Device for adjusting flatness of circuit board

Abstract

The utility model discloses a device for adjusting the flatness of a circuit board, which comprises a leveling device main body, a discharge plate arranged on the front side of the leveling device main body, a stand column arranged in the middle of the rear side of the leveling device main body, a leveling cavity arranged in the middle of the inside of the leveling device main body, and a leveling sliding block arranged on the front side of the stand column. A positioning groove is formed in the outer side of the leveling cavity, a positioning plate is arranged at the bottom of the leveling sliding block, a limiting plate is arranged in the leveling cavity, a telescopic table is arranged above the limiting plate, a heat conduction plate is arranged in the extrusion plate, and a thermal resistance wire is laid in the heat conduction plate. The arrangement of the leveling sliding block and the positioning plate enables the circuit board to be accurately positioned in the leveling cavity, the position accuracy and stability in the machining process are ensured, the arrangement of the bottom position of the extrusion plate ensures the uniform extrusion of the circuit board, and the pressure distribution is uniform in the leveling process.

Description

Technical Field

[0001] The utility model belongs to the technical field related to circuit board leveling machines, and in particular relates to a device for adjusting the flatness of a circuit board. Background Art

[0002] A circuit board leveling device, also known as a PCB leveling machine, is a device used in the manufacture of electronic circuit boards. During the electronic manufacturing process, circuit boards usually go through multiple processes, one of which is the leveling process. The leveling process refers to making the surface of the electronic circuit board completely flat to ensure the accuracy and reliability of the installation and connection of each component. The key to the leveling process is to use mechanical or thermal effects to make the components or connection materials on the circuit board reach a stable and uniform state.

[0003] However, the existing circuit board flatness adjustment device has a slow flatness speed and poor positioning effect, which causes the circuit board to swing or shift during the processing, making the equipment run unstable and increasing the failure rate of the production line. Utility Model Content

[0004] The purpose of the utility model is to provide a device for adjusting the flatness of a circuit board, so as to solve the problem that the existing device for adjusting the flatness of a circuit board proposed in the above-mentioned background technology has a slow flatness speed and a poor positioning effect, which causes the circuit board to swing or shift during the processing, making the equipment run unstable and increasing the failure rate of the production line.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a device for adjusting the flatness of a circuit board, comprising a leveling device body;

[0006] A discharge plate is provided at the front side of the main body of the leveling device, a column is provided at the middle position of the rear side of the main body of the leveling device, the column and the main body of the leveling device are integrated, and the device for adjusting the flatness of the circuit board is powered by an external power supply;

[0007] A leveling cavity is arranged at the middle position inside the main body of the leveling device, a leveling block is arranged at the front side of the column, and an extrusion plate is arranged at the bottom position of the leveling block.

[0008] Preferably, a positioning groove is provided at the outer side of the leveling cavity, and a positioning plate is provided at the bottom of the leveling block, and the positioning plate corresponds to the positioning groove.

[0009] Preferably, a limit plate is provided at an inner position of the leveling cavity, a telescopic platform is provided above the limit plate, and the telescopic platform is slidably connected to the leveling cavity.

[0010] Preferably, a heat conducting plate is arranged at an inner position of the extrusion plate, a thermal resistance wire is laid inside the heat conducting plate, and the extrusion plate corresponds to the flattening cavity.

[0011] Preferably, a discharging spring is provided at the bottom of the telescopic table, and a push plate is provided at the bottom of the column.

[0012] Preferably, the push plate is slidably connected to the column via an internal motor of the column, and the smoothing block is slidably connected to the column via an inner sliding groove.

[0013] Preferably, the angle between the discharge plate and the main body of the leveling device is 45 degrees, and the discharge plate is fixedly connected to the main body of the leveling device.

[0014] Compared with the prior art, the utility model provides a device for adjusting the flatness of a circuit board, which has the following beneficial effects:

[0015] 1. Through the setting of the leveling cavity, leveling block, extrusion plate, positioning groove, positioning plate, limit plate, telescopic table, heat conduction plate and thermal resistance wire, the setting of the leveling block and the positioning plate enables the circuit board to be accurately positioned inside the leveling cavity, ensuring the position accuracy and stability during the processing process. The bottom position setting of the extrusion plate ensures the uniform extrusion of the circuit board, so that the pressure distribution during the leveling process is uniform, avoiding the possibility of deformation or damage of the circuit board. The setting of the heat conduction plate and the thermal resistance wire can provide a good heat conduction effect during the leveling process, so that the circuit board can quickly reach the required temperature during the processing, improving the leveling efficiency and quality. The setting of the limit plate and the telescopic table can limit the moving range of the extrusion plate, prevent excessive extrusion or position deviation, and protect the safety and stability of the circuit board and the leveling device. The design advantages of the corresponding extrusion plate and the leveling cavity in the leveling device make the leveling process more accurate, stable and efficient.

[0016] 2. Through the setting of the discharge spring and the push plate, the setting of the discharge spring can automatically eject the circuit board from the leveling device after the leveling process is completed, thereby improving the operating efficiency and process continuity. The motor inside the column drives the push plate to slide and connect, realizing the precise control of the leveling block, ensuring the smoothness and accuracy during the leveling process. Through the inner slide groove connection, the sliding connection between the leveling block and the column is more stable and smooth, the operation is more flexible and convenient, and the difficulty and tediousness of manual operation are reduced. The motor-driven push plate can realize the control of the leveling block. At the same time, the design of the sliding connection ensures the safety and stability of the leveling process, reduces the risk of accidental injury, and makes the operation of the leveling device more convenient, precise, safe and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of the utility model.

[0018] Figure 2 It is a structural schematic diagram of the leveling cavity in the utility model.

[0019] Figure 3 It is a structural schematic diagram of the smoothing block in the utility model.

[0020] Figure 4 It is a structural schematic diagram of the cross section of the extruded plate in the utility model.

[0021] Figure 5 It is a structural schematic diagram of the flattening cavity cross section in the utility model.

[0022] In the figure: 1. Leveling device body; 2. Column; 3. Slide; 4. Leveling block; 5. Telescopic table; 6. Discharge plate; 7. Push plate; 8. Positioning groove; 9. Leveling cavity; 10. Limit plate; 11. Positioning plate; 12. Extrusion plate; 13. Thermal resistance wire; 14. Heat conduction plate; 15. Discharge spring. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The utility model provides Figure 1-5 A device for adjusting the flatness of a circuit board shown includes a flattening device body 1;

[0025] A discharge plate 6 is provided at the front side of the leveling device body 1, and a column 2 is provided at the middle position of the rear side of the leveling device body 1. The column 2 and the leveling device body 1 are integrated, and the device for adjusting the flatness of the circuit board is powered by an external power supply;

[0026] A leveling cavity 9 is arranged at the middle position inside the leveling device body 1 , a leveling block 4 is arranged at the front side of the column 2 , and an extrusion plate 12 is arranged at the bottom of the leveling block 4 .

[0027] A positioning groove 8 is arranged at the outer side of the leveling cavity 9 , and a positioning plate 11 is arranged at the bottom of the leveling block 4 , and the positioning plate 11 corresponds to the positioning groove 8 .

[0028] A limit plate 10 is arranged at an inner position of the leveling cavity 9 , and a telescopic platform 5 is arranged above the limit plate 10 . The telescopic platform 5 is slidably connected to the leveling cavity 9 .

[0029] A heat conducting plate 14 is arranged at an inner position of the extrusion plate 12 , a heat resistance wire 13 is laid inside the heat conducting plate 14 , and the extrusion plate 12 corresponds to the leveling cavity 9 .

[0030] A discharging spring 15 is arranged at the bottom of the telescopic platform 5 , and a pushing plate 7 is arranged at the bottom of the column 2 .

[0031] The push plate 7 is slidably connected to the column 2 through the motor inside the column 2, and the leveling block 4 is slidably connected to the column 2 through the inner sliding groove 3.

[0032] The angle between the discharge plate 6 and the leveling device body 1 is 45 degrees, and the discharge plate 6 is fixedly connected to the leveling device body 1 .

[0033] In this embodiment, a specific implementation step of a device for adjusting the flatness of a circuit board is to ensure that the main body 1 of the circuit board adjustment device is in normal working condition, check whether all components are intact, confirm that the required tools and materials are complete, place the circuit board that needs to be adjusted for flatness on the flattening cavity 9 of the adjustment device, ensure that the position of the circuit board is stable, and adjust the parameters of the device according to the actual situation and requirements of the circuit board, such as the flatness adjustment speed, positioning method and strength, to ensure the adjustment effect and quality, start the adjustment device to start the flatness adjustment and positioning operation, monitor the working status and effect during the adjustment process, and after the adjustment is completed, carefully check the flatness and positioning effect of the circuit board to confirm whether it meets the expected requirements. If necessary, further adjustment or correction can be made. After the adjustment is completed and confirmed to be correct, clean the adjustment device and the workbench, keep the equipment clean, and regularly maintain the device to ensure its long-term stable and reliable operation.

[0034] like Figure 1-4 As shown, a leveling cavity 9 is provided at the middle position inside the main body 1 of the leveling device, a leveling block 4 is provided at the front side of the column 2, an extrusion plate 12 is provided at the bottom of the leveling block 4, a positioning groove 8 is provided at the outer side of the leveling cavity 9, a positioning plate 11 is provided at the bottom of the leveling block 4, the positioning plate 11 corresponds to the positioning groove 8, a limiting plate 10 is provided at the inside of the leveling cavity 9, a telescopic table 5 is provided above the limiting plate 10, the telescopic table 5 is slidably connected to the leveling cavity 9, a heat conducting plate 14 is provided at the inside of the extrusion plate 12, a thermal resistance wire 13 is laid inside the heat conducting plate 14, and the extrusion plate 12 corresponds to the leveling cavity 9.

[0035] Preferably, the setting of the leveling block 4 and the positioning plate 11 enables the circuit board to be accurately positioned inside the leveling cavity 9, ensuring the position accuracy and stability during the processing; the bottom position setting of the extrusion plate 12 ensures uniform extrusion of the circuit board, so that the pressure distribution during the leveling process is uniform, avoiding the possibility of deformation or damage of the circuit board; the setting of the heat conducting plate 14 and the thermal resistance wire 13 can provide a good heat conduction effect during the leveling process, so that the circuit board can quickly reach the required temperature during the processing, thereby improving the leveling efficiency and quality; the setting of the limit plate 10 and the telescopic table 5 can limit the moving range of the extrusion plate 12, prevent excessive extrusion or position displacement, and protect the safety and stability of the circuit board and the leveling device; the design advantage of the extrusion plate 12 corresponding to the leveling cavity 9 in the leveling device makes the leveling process more accurate, stable and efficient.

[0036] like Figure 1-2 and Figure 5 As shown, a discharging spring 15 is provided at the bottom of the telescopic table 5, a push plate 7 is provided at the bottom of the column 2, the push plate 7 is slidably connected to the column 2 through the internal motor of the column 2, and the smoothing block 4 is slidably connected to the column 2 through the inner slide groove 3.

[0037] Preferably, the discharging spring 15 is arranged to automatically eject the circuit board from the leveling device after the leveling process is completed, thereby improving the operating efficiency and process continuity. The motor inside the column 2 drives the push plate 7 to slide and connect, thereby realizing precise control of the leveling block 4 and ensuring the smoothness and accuracy during the leveling process. The connection through the inner slide groove 3 makes the sliding connection between the leveling block 4 and the column 2 more stable and smooth, and the operation is more flexible and convenient, thereby reducing the difficulty and tediousness of manual operation. The motor-driven push plate 7 can realize the control of the leveling block 4, and at the same time, the design of the sliding connection ensures the safety and stability during the leveling process, reduces the risk of accidental injury, and makes the operation of the leveling device more convenient, precise, safe and reliable.

[0038] like Figure 1-5 As shown, the angle between the discharge plate 6 and the leveling device body 1 is 45 degrees, and the discharge plate 6 is fixedly connected to the leveling device body 1 .

[0039] Optionally, the fixed connection can ensure the stability of the positional relationship between the discharge plate 6 and the leveling device body 1, avoid loosening or falling off during the leveling process, and ensure the safety and stability of the operation. The 45-degree fixed angle enables the discharge plate 6 to smoothly discharge the leveled circuit board at a suitable angle, ensuring the smooth processing of the workpiece and the continuity of subsequent processes.

[0040] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for adjusting the flatness of a circuit board, comprising a flattening device body (1); A discharge plate (6) is arranged at the front side of the leveling device body (1), a column (2) is arranged at the middle position of the rear side of the leveling device body (1), and the column (2) and the leveling device body (1) are integrated. The device for adjusting the flatness of the circuit board is powered by an external power supply; Features: A leveling cavity (9) is arranged at the middle position inside the leveling device body (1), a leveling block (4) is arranged at the front side of the column (2), and an extrusion plate (12) is arranged at the bottom position of the leveling block (4).

2. The device for adjusting the flatness of a circuit board according to claim 1, characterized in that: A positioning groove (8) is arranged at the outer side of the leveling cavity (9), and a positioning plate (11) is arranged at the bottom of the leveling block (4), and the positioning plate (11) corresponds to the positioning groove (8).

3. The device for adjusting the flatness of a circuit board according to claim 2, characterized in that: A limit plate (10) is arranged at an inner position of the flattening cavity (9), a telescopic platform (5) is arranged above the limit plate (10), and the telescopic platform (5) is slidably connected to the flattening cavity (9).

4. The device for adjusting the flatness of a circuit board according to claim 3, characterized in that: A heat conducting plate (14) is arranged at an internal position of the extrusion plate (12), a heat resistance wire (13) is laid inside the heat conducting plate (14), and the extrusion plate (12) corresponds to the flattening cavity (9).

5. The device for adjusting the flatness of a circuit board according to claim 4, characterized in that: A discharging spring (15) is arranged at the bottom of the telescopic platform (5), and a pushing plate (7) is arranged at the bottom of the column (2).

6. The device for adjusting the flatness of a circuit board according to claim 5, characterized in that: The push plate (7) is slidably connected to the column (2) via an internal motor of the column (2), and the leveling block (4) is slidably connected to the column (2) via an inner sliding groove (3).

7. The device for adjusting the flatness of a circuit board according to claim 1, characterized in that: The angle between the discharge plate (6) and the main body (1) of the leveling device is 45 degrees, and the discharge plate (6) is fixedly connected to the main body (1) of the leveling device.

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