Wafer thinning device
By designing a wafer thinning device containing a conical collection tank, filter plate and particle collection assembly, the problem of difficulty in recycling particulate matter in the abrasive liquid is solved, and more efficient abrasive liquid recovery and particulate matter cleaning are achieved, and production reliability and efficiency are improved.
Patent Information
- Application Number
- CN202421593389.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-08
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-07-08
AI Technical Summary
During the wafer thinning process, the particulate matter mixed into the abrasive liquid increases the difficulty of recycling, affecting production efficiency and cost control.
A wafer thinning device is designed, including a conical collection tank, a filter plate, a particle collection component and other structures. The abrasive liquid is collected through the conical collection tank, the filter plate filters the particulate matter, and the particle collection component is used to clean and collect particles from the bottom wall of the conical collection tank.
It effectively solves the problem of recycling particulate matter in the abrasive liquid, avoids the blockage caused by the accumulation of particulate matter, and improves the recycling efficiency and production reliability of the abrasive liquid.
Smart Images
Figure CN222755164U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer thinning, in particular to a wafer thinning device. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.
[0003] In the manufacturing process of wafers, a thinning device is needed to remove excess material to achieve the required thickness. The thinning process usually includes grinding, polishing, and quality control. During the grinding process, a grinding fluid is needed to prevent the workpiece and the grinding tool from overheating, and to avoid deformation or cracks of the workpiece caused by thermal stress. It can also play a role in lubrication and cleaning, and the chemical reaction between the grinding fluid and the workpiece can promote the removal of materials. After use, the grinding fluid needs to be recycled to reduce production costs and avoid waste of resources. However, during the grinding process, particles will mix with the grinding fluid, which makes recycling more difficult. In view of this, we propose a wafer thinning device. Utility Model Content
[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a wafer thinning device that can solve the problem that particles are mixed with the grinding liquid during the grinding process, which makes recovery more difficult. In view of this, we propose a wafer thinning device.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer thinning device, comprising a workbench, a mounting frame is fixedly connected to the upper surface of the workbench, a grinding device is arranged on the mounting frame, a storage box is fixedly connected to the upper surface of the mounting frame, a conical collecting groove is provided on the upper surface of the workbench, a support platform is rotatably connected to the bottom wall of the conical collecting groove, a storage cavity is provided inside the workbench, the upper side of the storage cavity extends into the interior of the support platform, a through groove communicating with the interior of the storage cavity is provided on the outer surface of the support platform, a filter plate is fixedly connected to the inner wall of the through groove, an annular groove is provided on the bottom wall of the conical collecting groove, and a particle collection assembly is provided on the inner wall of the annular groove.
[0006] Preferably, the particle collection assembly includes an arc-shaped plate, which is fixedly connected to the inner wall of the annular groove, and the arc-shaped plate is arranged in a semicircular shape. A sliding groove is opened inside the arc-shaped plate, and a displacement plate is slidably connected to the inner wall of the annular groove, and the displacement plate is also arranged in a semicircular shape. A baffle is fixedly connected to the upper surface of the arc-shaped plate, and a cleaning plate is fixedly connected to the outer surface of the support platform, and the lower surface of the cleaning plate is in contact with the upper surface of the arc-shaped plate.
[0007] Preferably, an L-shaped connecting rod is fixedly connected to the upper surface of the displacement plate, the other end of the L-shaped connecting rod is fixedly connected to the outer surface of the support platform, the bottom wall of the storage cavity is fixedly connected to a support column, the upper surface of the support column is rotatably connected to the lower surface of the support platform, and a driving groove is provided on the upper surface of the support column.
[0008] Preferably, a motor is fixedly connected to the bottom wall of the driving groove, an output end of the motor is fixedly connected to the lower surface of the support platform, the bottom wall of the annular groove is arranged to be inclined, and an L-shaped groove is provided on the bottom wall of the annular groove.
[0009] Preferably, the L-shaped groove is communicated with the interior of the storage cavity, a second filter plate is fixedly connected to the inner wall of the L-shaped groove, the second filter plate is arranged in an inclined shape, and a transmission groove is opened on the inner wall of the L-shaped groove.
[0010] Preferably, a collecting groove is provided inside the workbench, the transmission groove is communicated with the inside of the collecting groove, a collecting frame is slidably connected to the inside of the collecting groove, and the front side surface of the collecting frame slides through the front side surface of the workbench.
[0011] Preferably, a pump body is disposed inside the storage box, and a transmission pipe is disposed inside the storage cavity.
[0012] Preferably, the other end of the transmission pipe penetrates into the interior of the storage box, the output end of the pump body is fixedly connected with an output pipe, and the other end of the output pipe extends out of the storage box.
[0013] Compared with the prior art, the beneficial effects of the utility model are:
[0014] (1) When the wafer thinning device is performing the wafer thinning operation, the wafer is placed on the upper surface of the support table, and then the wafer is ground and thinned by means of a grinding device. During the thinning process, the wafer is cooled and lubricated by means of a grinding fluid in a storage box. The used grinding fluid is collected through a conical collecting groove, and particles are blocked by the filter plate, while the grinding fluid enters the storage chamber through the through groove. After the grinding and thinning operation is completed, particles on the bottom wall of the conical collecting groove are cleaned and collected by a particle collection assembly. The above structure can not only collect the grinding fluid after use, but also clean and collect the filtered particles, thereby avoiding the problem of particles accumulating in the conical collecting groove and causing clogging of the filter plate.
[0015] (2) In the wafer thinning device, the particles pushed down enter the interior of the L-shaped groove and are filtered by the second filter plate. The remaining grinding liquid will enter the interior of the storage chamber through the L-shaped groove, and the particulate matter will enter the interior of the collection groove through the transmission groove and be collected by the collection frame. The grinding liquid in the storage chamber will be re-transported to the interior of the storage box through the transmission pipe, and the grinding liquid will be re-sprayed out through the pump body and the output pipe. Through the above structure, the internal grinding liquid can be further removed after the particulate matter is collected, and the collection frame can be used to facilitate the staff to uniformly collect and process the particulate matter. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The present invention is further described below with reference to the accompanying drawings and embodiments:
[0017] Figure 1 This is a schematic structural diagram of a wafer thinning device according to the utility model;
[0018] Figure 2 This is a first cross-sectional schematic diagram of the workbench of the utility model;
[0019] Figure 3 This is a second cross-sectional schematic diagram of the workbench of the utility model;
[0020] Figure 4 This is a schematic diagram of the support platform of the utility model;
[0021] Figure 5 It is a schematic diagram of the arc plate of the utility model.
[0022] Figure numerals: 1. workbench; 2. mounting frame; 3. grinding device; 4. storage box; 5. conical collecting trough; 6. support table; 7. storage chamber; 8. through groove; 9. filter plate; 10. annular groove; 11. arc plate; 12. sliding groove; 13. displacement plate; 14. baffle; 15. cleaning plate; 16. L-shaped connecting rod; 17. support column; 18. driving groove; 19. motor; 20. L-shaped groove; 21. second filter plate; 22. transmission groove; 23. collecting groove; 24. collecting frame; 25. transmission pipe; 26. output pipe. DETAILED DESCRIPTION
[0023] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.
[0024] See also Figure 1-5 The utility model provides a technical solution: a wafer thinning device, comprising a workbench 1, a mounting frame 2 is fixedly connected to the upper surface of the workbench 1, a grinding device 3 is arranged on the mounting frame 2, a storage box 4 is fixedly connected to the upper surface of the mounting frame 2, a conical collecting groove 5 is provided on the upper surface of the workbench 1, a support platform 6 is rotatably connected to the bottom wall of the conical collecting groove 5, a storage cavity 7 is provided inside the workbench 1, the upper side of the storage cavity 7 extends into the interior of the support platform 6, a through groove 8 communicating with the interior of the storage cavity 7 is provided on the outer surface of the support platform 6, a filter plate 9 is fixedly connected to the inner wall of the through groove 8, an annular groove 10 is provided on the bottom wall of the conical collecting groove 5, a particle collecting component is provided on the inner wall of the annular groove 10, and when the wafer is being thinned. During the thinning work, the wafer is placed on the upper surface of the support table 6, and then the wafer is ground and thinned by means of the grinding device 3. During the thinning process, the wafer is cooled and lubricated with the help of the grinding fluid in the storage box 4. The used grinding fluid is collected through the conical collection groove 5, and the particulate matter will be blocked by the filter plate 9, while the grinding fluid will enter the storage cavity 7 through the through groove 8. After the grinding and thinning work is completed, the particles on the bottom wall of the conical collection groove 5 are cleaned and collected by the particle collection assembly. Through the above structure, not only can the grinding fluid be collected after use, but also the filtered particulate matter can be cleaned and collected, thereby avoiding the accumulation of particulate matter in the conical collection groove 5 and causing clogging of the filter plate 9.
[0025] Furthermore, the particle collection assembly includes an arc plate 11, which is fixedly connected to the inner wall of the annular groove 10, and the arc plate 11 is set to be semicircular. A sliding groove 12 is opened inside the arc plate 11, and a displacement plate 13 is slidably connected to the inner wall of the annular groove 10, and the displacement plate 13 is also set to be semicircular. A baffle 14 is fixedly connected to the upper surface of the arc plate 11, and a cleaning plate 15 is fixedly connected to the outer surface of the support platform 6. The lower surface of the cleaning plate 15 contacts the upper surface of the arc plate 11, and an L-shaped connecting rod 16 is fixedly connected to the upper surface of the displacement plate 13, and the other end of the L-shaped connecting rod 16 is fixedly connected to the outer surface of the support platform 6. The bottom wall of the storage chamber 7 is fixedly connected to a support column 17, and the upper surface of the support column 17 is in contact with the support The lower surface of the table 6 is rotatably connected, the upper surface of the support column 17 is provided with a driving groove 18, the bottom wall of the driving groove 18 is fixedly connected with a motor 19, the output end of the motor 19 is fixedly connected with the lower surface of the support table 6, the bottom wall of the annular groove 10 is arranged in an inclined shape, the bottom wall of the annular groove 10 is provided with an L-shaped groove 20, the L-shaped groove 20 is communicated with the interior of the storage cavity 7, the inner wall of the L-shaped groove 20 is fixedly connected with a second filter plate 21, the second filter plate 21 is arranged in an inclined shape, the inner wall of the L-shaped groove 20 is provided with a transmission groove 22, the interior of the workbench 1 is provided with a collection groove 23, the transmission groove 22 is communicated with the interior of the collection groove 23, the interior of the collection groove 23 is slidably connected with a collection frame 24, and the front side surface of the collection frame 24 slides through the workbench 1, a pump body is arranged inside the storage box 4, a transmission pipe 25 is arranged inside the storage chamber 7, the other end of the transmission pipe 25 penetrates into the storage box 4, the output end of the pump body is fixedly connected with an output pipe 26, the other end of the output pipe 26 extends out of the storage box 4, when collecting particles, the motor 19 is used to synchronously drive the support platform 6 to rotate, when the support platform 6 rotates, it will synchronously drive the cleaning plate 15 to rotate, when the cleaning plate 15 rotates, it pushes the particles on the arc plate 11 to move, and at the same time, the support platform 6 will also drive the displacement plate 13 to move through the L-shaped connecting rod 16, after the displacement plate 13 moves, it gradually enters the interior of the sliding groove 12, and then opens the closure of the annular groove 10, and the displacement plate 13 moves after the displacement plate 13 is equipped with The baffle plate 14 pushes down the particles on its upper surface, and the cleaning plate 15 pushes down the particles on the arc plate 11. The pushed down particles enter the interior of the L-shaped groove 20, and are filtered by the second filter plate 21. The residual grinding liquid will pass through the L-shaped groove 20 into the interior of the storage chamber 7, and the particles will enter the interior of the collecting groove 23 through the transmission groove 22, and be collected by the collecting frame 24. The grinding liquid in the storage chamber 7 will be re-transported to the interior of the storage box 4 through the transmission pipe 25, and the grinding liquid will be re-ejected through the pump body and the output pipe 26. Through the above structure, the particles can be collected again to further eliminate the internal grinding liquid, and the collection frame 24 is used to facilitate the staff to uniformly collect and process the particles.
[0026] Working principle: When thinning the wafer, the wafer is placed on the upper surface of the support table 6, and then the wafer is ground and thinned by means of the grinding device 3. During the thinning process, the wafer is cooled and lubricated by means of the grinding fluid in the storage box 4. The used grinding fluid is collected through the conical collection groove 5, and the particles will be blocked by the filter plate 9, while the grinding fluid will enter the storage cavity 7 through the through groove 8. After the grinding and thinning work is completed, the particles on the bottom wall of the conical collection groove 5 are cleaned and collected by the particle collection assembly. When the particles are collected, the support table 6 is synchronously driven to rotate by the motor 19. When the support table 6 rotates, it will synchronously drive the cleaning plate 15 to rotate. When the cleaning plate 15 rotates, it pushes the particles on the arc plate 11 to move. At the same time, the support platform 6 will also drive the displacement plate 13 to move through the L-shaped connecting rod 16. After the displacement plate 13 moves, it gradually enters the interior of the sliding groove 12, and then opens the closure of the annular groove 10. After the displacement plate 13 moves, it cooperates with the baffle 14 to push down the particles on its upper surface. At the same time, the cleaning plate 15 pushes down the particles on the arc plate 11, and the pushed particles enter the interior of the L-shaped groove 20. After being filtered by the second filter plate 21, the residual grinding liquid will pass through the L-shaped groove 20 into the interior of the storage chamber 7, and the particles will enter the interior of the collecting groove 23 through the transmission groove 22, and will be collected by the collecting frame 24. The grinding liquid in the storage chamber 7 will be re-transported to the interior of the storage box 4 through the transmission pipe 25, and the grinding liquid will be re-sprayed out through the pump body and the output pipe 26.
[0027] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.
Claims
1. A wafer thinning device, comprising a workbench (1), characterized in that: The upper surface of the workbench (1) is fixedly connected to a mounting frame (2), a grinding device (3) is arranged on the mounting frame (2), a storage box (4) is fixedly connected to the upper surface of the mounting frame (2), a conical collecting trough (5) is provided on the upper surface of the workbench (1), a support platform (6) is rotatably connected to the bottom wall of the conical collecting trough (5), a storage cavity (7) is provided inside the workbench (1), the upper side of the storage cavity (7) extends into the interior of the support platform (6), a through groove (8) communicating with the interior of the storage cavity (7) is provided on the outer surface of the support platform (6), a filter plate (9) is fixedly connected to the inner wall of the through groove (8), an annular groove (10) is provided on the bottom wall of the conical collecting trough (5), and a particle collection assembly is provided on the inner wall of the annular groove (10).
2. A wafer thinning device according to claim 1, characterized in that: The particle collection assembly comprises an arc plate (11), wherein the arc plate (11) is fixedly connected to the inner wall of the annular groove (10), the arc plate (11) is arranged in a semicircular shape, a sliding groove (12) is provided inside the arc plate (11), a displacement plate (13) is slidably connected to the inner wall of the annular groove (10), and the displacement plate (13) is also arranged in a semicircular shape, a baffle (14) is fixedly connected to the upper surface of the arc plate (11), and a cleaning plate (15) is fixedly connected to the outer surface of the support platform (6), and the lower surface of the cleaning plate (15) is in contact with the upper surface of the arc plate (11).
3. A wafer thinning device according to claim 2, characterized in that: The upper surface of the displacement plate (13) is fixedly connected to an L-shaped connecting rod (16), the other end of the L-shaped connecting rod (16) is fixedly connected to the outer surface of the support platform (6), the bottom wall of the storage cavity (7) is fixedly connected to a supporting column (17), the upper surface of the supporting column (17) is rotatably connected to the lower surface of the support platform (6), and the upper surface of the supporting column (17) is provided with a driving groove (18).
4. A wafer thinning device according to claim 3, characterized in that: A motor (19) is fixedly connected to the bottom wall of the driving groove (18), and an output end of the motor (19) is fixedly connected to the lower surface of the support platform (6). The bottom wall of the annular groove (10) is arranged in an inclined shape, and an L-shaped groove (20) is provided on the bottom wall of the annular groove (10).
5. A wafer thinning device according to claim 4, characterized in that: The L-shaped groove (20) is communicated with the interior of the storage cavity (7); a second filter plate (21) is fixedly connected to the inner wall of the L-shaped groove (20); the second filter plate (21) is arranged in an inclined shape; and a transmission groove (22) is provided on the inner wall of the L-shaped groove (20).
6. A wafer thinning device according to claim 5, characterized in that: A collecting groove (23) is provided inside the workbench (1), the transmission groove (22) is communicated with the inside of the collecting groove (23), a collecting frame (24) is slidably connected inside the collecting groove (23), and the front side surface of the collecting frame (24) slides through the front side surface of the workbench (1).
7. The wafer thinning device according to claim 1, characterized in that: A pump body is arranged inside the storage box (4), and a transmission pipe (25) is arranged inside the storage chamber (7).
8. A wafer thinning device according to claim 7, characterized in that: The other end of the transmission pipe (25) penetrates into the interior of the storage box (4), and the output end of the pump body is fixedly connected to an output pipe (26), and the other end of the output pipe (26) extends out of the storage box (4).