LED device
By setting spaced metal plating on the substrate of the LED device, the contact area between the white wall glue and the substrate is increased, the problem of layering of the white wall glue and the substrate under high temperature and high humidity conditions is solved, and the binding force and stability are improved.
Patent Information
- Application Number
- CN202420202458.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-01-26
AI Technical Summary
Under high temperature and high humidity conditions, white wall glue and substrate are prone to layering, resulting in insufficient binding force.
By setting the metal plating layer on the front of the substrate, the area of the metal plating layer is reduced, the contact area between the white wall glue and the substrate is increased, and the bonding force is improved.
It effectively solves the problem of layering of white wall glue and substrate, improves the bonding force between white wall glue and substrate, and enhances the stability of LED devices under high temperature and high humidity conditions.
Smart Images
Figure CN222764230U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of LEDs, in particular to an LED device. Background Art
[0002] LED (Light Emitting Diode) is a semiconductor device, a solid-state light-emitting device that can convert electrical energy into light energy. It has the advantages of small size, low power consumption and long life. It is widely used in lighting, display and communication fields.
[0003] See also Figure 1 The existing LED device includes a substrate 1, an LED chip 2, a membrane 3 and a white wall glue 4. The LED chip 2 is placed on the front of the substrate 1, and the membrane 3 is bonded to the light-emitting area of the LED chip 2 by an adhesive. The white wall glue 4 wraps the LED chip 2 and fits the front of the substrate 1. The surface of the white wall glue 4 is flush with the surface of the membrane 3.
[0004] In the prior art, the white wall glue 4 is generally covered on the front side of the substrate 1 by molding. When such LED devices are subjected to high temperature and high humidity life tests, the white wall glue 4 and the substrate 1 often delaminate. Utility Model Content
[0005] Based on this, the purpose of the present invention is to provide an LED device.
[0006] On the one hand, the utility model provides an LED device, including a substrate, an LED chip and white wall glue, wherein a metal coating is provided on the front side of the substrate, the metal coating includes a first coating and a second coating that are spaced apart, the LED chip is placed on the second coating, the white wall glue wraps the LED chip and adheres to the front side of the substrate; the area of the second coating is larger than that of the first coating, the first coating includes a first side edge and a second side edge that are vertically connected, and the second coating is spaced apart from the first side edge and the second side edge.
[0007] Compared with the prior art, the utility model reduces the area of the metal plating on the substrate through the structural design of the metal plating, thereby increasing the contact area between the white wall glue and the substrate, improving the bonding force between the white wall glue and the substrate, and solving the delamination problem between the white wall glue and the substrate.
[0008] In one embodiment, the first side edge is arranged at a first edge of the substrate, the second side edge is arranged at a second edge of the substrate, the first edge is connected to the second edge, and the first side edge and the second side edge are both in the shape of long strips.
[0009] In one embodiment, the second coating layer includes a main body portion, the main body portion is spaced apart from a first side edge and a second side edge of the first coating layer, and the LED chip is placed in the main body portion.
[0010] In one embodiment, the second plating layer further includes a first protrusion, the first protrusion extends from one side of the main body, and the first protrusion is spaced apart from a first side edge of the first plating layer.
[0011] In one embodiment, the LED device further includes a Zener tube, and the Zener tube is placed on the first side of the first coating layer and the first protrusion of the second coating layer.
[0012] In one embodiment, the second plating layer further includes a second protrusion, the second protrusion and the first protrusion extend from the main body in the same direction, and the second protrusion is spaced apart from the first protrusion.
[0013] In one embodiment, the second coating layer further includes a third protrusion, wherein the third protrusion extends from the main body, and the third protrusion is spaced apart from the second side of the first coating layer.
[0014] In one embodiment, the LED device further includes a membrane and transparent glue, the membrane is placed in the light-emitting area of the LED chip, the surface of the white wall glue is flush with the surface of the membrane, and the transparent glue covers the surfaces of the white wall glue and the membrane.
[0015] In one embodiment, the white wall glue is added with fillers, and the fillers are spherical silica, metal powder, metal oxide or non-metallic mineral.
[0016] In one embodiment, a coupling agent is added to the white wall glue, and the coupling agent includes a group that combines with the metal plating layer and a group that combines with the white wall glue. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a structural schematic diagram of a conventional LED device;
[0018] Figure 2 It is a structural schematic diagram of the front side of the substrate in the prior art LED device;
[0019] Figure 3 This is a schematic structural diagram of the front side of a substrate in an LED device according to an embodiment of the utility model;
[0020] Figure 4 This is a schematic diagram of placing an LED chip and a Zener tube on a substrate in an LED device according to an embodiment of the utility model;
[0021] Figure 5 This is a schematic structural diagram of the back side of a substrate in an LED device according to an embodiment of the utility model;
[0022] Figure 6 This is a schematic diagram of the structure of an LED device according to an embodiment of the utility model. DETAILED DESCRIPTION
[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0024] The technicians analyzed the delamination problem between the white wall glue and the substrate and found that a major influencing factor was the bonding strength between the white wall glue and the substrate. Figure 2 In the prior art, a metal coating 10 is provided on the front of the substrate 1. In order to increase the light reflection of the chip and improve the brightness of the light, the metal coating 10 almost covers the entire substrate 1. When the white wall glue 4 is covered on the substrate 1, the white wall glue 4 is in direct contact with the metal coating 10. However, the thermal expansion coefficient of the white wall glue 4 is much greater than that of the metal coating 10. When the temperature changes, the shrinkage rate of the white wall glue 4 is large, and the shrinkage rate of the metal coating 10 is small. After the device undergoes high and low temperature cycles, the stress on the contact surface between the white wall glue 4 and the metal coating 10 will be further increased due to the inconsistent dimensional changes of the white wall glue 4 and the metal coating 10 at high and low temperatures. When this stress exceeds the bonding force between the white wall glue 4 and the metal coating 10, the white wall glue 4 and the substrate 1 will be delaminated.
[0025] Based on this, the present application reduces the area of the metal coating on the substrate through the structural design of the metal coating, thereby increasing the contact area between the white wall glue and the substrate, improving the bonding force between the white wall glue and the substrate, and solving the delamination problem between the white wall glue and the substrate.
[0026] The embodiments of the present application are further described below in conjunction with the accompanying drawings.
[0027] Example 1
[0028] Please refer to Figure 1 , 34. The LED device of the present invention comprises a substrate 1, an LED chip 2, a film 3, and a white wall glue 4. The LED chip 2 is placed on the front of the substrate 1, the film 3 is bonded to the light-emitting area of the LED chip 2 by an adhesive, the white wall glue 4 wraps the LED chip 2 and is attached to the front of the substrate 1, and the surface of the white wall glue 4 is flush with the surface of the film 3.
[0029] See also Figure 3 , 4 , a metal coating 10 is provided on the front of the substrate 1, and the metal coating 10 is prepared by chemical plating process. At the same time, the metal coating 10 includes palladium element, which can ensure the adhesion between the gold ball and the substrate during wire bonding while reducing the gold element and reducing the cost. The metal coating 10 includes a first coating 12 and a second coating 14 arranged at intervals, and the area of the second coating 14 is larger than the first coating 12. The first coating 12 includes a first side 122 and a second side 124 connected vertically, and the first side 122 and the second side 124 are both long strips. The first side 122 is arranged at the first edge of the substrate 1, and the second side 124 is arranged at the second edge of the substrate 1, and the first edge is connected to the second edge. The interval between the first side 122 and the first edge of the substrate 1, and the interval between the second side 124 and the second edge of the substrate 1 is not fixed, and can be adjusted according to the size of the LED device.
[0030] The second plating layer 14 includes a main body 142, a first protruding portion 144, a second protruding portion 146 and a third protruding portion 148. The main body 142 is spaced apart from the first side 122 and the second side 124 of the first plating layer 12, and the LED chip 2 is placed in the main body 142. In this embodiment, the first plating layer 12 includes a first side 122 and a second side 124, so that the LED chip 2 can be electrically connected to the first side 122 or the second side 124 of the first plating layer 12 through a welding wire, thereby being able to adapt to different types of LED chips. Among them, the area of the main body 142 is larger than the area of the LED chip 2. When the power of the LED chip 2 is greater than 10W, the area of the main body 142 is as large as possible while satisfying the bonding force between the substrate 1 and the white wall glue 4, which is conducive to heat dissipation; when the power of the LED chip is less than or equal to 10W, the area of the main body 142 is as small as possible while ensuring that the solid crystal adhesive does not overflow the second plating layer 14, thereby reducing the metal area on the substrate and improving the bonding force between the substrate and the white wall glue.
[0031] The first protrusion 144 extends from one side of the main body 142 and is spaced from the first side 122 of the first coating 12. The LED device further includes a Zener tube 5, which is placed on the first protrusion 144 of the second coating 14 and the first side 122 of the first coating 12. The second protrusion 146 extends in the same direction as the first protrusion 144 and is spaced from the first protrusion 144. The second protrusion 146 can be used to identify the direction of the substrate during the crystal bonding process, so as to facilitate the crystal bonding equipment to identify the placement position of the LED chip 2. The third protrusion 148 extends from the other side of the main body 142 and is spaced from the second side 124 of the first coating 12. The third protrusion 148 can assist in determining whether the position of the LED chip 2 meets the requirements during the appearance quality inspection after the LED chip 2 is eutecticized. In addition, when adjusting the machine, the second protrusion 146 and the third protrusion 148 can assist in visually determining whether the position of the LED chip 2 meets the requirements.
[0032] See also Figure 5 The back side of the substrate 1 is provided with a first electrode 16, a second electrode 17 and an auxiliary plate 18. The auxiliary plate 18 is located between the first electrode 16 and the second electrode 17 and is used to transfer the heat generated by the LED chip to achieve a heat dissipation effect. In addition, there is a notch on one side of the auxiliary plate 18 close to the second electrode 17 to facilitate the identification of the direction of the back side of the substrate. In this embodiment, the first electrode 16, the second electrode 17 and the auxiliary plate 18 are arranged at intervals on the back side of the substrate to achieve thermal and electrical separation.
[0033] White wall glue 4 is silicone resin, epoxy resin, epoxy molding compound (EMC, Epoxy Molding Compound) or sheet molding compound (SMC, Sheet Molding Compound). In the present embodiment, white wall glue 4 is also added with filler, and the filler can be spherical silica, metal powder, metal oxide or non-metallic mineral, which can reduce the thermal expansion coefficient of white wall glue 4, thereby narrowing the thermal expansion coefficient gap between substrate 1 and white wall glue 4. In addition, white wall glue 4 is also added with coupling agent, and the coupling agent includes a group combined with metal coating, and a group combined with white wall glue 4. For example, the group combined with metal coating can be amine, epoxy, alkoxy, etc., and the group combined with white wall glue 5 can be hydroxyl, alkoxy, etc. Thus, the bonding force between white wall glue and substrate is increased by coupling agent.
[0034] Compared with the prior art, the present application reduces the area of the metal coating on the substrate through the structural design of the metal coating, thereby increasing the contact area between the white wall glue and the substrate, improving the bonding force between the white wall glue and the substrate, and solving the delamination problem between the white wall glue and the substrate.
[0035] The present application may have a variety of modified implementations, for example, the surface of the film 3 is higher than the white wall glue 4, so that the side of the chip also emits light, thereby improving the light brightness of the LED device.
[0036] Example 2
[0037] See also Figure 6 Compared with Example 1, the LED device of Example 2 further includes a transparent glue 6, which covers the surface of the white wall glue 5 and the film 4. The transparent glue 6 can be a silicone resin or epoxy resin that is resistant to high temperatures of 150-180°C and has light transmittance, and is prepared by a plastic packaging process. Specifically, for high-power LED devices, high-temperature resistant silicone resin can be used, while low-power LED devices can use epoxy resin.
[0038] With regard to the cracking problem of the white wall glue in contact with the four corners of the diaphragm, the technicians believe after analysis that the white wall glue is in contact with the diaphragm all around, the lower surface of the diaphragm is bonded to the chip through an adhesive, and the upper surface of the diaphragm has no contact, which makes the force on the upper and lower surfaces of the diaphragm uneven, resulting in the white wall glue in contact with the four corners of the diaphragm being prone to cracking under high temperature and high humidity conditions. Based on this, the present embodiment covers the surface of the white wall glue and the diaphragm with transparent glue, which reduces the force difference between the upper and lower surfaces of the diaphragm, solves the cracking problem of the white wall glue under high temperature and high humidity conditions, and at the same time, the transparent glue can focus light, which can improve the luminous brightness of the LED device.
[0039] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0040] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. An LED device, comprising a substrate, an LED chip and white wall glue, wherein a metal coating is provided on the front side of the substrate, the metal coating comprises a first coating and a second coating arranged at intervals, the LED chip is placed on the second coating, the white wall glue wraps the LED chip and is bonded to the front side of the substrate; characterized in that: The area of the second plating layer is larger than that of the first plating layer. The first plating layer includes a first side and a second side that are vertically connected. The second plating layer is spaced apart from the first side and the second side.
2. The LED device according to claim 1, characterized in that: The first side edge is arranged at the first edge of the substrate, the second side edge is arranged at the second edge of the substrate, the first edge is connected to the second edge, and both the first side edge and the second side edge are in the shape of long strips.
3. The LED device according to claim 2, characterized in that: The second plating layer includes a main body portion, the main body portion is spaced apart from a first side edge and a second side edge of the first plating layer, and the LED chip is placed in the main body portion.
4. The LED device according to claim 3, characterized in that: The second plating layer further includes a first protruding portion, which extends from one side of the main body portion and is spaced apart from a first side edge of the first plating layer.
5. The LED device according to claim 4, characterized in that: The LED device further includes a Zener tube, and the Zener tube is placed on the first side of the first plating layer and the first protruding portion of the second plating layer.
6. The LED device according to claim 4, characterized in that: The second plating layer further includes a second protruding portion, the second protruding portion and the first protruding portion extend from the main body in the same direction, and the second protruding portion is spaced apart from the first protruding portion.
7. The LED device according to claim 6, characterized in that: The second plating layer further includes a third protruding portion, the third protruding portion extends from the main body portion, and the third protruding portion is spaced apart from the second side of the first plating layer.
8. The LED device according to any one of claims 1 to 7, characterized in that: The LED device also includes a membrane and transparent glue, the membrane is placed in the light-emitting area of the LED chip, the surface of the white wall glue is flush with the surface of the membrane, and the transparent glue covers the surfaces of the white wall glue and the membrane.