Gas uniformizing device and coating equipment

Abstract

The utility model provides a gas uniformizing device and coating equipment, and relates to the technical field of coating equipment. The gas uniformizing device comprises a plate body assembly which is provided with a cavity and a plurality of through holes, and the through holes are communicated with the cavity and the outside; the gas uniformizing pipe is arranged in the cavity, the gas uniformizing pipe comprises a gas inlet and a plurality of gas outlets, and the lengths of paths from the gas outlets to the gas inlet are the same, so that the gas outlet uniformity is improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of film coating equipment, and in particular to a gas homogenizing device and a film coating equipment. Background Art

[0002] In the photovoltaic industry, vacuum coating equipment plays an important role. For example, in the processing of solar cells, vacuum coating equipment can coat thin films such as aluminum oxide and silicon nitride on silicon substrates to improve the photoelectric conversion efficiency and enhance the stability of photovoltaic devices. It can be seen that the uniformity of coating is one of the key factors affecting the quality of solar cells.

[0003] During the coating process, the process gas is introduced into the process chamber of the vacuum coating equipment, and is heated and decomposed by the hot wire, and is evenly coated on the battery cell. In the related art, the process gas is mostly introduced into the coating equipment through a gas homogenizing device to slow down the discharge rate of the process gas in the process chamber and promote the uniform distribution of gas molecules. The traditional gas homogenizing device includes a gas homogenizing tube or a gas homogenizing plate. However, due to the characteristics of the gas itself and the structural defects of the traditional gas homogenizing device, it is difficult to ensure the uniform outflow of the process gas, which in turn affects the coating quality of the battery cell. Utility Model Content

[0004] In view of this, the present disclosure provides a gas homogenizing device and a coating device to improve the uniformity of the output gas.

[0005] In a first aspect, an embodiment of the present disclosure provides an air uniforming device, comprising: a plate assembly having a chamber, the plate assembly having a plurality of through holes, the through holes connecting the chamber with the outside; an air uniforming pipe, arranged in the chamber, the air uniforming pipe comprising an air inlet and a plurality of air outlets, and the length of the path from each air outlet to the air inlet is the same.

[0006] In combination with the first aspect, in certain implementations of the first aspect, the air uniforming pipe includes a multi-level pipeline from level one to level N, wherein each level of the pipeline includes an air inlet interface and an air outlet interface, and the air outlet interface of the upper-level pipeline is connected to the air inlet interface of the lower-level pipeline in accordance with the hierarchical order, and N is a positive integer.

[0007] In combination with the first aspect, in certain implementations of the first aspect, each level of the pipeline includes two gas outlet interfaces, the two gas outlet interfaces are respectively arranged at two ends of the pipeline, and the gas inlet interface is arranged in the middle position of the pipeline.

[0008] In combination with the first aspect, in certain implementations of the first aspect, an air outlet assembly is provided on the air outlet interface of the Nth stage pipeline, the air outlet assembly includes a plurality of air outlets, and the angles between at least some adjacent two air outlets are the same.

[0009] In combination with the first aspect, in certain implementations of the first aspect, a diameter of the upper-level pipeline is greater than a diameter of the lower-level pipeline.

[0010] In combination with the first aspect, in some implementations of the first aspect, a plurality of through holes are arranged in an array.

[0011] In combination with the first aspect, in certain implementations of the first aspect, the plate assembly includes a first plate, the first plate includes a first surface and a second surface arranged opposite to each other, the second surface is close to the gas equalizing tube, the through hole passes through the first surface and the second surface, and the diameter of the through hole gradually increases in the direction from the first surface to the second surface.

[0012] In combination with the first aspect, in certain implementations of the first aspect, a surface of the first plate away from the gas uniformizing tube has at least one step groove.

[0013] In combination with the first aspect, in certain implementations of the first aspect, the plate assembly includes: a second plate, arranged opposite to the first plate and connected to the first plate to form a chamber; a fixing member, arranged on the second plate, configured to fix the gas uniformizing tube to the second plate.

[0014] In combination with the first aspect, in some implementations of the first aspect, a plurality of strip-shaped barriers are disposed in the chamber, the plurality of strip-shaped barriers divide the chamber into a plurality of sub-areas, and the air uniforming pipe in each sub-area includes at least one air outlet.

[0015] In a second aspect, an embodiment of the present disclosure provides a coating device, including a process chamber and a gas homogenizing device as provided in the first aspect above, wherein the gas homogenizing device is disposed in the process chamber.

[0016] In the gas homogenizing device provided by the present disclosure, the length of the path from each gas outlet to the gas inlet is the same, so when the gas enters the gas homogenizing tube from the gas inlet, the gas can reach each gas outlet at the same time, so that each gas outlet can discharge gas at the same time. This arrangement can avoid the problem that the gas flow rate is large at the position close to the gas inlet and small at the position far from the gas inlet, thereby improving the uniformity of the gas outlet and further improving the coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and other purposes, features and advantages of the present disclosure will become more apparent by describing the embodiments of the present disclosure in more detail in conjunction with the accompanying drawings. The accompanying drawings are used to provide a further understanding of the embodiments of the present disclosure and constitute a part of the specification. Together with the embodiments of the present disclosure, they are used to explain the present disclosure and do not constitute a limitation of the present disclosure. In the drawings, the same reference numerals generally represent the same components or steps.

[0018] Figure 1a Shown is a top view of a gas uniforming device provided by an exemplary embodiment of the present disclosure.

[0019] Figure 1b Shown is a bottom view of a gas uniforming device provided by an exemplary embodiment of the present disclosure.

[0020] Figure 2 Shown is an exploded schematic diagram of a gas homogenizing device provided by an exemplary embodiment of the present disclosure.

[0021] Figure 3 Shown is a schematic structural diagram of an air homogenizing tube provided by an exemplary embodiment of the present disclosure.

[0022] Figure 4 Shown is a schematic structural diagram of a second plate provided by an exemplary embodiment of the present disclosure.

[0023] Figure 5 Shown is a schematic structural diagram of a first surface of a first plate provided by an exemplary embodiment of the present disclosure.

[0024] Figure 6 Shown Figure 5 The illustrated embodiment provides a schematic cross-sectional view of the first plate along AA.

[0025] Figure 7 Shown is a schematic structural diagram of the second surface of the first plate provided by an exemplary embodiment of the present disclosure.

[0026] Figure 8 Shown Figure 6 The illustrated embodiment provides a partial enlarged view of the first plate in region B.

[0027] Reference numerals:

[0028] 100, plate assembly; 110, first plate; 111, step groove; 112, through hole; 113, first side of the first plate; 114, second side of the first plate; 120, second plate; 121, strip-shaped block; 130, fixing piece; 200, air-distributing pipe; 210, primary pipeline; 211, air inlet interface of primary pipeline; 212, air outlet interface of primary pipeline; 220, secondary pipeline; 221, air inlet interface of secondary pipeline; 222, air outlet interface of secondary pipeline; 230, N-level pipeline; 231, air inlet interface of N-level pipeline; 232, air outlet interface of N-level pipeline; 240, air outlet assembly. DETAILED DESCRIPTION

[0029] The following will be combined with the drawings in the embodiments of the present disclosure to clearly and completely describe the technical solutions in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0030] In the related art, vacuum coating equipment mostly uses a uniform gas pipe or a uniform gas plate structure to pass the process gas into the process chamber. The uniform gas pipe is processed with multiple dense small holes. After the process gas passes into the pipe of the uniform gas pipe, it enters the process chamber through the small holes. The uniform gas pipe has a simple structure and is easy to install. But its disadvantages are also obvious: in the process chamber, the spacing between the multiple uniform gas pipes is large. At the same time, the outlet direction of the process gas is determined by the direction of the processing hole, which makes the overall distribution of the gas uneven; and, the flow rate of the process gas is large at the position close to the air inlet, and the flow rate is small at the position far from the air inlet, which further reduces the uniformity of the process gas outlet.

[0031] The gas distribution plate is a hollow plate structure with multiple dense small holes. The process gas directly enters the hollow plate and flows into the process chamber through the small holes. The disadvantages of the gas distribution plate are similar to those of the gas distribution pipe. The flow rate is large at the position close to the gas inlet and small at the position far from the gas inlet.

[0032] It can be seen that the gas uniformity pipe or gas uniformity plate structure in the related art is difficult to ensure the uniformity of the gas output, which in turn affects the uniformity of the coating.

[0033] In view of the above technical problems, the present disclosure provides an air uniforming device, comprising: a plate assembly having a chamber, the plate assembly having multiple through holes, the through holes connecting the chamber and the outside; an air uniforming pipe arranged in the chamber, the air uniforming pipe comprising an air inlet and multiple air outlets, and the length of the path from each air outlet to the air inlet is the same to improve the uniformity of the air outlet.

[0034] The gas homogenizing device provided by the embodiment of the present disclosure is described below with reference to the accompanying drawings.

[0035] Figure 1a , Figure 1b Shown are a top view and a bottom view respectively of a gas uniforming device provided by an exemplary embodiment of the present disclosure. Figure 2 The figure shows an exploded schematic diagram of a gas homogenizing device provided by an exemplary embodiment of the present disclosure. Figure 2 As shown, the gas homogenizing device is overall plate-shaped on the outside, including a plate assembly 100 and a gas homogenizing pipe 200 .

[0036] The board assembly 100 is composed of a first board 110 and a second board 120, and is hollow inside to form a chamber structure. The first board 110 has a plurality of through holes 112, which penetrate the upper and lower surfaces of the first board 110, so that the internal chamber of the board assembly 100 is connected to the outside of the board assembly 100.

[0037] The gas-leveling pipe 200 is disposed in the chamber of the plate assembly 100. The gas-leveling pipe 200 includes an air inlet and a plurality of air outlets, and the length of the path from each air outlet to the air inlet is the same. The gas enters the gas-leveling pipe 200 from the air inlet, and flows out from the plurality of air outlets respectively, and enters the chamber of the plate assembly 100. The gas fills the chamber of the plate assembly 100, and flows out of the gas-leveling device through the through hole 112 on the first plate 110, and enters the external environment.

[0038] The cross-sectional shape of the first plate 110 may be rectangular, circular, or irregular, which is not specifically limited in the present disclosure. The cross-sectional shape of the second plate 120 may be rectangular, circular, or irregular, which is not specifically limited in the present disclosure. The cross-sectional shape of the first plate 110 may be the same as or different from the cross-sectional shape of the second plate 120.

[0039] The first plate 110 and the second plate 120 may be detachably connected by bolts, nuts, screws, snaps, etc., or may be non-detachably connected by welding, bonding, etc. The present disclosure does not specifically limit the connection method between the first plate 110 and the second plate 120.

[0040] The cross-sectional shape of the gas homogenizing tube 200 may be a circular ring, a polygonal ring, or other irregular ring shapes. The present disclosure does not specifically limit the cross-sectional shape of the gas homogenizing tube 200 .

[0041] In this embodiment, the length of the path from each gas outlet to the gas inlet is the same, so when the gas enters the gas uniformizing tube 200 from the gas inlet, the gas can reach each gas outlet at the same time, so that each gas outlet can discharge gas at the same time. This arrangement can avoid the problem that the gas flow rate is large at the position close to the gas inlet and the gas flow rate is small at the position far from the gas inlet, thereby improving the uniformity of the gas outlet and further improving the coating quality.

[0042] Combine the following Figure 3 The specific structure of the gas homogenizing pipe 200 is further described. Figure 3 FIG. 2 is a schematic diagram of the structure of an air-distributing tube 200 provided by an exemplary embodiment of the present disclosure. Figure 3 As shown, the gas uniforming pipe 200 includes multiple pipelines from level 1 to level N, where N is a positive integer. Each pipeline level includes an air inlet interface and an air outlet interface, and in accordance with the hierarchical order, the air outlet interface of the upper pipeline is connected to the air inlet interface of the lower pipeline.

[0043] Specifically, the air inlet interface 211 of the first-level pipeline is connected to the gas input pipeline, the air outlet interface 212 of the first-level pipeline is connected to the air inlet interface 221 of the second-level pipeline, the air outlet interface 222 of the second-level pipeline is connected to the air inlet interface of the third-level pipeline, and so on. It is worth noting that each level of pipeline includes at least two air outlet interfaces, and each air outlet interface is respectively connected to a lower-level pipeline, so that the gas uniformity pipe 200 has a branched structure as a whole.

[0044] The lengths of the paths from the multiple gas outlets included in each level of pipeline to its gas inlet are the same, so that for each level of pipeline, the gas can flow out from the multiple gas outlets synchronously and enter the lower level pipeline. For example, the connection between the upper level pipeline and the lower level pipeline can be set as a three-way pipe structure, such as Figure 3 In the embodiment shown, the lower-level pipeline may include two gas outlet interfaces. Alternatively, the connection between the upper-level pipeline and the lower-level pipeline may be set as a four-way pipe structure, and the lower-level pipeline may include three gas outlet interfaces. It is understandable that the number of gas outlet interfaces included in each level of pipeline can be specifically set according to the actual application scenario; similarly, the specific number of levels of the multi-level pipelines included in the gas homogenizing pipe 200 can also be specifically set according to the actual situation such as the size of the gas homogenizing device and the layout planning of the gas homogenizing pipe 200, and the present disclosure does not make specific restrictions on this.

[0045] In this embodiment, a specific structure of a gas homogenizing pipe 200 is introduced. The gas homogenizing pipe 200 is composed of multiple pipes connected in sequence in a hierarchical order. In this way, when only one gas inlet is provided, it can ensure that the gas smoothly and synchronously spreads to each branch of the gas homogenizing pipe 200.

[0046] In some embodiments, each stage of the pipeline includes an air inlet interface and two air outlet interfaces, the air inlet interface is arranged in the middle of the pipeline, and the air outlet interfaces are arranged at both ends of the pipeline. Figure 3 The primary pipeline 210 includes an air inlet interface 211 and two air outlet interfaces 212. The air inlet interface 211 is arranged in the middle of the primary pipeline 210, and the two air outlet interfaces 212 are respectively located at two ends of the primary pipeline 210. Obviously, the distance between the air inlet interface 211 and the two air outlet interfaces 212 is the same, so when the gas flows into the primary pipeline 210 from the air inlet interface 211, it can synchronously reach the two air outlet interfaces 212 located at two ends of the pipeline, and flow into the secondary pipeline 220 through the air outlet interfaces 212.

[0047] Similarly, the secondary pipeline 220 includes an air inlet interface 221 and two air outlet interfaces 222. The air outlet interface 212 of the primary pipeline is connected to the air inlet interface 221 of the secondary pipeline. The air inlet interface 221 of the secondary pipeline is located in the middle of the secondary pipeline 220, and the two air outlet interfaces 222 are respectively located at both ends of the secondary pipeline 220.

[0048] By analogy, the outlet port of the N-1-stage pipeline is connected to the inlet port 231 of the N-stage pipeline. The inlet port 231 of the N-stage pipeline is located in the middle of the N-stage pipeline 230, and the outlet ports 232 of the N-stage pipeline are located at both ends of the secondary pipeline 230.

[0049] This embodiment provides a simple branching structure, where each upper pipeline can branch into two lower pipelines, which is simple in structure and easy to install and maintain. In addition, by adjusting the number of pipeline levels, the distribution density of the air outlets can be effectively adjusted to meet the diverse needs of users.

[0050] In the above embodiment, the gas can synchronously reach the gas outlet interface 232 of the N-stage pipeline. At this time, the gas can directly flow out from the gas outlet interface 232 of the N-stage pipeline into the chamber of the board assembly 100; or, a plurality of gas outlets can be further provided at one end of the gas outlet interface 232 of the N-stage pipeline, so that the gas can fill the chamber more evenly during the outflow process.

[0051] Continue to refer Figure 3 The gas outlet assembly 240 includes a plurality of gas outlets. The gas outlet assembly 240 is disposed at one end of the gas outlet interface 232 of the N-level pipeline and is connected to the N-level pipeline 230. The gas flows into the gas outlet assembly 240 from the gas outlet interface 232 of the N-level pipeline, and flows out of the gas outlet assembly 240 synchronously into the chamber from the plurality of gas outlets of the gas outlet assembly 240.

[0052] The angles between at least two adjacent gas outlets of the gas outlet assembly 240 are the same. Therefore, during the gas outlet process, the gas can be evenly discharged to the surroundings with the gas outlet assembly as the center. In addition, since the multiple N-level pipes 230 of the gas uniformity pipe 200 are evenly arranged in the chamber of the plate assembly 100, when the gas outlet assembly 240 at the end of the N-level pipe 230 synchronously and evenly discharges gas, the gas in the chamber is evenly distributed, further improving the gas outlet uniformity of the gas uniformity device.

[0053] In some embodiments, the diameter of the upper pipeline is larger than the diameter of the lower pipeline. The gas in each upper pipeline needs to flow into multiple lower pipelines evenly, so the flow rate of the gas in multiple lower pipelines is reduced. To adapt to this change, the diameter of the lower pipeline should be reduced accordingly.

[0054] In addition, since the pipeline is reduced, more levels of pipelines can be arranged in a unit area of ​​the chamber, which can effectively increase the distribution density of the gas outlets, thereby making the gas distribution in the chamber more uniform.

[0055] Exemplarily, when the upper pipeline is the first pipeline 210, the lower pipeline may be the second pipeline 220. When the upper pipeline is the second pipeline 220, the lower pipeline may be the N-stage pipeline 230. In other words, the upper pipeline and the lower pipeline are relative concepts.

[0056] The above describes the specific structure of the gas homogenizing tube 200. The following describes the specific structure of the plate assembly 100 in conjunction with the accompanying drawings.

[0057] In some embodiments, the plate assembly 100 is composed of a first plate 110 and a second plate 120. The first plate 110 and the second plate 120 are disposed opposite to each other and connected to each other to form a chamber of the plate assembly 100 to accommodate the gas homogenizing tube 200.

[0058] Figure 4 FIG. 1 is a schematic diagram of the structure of the second plate 120 provided by an exemplary embodiment of the present disclosure. Figure 4 As shown, the second plate 120 is a thick plate with a recessed space milled in the middle of the thick plate. After the second plate 120 is combined with the first plate 110, the recessed space in the second plate 120 forms a chamber to accommodate the gas homogenizing tube 200.

[0059] The second plate 120 is also provided with a plurality of strip-shaped barriers 121 on the surface of the side close to the first plate 110. In the chamber of the plate assembly 100, the plurality of strip-shaped barriers 121 divide the chamber into a plurality of sub-areas. Figure 2 It can be found from the structure of the air-distributing pipe 200 that a plurality of strip-shaped barriers 121 are interspersed between the multi-stage pipes of the air-distributing pipe 200, so that the air-distributing pipe 200 in each sub-area includes at least one air outlet.

[0060] Due to the blocking effect of the strip-shaped baffles 121, the gas flowing out of the gas outlet included in each sub-region is restricted to flow in the respective sub-region and will not flow into other sub-regions, thereby further improving the uniformity of gas distribution in the chamber.

[0061] In some embodiments, a fixing member 130 is further provided on the surface of the second plate 120 near the first plate 110, which is used to fix the gas homogenizing tube 200 to the second plate 120. Exemplarily, the fixing member 130 can be a plurality of clamps, the middle part of which is annular, and can surround a part of the pipeline of the gas homogenizing tube 200 to limit it. The second plate 120 is provided with threaded holes corresponding to the installation position of the fixing member 130, so that both ends of the clamp are fixed to the second plate 120 by threads.

[0062] In addition to the threaded holes, a reserved opening is also provided on the second plate 120 so that an external air supply device can communicate with the air inlet of the air homogenizing pipe 200 inside the plate assembly 100 through the reserved opening.

[0063] The specific structure of the first plate 110 will be further described below in conjunction with the accompanying drawings. Figure 5 FIG. 1 is a schematic structural diagram of a first surface 113 of a first plate 110 provided by an exemplary embodiment of the present disclosure. Figure 6 Shown Figure 5 The illustrated embodiment provides a schematic cross-sectional view of the first plate 110 along AA. Figure 7 FIG. 1 is a schematic structural diagram of a second surface 114 of a first plate 110 provided by an exemplary embodiment of the present disclosure. Figure 8 Shown Figure 6 The illustrated embodiment provides a partial enlarged view of the first plate 110 in area B.

[0064] The first plate 110 includes first surfaces 113 (such as Figure 5 as shown) and the second surface 114 (as shown Figure 6 The first surface 113 of the first plate 110 faces the outside of the gas homogenizing device and is away from the gas homogenizing tube 200 ; the second surface 114 faces the cavity of the plate assembly 100 and is close to the gas homogenizing tube 200 .

[0065] In some embodiments, Figure 5 As shown, the first surface 113 of the first plate 110 has at least one step groove 111. In the case where there are multiple step grooves 111, the depths of the multiple step grooves 111 may be different, so that when the gas flows out of the first plate 110 at the same time, the gas flowing out of the through hole 112 of each step groove 111 will not collide with the gas flowing out of the through hole 112 of the step groove 111 at other heights, so that the uniformity of the gas is affected. Exemplarily, the depth of each step groove 111 may gradually increase or decrease from the center position of the first plate 110 to the surrounding positions.

[0066] Continue to refer Figure 6 , the first plate 110 as a whole includes three annular step grooves 111 of different depths, and the depths of the three step grooves 111 gradually decrease from the center position to the surrounding positions. In some embodiments, as Figure 7 , Figure 8 As shown, the through hole 112 opened on the first plate 110 passes through the first surface 113 and the second surface 114 of the first plate 110, and the diameter of the through hole 112 gradually increases in the direction from the first surface 113 to the second surface 114, so that the shape of the through hole 112 close to the second surface 114 is a conical hole. In the process of gas flowing out of the gas homogenizing device through the through hole 112, the gas can be first buffered in the conical area of ​​the through hole 112 to ensure that the gas coming out of the gas homogenizing tube 200 can flow out of the first plate 110 evenly. In some embodiments, the multiple through holes 112 on the first plate 110 are arranged in an array, so as to ensure that the gas flows out from the surface of the first plate 110 to the outside of the gas homogenizing device evenly, further improving the uniformity of the gas outlet.

[0067] It is understood that the shapes of the step grooves in the above embodiments and the accompanying drawings are only schematic and should not be construed as limiting the present disclosure. Specifically, the shape of the step groove can be a ring as shown in the accompanying drawings, or any other shape; similarly, the shapes of the multi-level step grooves can be set to be the same as each other, or they can also be set to any shape, and it is only necessary to set the depths of the step grooves at different levels. The present disclosure does not specifically limit the shape of the step grooves.

[0068] In combination with the above embodiments, the advantages of the gas homogenizing device provided by the present disclosure are as follows.

[0069] 1. The length of the path from each air outlet to the air inlet of the air-distributing pipe is the same, which can ensure that each air outlet discharges air at the same time. There is no problem in the related art that the flow rate is large at the position close to the air inlet and the flow rate is small at the position far from the air inlet.

[0070] 2. The second plate of the plate assembly has many strip-shaped barriers to prevent the gas in each sub-area from running wildly.

[0071] 3. The first plate of the plate assembly has a conical hole on the inside, which acts as a gas buffer to ensure that the gas flowing out of the gas-uniform pipe can flow out of the first plate evenly. The first plate has a step groove on the outside to prevent the gas from colliding with each other when it flows out of the first plate at the same time, which affects the uniformity of the outflowing gas.

[0072] 4. The gas-uniform device can be assembled in a modular manner. No matter how large the gas-uniform plate is, you only need to piece it together to meet the needs of different scenarios.

[0073] The above combined with Figure 1 to Figure 8 The gas homogenizing device embodiment of the present disclosure is described in detail, and the coating device embodiment provided by the present disclosure is further described below. It should be understood that the description of the gas homogenizing device embodiment corresponds to the description of the coating device embodiment, so the part not described in detail can refer to the previous gas homogenizing device embodiment.

[0074] The coating equipment can be any equipment capable of growing an epitaxial film layer on the surface of a device to be coated. For example, the coating equipment can implement coating technologies such as physical vapor deposition (PVD) and chemical vapor deposition (CVD).

[0075] The coating equipment specifically includes a process chamber. Specifically, the process chamber is a sealed chamber that contains a device to be coated (such as a battery cell, etc.) and a gas homogenizing device provided in any of the above embodiments. In addition, the process chamber may also include an interface for connecting to external equipment such as a vacuum pump and a temperature measuring device.

[0076] In this embodiment, the air equalizing device includes: a plate assembly having a chamber, the plate assembly having multiple through holes, the through holes connecting the chamber and the outside; an air equalizing pipe arranged in the chamber, the air equalizing pipe including an air inlet and multiple air outlets, and the length of the path from each air outlet to the air inlet is the same.

[0077] During the coating process, the process gas is introduced into the gas equalizing pipe from the gas inlet of the gas equalizing device. The length of the path from each gas outlet to the gas inlet of the gas equalizing pipe is the same, so the process gas can synchronously flow out from the multiple gas outlets of the gas equalizing pipe into the chamber of the plate assembly; then, the process gas flows out evenly from the through holes of the plate assembly to the outside of the chamber, so that the process gas can be evenly distributed in the process chamber of the coating equipment, thereby improving the coating quality of the coating equipment.

[0078] The basic principles of the present disclosure are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present disclosure are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present disclosure. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, and are not limitations. The above details do not limit the present disclosure to the necessity of adopting the above specific details to be implemented.

[0079] The block diagrams of the devices, apparatuses, and equipment involved in the present disclosure are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including," "comprising," "having," and the like are open words, referring to "including but not limited to," and can be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or," and can be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and can be used interchangeably therewith.

[0080] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present disclosure. Therefore, the present disclosure is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0081] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present disclosure to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A gas homogenizing device, characterized in that: include: A plate assembly having a cavity, wherein the plate assembly has a plurality of through holes, wherein the through holes communicate with the cavity and the outside; An air-distributing pipe is disposed in the chamber, the air-distributing pipe comprises an air inlet and a plurality of air outlets, and the length of the path from each air outlet to the air inlet is the same; Among them, the air uniforming pipe includes a multi-level pipeline from level one to level N, and each level of the pipeline includes an air inlet interface and an air outlet interface. In accordance with the hierarchical order, the air outlet interface of the upper-level pipeline is connected with the air inlet interface of the lower-level pipeline; an air outlet assembly is provided on the air outlet interface of the N-th level pipeline, and the air outlet assembly includes a plurality of the air outlets, and the angles between at least some adjacent two air outlets are the same, and N is a positive integer.

2. The gas homogenizing device according to claim 1, characterized in that: Each level of the pipeline includes two air outlet interfaces, which are respectively arranged at two ends of the pipeline, and the air inlet interface is arranged in the middle position of the pipeline.

3. The gas homogenizing device according to claim 1, characterized in that: The diameter of the upper pipeline is greater than the diameter of the lower pipeline.

4. The gas homogenizing device according to any one of claims 1 to 3, characterized in that: A plurality of the through holes are arranged in an array.

5. The gas homogenizing device according to any one of claims 1 to 3, characterized in that: The plate assembly includes a first plate, the first plate includes a first surface and a second surface arranged opposite to each other, the second surface is close to the gas uniformizing tube, the through hole runs through the first surface and the second surface, and points from the first surface to the second surface, and the diameter of the through hole gradually increases.

6. The gas homogenizing device according to claim 5, characterized in that: A surface of the first plate away from the gas homogenizing tube has at least one step groove.

7. The gas homogenizing device according to claim 5, characterized in that: The plate assembly comprises: a second plate, disposed opposite to the first plate and connected to the first plate to form the chamber; The fixing member is disposed on the second plate and is configured to fix the gas uniformizing tube to the second plate.

8. The gas homogenizing device according to any one of claims 1 to 3, characterized in that: A plurality of strip-shaped barriers are arranged in the chamber, and the plurality of strip-shaped barriers divide the chamber into a plurality of sub-areas, and the gas uniformizing pipe in each of the sub-areas includes at least one gas outlet.

9. A coating device, characterized in that: The invention comprises a process chamber and a gas homogenizing device as claimed in any one of claims 1 to 8, wherein the gas homogenizing device is arranged in the process chamber.

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