IC laser marking device suitable for trays, tubes and braids

Abstract

The utility model provides a tray, tubular and braid IC laser marking device which comprises a marking assembly, and the marking assembly comprises a marking device body, a workbench, a tubular feeder automatic feeding device, a tray automatic feeding and discharging device, a braid feeder automatic feeding device and a braid feeder automatic receiving device. According to the utility model, a chip is moved to a designated position through the swing arm discharging suction nozzle, once the chip is placed to the designated position, the laser marking machine starts to work and carries out accurate marking operation on the surface of the chip, and the material marking displacement device and the X-axis displacement module work cooperatively to move the marked chip to a discharging position, so that the chip is accurately marked. The device is provided with a braid feeder automatic receiving device and a swing arm discharging suction nozzle, chips are packaged in braids or discharged in a tubular mode, finally the marked chips are packaged in the braids, the feeding modes include the tubular mode, the braid mode and the tray mode, the discharging modes include the braid mode and the tubular mode, and chip marking in various packaging modes can be achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of IC chip marking, in particular to a laser marking device suitable for tray, tubular and braided ICs. Background Art

[0002] With the continuous development of semiconductor manufacturing technology, chip manufacturing and packaging processes are becoming increasingly complex, and the requirements for chip marking technology are becoming higher and higher. Chip marking, as an important link in the chip manufacturing process, not only requires high marking accuracy and fast speed, but also needs to adapt to chips in different packaging methods to ensure the efficiency, stability and reliability of the marking process;

[0003] At present, the main challenge facing chip marking equipment is how to flexibly adapt to different feeding and discharging requirements. Traditional marking equipment on the market can only handle a single feeding and discharging method and cannot meet the needs of diversified production. Therefore, a laser marking device suitable for trays, tubes and braided ICs is proposed. Utility Model Content

[0004] In view of this, the utility model provides a laser marking device suitable for trays, tubes and braided ICs to solve or alleviate the technical problems existing in the prior art and at least provide a beneficial choice.

[0005] The technical solution of the embodiment of the utility model is implemented as follows: it is applicable to a laser marking device for trays, tubular and braided ICs, including a marking component, wherein the marking component includes a marking device body, a workbench, a tubular feeder automatic feeding device, a tray automatic loading and unloading device, a braided feeder automatic feeding device, a braided feeder automatic receiving device, a laser marking machine, a swing arm discharge nozzle, a material marking displacement device, an X-axis displacement module, and a double pick-and-place nozzle;

[0006] A workbench is fixedly connected between the inner walls on both sides of the marking device body, a tubular feeder automatic feeding device and a pallet automatic loading and unloading device are fixedly connected to the top of the workbench, a braid feeder automatic feeding device and a braid feeder automatic receiving device are fixedly connected to the top of the workbench, a laser marking machine is fixedly connected to the inner wall on the rear side of the marking device body, a swing arm discharging nozzle and a material marking displacement device are fixedly connected to the inner wall on the left side of the marking device body, an X-axis displacement module is fixedly connected to the top of the workbench, and a double pick-and-place nozzle is slidably connected to the X-axis displacement module.

[0007] Further preferably, the automatic tray loading and unloading device is located on the left side of the tubular feeder automatic feeding device.

[0008] Further preferably, the braid feeder automatic material receiving device is located on the left side of the braid feeder automatic material feeding device.

[0009] Further preferably, the material marking displacement device is located below the swing arm discharge nozzle.

[0010] Further preferably, a support frame is rotatably connected to the top inner wall of the marking device body.

[0011] Further preferably, four universal wheels are fixedly connected to the bottom of the marking device body.

[0012] Further preferably, four levelers are fixedly connected to the bottom of the marking device body.

[0013] Further preferably, a baffle is fixedly connected to the inner wall of the support frame, and a handle is fixedly connected to one side of the support frame.

[0014] The embodiment of the utility model has the following advantages due to the adoption of the above technical solution:

[0015] The utility model moves the chip to the designated position through the swing arm discharging nozzle. Once the chip is placed in the designated position, the laser marking machine starts to work. The control system controls the path and power of the laser beam according to the preset marking pattern or text, and performs precise marking operations on the chip surface. The material marking displacement device and the X-axis displacement module work together to move the marked chip to the discharging position. According to the discharging method, the device is equipped with a braiding feeder automatic receiving device and a swing arm discharging nozzle to package the chip in the braid or discharge it in a tubular manner. Finally, the marked chip is packaged in the braid. The double pick-and-place nozzle is used to process multiple chips at the same time when necessary, so as to further improve the work efficiency. There are three feeding methods: tubular, braided, and tray, and there are two discharging methods: braided and tubular, which can realize chip marking in various packaging methods.

[0016] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or technical descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0019] Figure 2It is a partial three-dimensional structural diagram of the utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the support frame, baffle and handle of the utility model;

[0021] Figure 4 For the utility model Figure 2 Enlarged structural diagram of area A in the middle.

[0022] Figure numerals: 1. marking component; 2. marking device body; 3. workbench; 4. tubular feeder automatic feeding device; 5. tray automatic loading and unloading device; 6. braid feeder automatic feeding device; 7. braid feeder automatic receiving device; 8. laser marking machine; 9. swing arm discharge nozzle; 10. material marking displacement device; 11. X-axis displacement module; 12. double pick-and-place nozzle; 13. support frame; 14. baffle; 15. handle; 16. universal wheel; 17. leveler. DETAILED DESCRIPTION

[0023] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0024] The embodiments of the present utility model are described in detail below with reference to the accompanying drawings.

[0025] like Figure 1-Figure 4 As shown, the embodiment of the utility model provides a laser marking device suitable for tray, tubular and braided IC, including a marking component 1, the marking component 1 includes a marking device body 2, a workbench 3, a tubular feeder automatic feeding device 4, a tray automatic loading and unloading device 5, a braided feeder automatic feeding device 6, a braided feeder automatic receiving device 7, a laser marking machine 8, a swing arm discharge nozzle 9, a material marking displacement device 10, an X-axis displacement module 11, and a double pick-and-place nozzle 12;

[0026] A workbench 3 is fixedly connected between the inner walls on both sides of the marking device body 2, a tubular feeder automatic feeding device 4 and a tray automatic loading and unloading device 5 are fixedly connected to the top of the workbench 3, a braid feeder automatic feeding device 6 and a braid feeder automatic receiving device 7 are fixedly connected to the top of the workbench 3, a laser marking machine 8 is fixedly connected to the inner wall on the rear side of the marking device body 2, a swing arm discharge nozzle 9 and a material marking displacement device 10 are fixedly connected to the inner wall on the left side of the marking device body 2, an X-axis displacement module 11 is fixedly connected to the top of the workbench 3, a double pick-and-place nozzle 12 is slidably connected to the X-axis displacement module 11, the chip is moved to the specified position by the swing arm discharge nozzle 9, once the chip is placed at the specified position, laser marking The machine 8 starts to work, and the control system controls the path and power of the laser beam according to the preset marking pattern or text, and performs precise marking operations on the chip surface. The material marking displacement device 10 and the X-axis displacement module 11 work together to move the marked chip to the discharge position. According to the discharge method, the device is equipped with a braid feeder automatic receiving device 7 and a swing arm discharge suction nozzle 9 to package the chip in the braid or discharge it through a tubular method. Finally, the marked chip is packaged in the braid. The double pick-up and place suction nozzle 12 is used to process multiple chips at the same time when necessary, further improving work efficiency. There are three feeding methods: tubular, braid, and tray, and there are two discharge methods: braid and tubular, which can realize chip marking in various packaging methods.

[0027] In one embodiment, the automatic loading and unloading device 5 for pallets is located on the left side of the automatic feeding device 4 for tubular feeder. Placing the automatic loading and unloading device 5 for pallets on the left side of the automatic feeding device 4 for tubular feeder makes the layout of the entire marking system in the working area more reasonable and effectively utilizes the working space. This layout can ensure that the relative positions of various devices are appropriate, reduce mutual interference between equipment, and improve the operating efficiency of the entire system.

[0028] In one embodiment, the braid feeder automatic receiving device 7 is located on the left side of the braid feeder automatic feeding device 6. The adjacent layout of the braid feeder automatic feeding device 6 and the braid feeder automatic receiving device 7 ensures the continuity of the feeding and receiving processes. The chips are automatically supplied from the braid feeder automatic feeding device 6, and after processes such as marking, they can be directly received by the braid feeder automatic receiving device 7 on the left side without long-distance transmission or transfer, thereby ensuring the smoothness of the entire operation process.

[0029] In one embodiment, the material marking displacement device 10 is located below the swing arm discharge nozzle 9. After the chip is marked, the material marking displacement device 10 can quickly and accurately move the chip to the bottom of the swing arm discharge nozzle 9. Since the two are close in position, the time and distance of the material during the movement are reduced, thereby improving the smoothness of the entire marking and discharge process.

[0030] In one embodiment, a support frame 13 is rotatably connected to the top inner wall of the marking device body 2 .

[0031] In one embodiment, four universal wheels 16 are fixedly connected to the bottom of the marking device body 2, and the entire device can be moved by setting the universal wheels 16.

[0032] In one embodiment, four levelers 17 are fixedly connected to the bottom of the marking device body 2, and the stability of the entire device can be adjusted by the levelers 17.

[0033] In one embodiment, a baffle 14 is fixedly connected to the inner wall of the support frame 13, and a handle 15 is fixedly connected to one side of the support frame 13. The setting of the support frame 13 plays a supporting role.

[0034] The utility model is in operation: when in use, the marking device body 2 is equipped with three automatic feeding devices, namely, a tubular feeder automatic feeding device 4, a tray automatic loading and unloading device 5 and a tape feeder automatic feeding device 6, to meet the chip feeding requirements of different packaging methods, and the chip is moved to the designated position by the swing arm discharge nozzle 9. Once the chip is placed in the designated position, the laser marking machine 8 starts to work, and the control system controls the path and power of the laser beam according to the preset marking pattern or text, and performs precise marking operations on the chip surface, and the material marking position The shifting device 10 and the X-axis displacement module 11 work together to move the marked chip to the discharge position. According to the discharge method, the device is equipped with a tape feeder automatic receiving device 7 and a swing arm discharge nozzle 9 to package the chip in the tape or discharge it through a tubular method. Finally, the marked chip is packaged in the tape. The double pick-up and placement nozzle 12 is used to process multiple chips at the same time when necessary, further improving work efficiency. There are three feeding methods: tubular, tape, and tray, and there are two discharge methods: tape and tubular, which can realize chip marking in various packaging methods.

[0035] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A laser marking device for tray, tubular and braided ICs, comprising a marking component (1), characterized in that: The marking assembly (1) comprises a marking device body (2), a workbench (3), a tubular feeder automatic feeding device (4), a tray automatic loading and unloading device (5), a braided feeder automatic feeding device (6), a braided feeder automatic receiving device (7), a laser marking machine (8), a swing arm discharge nozzle (9), a material marking displacement device (10), an X-axis displacement module (11), and a double pick-and-place nozzle (12); A workbench (3) is fixedly connected between the inner walls on both sides of the marking device body (2); a tubular feeder automatic feeding device (4) and a tray automatic loading and unloading device (5) are fixedly connected to the top of the workbench (3); a braid feeder automatic feeding device (6) and a braid feeder automatic receiving device (7) are fixedly connected to the top of the workbench (3); a laser marking machine (8) is fixedly connected to the inner wall on the rear side of the marking device body (2); a swing arm discharge suction nozzle (9) and a material marking displacement device (10) are fixedly connected to the inner wall on the left side of the marking device body (2); an X-axis displacement module (11) is fixedly connected to the top of the workbench (3); and a double pick-and-place suction nozzle (12) is slidably connected to the X-axis displacement module (11).

2. The IC laser marking device for trays, tubes and braids according to claim 1 is characterized in that: The automatic tray loading and unloading device (5) is located on the left side of the tubular feeder automatic feeding device (4).

3. The laser marking device for tray, tube and braid IC according to claim 1 is characterized in that: The braiding feeder automatic material receiving device (7) is located on the left side of the braiding feeder automatic material feeding device (6).

4. The IC laser marking device for trays, tubes and braids according to claim 1 is characterized in that: The material marking displacement device (10) is located below the swing arm discharge suction nozzle (9).

5. The IC laser marking device for trays, tubes and braids according to claim 1 is characterized in that: A support frame (13) is rotatably connected to the top inner wall of the marking device body (2).

6. The IC laser marking device for trays, tubes and braids according to claim 1 is characterized in that: Four universal wheels (16) are fixedly connected to the bottom of the marking device body (2).

7. The IC laser marking device for trays, tubes and braids according to claim 1 is characterized in that: Four levelers (17) are fixedly connected to the bottom of the marking device body (2).

8. The IC laser marking device for trays, tubes and braids according to claim 5 is characterized in that: A baffle (14) is fixedly connected to the inner wall of the support frame (13), and a handle (15) is fixedly connected to one side of the support frame (13).

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