Display module and display device

Abstract

The embodiment of the utility model provides a display module and a display device, relates to the technical field of display, and is used for reducing the risk of wire breakage of a first flexible circuit board. The display module comprises a touch function layer, a first flexible circuit board and a first supporting layer. The touch function layer comprises a first binding part; the first binding part is located on the non-touch side. The first flexible circuit board is provided with a second binding part, a main body part and a bending part arranged between the second binding part and the main body part; the first supporting layer is arranged on the side, away from the touch function layer, of the first flexible circuit board, and the first supporting layer comprises a first supporting part and a second supporting part which are connected with each other; the first supporting part covers the second binding part and extends to the bending part; in the first direction, at least part of the second supporting part is located on the side, away from the touch function layer, of the first supporting part, and the bending rigidity of the second supporting part is smaller than that of the first supporting part. The display panel is used for displaying images.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] With the development of display technology, display devices (such as mobile phones, laptops or tablets) are increasingly used in people's lives. Among them, organic light-emitting diode (OLED) display devices have the advantages of active light emission, wide viewing angle, high contrast, fast response speed, low power consumption, and ultra-thinness, so they have attracted widespread attention. Utility Model Content

[0003] An object of the embodiments of the present disclosure is to provide a display module and a display device, which are used to reduce the risk of wiring breakage of a first flexible circuit board.

[0004] To achieve the above objectives, the embodiments of the present disclosure provide the following technical solutions:

[0005] In one aspect, a display module is provided. The display module includes a touch function layer, a first flexible circuit board, and a first support layer. The touch function layer has a touch side and a non-touch side that are arranged opposite to each other; the touch function layer includes a first binding portion; the first binding portion is located on the non-touch side. The first flexible circuit board has a second binding portion, a main body portion, and a bending portion arranged between the second binding portion and the main body portion; the second binding portion is bound and connected to the first binding portion, and the bending portion is bent toward the non-touch side so that the main body portion is bent to the non-touch side. The first support layer is arranged on a side of the first flexible circuit board away from the touch function layer, and the first support layer includes a first support portion and a second support portion that are connected to each other; the first support portion covers the second binding portion and extends to the bending portion; along the first direction, at least part of the second support portion is located on a side of the first support portion away from the touch function layer, and the bending stiffness of the second support portion is less than the bending stiffness of the first support portion.

[0006] In the above display module, the bending rigidity of the second support portion is smaller than the bending rigidity of the first support portion, so that the bending shape of the first flexible circuit board 30 is relatively smooth and the bending radius is relatively large near the end surface of the first support layer away from the touch function layer. Therefore, the first support layer provided in some embodiments of the present disclosure can improve the problem of the first flexible circuit board having a relatively sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of the wiring of the first flexible circuit board being broken.

[0007] In some embodiments, the second support portion includes a plurality of support bars; along a second direction, the plurality of support bars are arranged at intervals; wherein the second direction intersects with the first direction and is parallel to the touch function layer.

[0008] In some embodiments, the second supporting portion includes two supporting bars, and end surfaces of the two supporting bars that are away from each other are flush with the end surface of the first flexible circuit board.

[0009] In some embodiments, the second support portion includes a support bar; along the second direction, the maximum size of the support bar is smaller than the minimum size of the first support portion; wherein the second direction intersects the first direction and is parallel to the touch function layer.

[0010] In some embodiments, the second supporting portion is symmetrical about a first axis; the first axis extends along the first direction and passes through the center of the first flexible circuit board.

[0011] In some embodiments, along the second direction, the ratio of the size of the second supporting portion to the size of the first flexible circuit board is 0.1 to 0.2.

[0012] In some embodiments, the second supporting portion has a plurality of via holes; at least a portion of the orthographic projections of the plurality of via holes on the first flexible circuit board are located at the bending portion.

[0013] In some embodiments, the plurality of vias are symmetrical about a first axis; the first axis extends along the first direction and passes through a center of the first flexible circuit board.

[0014] In some embodiments, the shape of the orthographic projection of the via hole on the first flexible circuit board includes a long strip, and the via hole extends along a second direction; wherein the second direction intersects the first direction and is parallel to the touch function layer.

[0015] In some embodiments, the first support portion and the second support portion are integrally formed.

[0016] In some embodiments, the elastic modulus of the material of the second support portion is smaller than the elastic modulus of the material of the first support portion.

[0017] In some embodiments, along the first direction, the second supporting portion includes a first sub-portion and a second sub-portion, the first sub-portion is located between the first supporting portion and the second sub-portion, and an elastic modulus of a material of the second sub-portion is smaller than an elastic modulus of a material of the first sub-portion.

[0018] In some embodiments, the material of the first sub-portion includes ink, and the material of the second sub-portion includes foam.

[0019] In some embodiments, the material of the first supporting portion includes polyimide, and the material of the second supporting portion includes at least one of ink, foam, and glue.

[0020] In some embodiments, the material of the first supporting layer includes a main material and a doping material; the doping concentration of the doping material included in the second supporting portion is different from the doping concentration of the doping material included in the first supporting portion.

[0021] In some embodiments, along the first direction, the doping concentration of the doping material included in the second supporting portion gradually increases or gradually decreases.

[0022] In some embodiments, along the first direction, the orthographic projection of the end surface of the second supporting portion away from the first supporting portion on the first flexible circuit board is located at the bending portion, and the second supporting portion is partially located at the side of the first supporting portion away from the touch function layer, and partially located at the side of the first supporting portion away from the first flexible circuit board. Along the first direction, the portion of the second supporting portion located at the side of the first supporting portion away from the touch function layer is away from the surface of the first flexible circuit board, and the distance between the portion and the surface of the first flexible circuit board close to the second supporting portion is reduced.

[0023] In some embodiments, the maximum distance between the bending portion and the touch function layer is d1, and along the first direction, the distance between the end surface of the second support portion away from the first support portion and the end surface of the touch function layer close to the bending portion is d2, wherein d1-d2=0.1 mm.

[0024] In some embodiments, the bending radius of the first flexible circuit board is 0.3 mm to 0.5 mm.

[0025] In another aspect, a display device is provided, comprising: a module as described in any of the above embodiments.

[0026] The above-mentioned display device has the same structure and beneficial technical effects as the display panels provided in some of the above-mentioned embodiments, which will not be described in detail here. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0028] Figure 1 is a structural diagram of a display device according to some embodiments;

[0029] Figure 2 for Figure 1 A cross-sectional view along section line AA;

[0030] Figure 3 A structural diagram showing that the second supporting portion is located at the bending portion according to some embodiments;

[0031] Figure 4 A structural diagram showing that the second supporting portion extends to the main body portion according to some embodiments;

[0032] Figure 5 is a front view of a first flexible circuit board according to some embodiments;

[0033] Figure 6 for Figure 5 A cross-sectional view along section line HH;

[0034] Figure 7 is a rear view of a first flexible circuit board according to some embodiments;

[0035] Figure 8 A structural diagram showing a second supporting portion including two supporting bars according to some embodiments;

[0036] Fig. 9 A structural diagram showing a second supporting portion including a supporting bar according to some embodiments;

[0037] Fig.10 is a structural diagram showing that the size of the second supporting portion is reduced along the first direction according to some embodiments;

[0038] Fig.11 A structural diagram showing a second supporting portion including a plurality of via holes according to some embodiments;

[0039] Fig.12 A structural diagram showing a reduction in the number of vias along a first direction according to some embodiments;

[0040] Fig.13 A structural diagram showing that the second supporting portion includes a first sub-portion and a second sub-portion according to some embodiments;

[0041] Fig.14 for Fig.13 A cross-sectional view along section line BB;

[0042] Fig.15 is a structural diagram showing that the doping concentration of the doping material of the second supporting portion is greater than the doping concentration of the doping material of the first supporting portion according to some embodiments;

[0043] Fig.16 for Fig.15 A cross-sectional view along section line CC;

[0044] Fig.17 is a structural diagram of a doping concentration of a doping material of a second supporting portion according to some embodiments being less than a doping concentration of a doping material of a first supporting portion;

[0045] Fig.18 for Fig.17 A cross-sectional view along section line DD;

[0046] Fig.19 is another structural diagram in which the second supporting portion is located at the bending portion according to some embodiments;

[0047] Fig. 20 for Fig.19 A cross-sectional view along section line GG;

[0048] Fig.21 is a structural diagram of a first flexible circuit board according to some embodiments. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field belong to the scope of protection of the present disclosure.

[0050] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and other forms thereof, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open, inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0051] In the following, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0052] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0053] “At least one of A, B, and C” has the same meaning as “at least one of A, B, or C” and both include the following combinations of A, B, and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B, and C.

[0054] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0055] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [a stated condition or event] is detected" are optionally interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [a stated condition or event]" or "in response to detecting [a stated condition or event]," depending on the context.

[0056] The use of "adapted to" or "configured to" herein is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0057] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0058] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of variation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0059] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism may be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity may also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality may be, for example, the difference between the two equalities is less than or equal to 5% of either one.

[0060] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0061] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include shape deviations due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0062] The embodiment of the present disclosure provides a display device 1000, such as Figure 1 As shown, the display device 1000 can be a laptop computer, a tablet computer, a mobile phone, a personal digital assistant (PDA), a navigator, a wearable device, an augmented reality (AR) device, a virtual reality (VR) device, a car central control screen, or any other product or component with a display function.

[0063] The above-mentioned display device 1000 can be a liquid crystal display device (Liquid Crystal Display, LCD for short), an organic light emitting display device, a quantum dot light emitting display device (Quantum Dot Light Emitting Display, QLED for short), a micro light emitting diode (Micro Light Emitting Diode, MicroLED for short), a sub-millimeter light emitting diode (Mini Light Emitting Diode, Mini LED for short) or an active-matrix organic light emitting diode (AMOLED for short) display device.

[0064] It should be noted that Micro LED refers to an LED with a size (such as length) less than 50 μm, and Mini LED refers to an LED with a size (such as length) of 50 μm to 200 μm.

[0065] In the following embodiments, the display device 1000 is an OLED display device as an example to schematically illustrate some embodiments of the present disclosure. However, the implementation of the present disclosure is not limited thereto, and any other display device may also be considered as long as the same technical concept is applied.

[0066] In some embodiments, Figure 1 As shown, the display device 1000 includes a display module 100, such as Figure 2 As shown, the display module 100 includes a display panel 10 , and the display panel 10 has a display side 10A and a non-display side 10B that are oppositely disposed.

[0067] It should be noted that the display side 10A refers to the side of the display panel 10 that displays an image ( Figure 2 The non-display side 10B refers to the other side opposite to the display side 10A ( Figure 2 The lower side of the display panel 10).

[0068] In some embodiments, Figure 2 As shown, the display panel 10 includes a display function layer 11 and a touch function layer 12 .

[0069] like Figure 2As shown, the display function layer 11 is configured to realize the display function of the display panel 10. For example, the display function layer 11 includes a plurality of sub-pixels, and the plurality of sub-pixels may include a first sub-pixel emitting a first color, a second sub-pixel emitting a second color, and a third sub-pixel emitting a third color. The first color, the second color, and the third color are three primary colors. For example, the first color is red, the second color is blue, and the third color is green, which is not specifically limited in the embodiments of the present disclosure.

[0070] like Figure 2 As shown, the touch function layer 12 is located on one side of the display function layer 11, and the touch function layer 12 is configured to realize the touch function of the display panel 10. For example, the touch function layer 12 includes a plurality of touch electrodes, and the plurality of touch electrodes include a plurality of touch driving electrodes and a plurality of touch sensing electrodes, and the plurality of touch sensing electrodes and the plurality of touch driving electrodes are insulated from each other and cross-arranged.

[0071] In some embodiments, the display panel further includes a substrate and an encapsulation layer.

[0072] The substrate is located on a side of the display function layer 11 away from the touch function layer 12 , and the display function layer 11 is disposed on the substrate.

[0073] The substrate is a rigid substrate. For example, the rigid substrate may be a glass substrate or a polymethyl methacrylate (English: Polymethyl Methacrylate, abbreviated: PMMA) substrate.

[0074] The encapsulation layer is arranged between the display function layer 11 and the touch function layer 12, and the touch function layer 12 is arranged on the encapsulation layer. The encapsulation layer can be a rigid encapsulation or a flexible film encapsulation. In the case where the encapsulation layer is a rigid encapsulation, the encapsulation layer is a glass encapsulation. In the case where the encapsulation layer is a flexible film encapsulation, the encapsulation layer may include a layer of encapsulation film, or may include two or more layers of encapsulation films stacked in layers. For example, the encapsulation layer includes three layers of encapsulation films stacked in sequence.

[0075] Exemplarily, the substrate is a glass substrate, and the encapsulation layer is a glass encapsulation. The display module further includes an adhesive layer, which is located between the substrate and the encapsulation layer and surrounds a plurality of pixels. The material of the adhesive layer can be glass glue.

[0076] In some embodiments, Figure 2 As shown, the display module 100 further includes a main board 1 (English: Main Flexible Printed Circuit, abbreviated as: MFPC), which is located at the non-display side B of the display panel 10. The main board 1 is configured to provide signals to the display function layer 11 and the touch function layer 12.

[0077] In some embodiments, Figure 2 As shown, the display module 100 also includes a first flexible circuit board 30, and the first flexible circuit board 30 connects the touch function layer 12 and the main board 1. In this way, the main board 1 can provide a signal to the touch function layer 12 through the first flexible circuit board 30, and receive feedback signals from multiple touch electrodes, and judge whether the touch electrodes are touched by analyzing the feedback signals, thereby realizing the touch function. At this time, the first flexible circuit board 30 can be called a touch flexible circuit board (English: Touch Flexible Printed Circuit, abbreviated as: TFPC).

[0078] It should be noted that the first flexible circuit board 30 has two states: an unfolded state and a bent state. Figure 3 and Figure 4 As shown, the expanded state is Figure 5 , Figure 6 , Figure 7 and Figure 8 shown. Figure 8 The shape of the first flexible circuit board 30 in the unfolded state is substantially rectangular.

[0079] In this article, "roughly rectangular" means that the shape is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangle" here includes not only a basic rectangular shape, but also a shape similar to a rectangle. For example, the long side and the short side of the rectangle are curved at each intersection (i.e., the corner), that is, the corner is smooth and the shape is a rounded rectangle. The following is an example of the shape of the first flexible circuit board 30 in the unfolded state being roughly rectangular.

[0080] For example, Figure 3 and Figure 4 As shown, the touch function layer 12 has a touch side 12A and a non-touch side 12B that are arranged opposite to each other. The touch function layer 12 includes a first binding portion 121, for example, the first binding portion 121 includes a plurality of first binding pins 1211. The touch side 12A refers to a side of the touch function layer 12 that implements the touch function ( Figure 2 The non-touch side 12B refers to the other side opposite to the touch side 12A ( Figure 2 The lower side of the touch function layer 12).

[0081] like Figure 5 and Figure 6 As shown, the first flexible circuit board 30 has a second binding portion 31, a main body portion 32, and a bending portion 33 disposed between the second binding portion 31 and the main body portion 32. For example, the second binding portion 31 includes a plurality of second binding pins 311.

[0082] like Figure 3 and Figure 4 As shown, through the binding process, the second binding portion 31 and the first binding portion 121 are bound and connected, so that the touch function layer 12 and the first flexible circuit board 30 are bound and connected.

[0083] like Figure 3 and Figure 4 As shown, through the bending process, the bending portion 33 can be bent along the bending axis extending along the second direction Y toward the non-touch side 12B, so that the main body 32 is bent to the non-touch side 12B.

[0084] In some embodiments, Figure 6 and Figure 7 As shown, the main body 32 includes a plurality of plug pins 321, and the plug pins 321 are connected to the main board 1, so that the first flexible circuit board 30 is connected to the main board, and then the main board 1 is connected to the touch function layer 12. The bending axis is not an actual structure existing in the display panel 10, but is only a concept proposed to illustrate the bending process of the first flexible circuit board 30.

[0085] It should be noted that, in the binding process, generally, only part of the second binding portion 31 is bound to the first binding portion 121. Therefore, in the bending process, the bending portion 33 will drive the unbound second binding portion 31 to bend toward the non-touch side 12B. Figure 3 and Figure 4 As shown, the second binding portion 31 includes a first binding sub-portion 312 and a second binding sub-portion 313 connected to each other. The first binding sub-portion 312 is bound to the first binding portion 121, and the second binding sub-portion 313 is located between the first binding sub-portion 312 and the bend. The second binding sub-portion 313 is bent toward the non-touch side 12B.

[0086] In some embodiments, Figure 3 , Figure 4 , Figure 6 and Figure 7 As shown, the display module 100 further includes a first supporting layer 40. Figure 3 and Figure 4 As shown, the first supporting layer 40 is arranged on the side of the first flexible circuit board 30 away from the touch function layer 12, and the first supporting layer 40 covers the second binding part 31. In this way, the first supporting layer 40 can provide support for the second binding part 31, which can improve the deformation problem of the second binding part 31 and help improve the reliability of the binding between the second binding part 31 and the first binding part 121.

[0087] On this basis, if Figure 6 As shown, the display module 100 further includes a second adhesive layer 2. The second adhesive layer 2 is used to bond the first flexible circuit board 30 and the first supporting layer 40.

[0088] In some embodiments, Figure 6 As shown, the first flexible circuit board 30 includes a substrate layer 34, a first conductive layer 35 and a second conductive layer 36. The first conductive layer 35 is located on one side of the substrate layer 34, and the first conductive layer 35 includes a second binding pin 311. The second conductive layer 36 is located on a side of the substrate layer 34 away from the first conductive layer 35, and the second conductive layer 36 includes a plurality of plug pins 321.

[0089] In some embodiments, Figure 6 As shown, the display module 100 further includes a flattening layer 3, which is disposed on a side of the first conductive layer 35 away from the second conductive layer 36, and the flattening layer 3 covers a portion of the second binding pin 311 to improve the flatness of the second binding pin 311, thereby improving the stability and reliability of the connection between the second binding portion 31 and the first binding portion 121. For example, the material of the flattening layer 3 can be green oil.

[0090] In some embodiments, Figure 6 As shown, the display module 100 further includes a second supporting layer 4. The second supporting layer 4 is located on a side of the first conductive layer 35 away from the second conductive layer 36 and is located on the main body 32. In this way, the second supporting layer 4 can provide support for the main body 32, which can improve the problem of deformation of the main body 32.

[0091] In some embodiments, Figure 6 As shown, the display module 100 further includes a third supporting layer 5. The third supporting layer 5 is located on the side of the first conductive layer 35 away from the second conductive layer 36, located on the main body 32, and covers a plurality of plug pins 321. In this way, the third supporting layer 5 can provide support for the plurality of plug pins 321, which can improve the problem of deformation of the plurality of plug pins 321, and is conducive to improving the reliability of the connection between the plurality of plug pins 321 and the motherboard 1.

[0092] In some related technologies, the first supporting layer extends to the bending portion. The bending stiffness of the portion of the bending portion covered by the first supporting layer and the total bending stiffness of the first supporting layer is the first bending stiffness, which is relatively large and has a strong bending resistance. The bending stiffness of the portion of the bending portion not covered by the first supporting layer is the second bending stiffness, which is relatively small and has a small bending resistance, resulting in a large first bending stiffness difference (the difference between the first bending stiffness and the second bending stiffness). Near the end face of the first supporting layer away from the touch function layer, the bending shape of the first flexible circuit board is relatively sharp, resulting in a dead bend, and the bending radius is too small, which leads to a broken line of the first flexible circuit board.

[0093] In some other related technologies, the first supporting layer extends to the main body, and the bending stiffness and bending resistance of the first supporting layer are too large, which will increase the difficulty of bending the first flexible circuit board, resulting in a large elastic recovery force of the first flexible circuit board after bending, causing the first binding part and the second binding part to separate.

[0094] In order to solve the above technical problems, Figure 3 and Figure 4 As shown, some embodiments of the present disclosure provide a first supporting layer 40 including a first supporting portion 41 and a second supporting portion 42 connected to each other.

[0095] The first support portion 41 covers the second binding portion 31 and extends to the bending portion 33. In this way, the first support portion 41 can provide support for the second binding portion 31, improve the deformation problem of the second binding portion 31, and help improve the reliability of the binding between the second binding portion 31 and the first binding portion 121.

[0096] like Figure 3 As shown, along the first direction X (the first direction X and Figure 3 The second support portion 42 is at least partially located on a side of the first support portion 41 away from the touch function layer 12. The bending stiffness of the second support portion 42 is less than the bending stiffness of the first support portion 41. Bending stiffness refers to the ability of an object to resist bending deformation.

[0097] like Figure 3 As shown, when the second support portion 42 is projected onto the first flexible circuit board 30 and is located at the bending portion 33, the portion of the bending portion 33 covered by the first support portion 41 and the total bending stiffness of the first support portion 41 are the third bending stiffness, the portion of the bending portion 33 covered by the second support portion 42 and the total bending stiffness of the second support portion 42 are the fourth bending stiffness, the bending stiffness of the portion of the bending portion 33 not covered by the first supporting layer 40 is the fifth bending stiffness, and the difference between the fourth bending stiffness and the fifth bending stiffness is the second bending stiffness difference.

[0098] Among them, the third bending stiffness is substantially equal to the first bending stiffness, the fifth bending stiffness is substantially equal to the second bending stiffness, and the bending stiffness of the second support portion 42 is less than the bending stiffness of the first support portion 41. In this case, the fourth bending stiffness is less than the third bending stiffness, that is, the fourth bending stiffness is less than the first bending stiffness, so that the second bending stiffness difference is less than the first bending stiffness difference, and then near the end surface of the first support layer 40 away from the touch function layer 12, the bending shape of the first flexible circuit board 30 is relatively smooth and the bending radius is relatively large. Therefore, the first support layer 40 provided in some embodiments of the present disclosure can improve the problem that the bending shape of the first flexible circuit board 30 is relatively sharp, resulting in a dead bend, and the bending radius is relatively small, and reduce the risk of the routing of the first flexible circuit board 30 being broken.

[0099] like Figure 4 As shown, when the second support portion 42 extends to the main body portion 32, the bending rigidity of the second support portion 42 is less than the bending rigidity of the first support portion 41, which can reduce the bending rigidity of the first support layer 40, reduce the bending resistance of the first support layer 40, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. Therefore, the first support layer 40 provided in some embodiments of the present disclosure can improve the risk of separation of the first binding portion 121 and the second binding portion 31.

[0100] In general, the first supporting layer 40 provided in some embodiments of the present disclosure can improve the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of the wiring of the first flexible circuit board 30 being broken. The risk of the first binding portion 121 and the second binding portion 31 being separated can also be reduced.

[0101] In some embodiments, Figure 7 and Figure 8 As shown, the second support portion 42 includes a plurality of support bars 421. For example, the second support portion 42 includes two, three, five or ten support bars 421, which are not listed one by one in the embodiments of the present disclosure. Along the second direction Y, the plurality of support bars 421 are arranged at intervals. The second direction Y intersects with the first direction X and is parallel to the touch function layer 12, for example, the second direction Y and the touch function layer 12 are away from the surface of the display function layer 11.

[0102] By configuring in this manner, the bending stiffness of the second support portion 42 can be made smaller than the bending stiffness of the first support portion 41 , thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of the routing of the first flexible circuit board 30 being broken.

[0103] In some examples, such as Figure 8 As shown, the second support portion 42 includes two support bars 421, and the end surfaces of the two support bars 421 that are away from each other are aligned with the end surface of the first flexible circuit board 30, that is, the support bars 421 are located at the edge of the first flexible circuit board 30. In this way, the two support bars 421 can support the edge portion of the first flexible circuit board 30 and the middle portion of the first flexible circuit board 30.

[0104] In other embodiments, Fig. 9As shown, the second support portion 42 includes a support bar 421. Along the second direction Y, the maximum dimension of the support bar 421 is smaller than the minimum dimension of the first support portion 41. In this way, the bending stiffness of the second support portion 42 can be smaller than the bending stiffness of the first support portion 41, thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, and reducing the risk of the wiring of the first flexible circuit board 30 being broken.

[0105] In some embodiments, Figure 8 and Fig. 9 As shown, the second support portion 42 is symmetrical about the first axis X1. The first axis X1 extends along the first direction X and passes through the center of the first flexible circuit board 30. In this way, during the bending process of the first flexible circuit board 30, the forces on the parts of the second support portion 42 located on both sides of the first axis X1 are balanced, which can reduce the risk of distortion of the bending portion 33.

[0106] In some examples, such as Figure 8 As shown, the second support portion 42 includes two support bars 421 , and the two support bars 421 are located on both sides of the first axis X1 and are symmetrical with respect to the first axis X1 .

[0107] In other examples, such as Fig. 9 As shown, the second support portion 42 includes a support bar 421 , the first axis X1 passes through the support bar 421 , and portions of the support bar 421 located on both sides of the first axis X1 are symmetrical about the first axis X1 .

[0108] In some embodiments, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 along the second direction Y is 0.1-0.2. For example, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is any one of 0.1, 0.15 or 0.2.

[0109] In this way, on the one hand, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is greater than 0.1, which can increase the portion of the bending portion 33 covered by the second support portion 42, so that the second support portion 42 can better support the bending portion 33, thereby improving the risk of the wiring in the first flexible circuit board 30 being broken due to deformation of the bending portion 33.

[0110] On the other hand, the ratio of the size of the second support portion 42 to the size of the first flexible circuit board 30 is less than 0.2, which can reduce the second bending stiffness difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of wiring breakage of the first flexible circuit board 30. It can also reduce the bending stiffness of the first support layer 40, reduce the bending resistance of the first support layer 40, thereby reducing the bending difficulty of the first flexible circuit board 30, and reduce the elastic restoring force of the first flexible circuit board 30 after bending, which can improve the risk of separation of the first binding portion 121 and the second binding portion 31.

[0111] In some embodiments, Fig.10 As shown, along the first direction X, the size of the second support portion 42 along the second direction Y is reduced. In this way, on the one hand, the bending rigidity of the second support portion 42 along the first direction X can be reduced, thereby reducing the second bending rigidity difference, and near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of the wiring of the first flexible circuit board 30 being broken.

[0112] On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. The risk of separation of the first binding portion 121 and the second binding portion 31 can be improved.

[0113] In some embodiments, Fig.11 As shown, the second support portion 42 has a plurality of vias 422. At least part of the orthographic projection of the plurality of vias 422 on the first flexible circuit board 30 is located at the bending portion 33. In this way, the bending rigidity of the second support portion 42 can be made smaller than the rigidity of the first support portion 41, thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of the wiring of the first flexible circuit board 30 being broken.

[0114] It should be noted that, when the orthographic projection of the end surface of the second supporting portion 42 away from the first supporting portion 41 on the first flexible circuit board 30 is located at the bending portion 33, the orthographic projections of the plurality of vias 422 on the first flexible circuit board 30 are located at the bending portion 33. When the second supporting portion 42 extends to the main body 32, the orthographic projections of the plurality of vias 422 on the first flexible circuit board 30 are partially located at the bending portion 33 and partially located at the main body 32; or, the orthographic projections of the plurality of vias 422 on the first flexible circuit board 30 are all located at the bending portion 33.

[0115] In some embodiments, Fig.11As shown, the plurality of vias 422 are symmetrical about the first axis X1. In this way, during the bending process of the first flexible circuit board 30, the forces on the parts of the second support portion 42 located on both sides of the first axis X1 are balanced, which can reduce the risk of the bending portion 33 being twisted.

[0116] In some embodiments, the shape of the orthographic projection of the via hole 422 on the first flexible circuit board 30 includes a long strip, and the via hole 422 extends along the second direction Y.

[0117] For example, Fig.11 As shown, a plurality of via holes 422 are arranged into a plurality of columns of via holes 422 along the second direction Y, each column of via holes 422 includes a plurality of via holes 422 arranged at intervals along the second direction Y, and the via holes 422 in two adjacent columns are staggered. It is understandable that the via holes 422 in two adjacent columns may be partially staggered or completely staggered.

[0118] It should be noted that the shape of the orthographic projection of the via hole 422 on the first flexible circuit board 30 may also be other shapes, such as a circle, a rectangle, a regular polygon, a rhombus or a cross.

[0119] In some embodiments, Fig.12 As shown, the shapes of the orthographic projections of the plurality of vias 422 on the first flexible circuit board 30 are the same, and the number of the vias 422 decreases along the first direction X. In this way, on the one hand, the bending rigidity of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending rigidity difference, and near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of the wiring of the first flexible circuit board 30 being broken.

[0120] On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. The risk of separation of the first binding portion 121 and the second binding portion 31 can be improved.

[0121] In some embodiments, Figures 4 to 12 As shown, the first support portion 41 and the second support portion 42 are integrally formed. In this way, the processing of the first support portion 41 and the second support portion 42 is simple.

[0122] In some embodiments, the elastic modulus of the material of the second support portion 42 is smaller than the elastic modulus of the material of the first support portion 41. In this way, the bending rigidity of the second support portion 42 can be smaller than the rigidity of the first support portion 41, thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, thereby reducing the risk of the wiring of the first flexible circuit board 30 being broken.

[0123] Exemplarily, the material of the first supporting portion 41 includes polyimide, and the material of the second supporting portion 42 includes at least one of ink, foam and glue.

[0124] In some embodiments, Fig.13 and Fig.14 As shown, the second support portion 42 includes a plurality of sub-portions, and the elastic modulus of the materials of the plurality of sub-portions decreases along a direction. In this way, on the one hand, the bending stiffness of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending stiffness difference, and near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of the wiring of the first flexible circuit board 30 being broken.

[0125] On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. The risk of separation of the first binding portion 121 and the second binding portion 31 can be improved.

[0126] In some examples, such as Fig.13 and Fig.14 As shown, the second support portion 42 includes a first sub-portion 423 and a second sub-portion 424 . The first sub-portion 423 is located between the first support portion 41 and the second sub-portion 424 . The elastic modulus of the material of the second sub-portion 424 is smaller than that of the material of the first sub-portion 423 .

[0127] Exemplarily, the material of the first sub-portion 423 includes ink, and the material of the second sub-portion 424 includes foam.

[0128] Exemplarily, along the first direction X, the ratio of the size of the first sub-portion 423 to the size of the second sub-portion 424 is 1.

[0129] In some embodiments, the material of the first support layer 40 includes a main material and a doping material. The doping concentration of the doping material included in the second support portion 42 is different from the doping concentration of the doping material included in the first support portion 41, so that the bending stiffness of the second support portion 42 is less than the stiffness of the first support portion 41, thereby improving the problem of the first flexible circuit board 30 having a sharp bending shape resulting in a dead bend and a small bending radius, and reducing the risk of the wiring of the first flexible circuit board 30 being broken.

[0130] It should be noted that the doping concentration of the doping material included in the second supporting portion 42 may be greater than the doping concentration of the doping material included in the first supporting portion 41 , or may be less than the doping concentration of the doping material included in the first supporting portion 41 .

[0131] In some examples, such as Fig.15 and Fig.16 As shown, the main material is polyimide, and the doping material is a plasticizer. The plasticizer can reduce the bending stiffness of the plastic. The doping concentration of the doping material included in the second support part 42 is set to be greater than the doping concentration of the doping material included in the first support part 41, so that the bending stiffness of the second support part 42 is less than the stiffness of the first support part 41.

[0132] For example, the doping material includes aliphatic dicarboxylic acid esters, phthalic acid esters, polybenzoic acid esters, benzoic acid esters, polyol esters, chlorinated hydrocarbons, epoxy resins, or citrate esters.

[0133] In other examples, such as Fig.15 and Fig.16 As shown, the main material is polyimide, and the doping material is a toughening agent, which can also reduce the bending stiffness of the plastic. The doping concentration of the doping material included in the second support portion 42 is set to be greater than the doping concentration of the doping material included in the first support portion 41, so that the bending stiffness of the second support portion 42 is less than the stiffness of the first support portion 41.

[0134] For example, the doping material includes liquid polysulfide rubber, liquid acrylic rubber, liquid polybutadiene rubber, nitrile rubber, ethylene propylene rubber or styrene butadiene rubber, etc.

[0135] In some other examples, such as Fig.17 and Fig.18 As shown, the main material is polyimide, and the doping material is a reinforcing agent, which can increase the bending stiffness of the plastic. The doping concentration of the doping material included in the second support part 42 is less than the doping concentration of the doping material included in the first support part 41, so that the bending stiffness of the second support part 42 is less than the stiffness of the first support part 41.

[0136] For example, the doping material includes carbon fiber, glass fiber, or polyester fiber.

[0137] In some embodiments, the doping concentration of the doping material included in the second support portion 42 gradually increases or decreases along the first direction X. In this way, on the one hand, the bending stiffness of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending stiffness difference, and near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of the wiring of the first flexible circuit board 30 being broken.

[0138] On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. The risk of separation of the first binding portion 121 and the second binding portion 31 can be improved.

[0139] In some examples, such as Fig.15 and Fig.16 As shown, the doping concentration of the doping material included in the second support portion 42 is greater than the doping concentration of the doping material included in the first support portion 41, and the doping concentration of the doping material included in the second support portion 42 gradually increases along the first direction X. On the one hand, the bending stiffness of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending stiffness difference. On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced.

[0140] In other examples, such as Fig.17 and Fig.18 As shown, the doping concentration of the doping material included in the second support portion 42 is less than the doping concentration of the doping material included in the first support portion 41, and the doping concentration of the doping material included in the second support portion 42 gradually decreases along the first direction X. On the one hand, the bending stiffness of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending stiffness difference. On the other hand, the bending stiffness of the first support layer 40 can be further reduced, thereby reducing the bending resistance of the first support layer 40.

[0141] In some embodiments, Fig.19 , Fig. 20 and Fig.21 As shown, along the first direction X, the orthographic projection of the end surface of the second support portion 42 away from the first support portion 41 on the first flexible circuit board 30 is located at the bending portion 33. The second support portion 42 is partially located on the side of the first support portion 41 away from the touch function layer 12, and partially located on the side of the first support portion 41 away from the first flexible circuit board 30. In this way, the contact area between the second support portion 42 and the first support portion 41 can be increased, thereby improving the reliability of the first support portion 41 and the second support portion 42.

[0142] In some examples, the material of the first support portion 41 includes polyimide, and the material of the second support portion 42 includes ink. The second support portion 42 can be formed by coating ink near an edge of the first support portion 41 away from the touch function layer 12 .

[0143] In other examples, the material of the first support part 41 includes polyimide, and the material of the second support part 42 includes glue, and the second support part 42 can be formed by attaching glue to the edge of the first support part 41 away from the touch function layer 12. For example, the glue material includes sealant or UV glue.

[0144] Based on the above embodiments, Fig.19 , Fig. 20 and Fig.21 As shown, along the first direction X, the portion of the second support portion 42 located on the side of the first support portion 41 away from the touch function layer 12 is away from the surface of the first flexible circuit board 30, and the distance between the surface of the first flexible circuit board 30 close to the second support portion 42 is reduced. On the one hand, the bending rigidity of the second support portion 42 can be reduced along the first direction X, thereby reducing the second bending rigidity difference. Near the end surface of the second support portion 42 away from the first support portion 41, the bending shape of the first flexible circuit board 30 is smoother, which can reduce the risk of the wiring of the first flexible circuit board 30 being broken.

[0145] On the other hand, the bending stiffness of the first support layer 40 can be further reduced, and the bending resistance of the first support layer 40 can be reduced, thereby reducing the bending difficulty of the first flexible circuit board 30 and reducing the elastic restoring force of the first flexible circuit board 30 after bending. The risk of separation of the first binding portion 121 and the second binding portion 31 can be improved.

[0146] In some embodiments, Fig.21 As shown, the maximum distance between the bent portion 33 and the touch function layer 12 is d1. Fig. 20 As shown, along the first direction X, the distance between the end surface of the second support portion 42 away from the first support portion 41 and the end surface of the touch function layer 12 close to the bending portion 33 is d2, wherein d1-d2=0.1 mm.

[0147] In this way, in the bent state, the maximum distance between the bent portion 33 and the second support portion 42 can be smaller than the maximum distance between the bent portion 33 and the touch function layer 12, that is, the end of the bent portion 33 away from the touch function layer 12 is farther away from the touch function layer 12 than the end of the second support portion 42 away from the touch function layer 12. The frame of the display device 1000 corresponding to the bent portion 33 can be designed to be narrower, which is more conducive to the narrow frame design of the display device 1000.

[0148] In some embodiments, the bending radius of the first flexible circuit board 30 is 0.3 mm to 0.5 mm. For example, the bending radius of the bending portion 33 may be 0.3 mm, 0.36 mm, 0.38 mm, 0.4 mm, 0.42 mm, 0.46 or 0.5 mm.

[0149] It can be understood that the smaller the bending radius of the bending portion 33 is, the smaller the frame ( Figure 1 The lower frame in the display device 1000 can be designed to be narrower, which is more conducive to the narrow frame design of the display device 1000. Exemplarily, the bending radius of the bending portion 33 can be 0.3mm to 0.4mm. For example, the bending radius of the bending portion 33 can be 0.3mm, 0.32mm, 0.36 or 0.4, so that the frame ( Figure 1 The bottom border in the image can be made narrower.

[0150] In some embodiments, Figure 2 As shown, the display module 100 further includes a second flexible circuit board 50, which is connected to the display function layer 11 and the main board 1, so that the main board 1 can provide a signal to the display function layer 11 through the second flexible circuit board 50 to realize the display function. At this time, the second flexible circuit board 50 can be called a chip on film (English: Chip On Flex, abbreviated as: COF).

[0151] In some embodiments, the display module 100 further includes a cover plate 60, a first adhesive layer 70, a circular polarizer 80 and a buffer layer 90. The circular polarizer 80 is disposed on the display side of the display panel 10 and is configured to reduce the reflection of ambient light by the display panel 10.

[0152] The cover plate 60 is disposed on a side of the circular polarizer 80 away from the display panel 10 , and is configured to protect the display panel 10 and reduce the risk of the display panel 10 being scratched.

[0153] The first adhesive layer 70 is located between the cover plate 60 and the circular polarizer 80 , and the first adhesive layer 70 bonds the cover plate 60 and the circular polarizer 80 .

[0154] For example, the material of the first adhesive layer 70 may include other adhesive materials with high light transmittance, such as optically clear adhesive (OCA) or pressure sensitive adhesive (PSA). For example, the material of the first adhesive layer 70 includes optical adhesive.

[0155] The buffer layer 90 is located on the non-display side 10B of the display panel 10 . The buffer layer 90 can play a good buffering role, which is helpful to reduce the risk of damage to the display panel 10 .

[0156] Exemplarily, the material of the buffer layer 90 includes a super clean foam composite film (English: Super Clean Foam, abbreviated as: SCF).

[0157] For example, the ultra-clean foam composite film includes an adhesive layer, a buffer layer, and a heat dissipation layer which are sequentially stacked in a direction away from the display panel.

[0158] The adhesive layer is used to bond the buffer layer and the heat dissipation layer to one side of the display panel, and the adhesive layer may be flexible, which is beneficial to the flexible design of the display module 100. For example, the material of the adhesive layer includes a hydrophobic material.

[0159] The buffer layer can not only buffer the stress acting on the display panel 10, but also be used for light shielding, thereby improving the display effect of the display panel 10. For example, the material of the buffer layer includes foam, and the color of the buffer layer is darker (for example, the material of the buffer layer is black).

[0160] The heat dissipation layer can be used to dissipate the heat generated by the display panel 10 when it is working, so as to reduce the risk of the display panel 10 being burned due to the high heat of the display panel 10. For example, the material of the heat dissipation layer includes a metal material.

[0161] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0162] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be thought of by any person skilled in the art within the technical scope disclosed in the present disclosure should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A display module, characterized in that: include: The touch function layer has a touch side and a non-touch side that are arranged opposite to each other; the touch function layer includes a first binding portion, and the first binding portion is located on the non-touch side; The first flexible circuit board comprises a second binding portion, a main body portion, and a bending portion disposed between the second binding portion and the main body portion; the second binding portion is bound and connected to the first binding portion, and the bending portion is bent toward the non-touch side so that the main body portion is bent to the non-touch side; A first supporting layer is arranged on a side of the first flexible circuit board away from the touch function layer, the first supporting layer comprising a first supporting portion and a second supporting portion connected to each other; the first supporting portion covers the second binding portion and extends to the bending portion; Along the first direction, at least a portion of the second supporting portion is located on a side of the first supporting portion away from the touch function layer, and the bending stiffness of the second supporting portion is smaller than the bending stiffness of the first supporting portion.

2. The display module according to claim 1, characterized in that: The second supporting portion includes a plurality of supporting bars; the plurality of supporting bars are arranged at intervals along a second direction; the second direction intersects with the first direction and is parallel to the touch function layer.

3. The display module according to claim 2, characterized in that: The second supporting portion includes two supporting bars, and end surfaces of the two supporting bars that are away from each other are flush with the end surface of the first flexible circuit board.

4. The display module according to claim 1, characterized in that: The second supporting portion includes a supporting bar; along the second direction, the maximum size of the supporting bar is smaller than the minimum size of the first supporting portion; the second direction intersects the first direction and is parallel to the touch function layer.

5. The display module according to claim 2, characterized in that: The second supporting portion is symmetrical about a first axis; the first axis extends along the first direction and passes through the center of the first flexible circuit board.

6. The display module according to claim 2, characterized in that: Along the second direction, the ratio of the size of the second supporting portion to the size of the first flexible circuit board is 0.1 to 0.

2.

7. The display module according to claim 1, characterized in that: The second supporting portion has a plurality of via holes; at least part of the orthographic projections of the plurality of via holes on the first flexible circuit board are located at the bending portion.

8. The display module according to claim 7, characterized in that: The plurality of via holes are symmetrical about a first axis; the first axis extends along the first direction and passes through the center of the first flexible circuit board.

9. The display module according to claim 8, characterized in that: The shape of the orthographic projection of the via hole on the first flexible circuit board includes a long strip, and the via hole extends along a second direction; the second direction intersects the first direction and is parallel to the touch function layer.

10. The display module according to claim 2, characterized in that: The first supporting portion and the second supporting portion are integrally formed.

11. The display module according to any one of claims 1 to 9, characterized in that: The elastic modulus of the material of the second support portion is smaller than the elastic modulus of the material of the first support portion.

12. The display module according to claim 11, characterized in that: Along the first direction, the second supporting portion includes a first sub-portion and a second sub-portion, the first sub-portion is located between the first supporting portion and the second sub-portion, and an elastic modulus of a material of the second sub-portion is smaller than an elastic modulus of a material of the first sub-portion.

13. The display module according to claim 12, characterized in that: The material of the first sub-portion includes ink, and the material of the second sub-portion includes foam.

14. The display module according to claim 11, characterized in that: The material of the first supporting part includes polyimide, and the material of the second supporting part includes ink, foam or glue.

15. The display module according to claim 1, characterized in that: Along the first direction, the orthographic projection of the end surface of the second supporting portion away from the first supporting portion on the first flexible circuit board is located at the bending portion, and the second supporting portion is partially located at a side of the first supporting portion away from the touch function layer, and partially located at a side of the first supporting portion away from the first flexible circuit board; Along the first direction, a portion of the second supporting portion located on a side of the first supporting portion away from the touch function layer is away from the surface of the first flexible circuit board, and a distance between the portion and the surface of the first flexible circuit board close to the second supporting portion is reduced.

16. The display module according to claim 15, characterized in that: Along the first direction, the maximum distance between the bending portion and the touch function layer is d1, and the distance between the end surface of the second supporting portion away from the first supporting portion and the end surface of the touch function layer close to the bending portion is d2, wherein d1-d2=0.1 mm.

17. The display module according to claim 1, characterized in that: The bending radius of the first flexible circuit board is 0.3 mm to 0.5 mm.

18. A display device, characterized in that: It comprises the display module as claimed in any one of claims 1 to 17.

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