Rapid cooling device for modified epoxy resin

By designing a fast cooling device for modified epoxy resin including a U-shaped cooling tube, a heat conductor, annular body and a fan blade, the problem of limited flow rate of epoxy resin in the prior art is solved, and better cooling effect and flow rate improvement are achieved.

CN222768822UActive Publication Date: 2025-04-18LUOYANG XIZHIAO NEW MATERIAL TECH CO LTD
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Patent Information

Application Number
CN202421289437.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-06
Publication Date
2025-04-18
Estimated Expiration
2034-06-06

AI Technical Summary

Technical Problem

The flow rate of epoxy resin flowing in the tank body by the rapid cooling device in the existing epoxy resin processing is limited, especially the viscous fluid cannot accelerate the flowability through external pressurization.

Method used

A rapid cooling device for modified epoxy resin is designed, using a cooling tank and a cooling mechanism. The cooling mechanism includes a cooling component distributed in an array. The cooling component includes a U-shaped cooling tube, a heat conductor, an ring body and a fan blade. The movement of the sprocket and chain is driven by the motor, so that the fan blades rotate, form a cooling liquid convection, improve the cooling effect, and increase the flow rate in the pipe by pressurization.

Benefits of technology

The rapid cooling of epoxy resin is achieved and the cooling effect is improved. Especially when pressurizing is used, the flow rate can be appropriately increased and the cooling effect can be further improved.

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Abstract

The utility model discloses a quick cooling device for modified epoxy resin, which relates to the field of epoxy resin processing, and comprises a cooling pond, cooling liquid is arranged in the cooling pond, a cooling mechanism is arranged on the cooling pond, the cooling mechanism comprises cooling assemblies distributed in an array, and each cooling assembly comprises a U-shaped cooling pipe. The epoxy resin cooling device has the beneficial effects that epoxy resin enters the L-shaped pipe and the collecting pipe and enters the U-shaped cooling pipe through the collecting pipe, heat is transmitted to the heat-conducting fins, the contact area of the heat-conducting fins and cooling liquid is large, and therefore the heat is transmitted to the cooling liquid around the heat-conducting fins, and meanwhile the motor drives the chain wheel and the chain to move, so that the ring body and the fan blades rotate; the rotating fan blades blow away cooling liquid with the high temperature near the heat-conducting fins, cooling liquid convection is formed, the cooling liquid more evenly cools epoxy resin in the pipe, the cooling effect is good, meanwhile, the epoxy resin is conveyed through a pipeline, and the flow speed in the pipe can be properly increased through pressurization.
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Description

Technical Field

[0001] The utility model relates to the field of epoxy resin processing, in particular to a rapid cooling device for modified epoxy resin. Background Art

[0002] Epoxy resin is a high molecular polymer with the molecular formula (C11H12O3)n. It is a general term for a class of polymers containing two or more epoxy groups in the molecule. It is a condensation product of epichlorohydrin and bisphenol A or polyols. Due to the chemical activity of the epoxy group, it can be opened with a variety of compounds containing active hydrogen, cured and cross-linked to form a network structure, so it is a thermosetting resin. Bisphenol A type epoxy resin not only has the largest output and the most complete varieties, but also new modified varieties are still increasing and the quality is constantly improving.

[0003] For example, the patent document with the announcement number CN219968594U discloses a rapid cooling device for modified epoxy resin processing, in which the epoxy resin is discharged into the interior of the first spiral groove through the feed port, and the epoxy resin flows inside the first spiral groove for preliminary heat dissipation. The fan blades are driven to rotate by the acceleration component to accelerate the air circulation inside the box body, and the epoxy resin is further cooled. However, the epoxy resin in this scheme flows through the groove body, and the flow rate is greatly limited, especially the viscous fluid cannot be accelerated by external pressurization. Utility Model Content

[0004] The purpose of the utility model is to provide a rapid cooling device for modified epoxy resin in order to solve the above problems.

[0005] The utility model achieves the above-mentioned purpose through the following technical solutions:

[0006] A rapid cooling device for modified epoxy resin comprises a cooling pool, wherein a coolant is arranged inside the cooling pool, a cooling mechanism is arranged on the cooling pool, the cooling mechanism comprises cooling components distributed in an array, the cooling component comprises a U-shaped cooling pipe, a heat conducting sheet distributed in a circumferential array is fixedly connected to the middle of the U-shaped cooling pipe, a ring body is arranged on one side of the heat conducting sheet, the ring body is rotatably connected to the U-shaped cooling pipe, a fan blade distributed in a circumferential array is fixedly connected to one side of the ring body close to the heat conducting sheet, and symmetrically distributed heat dissipation adjustment mechanisms are arranged on the left and right sides of the top of the cooling pool.

[0007] Preferably, the cooling assembly also includes a motor, the motor is fixedly connected to the U-shaped cooling tube, the output shaft of the motor is fixedly connected to a sprocket, the end of the ring body away from the fan blades is fixedly connected to a chain ring, and a chain is meshed with the outer side of the chain ring and the sprocket.

[0008] Preferably, the cooling mechanism includes two collecting pipes, an L-shaped pipe is inserted in the middle of the top surface of the collecting pipe, and two ends of a U-shaped cooling pipe are inserted in the bottom of the collecting pipe.

[0009] Preferably, the heat dissipation adjustment mechanism includes two U-shaped plates, which are arranged on the outside of the collecting pipe. The two ends of the U-shaped plates are fixedly connected to the collecting pipe. Bidirectional threaded rods are provided on the left and right sides of the top of the cooling pool. The bidirectional threaded rods are rotatably connected to the cooling pool, and connecting rod assemblies are provided at both ends of the bidirectional threaded rods.

[0010] Preferably, the connecting rod assembly includes a slider, the slider is threadedly connected to the front and rear sides of the bidirectional threaded rod, the slider is slidably connected to the cooling pool, the slider is hinged with a connecting rod, and the connecting rod is hinged to the U-shaped plate.

[0011] Preferably, the rear end of the bidirectional threaded rod is fixedly connected with a pulley, the outer belt link of the pulley is connected with a belt, and the front end of the bidirectional threaded rod is provided with a knob.

[0012] The beneficial effect is that the epoxy resin enters the L-shaped tube and the collecting tube, enters the U-shaped cooling tube through the collecting tube, and transfers the heat to the heat conducting plate. The contact area between the heat conducting plate and the coolant is large, so the heat is transferred to the coolant around the heat conducting plate. At the same time, the motor drives the movement of the sprocket chain to rotate the ring body and the fan blades. The rotating fan blades blow away the coolant with higher temperature near the heat conducting plate, forming coolant convection, so that the coolant cools the epoxy resin in the tube more evenly, and the cooling effect is better. At the same time, the epoxy resin is transported by pipeline, and the flow rate in the tube can be appropriately increased by pressurizing.

[0013] The additional technical features and advantages of the present invention will be more clearly explained in the following description, or can be understood through the specific practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation to the present invention. In the accompanying drawings:

[0015] Figure 1 This is a first schematic diagram of a rapid cooling device for modified epoxy resin according to the utility model;

[0016] Figure 2 The utility model is a modified epoxy resin rapid cooling device Figure 1 A partial enlarged view of the middle part;

[0017] Figure 3 This is a schematic diagram of a heat dissipation mechanism of a rapid cooling device for modified epoxy resin according to the utility model;

[0018] Figure 4 The utility model is a modified epoxy resin rapid cooling device Figure 3 A partial enlarged view of point B in the middle.

[0019] The following are the descriptions of the reference numerals:

[0020] 100, cooling pool; 201, L-shaped tube; 202, collecting tube; 203, U-shaped cooling tube; 204, heat conducting plate; 205, ring body; 206, fan blade; 207, chain ring; 208, sprocket; 209, chain; 210, motor; 301, U-shaped plate; 302, two-way threaded rod; 303, connecting rod; 304, slider; 305, pulley; 306, belt; 307, knob. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0023] The utility model is further described below in conjunction with the accompanying drawings:

[0024] like Figure 1 - Figure 4 As shown, a rapid cooling device for modified epoxy resin includes a cooling pool 100, wherein a coolant is arranged inside the cooling pool 100, a cooling mechanism is arranged on the cooling pool 100, the cooling mechanism includes a cooling component distributed in an array, the cooling component includes a U-shaped cooling pipe 203, a heat conducting sheet 204 distributed in a circular array is fixedly connected to the middle of the U-shaped cooling pipe 203, a ring body 205 is arranged on one side of the heat conducting sheet 204, the ring body 205 is rotatably connected to the U-shaped cooling pipe 203, a fan blade 206 distributed in a circular array is fixedly connected to one side of the ring body 205 close to the heat conducting sheet 204, and symmetrically distributed heat dissipation adjustment mechanisms are arranged on the left and right sides of the top of the cooling pool 100.

[0025] The U-shaped cooling tube 203 guides the epoxy resin into the coolant, the heat conductive sheet 204 is used to increase the contact area with the coolant, so that the heat dissipation and cooling are faster, and the ring body 205 is used to keep the fan blades 206 rotatable. When the fan blades 206 rotate, the coolant around the heat conductive sheet 204 is driven to flow, so that the coolant can take away excess heat in time, making the cooling more uniform.

[0026] The cooling assembly also includes a motor 210, which is fixedly connected to the U-shaped cooling tube 203. The output shaft of the motor 210 is fixedly connected to a sprocket 208. The end of the ring body 205 away from the fan blades 206 is fixedly connected to a chain ring 207. The outer sides of the chain ring 207 and the sprocket 208 are meshed with a chain 209.

[0027] The motor 210 provides a rotational power to drive the sprocket 208 to rotate, drives the chain ring 207 to rotate through the chain 209, and finally drives the ring body 205 and the fan blades 206 to rotate.

[0028] The cooling mechanism includes two collecting pipes 202 . An L-shaped pipe 201 is inserted in the middle of the top surface of the collecting pipe 202 . Both ends of a U-shaped cooling pipe 203 are inserted in the bottom of the collecting pipe 202 .

[0029] The collecting pipe 202 connects a plurality of U-shaped cooling pipes 203 together. The L-shaped pipe 201 on one side is used for the inflow of epoxy resin, and the L-shaped pipe 201 on the other side is used for the outflow of epoxy resin.

[0030] The heat dissipation adjustment mechanism includes two U-shaped plates 301, which are arranged on the outside of the collecting pipe 202. The two ends of the U-shaped plate 301 are fixedly connected to the collecting pipe 202. Bidirectional threaded rods 302 are provided on the left and right sides of the top of the cooling pool 100. The bidirectional threaded rods 302 are rotatably connected to the cooling pool 100, and connecting rod assemblies are provided at both ends of the bidirectional threaded rods 302.

[0031] The U-shaped plate 301 is used to connect the connecting rod assembly, and the rotation of the bidirectional threaded rod 302 can control the sliders 304 on both sides to move closer to or away from each other.

[0032] The connecting rod assembly includes a slider 304 , which is threadedly connected to the front and rear sides of the bidirectional threaded rod 302 , and the slider 304 is slidably connected to the cooling pool 100 . The slider 304 is hinged with a connecting rod 303 , and the connecting rod 303 is hinged to the U-shaped plate 301 .

[0033] When the sliders 304 are close to each other, the top of the connecting rod 303 is driven to push up the U-shaped plate 301. When the sliders 304 are away from each other, the top of the connecting rod 303 is driven to pull the U-shaped plate 301 downward. When moving downward, the depth of immersion of the U-shaped cooling tube 203 in the coolant deepens. When the flow rate in the tube is faster, it can still be immersed in the coolant for a longer time, thereby achieving a better cooling effect.

[0034] The rear end of the bidirectional threaded rod 302 is fixedly connected with a pulley 305 , the outer belt link of the pulley 305 is connected with a belt 306 , and the front end of the bidirectional threaded rod 302 is provided with a knob 307 .

[0035] The belt 306 is used to keep the pulley 305 rotating synchronously, thereby driving the rotation of the bidirectional threaded rod 302 . The rotation of the bidirectional threaded rod 302 drives the movement of the slider 304 . The knob 307 facilitates manual control of the rotation of the bidirectional threaded rod 302 .

[0036] Working principle:

[0037] The epoxy resin enters the collecting pipe 202 from the L-shaped tube 201 on one side, and then enters multiple U-shaped cooling tubes 203. The U-shaped cooling tubes 203 are immersed in the coolant in the cooling pool 100. The heat conductive sheet 204 takes away most of the heat in the epoxy resin, and the epoxy resin cools down quickly. At the same time, the motor 210 drives the sprocket 208 to rotate. The sprocket 208 drives the chain ring 207 to rotate through the chain 209, and then drives the ring body 205 and the fan blades 206 to rotate. The fan blades 206 blow away the coolant near the heat conductive sheet 204, so that the local temperature of the coolant is more uniform and the cooling effect is better.

[0038] As external pressure is applied, the flow rate of the epoxy resin inside the U-shaped cooling tube 203 is accelerated, the time the epoxy resin stays in the coolant becomes shorter, and the cooling effect is poor. Therefore, the knob 307 is manually rotated to drive the bidirectional threaded rod 302 to rotate. The two bidirectional threaded rods 302 rotate synchronously through the pulley 305 and the belt 306. The sliders 304 on both sides drive the U-shaped plate 301 on the same side to descend through the connecting rod 303, causing the collecting tube 202 to descend. The immersion depth of the U-shaped cooling tube 203 in the coolant increases, which increases the time the epoxy resin stays in the coolant and achieves a better cooling effect.

[0039] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A rapid cooling device for modified epoxy resin, comprising a cooling pool (100), wherein a coolant is provided inside the cooling pool (100), characterized in that: The cooling pool (100) is provided with a cooling mechanism, the cooling mechanism includes a cooling component distributed in an array, the cooling component includes a U-shaped cooling pipe (203), the middle part of the U-shaped cooling pipe (203) is fixedly connected with a heat conducting plate (204) distributed in a circular array, one side of the heat conducting plate (204) is provided with a ring body (205), the ring body (205) is rotatably connected to the U-shaped cooling pipe (203), and the side of the ring body (205) close to the heat conducting plate (204) is fixedly connected with fan blades (206) distributed in a circular array, and the left and right sides of the top of the cooling pool (100) are provided with symmetrically distributed heat dissipation adjustment mechanisms.

2. The rapid cooling device for modified epoxy resin according to claim 1, characterized in that: The cooling assembly also includes a motor (210), the motor (210) is fixedly connected to the U-shaped cooling tube (203), the output shaft of the motor (210) is fixedly connected to a sprocket (208), one end of the ring body (205) away from the fan blade (206) is fixedly connected to a chain ring (207), and a chain (209) is meshed between the outer sides of the chain ring (207) and the sprocket (208).

3. The rapid cooling device for modified epoxy resin according to claim 1, characterized in that: The cooling mechanism comprises two collecting pipes (202), an L-shaped pipe (201) is inserted in the middle of the top surface of the collecting pipe (202), and two ends of the U-shaped cooling pipe (203) are inserted in the bottom of the collecting pipe (202).

4. A rapid cooling device for modified epoxy resin according to claim 3, characterized in that: The heat dissipation adjustment mechanism comprises two U-shaped plates (301), wherein the U-shaped plates (301) are arranged on the outside of the collecting pipe (202), and the two ends of the U-shaped plates (301) are fixedly connected to the collecting pipe (202). Bidirectional threaded rods (302) are arranged on the left and right sides of the top of the cooling pool (100), and the bidirectional threaded rods (302) are rotatably connected to the cooling pool (100), and connecting rod assemblies are arranged at the two ends of the bidirectional threaded rods (302).

5. A rapid cooling device for modified epoxy resin according to claim 4, characterized in that: The connecting rod assembly includes a slider (304), the slider (304) is threadedly connected to the front and rear sides of the bidirectional threaded rod (302), the slider (304) is slidably connected to the cooling pool (100), the slider (304) is hinged with a connecting rod (303), and the connecting rod (303) is hinged to the U-shaped plate (301).

6. A rapid cooling device for modified epoxy resin according to claim 4, characterized in that: The rear end of the bidirectional threaded rod (302) is fixedly connected to a pulley (305), the outer belt of the pulley (305) is connected to a belt (306), and the front end of the bidirectional threaded rod (302) is provided with a knob (307).

Citation Information

Patent Citations

  • Rapid cooling device for processing modified epoxy resin

    CN219968594U