Gas reaction device for semiconductor production

Abstract

The utility model discloses a gas reaction device for semiconductor production, which relates to the technical field of semiconductors, and is characterized in that a gas injection mechanism of the device can inject gas into a reaction box by utilizing a plurality of gas injection nozzles which transversely move, so that the gas uniformly enters the reaction box, and the gas concentration in the reaction box is the same; the device is provided with two placing mechanisms, one placing mechanism with the semiconductor is taken out after the reaction is completed, and the placing mechanism with the semiconductor can be taken out after the reaction is completed, so that the production efficiency is improved, the reaction degree of the semiconductor is the same, and the yield of finished products is improved. According to the invention, one placing mechanism containing the unreacted semiconductor is placed in the reaction box, the other placing mechanism containing the unreacted semiconductor is placed in the reaction box, then the reacted semiconductor is taken down from the drawn-out placing mechanism, the unreacted semiconductor is placed on the placing mechanism, the semiconductor does not need to be taken down, the unreacted semiconductor is reinstalled and then the reaction is carried out, the consumed time is shortened, and the efficiency is improved. And meanwhile, the working efficiency of the device is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a gas reaction device for semiconductor production. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. In the process of semiconductor production, chemical vapor deposition is required to coat the surface of the semiconductor. This process requires the use of a gas reaction device to complete;

[0003] For example, the patent website discloses a gas reaction device for semiconductor production (publication number: CN218059197U). This device transports gas into the device through an air inlet pipe. After the gas enters the device, it floats to various areas in the device. However, the gas is not transported evenly, resulting in different gas contents in various areas of the device, which in turn leads to different degrees of reaction of various semiconductors. The reaction time in the area with low concentration is long, so it is necessary to wait until the reaction of the last semiconductor is completed before all semiconductors can be taken out, which leads to a long reaction time for the entire device and low device efficiency. Therefore, a person skilled in the art has proposed a gas reaction device for semiconductor production. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a gas reaction device for semiconductor production, which solves the problems in the above background.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a gas reaction device for semiconductor production, including a reaction box and two placement mechanisms, an injection mechanism is arranged above the interior of the reaction box, and a placement mechanism is arranged below the injection mechanism inside the reaction box, the injection mechanism includes a motor installed on the side of the reaction box and close to the top, the driving end of the motor extends into the reaction box and is equipped with a screw with an end rotatably connected to its inner wall, a threaded seat is arranged on the screw, a shunt pipe is fixedly installed on the lower surface of the threaded seat, a plurality of evenly distributed and downwardly facing injection nozzles are installed on the side of the shunt pipe, and a serpentine telescopic tube extending to the outside of the reaction box is also installed on the side of the shunt pipe.

[0006] As a further technical solution of the utility model, an opening is provided on the side of the reaction box near the bottom, and an air outlet pipe extending into the reaction box is installed on the side of the reaction box below the motor.

[0007] As a further technical solution of the utility model, the placement mechanism includes a movable seat adapted to the opening, and a plurality of evenly distributed placement grooves are provided on the surface of the movable seat. Two clamps are correspondingly arranged in each of the placement grooves, and a group of first springs with their ends fixedly connected to the inner wall of the placement groove are provided on the side of each of the clamps.

[0008] As a further technical solution of the utility model, two card slots are provided on the side of the reaction box corresponding to the opening port, and two cavities are provided inside the movable seat corresponding to one side of the placement slot, a limiting plate is provided in each of the cavities, and a card member matching the card slot is installed on the side of each of the limiting plates.

[0009] As a further technical solution of the utility model, a second spring is arranged in each of the cavities on the other side of the limit plate, a central groove is opened inside the movable seat between the two cavities, a rotating rod is rotatably installed in the central groove, and a pull rope extending into the central groove and fixedly connected to the rotating rod is installed at the center of the other side surface of each of the limit plates, one end of the rotating rod extends to the outside of the movable seat and is installed with a knob.

[0010] As a further technical solution of the utility model, a knob is installed on the side of the movable seat at one side of the pull rope.

[0011] Beneficial Effects

[0012] The utility model provides a gas reaction device for semiconductor production. Compared with the prior art, it has the following beneficial effects:

[0013] 1. A gas reaction device for semiconductor production. The gas injection mechanism of the device can use multiple laterally moving gas nozzles to inject gas into a reaction box, so that the gas enters the reaction box evenly, so that the gas concentration in the reaction box is the same, and then the reaction speed of each semiconductor is the fastest, which speeds up production efficiency. At the same time, the reaction degree of each semiconductor is the same, which improves the qualified rate of finished products.

[0014] 2. A gas reaction device for semiconductor production. The device is provided with two placing mechanisms. After the reaction of a placing mechanism with a semiconductor is completed, it is taken out, and the other placing mechanism with an unreacted semiconductor is placed in a reaction box. Then, the reacted semiconductor is taken out from the withdrawn placing mechanism and the unreacted semiconductor is replaced. There is no need to remove the semiconductor and then reinstall the unreacted semiconductor before reacting, which shortens the time consumed and also enhances the working efficiency of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the structure of a gas reaction device used in semiconductor production;

[0016] Figure 2 A schematic diagram of the structure of a gas reaction device for semiconductor production in a state where the placement mechanism is extracted;

[0017] Figure 3 A cross-sectional view of a gas reaction device for semiconductor production;

[0018] Figure 4 A cross-sectional view of a movable seat of a gas reaction device for semiconductor production;

[0019] Figure 5 The present invention is a schematic diagram of the structure of a uniform gas injection component of a gas reaction device used in semiconductor production.

[0020] In the figure: 1. reaction box; 2. motor; 3. screw; 4. threaded seat; 5. shunt pipe; 6. air nozzle; 7. air outlet pipe; 8. opening; 9. movable seat; 10. handle; 11. placement slot; 12. clamp; 13. first spring; 14. cavity; 15. limit plate; 16. second spring; 17. slot; 18. clamp; 19. center slot; 20. rotating rod; 21. pull rope; 22. knob; 23. serpentine telescopic tube. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5The utility model provides a technical solution of a gas reaction device for semiconductor production: a gas reaction device for semiconductor production, comprising a reaction box 1 and two placement mechanisms, an air jet mechanism is arranged above the interior of the reaction box 1, and a placement mechanism is arranged below the air jet mechanism inside the reaction box 1, the air jet mechanism comprises a motor 2 installed on the side of the reaction box 1 and close to the top, the driving end of the motor 2 extends into the reaction box 1 and is equipped with a screw 3 with an end rotatably connected to its inner wall, a threaded seat 4 is arranged on the screw 3, a shunt pipe 5 is fixedly installed on the lower surface of the threaded seat 4, a plurality of air jet nozzles 6 evenly distributed and facing downward are installed on the side of the shunt pipe 5, and a gas jet nozzle 6 evenly distributed and facing downward is installed on the side of the shunt pipe 5. There is a serpentine telescopic tube 23 extending to the outside of the reaction box 1, and an exhaust pipe 7 extending into the reaction box 1 is installed on the side of the reaction box 1 below the motor 2. When in use, gas is injected into the serpentine telescopic tube 23, and the gas enters the diversion tube 5 and is evenly sprayed out from each air nozzle 6 after diversion. At the same time, the motor 2 drives the screw 3 to rotate, and the rotating screw 3 drives the threaded seat 4 to move and drives the various air nozzles 6 thereon to move. When the threaded seat 4 reaches the end of the screw 3, the motor 2 drives the screw 3 to reverse and drives the threaded seat 4 to move in the opposite direction to make the threaded seat 4 reciprocate in the reaction box 1, and at the same time, each laterally moving air nozzle 6 sprays gas, so that the gas can evenly enter the reaction box 1.

[0023] See also Figure 1-4, an opening 8 is provided on the side of the reaction box 1 near the bottom, the placement mechanism includes a movable seat 9 adapted to the opening 8, a plurality of evenly distributed placement grooves 11 are provided on the surface of the movable seat 9, two splints 12 are provided in each placement groove 11, and a group of first springs 13 whose ends are fixedly connected to the inner wall of the placement groove 11 are provided on the side of each splint 12, two card slots 17 are provided on the side of the reaction box 1 at the end of the opening 8, two cavities 14 are provided on one side of the placement groove 11 in the interior of the movable seat 9, a limiting plate 15 is provided in each cavity 14, a card 18 adapted to the card slot 17 is installed on the side of each limiting plate 15, and a second spring 16 is provided on the other side of the limiting plate 15 in each cavity 14, a central groove 19 is provided between the two cavities 14 in the interior of the movable seat 9, a rotating rod 20 is rotatably installed in the central groove 19, and a spring 20 extending to the center of the other side of each limiting plate 15 is installed to rotate with the rotating rod 20 is fixedly connected to a pull rope 21, one end of the rotating rod 20 extends to the outside of the movable seat 9 and is installed with a knob 22, and a handle 10 is installed on the side of the movable seat 9 on one side of the knob 22. When in use, a semiconductor compatible with it is placed in each placement slot 11, and the two groups of first springs 13 in each placement slot 11 cooperate with the two clamps 12 to fix the semiconductor therein until all the placement slots 11 are filled with semiconductors, then the knob 22 is rotated to drive the rotating rod 20 to rotate, wrap the two pull ropes 21, and pull the two limit plates 15 to move. Each moving limit plate 15 compresses the second spring 16 and also drives the card 18 to enter the cavity 14, then the movable seat 9 is inserted into the reaction box 1 through the opening 8 until the two card members 18 are aligned with the two card slots 17, and the knob 22 is released to allow the two second springs 16 to rebound and drive the two limit plates 15 to restore their positions, thereby driving each card member 18 to be clamped into the corresponding card slot 17 to fix the movable seat 9.

[0024] Working principle of the utility model: the device prepares two placement mechanisms, and a semiconductor adapted to each placement slot 11 is placed. The two groups of first springs 13 in each placement slot 11 cooperate with the two clamping plates 12 to fix the semiconductor therein until all the placement slots 11 are filled with semiconductors. Then, the rotating knob 22 is rotated to drive the rotating rod 20 to rotate, and the two pull ropes 21 are wound to pull the two limit plates 15 to move. Each movable limit plate 15 compresses the second spring 16 and also drives the clamp 18 to enter the cavity 14. Then, the movable seat 9 is inserted into the reaction box 1 through the opening 8 until the two clamps 18 are aligned with the two clamping slots 17. The knob 22 is released to allow the two second springs 16 to rebound and drive the two limit plates 15 to restore their positions, thereby driving each clamp 18 to be clamped into the corresponding clamping slot 17 to fix the movable seat 9.

[0025] Then, gas is injected into the serpentine telescopic tube 23. After the gas enters the shunt tube 5, it is evenly ejected from each air nozzle 6 after being shunt. At the same time, the motor 2 runs to drive the screw 3 to rotate. The rotating screw 3 drives the threaded seat 4 to move and drives each air nozzle 6 thereon to move. When the threaded seat 4 reaches the end of the screw 3, the motor 2 drives the screw 3 to reverse and drive the threaded seat 4 to move in the opposite direction so that the threaded seat 4 makes a reciprocating motion in the reaction box 1. At the same time, each air nozzle 6 that moves laterally ejects gas, so that the gas can evenly enter the reaction box 1, and the gas concentration in the reaction box 1 is the same, so that the reaction speed of each semiconductor in the reaction box 1 is the same, and the yield rate of the semiconductor is guaranteed;

[0026] At the same time, when the semiconductor reacts in the reaction box 1, the staff can put the semiconductor into each placement slot 11 of another placement mechanism. After that, when the reaction in the reaction box 1 is completed, the knob 22 is rotated to allow each card member 18 to move out of the card slot 17 and into the cavity 14 through the above operation, and the fixation of the movable seat 9 is released. Then, the movable seat 9 is pulled out, and the placement mechanism with the semiconductor previously placed is inserted into the reaction box 1 to continue the reaction. After that, the staff removes the reacted semiconductor on the pulled out movable seat 9, and replaces the unreacted semiconductor, and repeats the above operation to achieve continuous work.

Claims

1. A gas reaction device for semiconductor production, characterized in that: The invention comprises a reaction box (1) and two placement mechanisms, wherein an air jet mechanism is arranged above the interior of the reaction box (1), and a placement mechanism is arranged below the air jet mechanism inside the reaction box (1), wherein the air jet mechanism comprises a motor (2) installed on the side of the reaction box (1) and close to the top, wherein the driving end of the motor (2) extends into the reaction box (1) and is provided with a screw (3) whose end is rotatably connected to the inner wall thereof, wherein a threaded seat (4) is arranged on the screw (3), wherein a shunt pipe (5) is fixedly installed on the lower surface of the threaded seat (4), wherein a plurality of air jet nozzles (6) evenly distributed and facing downward are installed on the side of the shunt pipe (5), and a serpentine telescopic pipe (23) extending to the outside of the reaction box (1) is also installed on the side of the shunt pipe (5).

2. A gas reaction device for semiconductor production according to claim 1, characterized in that: An opening (8) is provided on the side of the reaction box (1) near the bottom, and an air outlet pipe (7) extending into the reaction box (1) is installed on the side of the reaction box (1) below the motor (2).

3. A gas reaction device for semiconductor production according to claim 2, characterized in that: The placement mechanism comprises a movable seat (9) adapted to the opening (8); a surface of the movable seat (9) is provided with a plurality of evenly distributed placement grooves (11); two clamping plates (12) are correspondingly arranged in each of the placement grooves (11); and a group of first springs (13) whose ends are fixedly connected to the inner wall of the placement groove (11) are arranged on the side surface of each of the clamping plates (12).

4. A gas reaction device for semiconductor production according to claim 3, characterized in that: The side of the reaction box (1) is provided with two slots (17) corresponding to the port of the opening (8), and the inside of the movable seat (9) is provided with two cavities (14) corresponding to one side of the placement slot (11), each of the cavities (14) is provided with a limit plate (15), and the side of each limit plate (15) is provided with a clamping member (18) adapted to the slot (17).

5. A gas reaction device for semiconductor production according to claim 4, characterized in that: A second spring (16) is arranged in each of the cavities (14) on the other side of the limiting plate (15); a central groove (19) is opened inside the movable seat (9) between the two cavities (14); a rotating rod (20) is rotatably installed in the central groove (19); a pull rope (21) extending into the central groove (19) and fixedly connected to the rotating rod (20) is installed at the center of the other side surface of each of the limiting plates (15); one end of the rotating rod (20) extends to the outside of the movable seat (9) and is installed with a knob (22).

6. A gas reaction device for semiconductor production according to claim 5, characterized in that: A handle (10) is installed on the side of the movable seat (9) at one side of the knob (22).

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