Deposition equipment
By designing a rotary load-bearing structure and a fast replacement system for uniform air plates in the deposition equipment, the problems of equipment utilization and production capacity are solved, and efficient film deposition and meeting different process requirements are achieved.
Patent Information
- Application Number
- CN202421675568.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-15
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-07-15
AI Technical Summary
When existing deposition equipment frequently replaces uniform plates with different structures, the equipment utilization rate and production capacity are reduced.
A deposition device including a main cavity and an auxiliary cavity is designed. By providing a rotating load-bearing structure and a uniform air uniform plate in the auxiliary cavity, the uniform air uniform plate can be quickly replaced and reciprocating through the through hole through the lifting structure.
It realizes rapid replacement of uniform air plates, improves the utilization rate and production capacity of deposition equipment, and can deposit various film layers with different thickness uniformity on the wafer surface to meet the needs of different processes.
Smart Images
Figure CN222770955U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductors, and particularly relates to a deposition device. Background Art
[0002] As one of the core equipment in the semiconductor manufacturing process, the deposition equipment is used to form a metal or non-metal film layer on the surface of the wafer to change the conductive properties of the wafer. In practical applications, different process requirements require a variety of film layers with different thickness uniformity, such as uniform film thickness, thick inside and thin outside, or thin inside and thick outside, to meet the requirements. Therefore, the deposition equipment needs to be shut down frequently to replace the uniforming plates of different structures in order to deposit the corresponding film layer on the wafer, which reduces the utilization rate and production capacity of the deposition equipment. Utility Model Content
[0003] The utility model aims to provide a deposition device, which can quickly replace the gas uniforming plate, save the replacement time of the gas uniforming plate, and improve the utilization rate and production capacity of the deposition device.
[0004] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0005] The utility model provides a deposition device, which at least comprises:
[0006] A cavity, the cavity comprising a main cavity and at least two auxiliary cavities, the auxiliary cavities are located on the sides of the main cavity, and the main cavity and the auxiliary cavities are communicated;
[0007] A plurality of bearing structures are respectively arranged in the auxiliary cavity, and the bearing structures are allowed to rotate at a preset angle at one end close to the main cavity;
[0008] A plurality of air-distributing plates are respectively placed on the bearing structure;
[0009] A support structure is disposed around the inner wall of the main cavity, and at least one through hole is disposed on the support structure; and
[0010] A plurality of lifting structures are provided, allowing the lifting structures to pass through the through holes and perform reciprocating motion relative to the main cavity.
[0011] In an embodiment of the present utility model, the bearing structure includes a rotating shaft, and the rotating shaft is arranged on the inner wall of the auxiliary cavity on a side close to the main cavity.
[0012] In an embodiment of the present utility model, the bearing structure further includes a support seat, which is disposed on the rotating shaft and extends to a side away from the main cavity.
[0013] In an embodiment of the present invention, the bearing structure further includes a bearing plate, and the bearing plate is disposed on the supporting seat.
[0014] In an embodiment of the present invention, the shape of the supporting plate is an arc or an open polygon.
[0015] In an embodiment of the present utility model, the bearing structure further includes a plurality of limiting members, and the limiting members are arranged on the bearing plate.
[0016] In an embodiment of the present invention, the air uniforming plate includes a plate body and a protrusion, and the protrusion extends from a side of the plate body in a direction away from the center of the plate body.
[0017] In an embodiment of the present invention, the distance between the plurality of limit members is equal to the length of the plate.
[0018] In an embodiment of the present invention, the height of the protruding member is smaller than the height of the plate body, and the difference between the height of the plate body and the protruding member is equal to the height of the limiting member.
[0019] In an embodiment of the present invention, the structures of the air uniforming plates in different auxiliary cavities are different.
[0020] In summary, the utility model provides a deposition device. By improving the structure of the deposition device, the unexpected technical effect of the present application is that the uniform gas plate can be quickly replaced to improve the production capacity and utilization rate of the deposition device. Moreover, the deposition device provided by the utility model can deposit various film layers with different thickness uniformity on the surface of the wafer to meet the needs of different processes. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 Schematic diagram of a deposition device in one embodiment.
[0023] Figure 2 Schematic diagram of a carrier plate in one embodiment.
[0024] Figure 3 FIG. 4 is a schematic diagram of a carrier plate in another embodiment.
[0025] Figure 4 FIG. 4 is a schematic diagram of a rotating carrier plate in an embodiment.
[0026] Figure 5 Schematic diagram of an air homogenizing plate in one embodiment.
[0027] Figure 6 FIG. 4 is a top view of an air distribution plate in one embodiment.
[0028] Figure 7 FIG. 4 is a top view of an air uniforming plate in another embodiment.
[0029] Figure 8 FIG. 4 is a top view of an air uniforming plate in another embodiment.
[0030] Fig. 9 Schematic diagram of a support structure in one embodiment.
[0031] Fig.10 FIG. 1 is a top view of a support structure in one embodiment.
[0032] Fig.11 FIG. 4 is a top view of a shower head in one embodiment.
[0033] Fig.12 Schematic diagram of the initial state of a deposition device in one embodiment.
[0034] Fig.13 Schematic diagram of a rotating carrier plate and an air distribution plate in one embodiment.
[0035] Fig.14 Schematic diagram of a mobile lifting structure in one embodiment.
[0036] Fig.15 Schematic diagram of placing an air uniforming plate on a support structure in one embodiment.
[0037] Fig.16 It is a schematic diagram of restoring the lifting structure to an initial state in one embodiment.
[0038] Description of labels:
[0039] 11. Cavity; 111. Main cavity; 112. First cavity; 113. Second cavity; 114. Air inlet; 12. Carrying structure; 121. Rotating shaft; 122. Support seat; 123. Carrying plate; 124. Positioning member; 13. Air uniforming plate; 131. Plate body; 1311. Hole; 132. Protrusion; 14. Support structure; 141. Support part; 142. Raised part; 143. Through hole; 15. Lifting structure; 16. Heating substrate; 17. Shower; 171. Air hole; 18. Support assembly; 19. Wafer; 20. Lifting assembly. DETAILED DESCRIPTION
[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0041] See also Figure 1 As shown, the utility model provides a deposition device, for example, including a chamber 11, a bearing structure 12, an air-distributing plate 13, a support structure 14 and a lifting structure 15. The chamber 11 includes a main chamber 111 and at least two auxiliary chambers, the auxiliary chambers are located at the side of the main chamber 111, and are connected to the main chamber 111. A bearing structure 12 is placed in each auxiliary chamber, and the bearing structure 12 is allowed to rotate at a preset angle with one end close to the main chamber 111. The air-distributing plate 13 is placed on the bearing structure 12, and the support structure 14 is arranged around the inner wall of the main chamber 111. At least one through hole 143 is arranged on the support structure 14, and the lifting structure 15 is allowed to reciprocate relative to the main chamber 111 through the through hole 143. The wafer 19 is placed in the main chamber 111. The deposition device provided by the utility model drives the uniform gas plate 13 to rotate back and forth in the main cavity 111 and the auxiliary cavity through the bearing structure 12, and the uniform gas plate 13 in the main cavity 111 can be replaced to deposit different forms of film layers on the surface of the wafer 19 to meet the needs of different processes. Moreover, the deposition device provided by the utility model can quickly replace the uniform gas plate 13 in the main cavity 111, saving the replacement time of the uniform gas plate 13, so as to improve the utilization rate and production capacity of the deposition device.
[0042] See also Figure 1 As shown, in one embodiment of the utility model, the chamber 11 provides space for gas to be deposited on the wafer 19 to form a film layer. In this embodiment, the chamber 11, for example, includes a main chamber 111 and an auxiliary chamber. Among them, an air inlet 114 is provided on the main chamber 111, and the air inlet 114 is connected to the main chamber 111 to transport gas into the main chamber 111. In this embodiment, the gas transported by the air inlet 114 is, for example, a deposition gas or a cleaning gas, and the deposition gas includes, for example, at least one of silane, dichlorosilane and trichlorosilane, and the cleaning gas is, for example, a fluorine-containing gas.
[0043] See also Figure 1As shown, in one embodiment of the utility model, a heating substrate 16 is further provided in the main cavity 111, and the heating substrate 16 is used to support and heat the wafer 19. In this embodiment, a support assembly 18 is further provided on the side of the heating substrate 16 away from the wafer 19, and the support assembly 18 is connected to the inner wall of the main cavity 111 to support the heating substrate 16. In this embodiment, a lifting assembly 20 is further provided in the heating substrate 16, and the lifting assembly 20 penetrates the heating substrate 16 and contacts the wafer 19, and the lifting assembly 20 reciprocates relative to the heating substrate 16 to drive the wafer 19 to contact the heating substrate 16 or leave the heating substrate 16. Among them, the lifting assembly 20 is, for example, multiple, and the lifting assembly 20 is, for example, a lifting pin.
[0044] See also Figure 1 As shown, in one embodiment of the utility model, the auxiliary cavity is located on the side of the main cavity 111, and the auxiliary cavity is connected to the main cavity 111. Among them, there are at least two auxiliary cavities, for example. In this embodiment, there are two auxiliary cavities, for example, the two auxiliary cavities are respectively a first cavity 112 and a second cavity 113, etc., with the axis of the main cavity 111 as the center, the first cavity 112 and the second cavity 113 are symmetrically arranged on the side of the main cavity 111, and are connected to the main cavity 111.
[0045] See also Figure 1 As shown, in one embodiment of the utility model, the bearing structure 12 is arranged in the auxiliary cavity. The number of the bearing structures 12 is the same as the number of the auxiliary cavities. In this embodiment, there are two bearing structures 12, for example, and one bearing structure 12 is arranged in each of the first cavity 112 and the second cavity 113. The bearing structure 12 in the first cavity 112 is taken as an example to illustrate the bearing structure 12. The bearing structure 12 includes, for example, a rotating shaft 121, a support seat 122, a bearing plate 123, and a stopper 124.
[0046] See also Figure 1 As shown, in one embodiment of the utility model, the rotating shaft 121 is arranged on the inner wall of the first cavity 112 and is arranged close to the main cavity 111, serving as the base point for the rotation of the bearing structure 12, so as to drive the bearing structure 12 to rotate, for example, in a horizontal plane. In this embodiment, the support seat 122 is arranged on the rotating shaft 121 and extends to a side away from the main cavity 111 to support the subsequent supporting plate 123. In this embodiment, the supporting plate 123 is arranged on the supporting seat 122 to support the uniform gas plate 13.
[0047] See also Figure 1 to Figure 2As shown, in one embodiment of the present invention, the shape of the supporting plate 123 is, for example, an arc or an open polygon, and the width of the supporting plate 123 is, for example, smaller than the distance between the side wall of the main cavity 111 and the lifting structure 15, so that when the supporting plate 123 rotates into the main cavity 111 with the rotating shaft 121 as the base point, the lifting structure 15 can pass through the opening of the arc or polygonal supporting plate 123 and contact the air distribution plate 13. Figure 2 As shown, in this embodiment, the supporting plate 123 is, for example, arc-shaped, and the central angle of the arc-shaped supporting plate 123 is, for example, greater than or equal to 180°, so as to improve the stability of the supporting plate 123 supporting the air-distributing plate 13. Figure 3 As shown, in another embodiment of the present invention, the shape of the supporting plate 123 is, for example, an open polygon, and the perimeter of the open polygon is, for example, greater than or equal to half of the perimeter of the complete polygon, so as to improve the stability of the supporting plate 123 in supporting the air homogenizing plate 13.
[0048] See also Figure 1 As shown, in one embodiment of the utility model, a stopper 124 is disposed on the bearing plate 123 to fix the air-distributing plate 13 on the bearing plate 123. There are, for example, multiple stoppers 124, and the specific structure of the stopper 124 can be selected according to actual needs. In this embodiment, there are, for example, two stoppers 124, and the stoppers 124 are, for example, stop blocks, and the air-distributing plate 13 is clamped and placed on the bearing plate 123 between the two stoppers 124 to prevent the air-distributing plate 13 from detaching from the bearing plate 123 when the bearing structure 12 drives the air-distributing plate 13 to rotate.
[0049] See also Figure 1 and Figure 4 As shown, in one embodiment of the utility model, the bearing structure 12 can rotate to a preset angle at one end close to the main cavity 111. Specifically, with the rotating shaft 121 as the base point, the support seat 122, the bearing plate 123 and the limit member 124 drive the air-distributing plate 13 to rotate to a preset angle. The preset angle is, for example, 120°-240°. By setting the bearing structure 12, the bearing structure 12 can drive the air-distributing plate 13 to rotate back and forth in the auxiliary cavity and the main cavity 111, so as to switch the air-distributing plate 13 in the first cavity 112 or the second cavity 113 to the main cavity 111, so as to achieve the purpose of installing different air-distributing plates 13 in the main cavity 111.
[0050] See also Figure 1 and Figure 5As shown, in one embodiment of the utility model, an air-distributing plate 13 is placed on the supporting structure 12. The number of the air-distributing plates 13 is the same as the number of the auxiliary cavities. In the present embodiment, there are, for example, two air-distributing plates 13, and one air-distributing plate 13 is placed on each of the supporting plates 123 in the first cavity 112 and the second cavity 113. The air-distributing plate 13 includes, for example, a plate body 131 and a protrusion 132, etc. The protrusion 132 is, for example, arranged on the side of the plate body 131 and extending in a direction away from the center of the plate body 131. The number of the protrusions 132 is, for example, the same as the number of the limiters 124, and the relative positions between the protrusions 132 are, for example, the same as the relative positions between the limiters 124, so that each protrusion 132 can be engaged with each limiter 124. In the present embodiment, there are two protrusions 132, for example, and the height of the protrusions 132 is, for example, less than the height of the plate body 131, and the difference between the height of the plate body 131 and the protrusions 132 is equal to the height of the stopper 124, and the width of the protrusions 132 may be equal to or unequal to the width of the stopper 124. In the present embodiment, the width of the protrusions 132 is equal to the width of the stopper 124, and the length of the plate body 131 is, for example, equal to the distance between the two stoppers 124, and the protrusions 132 and the plate body 131 are, for example, integrated. In the present embodiment, the protrusions 132 and the stoppers 124 are locked, so that the air-distributing plate 13 can be fixed between the two stoppers 124, preventing the air-distributing plate 13 from detaching from the bearing structure 12 when the bearing structure 12 drives the air-distributing plate 13 to rotate.
[0051] See also Figure 1 , Figures 5 to 8 As shown, in one embodiment of the utility model, the structures of the air-distributing plates 13 in different auxiliary cavities may be the same or different. In this embodiment, the structure of the air-distributing plate 13 in the first cavity 112 is different from the structure of the air-distributing plate 13 in the second cavity 113, for example. Specifically, at least one hole 1311 is provided on the plate body 131, for example, and the size, number and distribution of the holes 1311 on the plate body 131 are different in different auxiliary cavities. The utility model does not limit the specific shapes of the plate body 131 and the holes 1311, and takes the plate body 131 and the holes 1311 as both circular as an example to illustrate the air-distributing plate 13.
[0052] See also Figure 6As shown, in one embodiment of the utility model, the hole 1311 is, for example, one, and the hole 1311 is arranged at the center of the plate body 131, and the outer circle of the plate body 131 is sealed. In this embodiment, when the gas-distributing plate 13 rotates from the auxiliary cavity to the main cavity 111, the gas enters the main cavity 111 from the gas inlet 114, and flows out of the gas-distributing plate 13 through the hole 1311. Most of the gas flows to the center of the wafer 19 and is deposited on the center of the wafer 19. A small part of the gas diffuses from the center of the gas-distributing plate 13 to the side wall of the main cavity 111 and is deposited on the outer circle of the wafer 19, thereby causing the film layer on the wafer 19 to be thick inside and thin outside.
[0053] See also Figure 7 As shown, in another embodiment of the utility model, there are multiple holes 1311, for example, and the sizes of the multiple holes 1311 are, for example, equal, and the distances between the holes 1311 can be equal or unequal. In this embodiment, when the gas-distributing plate 13 rotates from the auxiliary cavity to the main cavity 111, the gas enters the main cavity 111 from the gas inlet 114, flows out of the gas-distributing plate 13 through the holes 1311, and is evenly diffused to the surface of the wafer 19, and is deposited on the surface of the wafer 19, thereby resulting in a uniform thickness of the film layer on the wafer 19.
[0054] See also Figure 8 As shown, in another embodiment of the utility model, there are multiple holes 1311, for example, and the multiple holes 1311 are, for example, arranged on the outer circle of the plate body 131, and the center of the plate body 131 is sealed. In this embodiment, when the gas-distributing plate 13 rotates from the auxiliary cavity to the main cavity 111, the gas enters the main cavity 111 from the gas inlet 114, flows out of the gas-distributing plate 13 through the holes 1311, and most of the gas flows to the outer circle of the wafer 19 and is deposited on the outer circle of the wafer 19, and a small part of the gas diffuses from the outer circle of the plate body 131 to the center of the plate body 131 and is deposited on the center of the wafer 19, thereby causing the film layer on the wafer 19 to present a shape that is thin inside and thick outside. By arranging gas-distributing plates 13 of different structures in the first cavity 112 and the second cavity 113, it is possible to conveniently switch the gas-distributing plates 13 in the main cavity 111 to deposit different forms of film layers on the wafer 19 to meet the needs of different processes.
[0055] See also Figure 1 and Fig. 9As shown, in one embodiment of the utility model, the support structure 14 is arranged around the inner wall of the main cavity 111. The support structure 14, for example, includes a support portion 141 and a protrusion 142, and the protrusion 142 extends from the side of the support portion 141 in the direction of the air inlet 114. The number of protrusions 142, for example, is equal to the number of protrusions 132, and the relative positions between the protrusions 142 are the same as the relative positions between the protrusions 132, so that each protrusion 142 can be engaged with each protrusion 132, so that the support structure 14 serves the purpose of supporting the air homogenizing plate 13. In this embodiment, there are two protrusions 142, for example, the height of the protrusion 142 is equal to the difference between the height of the plate body 131 and the protrusion 132, and the length of the support portion 141 is equal to the sum of the lengths of the protrusion 132 and the plate body 131, and the support portion 141 and the protrusion 142 are, for example, integrated. In this embodiment, the raised portion 142 and the protruding member 132 are engaged with each other, so that the air uniforming plate 13 can be stably placed on the supporting structure 14 .
[0056] See also Figure 1 , Figures 9 and 10 As shown, in one embodiment of the utility model, for example, a through hole 143 is further provided on the support portion 141, and the center of the through hole 143 is the same as the center of the support portion 141. Among them, the through hole 143 is, for example, at least one, and the utility model does not limit the specific shapes of the support portion 141, the through hole 143 and the plate body 131. The technical solution is described by taking the support portion 141, the through hole 143 and the plate body 131 as an example that they are all circular. In this embodiment, for example, there is one through hole 143, and the diameter of the through hole 143 is, for example, greater than or equal to the diameter of the plate body 131. When the gas homogenizing plate 13 rotates into the main cavity 111, the portion of the support portion 141 opposite to the plate body 131 is hollowed out to prevent the support portion 141 from hindering the diffusion of gas in the direction where the wafer 19 is located.
[0057] See also Figure 1 As shown, in one embodiment of the utility model, the lifting structure 15 is arranged in the main cavity 111 on the side of the support structure 14 away from the air inlet 114. Among them, the lifting structure 15 is, for example, multiple. In this embodiment, there are, for example, three lifting structures 15 (part of the lifting structures 15 are shown in the figure), and the three lifting structures 15 are, for example, equidistantly arranged in the main cavity 111. The lifting structure 15 is, for example, a lifting pin, etc. The lifting structure 15 can pass through the through hole 143 to reciprocate relative to the main cavity 111. Specifically, the lifting structure 15 can perform lifting and lowering movements in the axial direction of the main cavity 111. Moreover, when the air-distributing plate 13 in the auxiliary cavity rotates into the main cavity 111, the lifting structure 15 can successively pass through the support structure 14 and the bearing plate 123, and directly contact the air-distributing plate 13, so as to drive the air-distributing plate 13 to rise and fall together.
[0058] See also Figure 1 and Fig.11 As shown, in one embodiment of the utility model, the deposition device further includes a shower head 17, and the shower head 17 is arranged in the main cavity 111 between the plurality of lifting structures 15. Among them, a plurality of air holes 171 are arranged on the shower head 17, for example. The utility model does not limit the relative sizes of the air holes 171 and the holes 1311, which can be selected according to actual needs. In this embodiment, the size of the air holes 171 is, for example, smaller than the size of the holes 1311. By setting the shower head 17, the gas transmitted to the main cavity 111 by the air inlet 114 passes through the air uniforming plate 13 and reaches the shower head 17, flows out of the shower head 17 through the air holes 171, and flows to the wafer 19. By setting the air holes 171, the gas flowing to the wafer 19 can be further processed.
[0059] In order to further illustrate a deposition device provided by the present invention, the following specifically describes the steps for using the deposition device. The specific steps for using the deposition device are as follows.
[0060] See also Fig.12 As shown, in the initial state, a supporting structure 12 and an air distribution plate 13 are located in the first cavity 112, and another supporting structure 12 and another air distribution plate 13 are located in the second cavity 113. Fig.13 As shown, in the first cavity 112 , with the rotating shaft 121 as the base point, the support seat 122 , the bearing plate 123 and the stopper 124 drive the air distribution plate 13 to rotate into the main cavity 111 .
[0061] See also Fig.14 As shown, the driving lifting structure 15 rises, passes through the carrying plate 123, and supports the air-distributing plate 13, so that the air-distributing plate 13 is separated from the carrying plate 123. Fig.15 As shown, with the rotating shaft 121 as the base point, the support seat 122, the bearing plate 123 and the limit member 124 rotate back into the first cavity 112, and then drive the lifting structure 15 to descend, and the lifting structure 15 drives the air uniforming plate 13 to descend until the air uniforming plate 13 is placed on the supporting structure 14.
[0062] See also Fig.16As shown, the lifting structure 15 is driven to descend, and the lifting structure 15 is restored to the position of the initial state, and then the heating substrate 16 is started to heat the wafer 19, and the deposition gas is introduced from the air inlet 114. The gas passes through the uniform gas plate 13 and the shower 17 of the main chamber 111 successively, reaches the wafer 19, and is deposited on the wafer 19 to form a film layer. After the deposition is completed, the heating of the wafer 19 and the introduction of the deposition gas are stopped, and the lifting structure 15 is driven to rise, so that the uniform gas plate 13 is separated from the support structure 14, and then the support seat 122, the supporting plate 123 and the limiting member 124 are rotated into the main chamber 111 with the rotating shaft 121 as the base point, and then the lifting structure 15 is driven to descend, and the lifting structure 15 drives the uniform gas plate 13 to descend until the uniform gas plate 13 is placed on the supporting plate 123. Then the lifting structure 15 continues to descend until it returns to the position of the initial state. Then, with the rotating shaft 121 as the base point, the support seat 122 , the carrying plate 123 and the stopper 124 drive the gas uniforming plate 13 to rotate back into the first chamber 112 , and restore the deposition device to the initial state.
[0063] In summary, the utility model provides a deposition device, which sets a plurality of auxiliary chambers on the side of the main chamber, and sets a bearing structure and an air-distributing plate in each auxiliary chamber, so that the bearing structure drives the air-distributing plate to rotate back and forth in the auxiliary chamber and the main chamber, and the air-distributing plate in the main chamber can be replaced, so that various forms of film layers can be deposited on the wafer to meet the needs of different processes. Moreover, the deposition device provided by the utility model can quickly replace the air-distributing plate in the main chamber, saving the replacement time of the air-distributing plate and improving the utilization rate and production capacity of the deposition device.
[0064] The embodiments of the utility model disclosed above are only used to help illustrate the utility model. The embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A deposition device, characterized in that: At least: A cavity, the cavity comprising a main cavity and at least two auxiliary cavities, the auxiliary cavities are located on the sides of the main cavity, and the main cavity and the auxiliary cavities are communicated; A plurality of bearing structures are respectively arranged in the auxiliary cavity, and the bearing structures are allowed to rotate at a preset angle at one end close to the main cavity; A plurality of air-distributing plates are respectively placed on the bearing structure; A support structure is disposed around the inner wall of the main cavity, and at least one through hole is disposed on the support structure; as well as A plurality of lifting structures are provided, allowing the lifting structures to pass through the through holes and perform reciprocating motion relative to the main cavity.
2. The deposition device according to claim 1, characterized in that: The bearing structure comprises a rotating shaft, and the rotating shaft is arranged on an inner wall of the auxiliary cavity on a side close to the main cavity.
3. The deposition device according to claim 2, characterized in that: The bearing structure further includes a support seat, which is disposed on the rotating shaft and extends to a side away from the main cavity.
4. The deposition device according to claim 3, characterized in that: The bearing structure further comprises a bearing plate, and the bearing plate is arranged on the supporting seat.
5. The deposition device according to claim 4, characterized in that: The shape of the carrying plate is an arc or an open polygon.
6. The deposition device according to claim 4, characterized in that The bearing structure further comprises a plurality of limiting members, and the limiting members are arranged on the bearing plate.
7. The deposition device according to claim 6, characterized in that The air-distributing plate comprises a plate body and a protruding piece, wherein the protruding piece extends from a side of the plate body in a direction away from the center of the plate body.
8. The deposition device according to claim 7, characterized in that: The distance between the plurality of limit members is equal to the length of the plate body.
9. The deposition device according to claim 7, characterized in that: The height of the protruding member is smaller than the height of the plate body, and the difference between the height of the plate body and the protruding member is equal to the height of the limiting member.
10. The deposition device according to claim 1, characterized in that The structures of the air homogenizing plates in different auxiliary cavities are different.