Pin side surface excessive glue cutting device

Abstract

The utility model discloses a pin side surface excessive glue cutting device, which is characterized in that a lower die is provided with a supporting table surface for supporting a pin, an upper die comprises a first plate, a second plate and a third plate, and a cutter stroke limiting piece is used for adjusting the distance between the second plate and the third plate; the upper die cutter assembly is arranged on the second plate, and when the first plate is stressed and pressed downwards, the upper die cutter assembly is driven to cut off overflowing glue on the side face of the lower pin. When the tool stroke limiting piece is pressed downwards under stress, the third plate is driven to move downwards, and the upper die tool assembly retracts. And the supporting table of the lower die is arranged, so that the pins can be supported, and deformation of the pins during cutting is prevented.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor chip packaging, and in particular relates to a device for removing glue overflow from the side of a pin. Background Art

[0002] The statements in this section merely provide background art related to the present disclosure and do not necessarily constitute prior art.

[0003] For integrated circuit packaging, such as SOT packaging with external pins, when the gap between the plastic mold and the pin is too large, the gap between the plastic mold and the pin will be filled with plastic molding material, also known as pin side glue overflow. Once the pin side glue overflow occurs, the subsequent electroplating and pin molding will have a poor appearance, thus affecting the SMT quality of the packaged product.

[0004] However, when the existing cutting device is used to cut the overflow glue on the side of the pin, there are problems such as the overflow glue on the side of the pin is not removed cleanly, or it is easy to cause damage or deformation of the pin. Utility Model Content

[0005] In order to solve the above problems, the utility model proposes a pin side glue overflow cutting device, which can cut the pin side glue overflow more thoroughly and prevent the pin from being deformed during cutting by supporting the pin.

[0006] According to some embodiments, the utility model adopts the following technical solutions: a device for cutting off glue overflow on the side of a pin, comprising: an upper mold, a lower mold, a tool travel limiter and an upper mold tool assembly; the lower mold is provided with a support table for supporting the pin; the upper mold comprises a first plate, a second plate and a third plate, the tool travel limiter penetrates the first plate and the second plate, and is fixed on the third plate, for adjusting the distance between the second plate and the third plate, the upper mold tool assembly is fixed on the first plate, when the first plate is pressed downward by force, the upper mold tool of the upper mold tool assembly is driven downward to cut off the glue overflow on the side of the pin; when the tool travel limiter is pressed downward by force, the third plate is driven downward to realize the retraction of the upper mold tool assembly.

[0007] In addition, a pin side overflow glue removal device according to an embodiment of the utility model may also have the following additional technical features:

[0008] Preferably, the tool travel limiter includes a pull rod base and a pull rod, the pull rod base is arranged in a first groove on the upper end surface of the first plate, the pull rod and the pull rod base are fixed to the third plate by bolts, and the pull rod is arranged through the second plate.

[0009] Preferably, the lower end surface of the pull rod abuts against the upper end surface of the third plate.

[0010] Preferably, the upper die tool assembly includes a tool cover plate, a tool fixing block, an upper die tool and a tool guide, the tool cover plate is fixedly connected to the tool fixing block, the upper die tool is fixed in the tool fixing block, and the tool guide is arranged below the third plate.

[0011] Preferably, guide sleeves and guide posts for limiting position are provided on the upper mold and the lower mold, and the guide sleeves and the guide posts are used to limit the relative horizontal movement between the upper mold and the lower mold.

[0012] Preferably, it further comprises an upper limit post, wherein the upper limit post is fixed on the third plate, and the upper end surface of the upper limit is higher than the upper end surface of the third plate.

[0013] Preferably, the lower mold includes a fourth plate and a fifth plate, and a lower mold tool arranged on the fourth plate, the upper mold tool includes a plurality of protrusions, and the lower mold tool includes a plurality of second grooves that cooperate with the protrusions of the upper mold tool.

[0014] Preferably, it further comprises a lower limit column, wherein the lower limit column is fixed on the fourth plate and the fifth plate, and the upper end surface of the lower limit column is higher than the upper end surface of the fourth plate.

[0015] Preferably, the tool travel limiter is fixed to the third plate by bolts.

[0016] Preferably, the pull rod base and the pull rod are connected by bolts.

[0017] Compared with the prior art, the beneficial effects of the utility model are:

[0018] The utility model provides a support table for supporting the pins on the lower mold, the upper mold includes a first plate, a second plate and a third plate, the tool travel limiter is used to adjust the distance between the second plate and the third plate, the upper mold tool assembly is arranged on the first plate, when the first plate is pressed downward by force, the upper mold tool is driven downward to cut off the overflow glue on the side of the pin; when the tool travel limiter is pressed downward by force, the third plate is driven downward to realize the retraction of the upper mold tool assembly; and the arrangement of the support table of the lower mold can support the pins and prevent the pins from being deformed during cutting. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0020] Figure 1 This is an exploded schematic diagram of the device for removing glue overflow from the side of the pin in the utility model;

[0021] Figure 2 It is a partial schematic diagram of the device for removing glue overflow from the side of the pin in the utility model;

[0022] Figure 3 This is a partial second schematic diagram of the device for removing glue overflow from the side of the pin in the utility model;

[0023] Figure 4 It is a partial schematic diagram of the device for removing glue overflow from the side of the pin in the utility model;

[0024] Description of reference numerals:

[0025] 1. Tool travel limit, 2. Upper limit column, 3. Tool fixing block, 4. Upper die tool, 5. Guide sleeve, 6. Guide column, 7. Tool guide, 8. Tool fixing block, 9. Lower die tool, 10. Lower limit column, 11. Pull rod base, 12. Pull rod, 13 Lower die tool, 14. First plate, 15. Second plate, 16. Third plate, 17. Fourth plate, 18. Fifth plate, 19. Tool cover. DETAILED DESCRIPTION

[0026] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0027] It should be noted that the following detailed descriptions are all exemplary and are intended to provide further explanation of the present invention. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present invention belongs.

[0028] In the present utility model, terms such as "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "side", "bottom" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are relational words determined only for the convenience of describing the structural relationships of the various parts or elements of the present utility model. They do not specifically refer to any part or element in the present utility model and cannot be understood as limitations on the present utility model. In the present utility model, terms such as "fixedly connected", "connected", "connected" and the like should be understood in a broad sense, indicating that they can be fixedly connected, integrally connected or detachably connected; they can be directly connected or indirectly connected through an intermediate medium. For relevant scientific research or technical personnel in this field, the specific meanings of the above terms in the present utility model can be determined according to specific circumstances, and they cannot be understood as limitations on the present utility model.

[0029] Embodiment 1

[0030] like Figure 1-Figure 4As shown, this embodiment provides a device for removing excess glue from the side of the pin, comprising: an upper mold, a lower mold, a tool travel limiter 1 and an upper mold tool assembly; the lower mold is provided with a support table for supporting the pin; the upper mold comprises a first plate 14, a second plate 15 and a third plate 16, the tool travel limiter 1 is provided on the first plate 14, for adjusting the distance between the second plate 15 and the third plate 16, the upper mold tool assembly is fixed on the first plate 14, when the first plate 14 is pressed downward, the upper mold tool is driven to remove the excess glue from the side of the pin; when the tool travel limiter 1 is pressed downward, the third plate is driven to move downward, thereby realizing the retraction of the upper mold tool.

[0031] In this embodiment, the tool travel limiter 1 includes a rod base 11 and a rod 12. The rod base 11 is arranged in a first groove on the upper end surface of the first plate 14. The rod 12 is assembled with the rod base 11 and passes through the second plate.

[0032] It can be understood that the tool travel limiter 1 and the first plate 14 can move relative to each other.

[0033] Specifically, the tie rod base 11 and the tie rod 12 are connected by bolts, and a first groove is provided on the first plate, the first groove is used to accommodate the tie rod base 11, and a tie rod 12 is installed below the tie rod base 11, the tie rod 12 is arranged to pass downward through the second plate, the lower end surface of the tie rod 12 is against the upper end surface of the third plate 16, and the bolts used to fix the tie rod base 11 and the tie rod 12 are fixed on the third plate 16.

[0034] In this embodiment, the upper die tool assembly includes a tool cover plate 19, a tool fixing block 8, a tool guide 7 and an upper die tool 4. The tool cover plate 19 and the tool fixing block 8 are placed in a receiving groove opened in the second plate 15, and the tool cover plate 19 is arranged above the tool fixing block 8; a boss is arranged at the upper end of the upper die tool 4, and a groove adapted to the boss of the upper die tool 4 is arranged on the tool fixing block 8; the tool fixing block 8, the tool cover plate 19, and the first plate 14 are fixed by bolts to prevent shaking.

[0035] The lower end of the upper die tool passes through the tool fixing block 8 , the third plate 16 and the tool guide 7 in sequence. The tool guide 7 is arranged in the lower groove of the third plate 16 .

[0036] In this embodiment, guide pillars 6 , guide sleeves 5 and limiting pillars are also included. The guide pillars 6 are arranged to penetrate the second plate 15 , the third plate 16 and the fourth plate 17 , and the guide sleeves 5 are located on the third plate 16 and the fourth plate 17 .

[0037] The guide sleeve 5 and the guide column 6 cooperate with each other to play a guiding role, which can accurately guide the upper mold into the lower mold and restrict the horizontal displacement of the mold.

[0038] Specifically, the limit column includes an upper limit column 2 and a lower limit column 10. The upper limit column 2 is fixed to the third plate 17 by bolts. The upper limit column 2 is higher than the upper end surface of the third plate 17, that is, the upper part of the upper limit column 2 is located in the gap between the lower end surface of the second plate 15 and the upper end surface of the third plate 17. The upper limit column 2 cooperates with the pull rod 12 to determine the stroke of the upper die tool 8. The upper limit column is used to control the extension length of the upper die tool 4 on the one hand, and to press the guide sleeve to prevent it from being ejected on the other hand.

[0039] Specifically, the lower limit column 10 is fixed to the fourth plate 17 and the fifth plate 18 by bolts, and is higher than the upper end surface of the fourth plate 17 in the vertical direction, that is, the upper part of the lower limit column 10 is located in the gap between the upper end surface of the fourth plate 17 and the lower end surface of the third plate 16. When closing the mold, the space required for the carrier plate can be reserved, and the cutting operation of carrier plates of different thicknesses can be handled by changing the length of the lower limit column 10.

[0040] Specifically, a lower die cutter 9 is provided on the fourth plate 17 , and the upper die cutter 4 cooperates with the lower die cutter 9 to achieve the purpose of cutting off the overflow glue on the side of the lead.

[0041] Specifically, the upper die cutter 4 has a plurality of protrusions, and the lower die cutter 9 has a second groove that matches with the upper die cutter 8 .

[0042] It can be understood that the upper end surface of the lower die tool is used to support the pin, and the pin is placed between the lower die tool and the lower end surface of the tool guide. The pin is placed on the upper end surface of the lower die tool 9, and the protrusion of the upper die tool 8 is aligned with one side of the pin, and the excess glue on the side of the pin is cut off by cutting downward. Due to the setting of the second groove of the lower die tool 9, the protrusion of the upper die tool 8 further limits its downward cutting and left and right movement, thereby preventing lateral displacement during cutting from causing damage to the pin, deformation, etc.

[0043] In this embodiment, in the initial state, the upper end surface of the pull rod base 11 and the end surface of the first plate 14 are flush. When a downward force is applied to the first plate 14, the pull rod base 11 will bounce upward. Since the first plate 14 is fixedly connected to the tool fixing block 8 and the tool cover plate 19, the first plate 14 drives the tool fixing block 8 and the tool cover plate 19 downward, thereby driving the upper mold tool 4 to move downward until the second plate 15 is pressed against the upper limit column. At this time, the upper mold tool 4 extends from the tool guide 7 at the bottom of the third plate 16 to cut off the overflow glue on the side of the pin; when the pull rod seat 11 is pressed downward, since the lower end surface of the pull rod 12 is pressed against the upper end surface of the third plate 16, the third plate 16 moves downward under the action of the pull rod 12, thereby realizing the retraction of the upper mold tool 4 back into the third plate 16, thereby controlling the upward movement of the upper mold tool 4, and repeating the above actions to achieve the cutting and retraction of the upper mold tool assembly.

[0044] Although the above describes the specific implementation methods of the utility model in combination with the accompanying drawings, it is not intended to limit the scope of protection of the utility model. Technical personnel in the relevant field should understand that on the basis of the technical solution of the utility model, various modifications or deformations that can be made by technical personnel in this field without creative work are still within the scope of protection of the utility model.

Claims

1. A device for removing glue overflow from the side of a pin, characterized in that: include: An upper mold, a lower mold, a tool travel limiter and an upper mold tool assembly; the lower mold is provided with a support platform for supporting the pin; the upper mold includes a first plate, a second plate and a third plate, the tool travel limiter penetrates the first plate and the second plate, and is fixed on the third plate to adjust the distance between the second plate and the third plate, the upper mold tool assembly is fixed on the first plate, when the first plate is pressed downward, the upper mold tool of the upper mold tool assembly is driven downward to cut off the overflow glue on the side of the pin; when the tool travel limiter is pressed downward, the third plate is driven downward to achieve the retraction of the upper mold tool assembly.

2. A device for removing excess glue from the side of a lead as claimed in claim 1, characterized in that: The tool travel limiter includes a pull rod base and a pull rod. The pull rod base is arranged in a first groove on the upper end surface of the first plate. The pull rod is connected to the pull rod base, and the pull rod passes through the second plate.

3. A device for removing glue overflow from the side of a lead as claimed in claim 2, characterized in that: The lower end surface of the pull rod abuts against the upper end surface of the third plate.

4. The device for removing glue overflow from the side of a lead as claimed in claim 1, characterized in that: The upper die tool assembly includes a tool cover plate, a tool fixing block, an upper die tool and a tool guide, the tool cover plate is fixedly connected to the tool fixing block, the upper die tool is fixed in the tool fixing block, and the tool guide is arranged below the third plate.

5. The device for removing glue overflow from the side of a lead as claimed in claim 1, characterized in that: Guide sleeves and guide posts for limiting position are arranged on the upper mold and the lower mold, and the guide sleeves and the guide posts are used to limit the relative horizontal movement between the upper mold and the lower mold.

6. The device for removing excess glue from the side of a lead as claimed in claim 1, characterized in that: It also includes an upper limit post and a lower limit post, wherein the upper limit post is fixed on the third plate, and the upper end surface of the upper limit post is higher than the upper end surface of the third plate.

7. The device for removing glue overflow from the side of a lead as claimed in claim 1, characterized in that: The lower mold includes a fourth plate and a fifth plate, and a lower mold tool disposed on the fourth plate, the upper mold tool includes a plurality of protrusions, and the lower mold tool includes a plurality of second grooves that cooperate with the protrusions of the upper mold tool.

8. A device for removing excess glue from the side of a lead as claimed in claim 7, characterized in that: It also includes a lower limit column, which is fixed on the fourth plate and the fifth plate, and the upper end surface of the lower limit column is higher than the upper end surface of the fourth plate.

9. The device for removing glue overflow from the side of a lead as claimed in claim 7, characterized in that: The end surface between the second grooves is used to support the pin.

10. The device for removing excess glue from the side of a lead as claimed in claim 2, characterized in that: The pull rod base and the pull rod are connected by bolts.

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