Annealing equipment capable of uniformly heating wafer

Abstract

The utility model provides annealing equipment capable of uniformly heating wafers. Comprising support legs fixed at the upper bottom of a furnace body and a cabin door convenient for placing a wafer into the device, and the visual cabin door enables an operator to directly observe the real-time state of the wafer in the annealing process, discover any abnormal condition in time and take corresponding measures. An operating mechanism for conveniently controlling the device is mounted on the other side, close to the cabin door, of the front side of the furnace body, a rotating mechanism for rotating during heating to enable heating to be uniform is mounted in the furnace body, and more uniform heating can be achieved by rotating a wafer. The rear side of the furnace body is sealed through threaded connection of a mounting plate, a heating mechanism for heating a wafer is arranged in the heating bin, and a placement table with a ventilation opening can enable hot air to flow in a heating cavity, so that more uniform temperature distribution is realized, hot spots and cold spots are reduced, and the service life of the wafer is prolonged. And uniform heating of the wafer in the annealing process is ensured.

Description

Technical Field

[0001] The utility model belongs to the field of wafer processing technology, and in particular relates to an annealing device capable of uniformly heating a wafer. Background Art

[0002] In the semiconductor industry, wafers may have lattice defects during processing. Rapid annealing refers to heating the wafer to a certain high temperature in a short time and then performing annealing. This eliminates wafer defects and improves product quality. However, some existing annealing equipment fixes the heating rod inside and places the wafer inside for heating through a carrier. However, the temperature at the center position close to the heating rod is relatively high, and the temperature at a position far from the heating rod is relatively low, resulting in uneven heat distribution. This will cause the photoresist on the surface of the wafer to be heated unevenly and affected by different temperatures, resulting in poor uniformity of debonding, thereby affecting the yield of the processed product. At the same time, some annealing equipment performs annealing through a drawer-type insertion method, and the operator cannot directly observe the real-time status of the wafer during the annealing process, which may lead to the inability to timely discover and handle abnormal conditions in the process.

[0003] Chinese patent announcement number CN220491849U discloses a high-temperature temperature measuring device for rapid annealing of wafers, including a furnace body, a temperature measuring through hole is opened on the bottom wall of the furnace body, a wafer carrier is arranged in the furnace body and directly above the temperature measuring through hole, a temperature measuring module is arranged at the bottom of the furnace body, a heating module is arranged inside the furnace body, and a baffle for shielding the temperature measuring through hole is arranged on the bottom wall of the furnace body; when working, the wafer on the wafer carrier is heated by the heating module, the temperature measuring module can receive light radiation on the wafer carrier through the temperature measuring through hole through the baffle, and the light radiation can be converted into a temperature value by the temperature measuring module, so as to achieve the purpose of measuring the temperature of the wafer. Since the temperature measuring module of this device is arranged outside the furnace body, it will not be affected by the high temperature in the furnace body and the accuracy of the measured temperature will be reduced.

[0004] However, the device is inserted into the furnace body for heating during operation. Since the part close to the heating module will be hotter during the heating process, heat may accumulate in some areas of the wafer, but relatively less in other areas, thus affecting the microstructure and performance of the wafer. Due to the uneven heating of the wafer, the crystal structure may be different in different areas of the wafer. At the same time, during the processing of the device, the processing status of the wafer cannot be observed from the outside of the device, and the operator cannot directly observe the real-time status of the wafer during the annealing process, which may lead to the inability to timely discover and handle abnormal situations in the process. Lack of intuitive observation makes it difficult for technicians to adjust and optimize annealing process parameters such as temperature and time according to the actual situation of the wafer, which may affect the optimization of the annealing effect. Therefore, in order to solve the above problems, an annealing device that can evenly heat the wafer is proposed. Utility Model Content

[0005] The technical problem solved by the utility model is to provide an annealing device which is highly practical, can be operated simply and has a relatively simple structure and can evenly heat a wafer.

[0006] To solve the above technical problems, the utility model provides an annealing device that can uniformly heat wafers, comprising: legs fixed to the bottom of a furnace body and a hatch for conveniently placing wafers into the device, a heating chamber for processing wafers is provided in the furnace body, one side of the hatch is hinged to the furnace body, and a handle for convenient opening and closing is fixed on the other side of the hatch, an operating mechanism for conveniently controlling the device is installed on the other side of the front side of the furnace body close to the hatch, a rotating mechanism for rotating during heating to ensure uniform heating is installed inside the furnace body, and the furnace body is closed by a threaded connection of a mounting plate on the rear side, and a heating mechanism for heating the wafers is provided inside the heating chamber.

[0007] As a further solution of the utility model, a rectangular piece of corrosion-resistant and high-temperature transparent material is embedded inside the hatch, so that the real-time status of the wafer during the annealing process can be directly observed.

[0008] As a further solution of the utility model, the operating mechanism includes a display screen, operating buttons and a control knob. The operating buttons and the control knob are installed below the display screen and are electrically connected.

[0009] As a further solution of the utility model, the rotating mechanism includes a driving motor, a mounting groove, a bevel gear set and a rotating shaft. The bevel gear set is composed of two groups of bevel gears, one group of bevel gears is arranged on the driving motor, and the other group of bevel gears is arranged on the rotating shaft. The two groups of bevel gears are meshed with each other. By rotating the wafer, more uniform heating can be achieved.

[0010] As a further solution of the utility model, the installation groove is connected with the rear side of the furnace body, so that the installation plate abuts against the furnace body and is fixed with threaded bolts at the four corners to facilitate subsequent maintenance of the equipment.

[0011] As a further solution of the utility model, the heating mechanism includes a heating component, a wafer carrier and a placement table. The heating components are symmetrically installed on the upper and lower sides of the heating chamber, and an additional heating component is installed at the center position of the placement table on the top of the heating chamber so that every part of the wafer is evenly exposed to the heating component.

[0012] As a further solution of the utility model, symmetrical ventilation holes are opened on the placement table, the wafer carrier is against the top of the placement table, and the center position of the bottom of the placement table is fixed on the rotating shaft. The ventilation holes can allow hot air to flow in the heating chamber, which helps to achieve a more uniform temperature distribution.

[0013] Compared with the related art, the annealing equipment provided by the utility model that can uniformly heat the wafer has the following beneficial effects:

[0014] 1. The utility model provides a rotatable rotating mechanism on the furnace body. By rotating the wafer, more uniform heating can be achieved, because each part is evenly exposed to the heating component, thereby reducing hot spots or cold spots caused by fixed positions and reducing thermal stress caused by temperature gradients, which is crucial to maintaining the structural integrity of the wafer and avoiding defects such as cracks. During the cooling process, rotation can help heat dissipate more evenly from the wafer surface and prevent local overcooling, thereby ensuring the consistency of material properties.

[0015] 2. The utility model provides a placement table with vents above the rotating mechanism, which allows hot air to flow in the heating chamber, helping to achieve a more uniform temperature distribution. This design can reduce the occurrence of hot spots and cold spots, ensure that the wafer is heated evenly during the annealing process, and thus improve the quality of the wafer.

[0016] 3. The utility model is provided with a visual cabin door, so that the operator can directly observe the real-time status of the wafer during the annealing process, which helps to detect any abnormal situation in time and take corresponding measures to help technicians adjust and optimize annealing process parameters, such as temperature, time, etc., to achieve the best annealing effect. Through real-time observation, the consistency and repeatability of the wafer annealing process can be ensured, thereby improving the quality and reliability of the final product. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with the accompanying drawings.

[0018] Figure 1 It is a three-dimensional schematic diagram of the overall structure of the utility model;

[0019] Figure 2 It is a three-dimensional schematic diagram of the furnace body and heating chamber structure of the utility model;

[0020] Figure 3 It is a three-dimensional schematic diagram of the furnace body and the mounting plate structure of the utility model;

[0021] Figure 4 It is a schematic diagram of the exploded three-dimensional structure of the heating mechanism of the utility model;

[0022] Figure 5 It is a schematic cross-sectional perspective view of the rotating mechanism structure of the utility model.

[0023] In the figure: 1. furnace body; 2. support legs; 3. hatch; 4. handle; 5. heating chamber; 6. heating mechanism; 61. heating component; 62. wafer carrier; 63. placement table; 7. rotation mechanism; 71. drive motor; 72. mounting groove; 73. bevel gear set; 74. rotating shaft; 8. mounting plate; 9. threaded bolt; 10. display screen; 11. operation button; 12. control knob. DETAILED DESCRIPTION

[0024] Please refer to Figure 1-5 , an annealing device that can uniformly heat wafers, comprising: a support leg 2 fixed to the bottom of a furnace body 1 and a hatch 3 for conveniently placing wafers into the device, a heating chamber 5 for processing wafers is provided in the furnace body 1, one side of the hatch 3 is hinged on the furnace body 1, and a handle 4 for convenient opening and closing is fixed on the other side of the hatch 3, an operating mechanism for conveniently controlling the device is installed on the other side of the front side of the furnace body 1 close to the hatch 3, a rotating mechanism 7 for rotating during heating to ensure uniform heating is installed inside the furnace body 1, and the furnace body 1 is closed by a threaded connection with a mounting plate 8 at the rear side, and a heating mechanism 6 for heating wafers is arranged inside the heating chamber 5.

[0025] Preferably, a rectangular piece of corrosion-resistant and high-temperature transparent material is inlaid inside the hatch 3, and the operating mechanism includes a display screen 10, an operating button 11 and a control knob 12. The operating button 11 and the control knob 12 are installed below the display screen 10 and are electrically connected. The wafer is placed inside the device, and the state of the wafer during the annealing process is observed through the hatch 3. The temperature can be increased through the display screen and by adjusting the clockwise rotation of the control knob 12, or the annealing time can be increased or decreased by pressing the control button 11 as needed to optimize the result.

[0026] Preferably, the rotating mechanism 7 includes a driving motor 71, a mounting groove 72, a bevel gear set 73 and a rotating shaft 74. The bevel gear set 73 is composed of two groups of bevel gears, one group of bevel gears is arranged on the driving motor 71, and the other group of bevel gears is arranged on the rotating shaft 74. The two groups of bevel gears are meshed with each other. The mounting groove 72 is connected to the rear side of the furnace body 1, so that the mounting plate 8 is in contact with the furnace body 1 and is fixed at the four corners with threaded bolts 9. The driving motor 71 can drive the rotating shaft 74 connected to the bevel gear set 73 to rotate. The rotation makes each part of the processed wafer evenly exposed to the heating component, thereby reducing hot spots or cold spots caused by the fixed position, reducing thermal stress caused by temperature gradients, and after the rotating mechanism 7 is installed in the mounting groove 72, the mounting plate 8 is used to seal the slot on the rear side of the furnace body 1, and threaded bolts 9 are used at the four corners for threaded fixation.

[0027] Preferably, the heating mechanism 6 includes a heating component 61, a wafer carrier 62 and a placement table 63. The heating component 61 is symmetrically installed on the upper and lower sides of the heating chamber 5, and an additional heating component 61 is installed at the center position of the placement table 63 on the top of the heating chamber 5. Symmetrical vents are opened on the placement table 63, and the vents can allow hot air to flow in the heating chamber, which helps to achieve a more uniform temperature distribution. The bottom center position of the placement table 63 is fixed on the rotating shaft 74. The rotation of the rotating shaft 74 drives the wafer carrier 62 to rotate, thereby driving the wafer carrier 62 placed on the placement table 63 to rotate, so that the heating components 61 installed above and below the heating chamber 5 ensure that the wafer is heated evenly during the annealing process, thereby improving the quality of the wafer.

[0028] The working principle of the annealing device for uniformly heating wafers provided by the utility model is as follows:

[0029] Using a wafer annealing tool with a visualization window typically involves the following steps:

[0030] Check whether the power supply, emergency stop system, etc. of the equipment are normal, clean and check the wafer carrier 62 and the rotating mechanism 7 to ensure that there is no dust or impurities, and set the appropriate annealing temperature according to the material properties of the wafer to be processed. This temperature needs to be high enough to allow the atoms to rearrange, but not too high to avoid irreversible damage.

[0031] Place the wafer on the wafer carrier 62 of the equipment, open the equipment door 3, and place it on the placement table 63 inside the heating chamber 5, ensure that it is in the correct position, and close the door 3 to ensure uniform heating.

[0032] The rotating mechanism 7 is started by the control button 12, and the driving motor 71 can drive the rotating shaft 74 connected to the bevel gear set 73 to rotate. The rotation drives the wafer carrier 62 to rotate, thereby driving the wafer carrier 62 placed on the placement table 63 to rotate. The rotation makes each part of the processed wafer evenly exposed to the heating component 61, ensuring that the wafer starts to rotate to achieve uniform heating, and starts the heating system to gradually increase the temperature to the annealing temperature according to the preset program and maintain it for a certain time.

[0033] Monitor the state and temperature change of the wafer in real time through the hatch 3 and the display screen 10, and adjust the temperature, rotation speed or other parameters according to the actual situation observed if necessary.

[0034] After annealing is completed, the temperature is lowered according to the procedure. It may be necessary to introduce protective gas or use a cooling system. The rotating mechanism 77 continues to work during the entire cooling process. After confirming that the temperature has dropped to a safe range, the rotation is stopped, the equipment door 3 is opened, the wafer is taken out, and necessary post-processing is performed on the wafer, such as cleaning, testing or other process steps, and the data records are analyzed to evaluate the effect of the annealing process for subsequent optimization.

[0035] After the processing is completed, the wafer carrier 62 and the rotating mechanism 7 of the equipment are cleaned and maintained as necessary to ensure their long-term stable operation.

[0036] Although the embodiments of the present invention have been shown and described, it is understood by those skilled in the art that various changes, modifications, substitutions and variations or direct or indirect applications may be made to these embodiments without departing from the principles and spirit of the present invention. In other related technical fields, the scope of the present invention is defined by the attached claims and their equivalents, which are equally included in the scope of patent protection of the present invention.

Claims

1. An annealing device capable of uniformly heating a wafer, comprising: A support leg (2) fixed to the bottom of a furnace body (1) and a hatch (3) for conveniently placing wafers into the device, characterized in that: a heating chamber (5) for processing wafers is provided in the furnace body (1), one side of the hatch (3) is hinged to the furnace body (1), and a handle (4) for convenient opening and closing is fixed on the other side of the hatch (3), an operating mechanism for conveniently controlling the device is installed on the other side of the front side of the furnace body (1) close to the hatch (3), a rotating mechanism (7) for rotating during heating to ensure uniform heating is installed inside the furnace body (1), and the furnace body (1) is closed by a threaded connection with a mounting plate (8) at the rear side, and a heating mechanism (6) for heating wafers is arranged inside the heating chamber (5); The heating mechanism (6) comprises a heating component (61), wherein the heating component (61) is installed at the top and the bottom of the heating chamber (5); The rotating mechanism (7) comprises a driving motor (71), wherein the driving motor (71) is installed inside the furnace body (1).

2. The annealing device capable of uniformly heating a wafer according to claim 1, characterized in that: A rectangular piece of corrosion-resistant and high-temperature transparent material is inlaid inside the hatch (3).

3. The annealing device capable of uniformly heating a wafer according to claim 1, characterized in that: The operating mechanism comprises a display screen (10), an operating button (11) and a control knob (12); the operating button (11) and the control knob (12) are installed below the display screen (10) and are electrically connected.

4. The annealing device capable of uniformly heating a wafer according to claim 1, characterized in that: The rotating mechanism (7) comprises a driving motor (71), a mounting groove (72), a bevel gear set (73) and a rotating shaft (74); the bevel gear set (73) is composed of two groups of bevel gears, one group of which is arranged on the driving motor (71), and the other group of which is arranged on the rotating shaft (74); the two groups of bevel gears are meshed with each other.

5. The annealing device capable of uniformly heating a wafer according to claim 4, characterized in that: The mounting groove (72) penetrates the rear side of the furnace body (1), so that the mounting plate (8) abuts against the furnace body (1) and is fixed at the four corners using threaded bolts (9).

6. The annealing device capable of uniformly heating a wafer according to claim 1, characterized in that: The heating mechanism (6) comprises a heating component (61), a wafer carrier (62) and a placement table (63); the heating component (61) is symmetrically installed on the upper and lower sides of the heating chamber (5), and an additional heating component (61) is installed at the center of the placement table (63) at the top of the heating chamber (5).

7. The annealing device capable of uniformly heating a wafer according to claim 6, characterized in that: The placement platform (63) is provided with symmetrical ventilation holes, the wafer carrier (62) is in contact with the top of the placement platform (63), and the center position of the bottom of the placement platform (63) is fixed on the rotating shaft (74).

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