Local cooling structure of casting mold
By adopting a local cooling structure combining semiconductor refrigeration parts and pump bodies in the casting mold, the recycle of coolant is achieved, and the problem of excessive cooling liquid consumption in the prior art is solved, reducing waste and simplifying operation.
Patent Information
- Application Number
- CN202421317864.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-11
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-06-11
AI Technical Summary
Existing casting molds require local cooling during molding, and the commonly used water cooling method requires continuous replacement of coolant, resulting in excessive consumption of coolant and serious waste.
A local cooling structure of casting mold is designed, using a combination of semiconductor refrigeration parts and pump bodies to realize the recycling of coolant, and the cooling liquid replacement and cleaning process is simplified through the moving mechanism.
It effectively reduces the use of coolant, avoids unnecessary waste, and simplifies the coolant replacement and cleaning operations, improving the overall operating efficiency.
Smart Images

Figure CN222754385U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of forging dies, in particular to a local cooling structure of a casting die. Background Art
[0002] A casting mold refers to a part that is made of other easily moldable materials in advance to obtain the structural shape of the part, and then the mold is placed in a sand mold, so that a cavity with the same size as the part structure is formed in the sand mold, and then a fluid liquid is poured into the cavity. After the liquid is cooled and solidified, a part with the same shape and structure as the mold can be formed; the existing mold needs to be locally cooled during molding, and water cooling is often used for cooling in the prior art. In the prior art, such as the utility model patent with publication number CN220112308U, it is necessary to continuously replace the coolant during its specific use. In this way, a large amount of coolant needs to be consumed during use, so how to reduce the use of cooling is a problem that needs to be considered. Utility Model Content
[0003] The utility model aims to solve the shortcomings in the prior art and proposes a local cooling structure for a casting mold.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] A local cooling structure for a casting mold comprises a shell, and a plurality of mounting plates are connected to both sides of the shell; a mounting hole is opened on each mounting plate, an addition port is arranged on the inner top of the shell, a sealing cover is installed on the addition port, a pump body is installed on the left side of the shell, the water inlet end of the pump body extends to the bottom of the left side space of the shell, and the water outlet end of the pump body is connected with a first connecting pipe; an L-shaped plate is installed on the upper end of the shell, a second connecting pipe is penetrated through the upper end of the L-shaped plate, the second connecting pipe is fixedly connected to the L-shaped plate, a hose is fixedly connected to the lower end of the second connecting pipe, a rectangular block is arranged above the shell, the lower end of the hose penetrates the rectangular block, a connecting port is opened on the upper end of the shell, and the connecting port corresponds to the lower end of the hose; a moving mechanism, the moving mechanism is used to move the rectangular block, a semiconductor refrigeration component is installed on the right side wall of the shell, the refrigeration end of the semiconductor refrigeration component extends to the inside of the shell, and an inclined guide plate is fixedly connected to the inner top of the shell.
[0006] In order to better achieve the above-mentioned purpose, the utility model adopts a further technical solution: the inner bottom surface of the shell is a slope inclined to the left.
[0007] In order to better achieve the above purpose, the utility model adopts a further technical solution: the moving mechanism includes an electric telescopic rod fixedly connected to the right side of the horizontal part of the L-shaped plate, the telescopic end of the electric telescopic rod is fixedly connected to the rectangular block, and the lower end of the rectangular block is fixedly connected with a sealing ring.
[0008] The utility model has the advantages of effectively avoiding the situation of using a large amount of coolant, thereby avoiding unnecessary waste of coolant. In addition, through the use of the moving mechanism, when the coolant needs to be replaced later, the overall operation is simpler and the residual coolant can be completely removed. BRIEF DESCRIPTION OF THE DRAWINGS
[0009] Figure 1 This is a schematic diagram of the structure of the local cooling structure of the casting mold proposed by the utility model;
[0010] Figure 2 for Figure 1 Schematic cross-sectional view of ;
[0011] Figure 3 for Figure 2 Enlarged view of point A.
[0012] In the figure: 1 shell, 2 mounting plate, 3 pump body, 4 first connecting pipe, 5 adding port, 6 L-shaped plate, 7 second connecting pipe, 8 hose, 9 electric telescopic rod, 10 rectangular block, 11 semiconductor refrigeration component, 12 inclined guide plate, 13 sealing ring, 14 connecting port. DETAILED DESCRIPTION
[0013] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.
[0014] Reference Figure 1-Figure 3As shown, the local cooling structure of the casting mold includes a shell 1, and a plurality of mounting plates 2 are connected to both sides of the shell 1, and each mounting plate 2 is provided with a mounting hole. An addition port 5 is provided on the inner top of the shell 1, and a sealing cover is installed on the addition port 5, wherein a pump body 3 is installed on the left side of the shell 1, and the water inlet end of the pump body 3 extends to the bottom of the left space of the shell 1, and the water outlet end of the pump body 3 is connected with a first connecting pipe 4, and the other end of the first connecting pipe 4 is connected to the liquid inlet part of the water cooling channel on the inner wall of the forging mold, and the inner bottom surface of the shell 1 is an inclined surface inclined to the left; an L-shaped plate 6 is installed on the upper end of the shell 1, and a second connecting pipe 7 is provided through the upper end of the L-shaped plate 6, and the upper end of the second connecting pipe 7 is connected to the liquid outlet part of the water cooling channel on the inner wall of the forging mold. The second connecting pipe 7 is fixedly connected to the L-shaped plate 6, and the lower end of the second connecting pipe 7 is fixedly connected to the hose 8. A rectangular block 10 is arranged above the shell 1, and the lower end of the hose 8 passes through the rectangular block 10. A connecting port 14 is opened at the upper end of the shell 1, and the connecting port 14 corresponds to the lower end of the hose 8; a semiconductor refrigeration component 11 is installed on the right side wall of the shell 1, and the semiconductor refrigeration component 11 is composed of a semiconductor refrigeration plate and a heat dissipation fan. The refrigeration end of the semiconductor refrigeration component 11 extends to the inside of the shell 1, and an inclined guide plate 12 is fixedly connected to the inner top of the shell 1. The shell 1 is filled with coolant, which is a prior art, specifically composed of distilled water, recovered refrigerant, additives, etc. The height of the coolant is lower than the semiconductor refrigeration component 11.
[0015] The moving mechanism is used to move the rectangular block 10. The moving mechanism includes an electric telescopic rod 9 fixedly connected to the right side of the horizontal part of the L-shaped plate 6. The telescopic end of the electric telescopic rod 9 is fixedly connected to the rectangular block 10, and the lower end of the rectangular block 10 is fixedly connected with a sealing ring 13. When in use, the semiconductor refrigeration component 11 and the pump body 3 are started at the same time. The pump body 3 will pump the coolant into the water cooling channel of the casting mold. The used coolant will enter the hose 8 from the second connecting pipe 7, and finally contact the cold end of the semiconductor refrigeration component 11 through the inclined guide plate 12, and then enter the bottom of the shell 1 again. When used continuously, circulating cooling can be achieved without using a large amount of coolant. When the coolant needs to be replaced, just open the addition port 5, and then start the electric telescopic rod 9 to move the rectangular block 10 to the right, until the rectangular block 10 moves to the right part of the shell 1. After that, start the pump body 3, the cooling inside the shell 1 can be extracted and discharged from the rectangular block 10. After it is completely discharged, add cleaning agent through the addition port 5, and start the pump body 3 to clean the entire flow channel. After the cleaning is completed, add clean water and fully complete the process to completely discharge the cleaning agent. Finally, add new coolant and then start the pump body 3 until the coolant is continuously discharged from the rectangular block 10 for 5-10 seconds, then turn off the pump body 3 and start the electric telescopic rod 9 to move the rectangular block 10 back to the initial position. At this time, the water in the flow channel is also completely removed, leaving only the coolant.
Claims
1. The local cooling structure of the casting mold is characterized by: include: A shell (1), wherein both sides of the shell (1) are connected to a plurality of mounting plates (2); each mounting plate (2) is provided with a mounting hole; an inner top of the shell (1) is provided with an addition port (5), and a sealing cover is installed on the addition port (5); a pump body (3) is installed on the left side of the shell (1); the water inlet end of the pump body (3) extends to the bottom of the left side space of the shell (1); the water outlet end of the pump body (3) is connected to a first connecting pipe (4); an L-shaped plate (6) is installed on the upper end of the shell (1); a second connecting pipe (7) is provided through the upper end of the L-shaped plate (6); the second connecting pipe (7) is connected to the L-shaped plate ( 6) a fixed connection, wherein the lower end of the second connecting pipe (7) is fixedly connected to a hose (8), a rectangular block (10) is arranged above the shell (1), the lower end of the hose (8) penetrates the rectangular block (10), and a connecting port (14) is opened at the upper end of the shell (1), and the connecting port (14) corresponds to the lower end of the hose (8); a moving mechanism, wherein the moving mechanism is used to move the rectangular block (10), a semiconductor refrigeration element (11) is installed on the right side wall of the shell (1), the refrigeration end of the semiconductor refrigeration element (11) extends into the interior of the shell (1), and an inclined guide plate (12) is fixedly connected to the inner top of the shell (1).
2. The local cooling structure of the casting mold according to claim 1, characterized in that: The inner bottom surface of the shell (1) is a sloped surface inclined to the left.
3. The local cooling structure of the casting mold according to claim 1, characterized in that: The moving mechanism comprises an electric telescopic rod (9) fixedly connected to the right side of the horizontal portion of the L-shaped plate (6), the telescopic end of the electric telescopic rod (9) being fixedly connected to a rectangular block (10), and a sealing ring (13) being fixedly connected to the lower end of the rectangular block (10).
Citation Information
Patent Citations
Local cooling structure of mold
CN220112308U