Roadside equipment and roadside system

Abstract

The utility model discloses roadside equipment and a roadside system, the roadside equipment comprises a high-speed core board, a power board, a high-speed daughter board and a low-speed board, the high-speed core board is connected with the power board, the high-speed daughter board and the low-speed board in a pluggable mode, and the high-speed core board is further connected with a heat dissipation layer. According to the roadside equipment provided by the invention, integrated design debugging and mass production are facilitated.

Description

Technical Field

[0001] The present application relates to the technical field of roadside equipment, and in particular to a roadside equipment and a roadside system. Background Art

[0002] Roadside equipment is usually distributed on roadside crossbars or in pole boxes, and the functions of each node device are relatively simple, such as cameras, radars, RSUs, MECs, switches, etc.

[0003] In order to further integrate and optimize the roadside system in related technologies, the goals of full functionality, high integration, low latency, low cost, and easy construction can be achieved. One solution is to integrate multiple functions into one device. However, the current common practice in the industry is to directly integrate the boards of existing equipment with different functions into one device, which results in a lot of messy wiring harnesses in the shell, making it difficult to mass produce, and making it difficult to debug and disassemble the machine with poor consistency. The EMC rectification of the whole machine is inconvenient and the risk of failure is high. Another solution is to optimize from the board-level design. Although the integration of multiple boards is smaller in size, more flexible, and more adjustable than a single-board design, it is inevitable that the boards need to be connected to numerous wiring harnesses for power supply and communication. Utility Model Content

[0004] The embodiments of the present application provide a roadside device and a roadside system to facilitate integrated design, debugging and mass production.

[0005] The present application embodiment adopts the following technical solutions:

[0006] In the first aspect, an embodiment of the present application provides a roadside device, wherein the interior of the roadside device includes: a high-speed core board, a power board, a high-speed sub-board, and a low-speed board, the high-speed core board is plugged and unplugged with the power board, the high-speed sub-board, and the low-speed board, respectively, and the high-speed core board is also connected to a heat dissipation layer.

[0007] In some embodiments, the exterior of the roadside equipment includes: an upper cover and a lower shell, and the upper cover and the lower shell form a complete machine housing.

[0008] In some embodiments, the wiring harness in the complete housing is arranged at the lower part of the complete housing, and / or is arranged at a wiring harness layer position on a side of the complete housing.

[0009] In some embodiments, the power supply boards include multiple ones, and the multiple power supply boards are plug-in connected to the high-speed core board via pin headers.

[0010] In some embodiments, multiple power boards are connected to the high-speed core board through a full circle of GND pins, or multiple power boards are connected to the high-speed core board using a high-speed B2B connector.

[0011] In some embodiments, the low-speed boards include multiple boards, and the multiple low-speed boards are plug-in connected to the high-speed core board via pin headers.

[0012] In some embodiments, multiple low-speed boards are connected to the high-speed core board through a full circle of GND pins, or multiple low-speed boards are connected to the high-speed core board using a high-speed B2B connector.

[0013] In some embodiments, the high-speed daughter boards include multiple ones, and the multiple high-speed daughter boards are plug-in connected to the high-speed core board via pin headers.

[0014] In some embodiments, the high-speed daughter board is connected to the high-speed core board through a full circle of GND pins, or a plurality of high-speed daughter boards are connected to the high-speed core board using a high-speed B2B connector.

[0015] In a second aspect, an embodiment of the present application further provides a roadside system, comprising the roadside equipment as described in the first aspect.

[0016] At least one of the above technical solutions adopted in the embodiments of the present application can achieve the following beneficial effects: the interior of the roadside equipment includes: a high-speed core board, a power board, a high-speed sub-board, and a low-speed board. The high-speed core board is plugged and unplugged with the power board, the high-speed sub-board, and the low-speed board respectively. Thus, it can be replaced and the loss and project cost can be reduced in a modular way, and the efficiency and EMC performance of the whole equipment can be improved. In addition, the high-speed core board is also connected to a heat dissipation layer to facilitate the heat dissipation of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 This is a schematic diagram of the internal structure of the roadside equipment in the embodiment of the present application;

[0019] Figure 2 It is a schematic diagram of the principles of the roadside equipment in the embodiment of the present application. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0021] The technical solutions provided by various embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0022] The present application embodiment provides a roadside device, such as Figure 1 As shown, a schematic diagram of the internal structure of the roadside equipment in an embodiment of the present application is provided, and the interior of the roadside equipment includes: a high-speed core board 110, a power board 120, a high-speed sub-board 130, and a low-speed board 140. The high-speed core board 110 is plugged and unplugged with the power board 120, the high-speed sub-board 130, and the low-speed board 140, respectively, and the high-speed core board is also connected to a heat dissipation layer 150.

[0023] The high-speed core board 110 is closely related to the functions of the roadside equipment. For example, a chip with computing and processing functions can be used as a high-speed core board or a core board with equivalent functions can be used instead. Of course, those skilled in the art can divide it according to actual needs, and it is not specifically limited in the embodiments of the present application, nor does it involve improvement or optimization of the high-speed core board itself.

[0024] After the power board 120 is connected to the high-speed core board 110 , it is used to provide power to the high-speed core board 110 .

[0025] The high-speed daughter board 130 and the low-speed board 140 are respectively connected to the high-speed core board 110 to realize corresponding modular functions. The definition is divided into a high-speed core main board, n power boards, n high-speed daughter boards, and n low-speed boards. According to the influence of space, function, location, structure, EMC and other factors, n boards can be evaluated and set.

[0026] During specific implementation, circuit modules for high-speed communications such as SOC or SOM, LPDDR5, UFS, FLASH, deserialization and serialization, 10 Gigabit network, 5G module, and radio frequency line are designed as high-speed core boards. Other factors such as ease of installation and EMC are considered, and other boards with high-speed routing such as PCIE, MIPI, USB, HDMI, LVDS, and M.2 are used as high-speed sub-boards. As for the power board, that is, the power line of the system; low-speed boards such as some IO line power lines and interface lines controlled by MCU, such as the drive line of the pan-tilt motor, RS232, RS485, and CAN low-speed routing signals are used as low-speed boards. That is, in the embodiments of the present application, the division is no longer mainly based on the function of the equipment (it is simply estimated that the high-speed and low-speed distinction can be divided according to the 100MHZ boundary), but the embodiments of the present application are flexibly applied, as long as the function of the entire machine is normal, the integrity is good, and the EMC performance meets the requirements.

[0027] The high-speed core board is also connected to a heat dissipation layer 150 . For example, the heat dissipation layer 150 is used to provide heat dissipation for devices / modules in the high-speed core board that need heat dissipation.

[0028] In one embodiment of the present application, the exterior of the roadside equipment includes: an upper cover and a lower shell, and the upper cover and the lower shell form a complete machine housing.

[0029] The heat dissipation components are mainly arranged between the high-speed core board and the upper cover, and there is no connector layout on this surface, so as to achieve the purpose of hiding the internal wiring harness of the whole machine.

[0030] like Figure 2 As shown, the exterior of the roadside equipment includes an upper cover and a lower shell, and the upper cover and the lower shell form a complete machine housing, which is convenient for installing a high-speed core board, a power board, a high-speed sub-board, a low-speed board, etc.

[0031] In one embodiment of the present application, the wiring harness in the whole machine housing is arranged at the lower part of the whole machine housing, and / or is arranged at the wiring harness layer position on the side of the whole machine housing.

[0032] It should be noted that the wiring harness layout in the whole machine housing is fixed at the lower and side wiring harness layers, mainly including some video, motor, RF antenna and other wiring harnesses, and the wire-to-board vertical connector is arranged under the board to facilitate wiring harness plugging and unplugging. At the same time, the lower shell of the whole machine housing is detachable to facilitate the installation and debugging of the wiring harness.

[0033] like Figure 2 As shown, in order to facilitate wiring, the wiring harness in the whole machine housing is arranged below the whole machine housing. Of course, it can also be arranged at the wiring harness layer position on the side of the whole machine housing, which is also convenient for wiring.

[0034] In one embodiment of the present application, the power supply boards include a plurality of power supply boards, and the plurality of power supply boards are plug-in connected to the high-speed core board via pin headers.

[0035] like Figure 2 As shown, the plurality of power boards are connected to the high-speed core board through pin headers, and the boards with upper and lower structures are connected through pin headers, which is convenient for integrated design, debugging and mass production.

[0036] In one embodiment of the present application, multiple power boards are connected to the high-speed core board through a full circle of GND pins, or multiple power boards are connected to the high-speed core board using a high-speed B2B connector.

[0037] like Figure 2 As shown, the use of pin headers can replace various power lines, low-speed signal lines, and 100M and 1000M network cables, thereby reducing and simplifying the types and quantities of wiring harnesses in the entire housing.

[0038] In addition, a whole circle of GND pins are arranged between the boards to improve the ground integrity and structural stability, and the pins are convenient for ground layout welding adjustment during EMC rectification. Preferably, the pins can be evaluated and set according to actual needs, functional layout definition, thickness, gold plating, silver plating, etc., which are not specifically limited in the embodiments of this application, and those skilled in the art can choose according to the actual usage scenario.

[0039] Furthermore, designated or special high-speed signals between multiple power boards and upper and lower boards of the high-speed core board can be connected through a high-speed B2B connector, and the ground integrity can still be compensated and adjusted through the pin header connection.

[0040] In one embodiment of the present application, the low-speed boards include a plurality of boards, and the plurality of boards are plug-in connected to the high-speed core board via pin headers.

[0041] like Figure 2 As shown, the low-speed boards include multiple boards, and the multiple low-speed boards are plugged and unplugged with the high-speed core board through pin headers. The pin header connection can replace each power line, low-speed signal line, and 100M / 1000M network cable, thereby reducing and simplifying the types and number of wiring harnesses in the entire housing.

[0042] In addition, a full circle of GND pin connections is laid out between the boards to improve ground integrity and structural stability, and the pins facilitate welding adjustments of the ground layout during EMC rectification.

[0043] In one embodiment of the present application, multiple low-speed boards are connected to the high-speed core board through a full circle of GND pins, or multiple low-speed boards are connected to the high-speed core board using a high-speed B2B connector.

[0044] like Figure 2 As shown, further, designated or special high-speed signals between the multiple low-speed boards and the upper and lower boards of the high-speed core board can be connected through a high-speed B2B connector through a pin header, and the grounding integrity can still be compensated and adjusted through the pin header connection.

[0045] In one embodiment of the present application, the high-speed daughter boards include a plurality of daughter boards, and the plurality of daughter boards are plug-in connected to the high-speed core board via pin headers.

[0046] like Figure 2 As shown, the high-speed boards include multiple boards, which are plug-in connected to the high-speed core board through pin headers. Pin header connection can replace various power lines, low-speed signal lines, and 100M and 1000M network cables, thereby reducing and simplifying the types and quantities of wiring harnesses in the entire housing.

[0047] In addition, a full circle of GND pin connections is laid out between the boards to improve grounding integrity and structural stability, and the pins facilitate welding adjustments of the grounding layout during EMC rectification.

[0048] In one embodiment of the present application, the high-speed daughter board is connected to the high-speed core board through a full circle of GND pins, or a plurality of high-speed daughter boards are connected to the high-speed core board using a high-speed B2B connector.

[0049] like Figure 2 As shown, further, designated or special high-speed signals between the plurality of high-speed boards and the upper and lower boards of the high-speed core board can be connected through a high-speed B2B connector through a pin header, and the ground integrity can still be compensated and adjusted through the pin header connection.

[0050] A roadside system is also provided in an embodiment of the present application, which includes the roadside equipment. The interior of the roadside equipment includes: a high-speed core board, a power board, a high-speed sub-board, and a low-speed board. The high-speed core board is pluggable connected to the power board, the high-speed sub-board, and the low-speed board respectively, and the high-speed core board is also connected to a heat dissipation layer.

[0051] The roadside system provided by this application solves the problems encountered in optimizing the integrated design of current roadside multifunctional equipment, such as numerous and messy wiring harnesses inside the shell, difficulty in debugging and disassembly, low consistency in mass production, and low electromagnetic compatibility performance. The roadside system provided by this application can simplify and hide the internal wiring harness of the whole machine, facilitate integrated design debugging and mass production, and modularization can replace and reduce losses and project costs, and improve efficiency and EMC performance of the whole equipment.

[0052] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A roadside device, wherein: The interior of the roadside equipment includes: a high-speed core board, a power board, a high-speed sub-board, and a low-speed board. The high-speed core board is plugged and unplugged with the power board, the high-speed sub-board, and the low-speed board respectively, and the high-speed core board is also connected to a heat dissipation layer.

2. The roadside equipment according to claim 1, wherein: The exterior of the roadside equipment includes: an upper cover and a lower shell, and the upper cover and the lower shell form a complete machine housing.

3. The roadside equipment according to claim 2, wherein: The wiring harness in the complete machine housing is arranged at the lower part of the complete machine housing and / or at a wiring harness layer position at a side part of the complete machine housing.

4. The roadside equipment according to claim 1, wherein: The power supply boards include a plurality of power supply boards, and the plurality of power supply boards are plug-in connected to the high-speed core board via pin headers.

5. The roadside equipment according to claim 4, wherein: Multiple power boards are connected to the high-speed core board through a full circle of GND pins, or multiple power boards are connected to the high-speed core board using a high-speed B2B connector.

6. The roadside equipment according to claim 1, wherein: The low-speed boards include a plurality of boards, and the plurality of low-speed boards are plug-in connected to the high-speed core board via pin headers.

7. The roadside equipment according to claim 6, wherein: The multiple low-speed boards are connected to the high-speed core board through a full circle of GND pins, or the multiple low-speed boards are connected to the high-speed core board using a high-speed B2B connector.

8. The roadside equipment according to claim 1, wherein: The high-speed daughter boards include a plurality of them, and the plurality of high-speed daughter boards are plug-in connected to the high-speed core board via pin headers.

9. The roadside equipment according to claim 8, wherein: The high-speed daughter board is connected to the high-speed core board through a full circle of GND pins, or a plurality of high-speed daughter boards are connected to the high-speed core board using a high-speed B2B connector.

10. A roadside system, wherein: Comprising the roadside equipment as described in any one of claims 1 to 9.

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