

[0016] The outer diameter of the annular portion is greater than the outer diameter of the glue coating surface.

[0017] In an optional implementation of the utility model, a tapered transition portion is provided between the annular portion and the rubber coating surface; and

[0018] The small outer diameter portion of the tapered bevel transition portion is connected to the glue coating surface, and the large outer diameter portion of the tapered bevel transition portion is connected to the annular portion.

[0019] In an optional implementation of the present invention, the rubber wheel assembly also includes a glue storage box for collecting colloid, which is arranged between the two support frames and below the rubber coating wheel.

[0020] In an optional implementation of the present invention, the support platform adopts a rectangular structure.

[0021] In an optional implementation of the present invention, the deviation correction component adopts a UVW three-dimensional adjustment platform structure.

[0022] In an optional implementation of the present invention, the rubber wheel mechanism suitable for gluing the edge of silicon wafers also includes a supporting base plate for supporting the deviation correction component from the bottom.

[0023] By adopting the above technical solution, the utility model has the following beneficial effects: the rubber wheel mechanism of the utility model suitable for gluing the edge of silicon wafers is used to drive the support table to deflect through the designed deviation correction component, thereby driving the rubber wheel assembly to move synchronously through the deflection movement of the support table, and then adjusting the gluing angle of the gluing surface of the gluing wheel relative to the silicon wafer, thereby making the gluing wheel in the rubber wheel assembly adapt to the offset angle of the silicon wafer. In summary, the deviation correction component is used in conjunction with the gluing wheel to improve the uniformity of gluing of silicon wafers with slight position deviations. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a schematic structural diagram of a first-viewing angle of view of a rubber wheel mechanism suitable for gluing the edge of a silicon wafer according to the utility model;

[0025] Figure 2 This is a schematic structural diagram from a second viewing angle of the rubber wheel mechanism of the utility model suitable for gluing the edge of silicon wafers;

[0026] Figure 3 It is a third-view structural diagram of the rubber wheel mechanism of the utility model suitable for gluing the edge of silicon wafers;

[0027] Figure 4 This is a schematic structural diagram from a fourth viewing angle of the rubber wheel mechanism of the utility model suitable for gluing the edge of silicon wafers.

[0028] In the figure: support platform 1, support base plate 2, support frame 31, glue coating wheel 32, paving knife 33, glue coating surface 34, glue storage box 35, annular portion 36, conical transition portion 37, driving motor 41, active gear disc 42, driven gear disc 43, transmission belt 44, deviation correction component 5. DETAILED DESCRIPTION

[0029] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0030] Example 1: Please refer to Figures 1 to 4 As shown, this embodiment provides a rubber wheel mechanism suitable for gluing the edge of silicon wafers, comprising: a support platform 1, a rubber wheel assembly arranged on the support platform 1, and a deflection correction assembly arranged under the support platform 1. Of course, it can be understood that in order to facilitate the use of the rubber wheel mechanism of this embodiment with other processes, a support base plate 2 for carrying the deflection correction assembly from the bottom is also provided at the bottom of the deflection correction assembly. The support base plate 2 can be fixed on the corresponding work surface to be combined with other processing processes, thereby realizing serial processing of silicon wafers.

[0031] Based on the above situation, in order to fully utilize the support surface of the support platform 1 to support the rubber wheel assembly, the support platform 1 in this embodiment may optionally adopt a rectangular structure.

[0032] Next, let's talk about it in detail. First, the rubber wheel assembly:

[0033] Regarding the rubber wheel assembly of this embodiment, any mature means in the prior art can be optionally adopted. Here, an optional implementation method is exemplified in conjunction with the accompanying drawings. The rubber wheel assembly includes two supporting frames 31 arranged in pairs above the support platform 1, a rubber coating wheel 32 suitable for self-rotation disposed between the two supporting frames 31, and a driving unit connected to the rubber coating wheel 32 for driving it to rotate.

[0034] Furthermore, in an optional implementation, the driving unit includes a driving motor 41, and a pulley structure for connecting the driving motor 41 and one end of the rubber coating wheel 32. The pulley structure here includes a driving toothed disc 42 connected to the driving motor 41, a driven toothed disc 43 connected to one end of the rubber coating wheel 32, and a transmission belt 44 for connecting the driving toothed disc 42 and the driven toothed disc 43 at the same time.

[0035] In addition, it should be noted that the rubber wheel assembly also includes a paving knife 33 provided on the two support frames 31 and used to scrape the glue on the rubber coating wheel 32. When the rubber coating wheel 32 is rotating, the paving knife 33 provided above the rubber coating wheel 32 scrapes the glue on the rubber coating wheel 32.

[0036] In order to prevent the colloid from flowing onto the support platform 1 during the gluing process, the rubber wheel assembly further includes a glue storage box 35 for collecting the colloid, which is arranged between the two support frames 31 and below the gluing wheel 32 .

[0037] On the basis of the above structure, in order to make the glue coating wheel 32 of this embodiment better fit the end angle of the silicon wafer, thereby improving the uniformity of glue coating on the edge of the silicon wafer, this embodiment also makes the following design:

[0038] The two ends of the glue coating surface 34 of the glue coating wheel 32 are respectively provided with annular portions 36; the outer diameter of the annular portion 36 is larger than the outer diameter of the glue coating surface 34. Furthermore, a tapered bevel transition portion 37 is provided between the annular portion 36 and the glue coating surface 34; and the small outer diameter portion of the tapered bevel transition portion 37 is connected to the glue coating surface 34, and the large outer diameter portion of the tapered bevel transition portion 37 is connected to the annular portion 36.

[0039] Regarding the deflection correction component of the present embodiment, the deflection correction component can optionally adopt a UVW three-dimensional adjustment platform structure. The UVW three-dimensional adjustment platform structure here can be any mature means in the prior art. As long as the support table 1 can be horizontally aligned and rotated relative to the silicon wafer, so that the support table 1 can adapt to the position state of the silicon wafer to adjust its gluing angle, the UVW three-dimensional adjustment platform structure meets the use requirements of the present embodiment, such as but not limited to a UVW three-dimensional adjustment platform disclosed by announcement number CN205951461U, or a UVW adjustment platform disclosed by announcement number CN213646638U. In the present embodiment, the use of the UVW three-dimensional adjustment platform structure can not only make the support table 1 adapt to the silicon wafer with a position offset to adjust the gluing angle, but also achieve approach and distance relative to the silicon wafer. In this way, for the rubber wheel mechanism of the present embodiment suitable for gluing the silicon wafer edge, there is no need to configure an additional linear motion mechanism for driving the rubber wheel mechanism to approach and move away from the silicon wafer during the process of gluing the silicon wafer.

[0040] In summary, the specific implementation principle of the glue wheel mechanism for gluing the edge of a silicon wafer in this embodiment is as follows:

[0041] In order to meet the requirements of gluing a pair of opposite edges of the silicon wafer, a pair of rubber wheel mechanisms of this embodiment suitable for gluing the edge of the silicon wafer are used in conjunction. When the position of the silicon wafer deviates within a small range, the designed deviation correction component is used to drive the support table 1 to deflect, thereby driving the rubber wheel assembly to move synchronously through the deflection movement of the support table 1, and then adjusting the gluing angle of the gluing surface 34 of the gluing wheel 32 relative to the silicon wafer, thereby making the gluing wheel 32 in the rubber wheel assembly adapt to the offset angle of the silicon wafer.

[0042] Based on the above situation, when the silicon wafer is coated with glue, the support table 1 is driven by the correction component to adapt to the silicon wafer to slightly adjust its coating angle, so that its coating angle adapts to the position and tilt angle of the silicon wafer, and the conical bevel transition portion 37 of the coating wheel 32 on one side of the silicon wafer fits with one end angle of the silicon wafer, and the conical bevel transition portion 37 of the coating wheel 32 on the other side of the silicon wafer fits with the other end angle of the silicon wafer, and the coating wheel 32 rolls to coat the diagonal and two side edges of the silicon wafer with glue.

[0043] Example 2: Based on the rubber wheel mechanism for silicon wafer edge coating in Example 1, the rubber wheel mechanism for silicon wafer edge coating provided in this example has the same general structure as that of Example 1, the difference being the deviation correction component used.

[0044] Specifically, the deflection correction assembly of this embodiment includes a circular ring gear disposed at the bottom of the support platform 1 of the rectangular structure, a gear meshing with the circular ring gear, and a micro motor for driving the gear to operate. In this structure, the micro motor drives the gear to rotate, thereby causing the circular ring gear to rotate, and in the process, the support platform 1 is driven to perform deflection motion.

[0045] Based on the above situation, since the correction component used in this embodiment can only realize the deflection movement of the support table 1, but cannot realize its linear movement away from and approaching the silicon wafer, it can be understood that for the rubber wheel mechanism suitable for silicon wafer edging and gluing in this embodiment, in order to meet the use requirements of its linear movement away from and approaching the silicon wafer, a linear screw module such as but not limited to a linear screw module can be further provided at the bottom of the support base plate 2 to drive the entire support base plate 2 and the related structures provided on the support base plate 2 to make linear motion together.

[0046] In summary, for the glue wheel mechanism suitable for gluing the edge of silicon wafers in this embodiment, the linear screw module at the bottom of the supporting base plate 2 is cooperated with the correction component to enable the glue coating wheel 32 to adapt to the position and angle of the silicon wafer to meet the use requirements for uniform glue coating on the side edges of the silicon wafer.

[0047] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0048] In the description of the present invention, it is necessary to understand that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0049] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0050] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0051] In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0052] In the present utility model, unless otherwise clearly specified and limited, the first feature being above or below the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through another feature between them. Moreover, the first feature being above, above, and above the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being below, below, and below the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

Claims

1. A rubber wheel mechanism suitable for gluing the edge of silicon wafers, characterized in that: include: Support table; The rubber wheel assembly comprises two supporting frames arranged in pairs above the supporting platform, a rubber coating wheel disposed between the two supporting frames and suitable for self-rotation, and a driving unit connected to the rubber coating wheel for driving the rubber coating wheel to self-rotate; The deflection correction component is arranged below the support platform to drive the support platform to perform deflection movement.

2. The rubber wheel mechanism for gluing the edge of silicon wafers according to claim 1, characterized in that: The driving unit comprises a driving motor and a pulley structure for connecting the driving motor and one end of the rubber coating wheel.

3. The rubber wheel mechanism for gluing the edge of silicon wafers according to claim 2, characterized in that: The pulley structure comprises a driving toothed disc connected to a driving motor, a driven toothed disc connected to one end of a rubber coating wheel, and a transmission belt for simultaneously connecting the driving toothed disc and the driven toothed disc.

4. The rubber wheel mechanism for gluing the edge of silicon wafers according to any one of claims 1 to 3, characterized in that: The rubber wheel assembly also includes a paving knife which is arranged on two support frames and is used for scraping the glue on the rubber coating wheel.

5. The glue wheel mechanism for gluing the edge of silicon wafers according to any one of claims 1 to 3, characterized in that: The two ends of the glue coating surface of the glue coating wheel are also provided with circular ring parts respectively; The outer diameter of the annular portion is greater than the outer diameter of the glue coating surface.

6. The rubber wheel mechanism for gluing the edge of silicon wafers according to claim 5, characterized in that: A tapered transition portion is provided between the annular portion and the rubber coating surface; and The small outer diameter portion of the tapered bevel transition portion is connected to the glue coating surface, and the large outer diameter portion of the tapered bevel transition portion is connected to the annular portion.

7. The glue wheel mechanism for gluing the edge of silicon wafers according to any one of claims 1 to 3, characterized in that: The rubber wheel assembly also includes a glue storage box for collecting colloid, which is arranged between the two support frames and located below the rubber coating wheel.

8. The rubber wheel mechanism for gluing the edge of silicon wafers according to claim 1, characterized in that: The support platform adopts a rectangular structure.

9. The rubber wheel mechanism for gluing the edge of silicon wafers according to claim 8, characterized in that: The deviation correction component adopts a UVW three-dimensional adjustment platform structure.

10. The glue wheel mechanism for gluing the edge of silicon wafers according to claim 1, characterized in that: The rubber wheel mechanism suitable for gluing the edge of silicon wafers also includes a supporting base plate for carrying the deviation correction component from the bottom.

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