Wafer dispensing device and dispensing system

Abstract

The utility model belongs to the technical field of dispensing machines, and relates to a wafer dispensing device and a dispensing system.The wafer dispensing device comprises a material carrying mechanism, a wafer loading mechanism, a dispensing mechanism, an alignment cooling mechanism and a preheating mechanism, and the wafer loading mechanism, the dispensing mechanism, the alignment cooling mechanism and the preheating mechanism are distributed on the periphery of the material carrying mechanism; the material carrying mechanism comprises a mechanical arm, the mechanical arm can horizontally rotate, ascend and descend and horizontally move, the alignment cooling mechanism and the dispensing mechanism are arranged adjacently, and the alignment cooling mechanism comprises a cooling assembly and an alignment assembly which are arranged at an interval. The wafer dispensing device provided by the utility model is compact in structure, the route of the material carrying mechanism is short, and the utilization rate of the material carrying mechanism and the dispensing efficiency of the dispensing device can be effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of glue dispensing machines, and more specifically, to a wafer glue dispensing device and a glue dispensing system. Background Art

[0002] Wafer dispensing device is an important equipment in semiconductor packaging process, which is mainly used for dispensing on wafers. Dispensing operation generally includes multiple steps such as loading, preheating, positioning, dispensing, and wafer removal. However, in the prior art, the structure of wafer dispensing device is unreasonable, the movement path of the manipulator used to transport wafers is long, and the other mechanisms of wafer dispensing device are idle for a long time before the current process is completed, resulting in low dispensing efficiency. Utility Model Content

[0003] The technical problem to be solved by the embodiments of the present application is: in the prior art, the wafer dispensing device has problems such as unreasonable structural setting, long idle time of each mechanism, low dispensing efficiency, etc.

[0004] In order to solve the above technical problems, the embodiment of the present application provides a wafer dispensing device, which adopts the following technical solution:

[0005] A wafer dispensing device comprises: a material handling mechanism, a wafer loading mechanism, a dispensing mechanism, an alignment cooling mechanism and a preheating mechanism, wherein the wafer loading mechanism, the dispensing mechanism, the alignment cooling mechanism and the preheating mechanism are distributed on the periphery of the material handling mechanism;

[0006] The material handling mechanism comprises a first drive assembly, an X-axis track, a second drive assembly and a manipulator, wherein the second drive assembly and the manipulator are arranged on the X-axis track, the first drive assembly is used to drive the second drive assembly and the manipulator to move along the X-axis track, and the second drive assembly is used to drive the manipulator to perform lifting and lowering motion and horizontal rotation;

[0007] The alignment cooling mechanism is arranged adjacent to the glue dispensing mechanism, and the alignment cooling mechanism comprises a cooling component and an alignment component which are arranged at intervals, and a partition is arranged between the cooling component and the alignment component.

[0008] Furthermore, the cooling assembly is arranged on the upper side of the alignment assembly, a cooling station is arranged on the side of the partition facing the cooling assembly, and a heat dissipation fan is arranged above the cooling station;

[0009] The alignment component includes an alignment device and an image recognition device, which are arranged adjacent to each other. The alignment device aligns the wafer transported by the robot assembly to adjust the position of the wafer, and the image recognition device is used to identify the wafer.

[0010] Further, the second driving assembly includes a lifting assembly and a rotating driving assembly, and the manipulator includes a first manipulator and a second manipulator;

[0011] The first manipulator and the second manipulator are arranged on the lifting assembly, and the lifting assembly is used to drive the first manipulator and the second manipulator to perform lifting motion;

[0012] The rotary drive assembly includes an outer cover, a first rotary drive member and a second rotary drive member. The outer cover is arranged on the top of the lifting assembly. The first rotary drive member and the second rotary drive member are arranged in the outer cover. The first rotary drive member is used to drive the first manipulator to rotate horizontally around the outer cover. The second rotary drive member is used to drive the second manipulator to rotate horizontally around the outer cover.

[0013] Further, the first manipulator includes a first manipulator arm and a first clamping claw, one end of the first manipulator arm is connected to the first rotating driving member, the other end of the first manipulator arm is connected to the first clamping claw, a first fork is provided at the end of the first clamping claw, and a first adsorption hole is provided on the first fork;

[0014] The second manipulator includes a second manipulator arm and a second clamp, one end of the second manipulator arm is connected to the second rotating drive member, the other end of the second manipulator arm is connected to the second clamp, a second fork is provided at the end of the second clamp, and a second adsorption hole is provided on the second fork.

[0015] Further, the dispensing mechanism includes a frame, a dispensing head, an X-axis driving unit, a Y-axis driving unit and a Z-axis driving unit, the frame is used to provide support for the dispensing mechanism, the Y-axis driving unit is arranged on the frame, the X-axis driving unit is arranged on the Y-axis driving unit, the Z-axis driving unit is arranged on the X-axis driving unit, and the dispensing head is arranged on the Z-axis driving unit;

[0016] The dispensing head includes a position calibration component, which includes a distance measuring component and an image recognition component. The distance measuring component and the image recognition component are arranged on the Z-axis driving part. The image recognition component includes a light source and a camera arranged adjacently, and the distance measuring component is arranged next to the light source.

[0017] Furthermore, the glue dispensing head also includes a glue dispensing cylinder, a glue valve and a glue heating component. The glue valve and the glue heating component are both arranged adjacent to the glue dispensing cylinder. A glue delivery channel is provided in the glue dispensing cylinder, and the glue valve is used to control the opening or closing of the glue delivery channel.

[0018] Furthermore, the glue dispensing cylinder includes a cylinder body and a nozzle connected to each other, the glue cylinder and the nozzle surround the glue delivery channel, and the glue heating assembly includes a first heating element and a second heating element, the first heating element is arranged adjacent to the cylinder body, and the second heating element is arranged adjacent to the nozzle.

[0019] Furthermore, the glue dispensing mechanism also includes a glue cleaning component and a weighing component, and the glue cleaning component and the weighing component are arranged beside the Y-axis driving part.

[0020] Furthermore, the preheating mechanism and the counter-cooling mechanism are symmetrically distributed on both sides of the X-axis track, the preheating mechanism includes a base, a heater and a lifting assembly, the heater and the lifting assembly are fixed on the base, a heating surface is formed on the upper surface of the heater, and a vacuum adsorption groove is provided on the heating surface;

[0021] The lifting assembly includes a support column and a position sensor. A positioning portion is provided on the support column. The support column can perform lifting and lowering movements relative to the heating surface.

[0022] In order to solve the above technical problems, the present application also provides a dispensing system, which adopts the following technical solution:

[0023] A glue dispensing system comprises the wafer glue dispensing device as described above.

[0024] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0025] (1) The technical solution provided in the present application can shorten the working route of the material handling mechanism and save the handling time by distributing the wafer loading mechanism, the glue dispensing mechanism, the alignment cooling mechanism and the preheating mechanism on the periphery of the material handling mechanism.

[0026] (2) The alignment cooling mechanism includes cooling components and alignment components that are spaced apart. When the wafer is being glued, the material handling mechanism can move other wafers to the corresponding preheating mechanism and alignment components for preheating and alignment. When the glue dispensing of the wafer is completed, the material handling mechanism will move the glued wafer to the cooling component for cooling and solidification. While waiting for the wafer to cool, the material handling mechanism can move the preheated and positioned wafer to the glue dispensing mechanism for glue dispensing. The idle time of each mechanism is short and the glue dispensing efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the solutions in the present application or the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0028] Figure 1 It is a top view of the wafer dispensing device provided by an embodiment of the utility model;

[0029] Figure 2 It is a schematic diagram of the three-dimensional structure of the wafer dispensing device provided by an embodiment of the utility model;

[0030] Figure 3 It is a three-dimensional structural schematic diagram of the counter-cooling mechanism provided by an embodiment of the utility model;

[0031] Figure 4 It is a three-dimensional structural schematic diagram of a material handling mechanism provided by an embodiment of the utility model;

[0032] Figure 5 It is a three-dimensional structural schematic diagram of the dispensing mechanism provided in the embodiment of the utility model;

[0033] Figure 6 It is a three-dimensional structural schematic diagram of a dispensing head provided by an embodiment of the utility model;

[0034] Figure 7 It is a three-dimensional structural schematic diagram of the preheating mechanism provided in the embodiment of the utility model;

[0035] Figure 8 It is a partial schematic diagram of the preheating mechanism provided in the embodiment of the utility model.

[0036] Reference numerals:

[0037] 100. Wafer dispensing device; 1. Material handling mechanism; 11. Outer cover; 12. X-axis track; 13. First manipulator; 131. First manipulator arm; 132. First gripper; 1321. First fork; 14. Second manipulator; 141. Second manipulator arm; 142. Second gripper; 1421. Second fork; 15. Second drive assembly; 2. Wafer loading mechanism; 3. Dispensing mechanism; 31. Dispensing head; 311. Image recognition assembly; 3112. Light source; 3113. Camera; 312. Dispensing cylinder; 3121. Cylinder; 3122. Nozzle; 313. Glue valve; 3142. First 2. Heating element; 32. X-axis driving unit; 33. Y-axis driving unit; 34. Z-axis driving unit; 35. Weighing assembly; 351. Electronic scale; 352. Buffer pad; 36. Glue cleaning assembly; 361. Glue wiping unit; 362. Glue suction unit; 37. Rack; 4. Alignment cooling mechanism; 41. Cooling assembly; 411. Cooling station; 412. Fixing element; 42. Alignment assembly; 421. Alignment device; 422. Image recognition device; 43. Partition; 5. Preheating mechanism; 51. Base; 52. Heating surface; 53. Support column; 531. Positioning unit; 54. Position sensor; 55. Positive air adsorption tank. DETAILED DESCRIPTION

[0038] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0039] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0040] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings.

[0041] Combine the following Figures 1 to 8 , describing an embodiment of the utility model.

[0042] Please refer to Figure 1 to Figure 3 As shown, the wafer dispensing device 100 of the present application includes: a material handling mechanism 1, a wafer loading mechanism 2, a dispensing mechanism 3, an alignment cooling mechanism 4 and a preheating mechanism 5. Specifically, the X-axis track 12 is a straight track extending in the front-to-back direction, the preheating mechanism 5 and the alignment cooling mechanism 4 are symmetrically distributed on both sides of the X-axis track 12, the wafer loading mechanism 2 is arranged at the front end of the X-axis track 12, the preheating mechanism 5 and the alignment cooling mechanism 4 are symmetrically distributed on the left and right sides of the X-axis track 12, the dispensing mechanism 3 and the alignment cooling mechanism 4 are located on the same side of the X-axis track 12, and the dispensing mechanism 3 and the alignment cooling mechanism 4 are arranged adjacent to each other. The number of the dispensing mechanisms 3 is not limited, and the dispensing mechanisms 3 can be one or more. Preferably, there are two dispensing mechanisms 3, and the two dispensing mechanisms 3 are symmetrically distributed on the left and right sides of the X-axis track 12. In this embodiment, the wafer needs to go through multiple processes such as out of the warehouse, preheating, alignment, glue dispensing, cooling, alignment, and warehouse entry in sequence. The material handling mechanism 1 is used to transport the wafers to various mechanisms for processing. The wafer loading mechanism 2, glue dispensing mechanism 3, alignment cooling mechanism 4 and preheating mechanism 5 are distributed on the periphery of the material handling mechanism 1, which can shorten the transportation distance from the material handling mechanism 1 to each mechanism, thereby saving the transportation time of the wafer.

[0043] Furthermore, the material handling mechanism 1 includes a first drive component (not shown in the figure) and an X-axis track 12, a second drive component 15, a first manipulator 13 and a second manipulator 14. The first drive component is used to drive the second drive component 15, the first manipulator 13 and the second manipulator 14 to move along the X-axis track 12, and the second drive component 15 is used to drive the first manipulator 13 and the second manipulator 14 to perform lifting and lowering movements and horizontal rotation.

[0044] In one embodiment, the various process steps of the wafer dispensing device 100 are as follows:

[0045] S1: The material handling mechanism 1 moves to the wafer loading mechanism 2 to take the wafer out of the warehouse, and the first manipulator 13 and the second manipulator 14 take out the first wafer and the second wafer respectively;

[0046] S2: The material handling mechanism 1 moves to the preheating mechanism 5, and places the first wafer in the preheating mechanism 5 for preheating;

[0047] S3: After the preheating of the first wafer is completed, the first robot 13 rotates horizontally in situ to transport the preheated first wafer to the opposite alignment assembly 42 for wafer alignment, and at the same time, the second robot 14 places the second wafer on the preheating mechanism 5 for preheating;

[0048] S4: After the first wafer is aligned, the material handling mechanism 1 moves to the glue dispensing mechanism 3, and the first manipulator 13 transports the first wafer to the glue dispensing mechanism 3 for glue dispensing;

[0049] S5: After the dispensing of the first wafer is completed, the first robot 13 moves the first wafer to the cooling assembly 41 for cooling and curing, and at the same time, the second robot 14 rotates horizontally in situ to move the preheated second wafer to the alignment assembly 42 for wafer alignment;

[0050] S6: After the alignment of the second wafer is completed, the second manipulator 14 transports the second wafer to the glue dispensing mechanism 3 for glue dispensing. During the glue dispensing of the second wafer, the material handling mechanism 1 moves to the cooling component 41 to transport the first wafer that has completed cooling and solidification to the alignment component 42 for alignment. After the alignment of the first wafer is completed, the first wafer is transported back to the wafer loading mechanism 2 for storage;

[0051] S6: After the first wafer enters the warehouse, the material handling mechanism 1 moves to the glue dispenser and transports the second wafer after glue dispensing to the cooling assembly 41 for cooling and curing;

[0052] S7: After the second wafer is cooled and solidified, the material handling mechanism 1 transports the second wafer to the alignment component 42 for alignment. After the alignment of the second wafer is completed, the material handling mechanism 1 transports the second wafer back to the wafer loading mechanism 2 for storage.

[0053] In this embodiment, the first robot 13 and the second robot 14 cooperate with each other to transport the two wafers to various mechanisms for processing, which can reduce the waiting time of each process and the idle time of each mechanism and improve the dispensing efficiency.

[0054] In a preferred embodiment, in step S6, while waiting for the second wafer to cool and solidify, steps S1 to S4 may be repeatedly executed to save and reduce the idle time of each mechanism and further improve the dispensing efficiency.

[0055] In this embodiment, the alignment cooling mechanism 4 is arranged adjacent to the dispensing mechanism 3, and the alignment cooling mechanism 4 includes a cooling component 41 and an alignment component 42 arranged at intervals in the vertical direction, and a partition 43 is provided between the cooling component 41 and the alignment component 42. Specifically, the partition 43 can prevent the cooling air in the cooling component 41 from blowing into the alignment component 42, thereby preventing the preheated wafer from being cooled.

[0056] In one embodiment, Figure 3As shown, the cooling assembly 41 is arranged on the upper side of the alignment assembly 42, a cooling station 411 is arranged on the side of the partition 43 facing the cooling assembly 41, and a cooling fan is arranged above the cooling station 411. Specifically, the partition 43 is a partition plate, a cooling station 411 is arranged on the side of the partition 43 facing the cooling assembly 41, a fixing member 412 for fixing the wafer is arranged on the cooling station 411, and a cooling fan is arranged above the cooling station 411, and the cooling fan is used to cool the wafer at the cooling station 411 to improve the curing efficiency of the glue on the wafer; in this embodiment, the type of the cooling fan is not limited, and preferably, the cooling fan is an ion cooling fan.

[0057] In this embodiment, the alignment component 42 includes an alignment device 421 and an image recognition device 422. The alignment device 421 and the image recognition device 422 are arranged adjacent to each other. The alignment device 421 aligns the wafer transported by the material handling mechanism 1 to adjust the position of the wafer. The image recognition device 422 is used to read the text or QR code on the wafer and can accurately identify the position and identity information of the wafer. Preferably, the image recognition device 422 is an OCR camera.

[0058] In one embodiment, Figure 4 As shown, the material handling mechanism 1 includes a first drive assembly (not shown in the figure), an X-axis track 12, a second drive assembly 15, a first manipulator 13 and a second manipulator 14, the second drive assembly 15, the first manipulator 13 and the second manipulator 14 are arranged on the X-axis track 12, and the first drive assembly is used to drive the second drive assembly 15, the first manipulator 13 and the second manipulator 14 to move along the X-axis track 12; the second drive assembly 15 includes a lifting assembly (not shown in the figure) and a rotation drive assembly, the first manipulator 13 and the second manipulator 14 are arranged on the lifting assembly, and the lifting assembly is used to drive the first manipulator 13 and the second manipulator 14 to perform lifting and lowering movements. In this embodiment, the power source type of the first drive assembly, the lifting assembly and the rotation drive assembly is not limited, and the power source of the first drive assembly, the lifting assembly and the rotation drive assembly can be a cylinder, a DD motor, a servo motor or other types of power sources.

[0059] Further, the rotary drive assembly includes an outer cover 11, a first rotary drive member (not shown in the figure) and a second rotary drive member (not shown in the figure), the outer cover 11 is arranged on the top of the lifting assembly, the first rotary drive member and the second rotary drive member are arranged in the outer cover 11, the first rotary drive member is used to drive the first manipulator 13 to rotate 360° around the outer cover 11, and the second rotary drive member is used to drive the second manipulator 14 to rotate 360° around the outer cover 11. The first manipulator 13 and the second manipulator 14 of this embodiment can move horizontally along the X-axis track 12, can also perform lifting and lowering movements in the vertical direction, and can also rotate 360° around the outer cover 11. In addition, the first manipulator 13 and the second manipulator 14 are separately controlled, and the first manipulator 13 and the second manipulator 14 are highly flexible.

[0060] In one embodiment, Figure 4 As shown, the first manipulator 13 includes a first manipulator arm 131 and a first clamp 132, one end of the first manipulator arm 131 is connected to the first rotating drive member, the other end of the first manipulator arm 131 is connected to the first clamp 132, a first fork 1321 is provided at the end of the first clamp 132, and a first adsorption hole (not shown in the figure) is provided on the first fork 1321; the second manipulator 14 includes a second manipulator arm 141 and a second clamp 142, one end of the second manipulator arm 141 is connected to the second rotating drive member, the other end of the second manipulator arm 141 is connected to the second clamp 142, a second fork 1421 is provided at the end of the second clamp 142, and a second adsorption hole (not shown in the figure) is provided on the second fork 1421.

[0061] In this embodiment, the first robot arm 131 and the second robot arm 141 are multi-axis robots, which can respectively drive the first clamp 132 and the second clamp 142 to change their positions to perform grasping operations; the first clamp 132 and the second clamp 142 respectively have a first fork 1321 and a second fork 1421, and the first fork 1321 and the second fork 1421 are both provided with adsorption holes, which are connected to the vacuum device. When grasping a wafer, the first fork 1321 or the second fork 1421 extends under the wafer and lifts the wafer, and the adsorption hole absorbs the wafer through the vacuum adsorption force to prevent displacement. Through the coordinated operation of the robot arm and the clamp, the wafer in the wafer loading mechanism 2 can be taken and placed layer by layer.

[0062] In one embodiment, Figure 5 and Figure 6As shown, the dispensing mechanism 3 includes a frame 37, a dispensing head 31, an X-axis driving unit 32, a Y-axis driving unit 33 and a Z-axis driving unit 34. The frame 37 is used to provide support for the dispensing mechanism 3. The frame 37 is formed by an integrated casting, and the frame 37 has a stable and reliable structure. The Y-axis driving unit 33 is arranged on the frame 37, the X-axis driving unit 32 is arranged on the Y-axis driving unit 33, the Z-axis driving unit 34 is arranged on the X-axis driving unit 32, and the dispensing head 31 is arranged on the Z-axis driving unit 34; the Y-axis driving unit 33 is used to drive the X-axis driving unit 32 to move along the Y-axis direction, the X-axis driving unit 32 is used to drive the Z-axis driving unit 34 to move along the X-axis direction, and the Z-axis driving unit 34 is used to drive the dispensing head 31 to move along the Z-axis direction. The dispensing head 31 can move in three directions of the X-axis, the Y-axis and the Z-axis, which can improve the flexibility of dispensing.

[0063] Furthermore, the Y-axis driving unit 33 includes a Y-axis slider (not shown in the figure), a Y-axis guide rail (not shown in the figure) and a Y-axis linear motor (not shown in the figure) for driving the Y-axis slider to slide along the Y-axis guide rail, and the X-axis driving unit 32 is arranged on the Y-axis slider; the X-axis driving unit 32 includes an X-axis slider (not shown in the figure), an X-axis guide rail (not shown in the figure) and an X-axis linear motor (not shown in the figure) for driving the X-axis slider to slide along the X-axis guide rail, and the Z-axis driving unit 34 is arranged on the X-axis slider; the Z-axis driving unit 34 includes a Z-axis slider (not shown in the figure), a Z-axis guide rail (not shown in the figure) and a Z-axis linear motor (not shown in the figure) for driving the Z-axis slider to slide along the Z-axis guide rail, and the dispensing head 31 is arranged on the Z-axis slider.

[0064] In one embodiment, Figure 6 As shown, the dispensing head 31 includes a position calibration component, which can correct the dispensing position before dispensing, improve production efficiency, and improve product quality. The position calibration component includes a distance measuring component (not shown in the figure) and an image recognition component 311. The distance measuring component and the image recognition component 311 are arranged on the Z-axis slider. The image recognition component 311 includes a light source 3112 and a camera 3113. The light source 3112 is fixed below the camera 3113. The distance measuring component is arranged beside the light source 3112. In this embodiment, the camera 3113 is a CCD camera, and the distance measuring component is a laser distance measuring sensor. Specifically, the light source 3112 is fixedly installed below the camera 3113. The light source 3112 provides a stable and reliable lighting environment for the camera 3113, ensuring that the camera 3113 can capture clear and accurate images; the camera 3113 cooperates with the distance measuring component to identify the precise position of the product on the production line, and then combined with the software algorithm, the position of the dispensing, the amount of glue filling, and whether the position is correct can be accurately determined, thereby improving the accuracy and reliability of the dispensing position calibration.

[0065] In one embodiment, Figure 6As shown, the glue dispensing head 31 also includes a glue dispensing cylinder 312, a glue valve 313 and a glue heating assembly. The glue valve 313 and the glue heating assembly are both arranged adjacent to the glue dispensing cylinder 312. The glue dispensing cylinder 312 is provided with a glue feeding channel, and the glue valve 313 is used to control the opening or closing of the glue feeding channel. In this embodiment, the glue valve 313 adopts a high-precision piezoelectric injection valve, which can accurately control the opening or closing of the glue feeding channel; the glue cylinder is connected to an external glue feeding mechanism (not shown in the figure) through a pipeline.

[0066] In one embodiment, Figure 6 As shown, the glue dispensing cylinder 312 includes a cylinder 3121 connected to each other and a nozzle 3122 arranged below the cylinder 3121. The cylinder 3121 and the nozzle 3122 surround a glue delivery channel. The glue heating assembly includes a first heating element (not shown in the figure) and a second heating element 3142. The first heating element is arranged adjacent to the cylinder 3121 to heat the glue in the cylinder 3121, and the second heating element 3142 is arranged adjacent to the nozzle 3122 to heat the glue in the nozzle 3122. In this embodiment, the first heating element is a constant temperature heating element, which is used to keep the temperature of the glue in the cylinder 3121 at a constant value, ensuring that the glue can melt and reach a fluidity and viscosity suitable for spraying, which helps to ensure the uniformity and consistency of glue dispensing and improve the accuracy and quality of glue dispensing; the second heating element 3142 is used to prevent the glue from solidifying or clogging inside the nozzle 3122, which helps to improve production efficiency, reduce maintenance costs, and ensure the stability of product quality.

[0067] In one embodiment, Figure 6 As shown, the glue dispensing mechanism 3 further includes a glue cleaning component 36 and a weighing component 35, and the glue cleaning component 36 and the weighing component 35 are arranged below the glue dispensing head 31. The weighing component 35 includes an electronic scale 351 and a buffer pad 352 arranged below the electronic scale 351. Before dispensing, the weighing component 35 is used to calibrate the glue dispensing amount of the glue dispensing head 31. The specific process is: weigh the glue flowing out of the glue dispensing head 31 within a certain period of time, calculate the glue flow rate of the glue dispensing head 31, so as to accurately control the glue dispensing amount on the product.

[0068] In this embodiment, the glue cleaning component 36 includes a glue erasing member 361 and a glue sucking member 362. The glue erasing member 361 is a glue erasing block, and is used to wipe the glue dispensing head 31 to erase the glue on the surface of the glue dispensing head 31; the glue sucking member 362 is a vacuum glue sucking member 362, and is used to suck glue from the glue dispensing head 31 to suck out the glue in the glue dispensing head 31. Before glue dispensing, the excess glue in the glue dispensing head 31 is discharged, and then the glue dispensing head 31 is moved to the glue erasing member 361 to erase the glue on the surface of the glue dispensing head 31. When it is necessary to remove the glue in the glue dispensing head 31, the glue dispensing head 31 is inserted into the glue sucking port on the glue sucking member 362, and the residual glue in the glue dispensing head 31 is sucked out by a vacuum device. Therefore, the glue cleaning component 36 can automatically clean the glue on the surface or inside of the glue dispensing head 31, thereby ensuring the quality of glue dispensing.

[0069] In one embodiment, Figure 7 and Figure 8 As shown, the preheating mechanism 5 includes a base 51, a heater (not shown in the figure) and a lifting assembly (not shown in the figure), the heater and the lifting assembly are fixed on the base 51, the upper surface of the heater is formed with a heating surface 52, and the heating surface 52 is provided with a vacuum adsorption groove 55; the lifting assembly includes a support column 53 and a position sensor 54, the support column 53 is provided with a positioning portion 531, and the support column 53 can move up and down relative to the heating surface 52. In this embodiment, when it is necessary to heat the wafer, the wafer is first placed on the positioning portion 531 of the support column 53 for preliminary fixation, the lifting assembly moves so that the support column 53 drives the wafer to descend to approach the heating surface 52, the vacuum adsorption groove 55 is used to adsorb and fix the wafer, and the heating surface 52 heats the wafer; when the heating is completed, the lifting assembly drives the support column 53 to rise so that the wafer is away from the heating surface 52, and the position sensor 54 is used to monitor the distance between the wafer and the heating surface 52.

[0070] According to an embodiment of the present invention, a dispensing system is also provided, including the wafer dispensing device 100 as described above.

[0071] In this embodiment, the wafer loading mechanism 2, the dispensing mechanism 3, the alignment cooling mechanism 4 and the preheating mechanism 5 of the dispensing system are distributed on the periphery of the material handling mechanism 1, which can shorten the working route between the material handling mechanism 1 and each mechanism and save the handling time; the first manipulator 13 and the second manipulator 14 cooperate with each other to transport the two wafers to each mechanism for processing, which can reduce the waiting time of each process and the idle time of each mechanism and improve the dispensing efficiency.

[0072] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A wafer dispensing device, characterized in that: include: A material handling mechanism, a wafer loading mechanism, a glue dispensing mechanism, an alignment cooling mechanism and a preheating mechanism, wherein the wafer loading mechanism, the glue dispensing mechanism, the alignment cooling mechanism and the preheating mechanism are distributed on the periphery of the material handling mechanism; The material handling mechanism comprises a first drive assembly, an X-axis track, a second drive assembly and a manipulator, wherein the second drive assembly and the manipulator are arranged on the X-axis track, the first drive assembly is used to drive the second drive assembly and the manipulator to move along the X-axis track, and the second drive assembly is used to drive the manipulator to perform lifting and lowering motion and horizontal rotation; The alignment cooling mechanism is arranged adjacent to the glue dispensing mechanism, and the alignment cooling mechanism comprises a cooling component and an alignment component which are arranged at intervals, and a partition is arranged between the cooling component and the alignment component.

2. The wafer dispensing device according to claim 1, characterized in that: The cooling assembly is arranged on the upper side of the alignment assembly, a cooling station is arranged on the side of the partition facing the cooling assembly, and a heat dissipation fan is arranged above the cooling station; The alignment component includes an alignment device and an image recognition device, which are arranged adjacent to each other. The alignment device aligns the wafers transported by the material handling mechanism to adjust the positions of the wafers, and the image recognition device is used to recognize the wafers.

3. The wafer dispensing device according to claim 1 or 2, characterized in that: The second driving assembly includes a lifting assembly and a rotating driving assembly, and the manipulator includes a first manipulator and a second manipulator; The first manipulator and the second manipulator are arranged on the lifting assembly, and the lifting assembly is used to drive the first manipulator and the second manipulator to perform lifting motion; The rotary drive assembly includes an outer cover, a first rotary drive member and a second rotary drive member. The outer cover is arranged on the top of the lifting assembly. The first rotary drive member and the second rotary drive member are arranged in the outer cover. The first rotary drive member is used to drive the first manipulator to rotate horizontally around the outer cover. The second rotary drive member is used to drive the second manipulator to rotate horizontally around the outer cover.

4. The wafer dispensing device according to claim 3, characterized in that: The first manipulator comprises a first mechanical arm and a first clamping claw, one end of the first mechanical arm is connected to the first rotating driving member, the other end of the first mechanical arm is connected to the first clamping claw, a first fork is provided at the end of the first clamping claw, and a first adsorption hole is provided on the first fork; The second manipulator includes a second manipulator arm and a second clamp, one end of the second manipulator arm is connected to the second rotating drive member, the other end of the second manipulator arm is connected to the second clamp, a second fork is provided at the end of the second clamp, and a second adsorption hole is provided on the second fork.

5. The wafer dispensing device according to claim 1 or 2, characterized in that: The dispensing mechanism comprises a frame, a dispensing head, an X-axis driving unit, a Y-axis driving unit and a Z-axis driving unit, wherein the frame provides support for the dispensing mechanism, the Y-axis driving unit is arranged on the frame, the X-axis driving unit is arranged on the Y-axis driving unit, the Z-axis driving unit is arranged on the X-axis driving unit, and the dispensing head is arranged on the Z-axis driving unit; The dispensing head includes a position calibration component, which includes a distance measuring component and an image recognition component. The distance measuring component and the image recognition component are arranged on the Z-axis driving part. The image recognition component includes a light source and a camera arranged adjacently, and the distance measuring component is arranged next to the light source.

6. The wafer dispensing device according to claim 5, characterized in that: The glue dispensing head also includes a glue dispensing cylinder, a glue valve and a glue heating component. The glue valve and the glue heating component are both arranged adjacent to the glue dispensing cylinder. A glue delivery channel is provided in the glue dispensing cylinder. The glue valve is used to control the opening or closing of the glue delivery channel.

7. The wafer dispensing device according to claim 6, characterized in that: The glue dispensing cylinder includes a cylinder body and a nozzle that are connected to each other, and the cylinder body and the nozzle surround the glue delivery channel. The glue heating component includes a first heating element and a second heating element. The first heating element is arranged adjacent to the cylinder body, and the second heating element is arranged adjacent to the nozzle.

8. The wafer dispensing device according to claim 7, characterized in that: The glue dispensing mechanism also includes a glue cleaning component and a weighing component, and the glue cleaning component and the weighing component are arranged beside the Y-axis driving part.

9. The wafer dispensing device according to claim 1 or 2, characterized in that: The preheating mechanism and the alignment cooling mechanism are symmetrically distributed on both sides of the X-axis track, the preheating mechanism comprises a base, a heater and a lifting assembly, the heater and the lifting assembly are fixed on the base, a heating surface is formed on the upper surface of the heater, and a vacuum adsorption groove is provided on the heating surface; The lifting assembly includes a support column and a position sensor. A positioning portion is provided on the support column. The support column can perform lifting and lowering movements relative to the heating surface.

10. A dispensing system, characterized in that: A wafer dispensing device comprising any one of claims 1 to 9.

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