Glue injection sealing device of light-emitting diode (LED)

Abstract

The utility model relates to the technical field of diode glue injection, in particular to a glue injection sealing device of an LED. The technical problems that when a traditional diode glue injection sealing device carries out glue injection processing on a diode, accumulation of dust on a diode workpiece and dust outside the device can affect the glue injection processing of the diode, and the glue injection processing quality of the diode is affected are solved. According to the technical scheme, the glue injection sealing device for the LED comprises a base, a driving assembly, a mounting assembly, a protection assembly, a feeding assembly, a glue injection assembly and a supporting assembly; compared with a traditional diode glue injection sealing device in use, dust accumulation can affect the glue injection processing quality of the diode, the device enables the diode to be rotatably adjusted in the protection structure by placing the diode subjected to dust removal through blowing into the installation structure and rotatably adjusting the position of the diode, so that the diode is prevented from being damaged, and the service life of the diode is prolonged. Therefore, sealing dustproof protection processing is carried out on diode processing.

Description

Technical Field

[0001] The utility model relates to the technical field of diode glue injection, in particular to a glue injection sealing device for LED light emitting diodes. Background Art

[0002] The diode glue injection sealing device is a device used to protect and fix the diode. This device can inject glue into the diode package to achieve a sealing effect. It is usually composed of a glue injection gun, a glue injection nozzle and a glue injection cavity. First, the operator needs to place the diode in the glue injection cavity. This step ensures the correct positioning of the diode during the glue injection process. Then, the operator uses the glue injection gun to inject glue from the glue injection nozzle into the glue injection cavity. The glue injection gun controls the flow rate and pressure of the glue through external pressure to ensure its uniform injection. During the glue injection process, the glue fills the cavity of the diode package and tightly seals it. In this way, the diode can maintain normal function under various environmental conditions and is protected from external factors. After a certain period of time, the diode will be able to maintain normal function under various environmental conditions and is protected from external factors. As time goes by, the glue becomes solid, which further strengthens the sealing effect. Finally, the operator needs to check whether the glue injection effect meets the requirements. They can make judgments by observing whether the glue injection completely covers the diode package and whether there are problems such as leakage or bubbles. If problems are found, the operator should take remedial measures in time, such as re-injecting glue or replacing the glue injection nozzle. However, in the use of traditional diode glue injection sealing devices, traditional diode glue injection sealing devices inject glue into the diode package to achieve a sealing effect. However, when traditional diode glue injection sealing devices perform glue injection processing on diodes, dust on the diode workpiece and dust accumulation outside the device will affect the glue injection processing of the diode and affect the glue injection processing quality of the diode. Utility Model Content

[0003] In order to overcome the problem that in the daily use of traditional diode glue injection and sealing devices, when the traditional diode glue injection and sealing devices are performing glue injection processing on the diode, the dust on the diode workpiece and the dust accumulation outside the device will affect the glue injection processing of the diode and affect the glue injection processing quality of the diode.

[0004] The technical scheme of the utility model is as follows: a glue injection sealing device for LED light emitting diodes comprises a base, a driving component, a mounting component, a protective component, a feeding component, a glue injection component and a supporting component; a driving component with a driving function is arranged on the inner side of the base, a mounting component with a mounting function is arranged on the upper side of the base, a protective component with a protective function is arranged on the outer side of the mounting component, a feeding component with a feeding function is arranged on the inner side of the protective component, a glue injection component with a glue injection function is arranged on the upper side of the base, and a supporting component with a supporting function is arranged on the lower side of the base;

[0005] The mounting assembly includes a mounting plate and a mounting groove; a mounting plate is arranged above the base, a mounting groove is provided on the inner side of the mounting plate, and the mounting groove is provided in multiple groups. When in use, the mounting plate is driven to rotate by rotating the connecting shaft;

[0006] The loading assembly includes a fan, a second motor and a connecting plate; a fan is arranged on the inner side of the first connecting frame, a second motor is arranged on one side of the first connecting frame, a connecting plate is arranged on the inner side of the first connecting frame, and the connecting plate and the second motor are connected through a rotating shaft. When in use, the diode can be placed through the first connecting frame, and the dust on the surface of the diode can be blown away by starting the fan, and the connecting plate can be driven to rotate by starting the second motor, and the diode can be placed into the inner side of the installation groove by rotating the connecting plate.

[0007] Preferably, the diode that needs to be injected with glue can be placed inside the installation component through the loading component, and the installation component is driven to rotate by starting the driving component to adjust the position of the diode inside the installation component. The diode is sealed and dustproof during the injection process through the protective component, the diode is injected with glue through the glue injection component, and the base is supported and shock-absorbing through the supporting component.

[0008] Preferably, the driving assembly includes a first motor and a connecting shaft; the first motor is arranged below the base, and the connecting shaft is arranged on the inner side of the base. The connecting shaft and the first motor are connected through a rotating shaft. When in use, the connecting shaft is driven to rotate by starting the first motor.

[0009] Preferably, the protective assembly includes a protective frame, a first connecting frame, a second connecting frame and a cover plate; a protective frame is arranged on the outer side of the mounting plate, a first connecting frame is arranged above the protective frame, a second connecting frame is arranged above the protective frame, and a cover plate is arranged on the inner side of the protective frame, and the cover plate and the protective frame are slidably connected. When in use, the position of the mounting groove is adjusted by rotating the mounting plate, thereby adjusting the position of the diode inside the mounting groove, and the protective frame is used to seal and protect the diode inside the mounting groove when the position is adjusted, and the second connecting frame is used to seal and protect the diode when the glue injection process is performed to prevent dust from affecting the glue injection process of the diode, and the processed diode can be taken out by pulling the cover plate to move it linearly.

[0010] Preferably, the glue injection assembly includes a glue cylinder and a glue dispensing head; the glue cylinder is arranged above the base, and the glue dispensing head is arranged below the glue cylinder. When in use, the glue inside the glue cylinder is guided out by the glue dispensing head to perform glue injection processing on the diode moved to the position below it.

[0011] Preferably, the supporting assembly includes a bracket and a shock-absorbing pad; a bracket is arranged below the base, and the bracket is arranged in multiple groups, and a shock-absorbing pad is arranged at the lower end of the bracket. When in use, the base is supported by the bracket, thereby supporting the glue injection sealing device, and the bracket is shock-absorbing by the shock-absorbing pad, thereby shock-absorbing the glue injection sealing device, thereby improving the stability of the glue injection sealing device when in use.

[0012] Beneficial effects of the utility model:

[0013] 1. Compared with the traditional diode glue injection sealing device, which injects glue into the diode package to achieve a sealing effect, the dust on the diode workpiece and the dust accumulation outside the device will affect the diode's glue injection processing and the quality of the diode's glue injection processing. This device puts the diode after dust removal by air blowing into the installation structure, and can make the diode rotate inside the protective structure by rotating its position, so as to seal and dustproof the diode during the glue injection process, thus realizing the sealing and dustproof protection of the diode processing;

[0014] 2. The diode can be placed through the first connecting frame, and the dust on the surface of the diode can be blown off by starting the fan. The connecting plate can be driven to rotate by starting the second motor. The diode can be placed inside the installation groove by rotating the connecting plate. The connecting shaft can be driven to rotate by starting the first motor, and the mounting plate can be driven to rotate by rotating the connecting shaft. The position of the mounting groove can be adjusted by rotating the mounting plate, thereby adjusting the position of the diode inside the mounting groove. The diode inside the mounting groove can be sealed and protected by the protective frame when the position is adjusted. The diode can be sealed and protected by the second connecting frame when the glue injection process is performed to prevent dust from affecting the glue injection process of the diode. The processed diode can be taken out by pulling the cover plate to make it move linearly, thereby realizing the sealing and dustproof treatment of the glue injection process of the diode.

[0015] 3. The base is supported by a bracket, thereby supporting the glue injection sealing device, and the bracket is shock-absorbing by a shock-absorbing pad, thereby shock-absorbing the glue injection sealing device, thereby improving the stability of the glue injection sealing device during use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The three-dimensional structure diagram of the glue injection sealing device for LED light emitting diodes of the utility model is shown;

[0017] Figure 2 The first cross-sectional structure diagram of the glue injection sealing device for LED light emitting diodes of the utility model is shown;

[0018] Figure 3 The second cross-sectional structure diagram of the glue injection sealing device for LED light emitting diodes of the utility model is shown;

[0019] Figure 4 The figure shows a partial three-dimensional structure diagram of the glue injection sealing device of the LED light emitting diode of the utility model;

[0020] Explanation of the reference numerals in the accompanying drawings: 1. Base; 2. Driving assembly; 201. First motor; 202. Connecting shaft; 3. Mounting assembly; 301. Mounting plate; 302. Mounting slot; 4. Protective assembly; 401. Protective frame; 402. First connecting frame; 403. Second connecting frame; 404. Cover plate; 5. Feeding assembly; 501. Fan; 502. Second motor; 503. Connecting plate; 6. Glue injection assembly; 601. Glue cartridge; 602. Glue dispensing head; 7. Support assembly; 701. Bracket; 702. Shock-absorbing pad. DETAILED DESCRIPTION

[0021] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0022] See also Figure 1 The utility model provides an embodiment: a glue injection sealing device for LED light emitting diodes, comprising a base 1, a driving component 2, a mounting component 3, a protective component 4, a feeding component 5, a glue injection component 6 and a supporting component 7; a driving component 2 with a driving function is arranged on the inner side of the base 1, a mounting component 3 with a mounting function is arranged above the base 1, a protective component 4 with a protective function is arranged on the outer side of the mounting component 3, a feeding component 5 with a feeding function is arranged on the inner side of the protective component 4, a glue injection component 6 with a glue injection function is arranged above the base 1, and a supporting component 7 with a supporting function is arranged below the base 1;

[0023] The mounting assembly 3 includes a mounting plate 301 and a mounting groove 302; the mounting plate 301 is arranged above the base 1, and the inner side of the mounting plate 301 is provided with a mounting groove 302, and the mounting groove 302 is provided with multiple groups. When in use, the mounting plate 301 is driven to rotate by rotating the connecting shaft 202;

[0024] The loading component 5 includes a fan 501, a second motor 502 and a connecting plate 503; a fan 501 is arranged on the inner side of the first connecting frame 402, a second motor 502 is arranged on one side of the first connecting frame 402, a connecting plate 503 is arranged on the inner side of the first connecting frame 402, and the connecting plate 503 and the second motor 502 are connected by a rotating shaft. When in use, the diode can be placed through the first connecting frame 402, and the dust on the surface of the diode can be blown away by starting the fan 501, and the connecting plate 503 can be driven to rotate by starting the second motor 502, and the diode can be placed into the inner side of the installation groove 302 by rotating the connecting plate 503.

[0025] See also Figure 2-4 In this embodiment, the driving assembly 2 includes a first motor 201 and a connecting shaft 202; the first motor 201 is arranged below the base 1, and the connecting shaft 202 is arranged on the inner side of the base 1, and the connecting shaft 202 and the first motor 201 are connected by a rotating shaft. When in use, the connecting shaft 202 is driven to rotate by starting the first motor 201, and the protective assembly 4 includes a protective frame 401, a first connecting frame 402, a second connecting frame 403 and a cover plate 404; the protective frame 401 is arranged on the outer side of the mounting plate 301, the first connecting frame 402 is arranged above the protective frame 401, and the second connecting frame 403 is arranged above the protective frame 401. 403, a cover plate 404 is arranged on the inner side of the protection frame 401, and the cover plate 404 and the protection frame 401 are slidably connected. When in use, the position of the mounting groove 302 is adjusted by rotating the mounting plate 301, so as to adjust the position of the diode inside the mounting groove 302. The diode inside the mounting groove 302 is sealed and protected when the position is adjusted by the protection frame 401. The diode is sealed and protected when the glue injection process is carried out by the second connecting frame 403 to prevent dust from affecting the glue injection process of the diode. The processed diode can be taken out by pulling the cover plate 404 to make it move linearly.

[0026] The glue injection component 6 includes a glue cylinder 601 and a glue dispensing head 602; a glue cylinder 601 is arranged above the base 1, and a glue dispensing head 602 is arranged below the glue cylinder 601. When in use, the glue inside the glue cylinder 601 is guided out by the glue dispensing head 602 to perform glue injection processing on the diode moved to the position below it. The support component 7 includes a bracket 701 and a shock-absorbing pad 702; a bracket 701 is arranged below the base 1, and the bracket 701 is provided with multiple groups. A shock-absorbing pad 702 is arranged at the lower end of the bracket 701. When in use, the base 1 is supported by the bracket 701, thereby supporting the glue injection sealing device, and the bracket 701 is shock-absorbing by the shock-absorbing pad 702, thereby shock-absorbing the glue injection sealing device, thereby improving the stability of the glue injection sealing device when in use.

[0027] During operation, the base 1 is first supported by the bracket 701 so as to support the glue injection sealing device, and the bracket 701 is shock-absorbing by the shock-absorbing pad 702 so as to shock-absorbing the glue injection sealing device.

[0028] After the device is fixed, the diode can be placed through the first connecting frame 402, the dust on the surface of the diode can be blown away by starting the fan 501, and the connecting plate 503 can be driven to rotate by starting the second motor 502. The diode can be placed inside the installation groove 302 by rotating the connecting plate 503;

[0029] After the diode is placed in, the first motor 201 is started to drive the connecting shaft 202 to rotate, and the connecting shaft 202 is used to drive the mounting plate 301 to rotate, and the mounting plate 301 is used to adjust the position of the mounting slot 302, thereby adjusting the position of the diode inside the mounting slot 302, and the protective frame 401 is used to seal and protect the diode inside the mounting slot 302 when the position is adjusted, and the second connecting frame 403 is used to seal and protect the diode when the glue injection process is carried out to prevent dust from affecting the glue injection process of the diode, and the processed diode can be taken out by pulling the cover plate 404 to move it linearly.

[0030] Through the above steps, the diode that needs to be injected with glue can be placed into the installation component 3 using the loading component 5, and the installation component 3 can be driven to rotate by the starting drive component 2 to adjust the position of the diode inside the installation component 3. The protective component 4 can be used to seal and dustproof the diode during the injection process, the glue injection component 6 can be used to inject glue on the diode, and the support component 7 can be used to support and shock-absorb the base 1.

[0031] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A glue injection sealing device for an LED light emitting diode, comprising a base (1); characterized in that: It also comprises a driving component (2), a mounting component (3), a protection component (4), a feeding component (5), a glue injection component (6) and a supporting component (7); a driving component (2) having a driving function is arranged on the inner side of the base (1); a mounting component (3) having a mounting function is arranged above the base (1); a protection component (4) having a protection function is arranged on the outer side of the mounting component (3); a feeding component (5) having a feeding function is arranged on the inner side of the protection component (4); a glue injection component (6) having a glue injection function is arranged above the base (1); and a supporting component (7) having a supporting function is arranged below the base (1); The mounting assembly (3) comprises a mounting plate (301) and a mounting groove (302); the mounting plate (301) is arranged above the base (1), the inner side of the mounting plate (301) is provided with a mounting groove (302), and the mounting groove (302) is provided with a plurality of groups; The loading assembly (5) comprises a fan (501), a second motor (502) and a connecting plate (503); the fan (501) is arranged on the inner side of the first connecting frame (402), the second motor (502) is arranged on one side of the first connecting frame (402), the connecting plate (503) is arranged on the inner side of the first connecting frame (402), and the connecting plate (503) and the second motor (502) are connected via a rotating shaft.

2. The LED light emitting diode glue injection sealing device according to claim 1, characterized in that: The driving assembly (2) comprises a first motor (201) and a connecting shaft (202); the first motor (201) is arranged below the base (1), the connecting shaft (202) is arranged inside the base (1), and the connecting shaft (202) and the first motor (201) are connected via a rotating shaft.

3. The LED light emitting diode glue injection sealing device according to claim 2, characterized in that: The protection assembly (4) comprises a protection frame (401), a first connecting frame (402), a second connecting frame (403) and a cover plate (404); the protection frame (401) is arranged on the outer side of the mounting plate (301), the first connecting frame (402) is arranged above the protection frame (401), the second connecting frame (403) is arranged above the protection frame (401), the cover plate (404) is arranged on the inner side of the protection frame (401), and the cover plate (404) and the protection frame (401) are slidably connected.

4. The LED light emitting diode glue injection sealing device according to claim 1, characterized in that: The glue injection assembly (6) comprises a glue cylinder (601) and a glue dispensing head (602); the glue cylinder (601) is arranged above the base (1), and the glue dispensing head (602) is arranged below the glue cylinder (601).

5. The LED light emitting diode glue injection sealing device according to claim 1, characterized in that: The support assembly (7) comprises a bracket (701) and a shock-absorbing pad (702); the bracket (701) is arranged below the base (1), the bracket (701) is arranged in multiple groups, and the shock-absorbing pad (702) is arranged at the lower end of the bracket (701).

Images